ONSEMI NBXSBA020LNHTAG

NBXSBB020, NBXSBA020
3.3 V, 280 MHz LVPECL
Clock Oscillator
The NBXSBB020/NBXSBA020 single frequency crystal oscillator
(XO) is designed to meet today’s requirements for 3.3 V LVPECL
clock generation applications. The device uses a high Q fundamental
crystal and Phase Lock Loop (PLL) multiplier to provide 280 MHz,
ultra low jitter and phase noise LVPECL differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000. Frequency stability options available as
either 50 PPM NBXSBA020 or 20 PPM NBXSBB020.
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6 PIN CLCC
LN SUFFIX
CASE 848AB
Features
•
•
•
•
•
•
•
•
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)
Output Frequency − 280 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range 3.3 V ±10%
Total Frequency Stability − ±20 PPM* or ±50 PPM
Applications
• Servers
VDD
6
CLK CLK
5 4
MARKING DIAGRAMS
NBXSBB020
280
AAWLYYWWG
NBXSBB020 = NBXSBB020 (±20 PPM)*
NBXSBA020 = NBXSBA020 (±50 PPM)
280
= Output Frequency (MHz)
AA
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
NBXSBB020LN1TAG*
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXSBA020LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXSBA020LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
Device
PLL
Clock
Multiplier
Crystal
1
OE
2
NC
NBXSBA020
280
AAWLYYWWG
3
GND
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Simplified Logic Diagram
* Please contact sales office for availability
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 5
1
Publication Order Number:
NBXSBB020/D
NBXSBB020, NBXSBA020
OE
1
6
VDD
NC
2
5
CLK
GND
3
4
CLK
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Pin No.
Symbol
I/O
Description
1
OE
LVTTL/LVCMOS
Control Input
2
NC
N/A
No Connect.
3
GND
Power Supply
Ground 0 V.
4
CLK
LVPECL Output
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
5
CLK
LVPECL Output
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
6
VDD
Power Supply
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
Positive power supply voltage. Voltage should not exceed 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
OE Pin
Output Pins
Open
Active
HIGH Level
Active
LOW Level
High Z
Table 3. ATTRIBUTES
Characteristic
Value
Internal Default State Resistor
ESD Protection
170 kW
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Rating
Units
VDD
Positive Power Supply
Parameter
Condition 1
GND = 0 V
Condition 2
4.6
V
Iout
LVPECL Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−55 to +120
°C
Tsol
Wave Solder
260
°C
See Figure 5
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
NBXSBB020, NBXSBA020
Table 5. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 2)
Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
75
100
mA
IDD
Power Supply Current (Note 2)
VIH
OE and FSEL Input HIGH Voltage
2000
VDD
mV
VIL
OE and FSEL Input LOW Voltage
GND − 300
800
mV
IIH
Input HIGH Current
OE
FSEL
−100
−100
+100
+100
mA
IIL
Input LOW Current
OE
FSEL
−100
−100
+100
+100
mA
VDD−1195
2105
VDD−945
2355
mV
VDD = 3.3 V
VDD−1945
1355
VDD−1600
1700
mV
VDD = 3.3 V
VOH
VOL
VOUTPP
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
Output Voltage Amplitude (Note 2)
700
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 4.
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3
NBXSBB020, NBXSBA020
Table 6. AC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Symbol
Characteristic
fCLKOUT
Output Clock Frequency
Df
FNOISE
Typ.
Max.
280
Units
MHz
0°C to +70°C
−40°C to +85°C
(Note 4)
Phase−Noise Performance
100 Hz of Carrier
−102
dBc/Hz
fCLKout = 280 MHz
(See Figure 3)
1 kHz of Carrier
−114
dBc/Hz
Spurious Noise
tjit(F)
RMS Phase Jitter
tjitter
Cycle to Cycle, RMS
Cycle to Cycle, Peak−to−Peak
tDUTY_CYCLE
Min.
Frequency Stability − NBXSBB020
Frequency Stability − NBXSBA020
NSP
tOE/OD
Conditions
±20
±50
PPM
10 kHz of Carrier
−123
dBc/Hz
100 kHz of Carrier
−123
dBc/Hz
1 MHz of Carrier
−132
dBc/Hz
10 MHz of Carrier
−157
dBc/Hz
(Note 5)
−60
dBc
12 kHz to 20 MHz
0.4
0.9
ps
1000 Cycles
2
8
ps
1000 Cycles
13
30
ps
Period, RMS
10,000 Cycles
1
4
ps
Period, Peak−to−Peak
10,000 Cycles
10
20
ps
200
ns
50
52
%
Output Enable/Disable Time
Output Clock Duty Cycle
(Measured at Cross Point)
48
tR
Output Rise Time (20% and 80%)
250
400
ps
tF
Output Fall Time (80% and 20%)
250
400
ps
1
5
ms
3
ppm
1
ppm
tstart
Start−up Time
Aging
1st
Year
Every Year After 1st
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 4.
4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
5. Guaranteed by design and verified at qualification. Not tested in production.
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4
NBXSBB020, NBXSBA020
Figure 3. Typical Phase Noise Plot
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5
NBXSBB020, NBXSBA020
Table 7. RELIABILITY COMPLIANCE
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Parameter
Standard
Method
Shock
Mechanical
MIL−STD−833, Method 2002, Condition B
Solderability
Mechanical
MIL−STD−833, Method 2003
Vibration
Mechanical
MIL−STD−833, Method 2007, Condition A
Solvent Resistance
Mechanical
MIL−STD−202, Method 215
Thermal Shock
Environment
MIL−STD−833, Method 1011, Condition A
Moisture Level Sensitivity
Environment
MSL1 260°C per IPC/JEDEC J−STD−020D
NBXSBB020/NBXSBA020
Zo = 50 W
CLK
D
Receiver
Device
Driver
Device
CLK
D
Zo = 50 W
50 W
50 W
VTT
VTT = VDD − 2.0 V
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
temp. 260°C
20 − 40 sec. max.
peak
Temperature (°C)
260
6°C/sec. max.
3°C/sec. max.
217
ramp−up
175
150
cooling
pre−heat
reflow
60180 sec.
Time
60150 sec.
Figure 5. Recommended Reflow Soldering Profile
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6
NBXSBB020, NBXSBA020
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
4X
A
D
D1
0.15 C
E2
TERMINAL 1
INDICATOR
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
H E1
DIM
A
A1
A2
A3
b
D
D1
D2
D3
E
E1
E2
E3
e
L
R
E
D2
TOP VIEW
A3
A2
0.10 C
A
SIDE VIEW
A1
C
SEATING
PLANE
2
3
0.08
1.30
6.17
6.66
4.37
4.65
1.17
MILLIMETERS
NOM
MAX
1.80
1.90
0.70 REF
0.36 REF
0.10
0.12
1.40
1.50
7.00 BSC
6.20
6.23
6.81
6.96
5.08 BSC
5.00 BSC
4.40
4.43
4.80
4.95
3.49 BSC
2.54 BSC
1.27
1.37
0.70 REF
SOLDERING FOOTPRINT*
D3
1
MIN
1.70
e
6X
1.50
R
E3
0.10 C A B
0.05 C
6X
b
6
5
4
6X
L
2.54
PITCH
BOTTOM VIEW
5.06
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NBXSBB020/D