HRS IT1-252P/44-23H

NEW
High Speed, Matched-Impedance, Parallel Board-to-board Connector System
IT1 Series
Receptacle (2 required)
IT1 Series Outline
High-speed matched-impedance parallel board-to-board
connector designed for applications requiring board-toboard spacing with transmission speeds exceeding
1GHz. The connection system has matched impedance
of 50 ohm or can be customized. Contacts are on 0.5mm
pitch.
■Features
Transmission Module
●Connection Cross-Sectional Diagram
The innovative transmission module uses PC boards
with a strip line design of transmission lines, providing
matched impedance of 50 ohms, for standard product.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X
and Y-axis. The three-piece structure and the +/- 0.2mm
tolerance allows 3 or more IT1’s to be mounted on a
single board.
(0.95) : Wipe
1. Impedance Matching using a 4-Layer Board
Receptacle
2-Point contact
4-Layer board
(Impedance matching)
3. Customized Board-to-Board Distance
Transmission Module
(1.2): Wipe
Board-to-board distance can be customized, from 16mm
to 40mm.
Ground lines or additional traces can be added to
support high level, high speed transmission or mixed
power/signal applications.
2-Point contact
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes
reliable matching of the characteristic impedance of each
transmission line. This ratio also can be customized.
Receptacle
5. Contact Reliability
Use of double contact points on each of the contacts
assures highly reliable performance.
■Applications
Routers, servers, base stations and other
telecommunication equipment.
2004.8
1
■Product Specifications
Rating
Current
rating
Voltage
rating
0.4 A (Note 1)
-55ç to +85ç
Operation Humidity Relative humidity 95% max.
Range
(No condensation)
50V AC
Item
Operation Temperature
Range
Storage Temperature -10ç to +60ç (Note 2)
Range
Storage Humidity
Range
Specification
40% to 70% (Note 2)
Conditions
Measured at 100V DC
150 V AC/one minute
Measured at 100 mA
1. Insulation resistance 100 M ohms min.
2. Withstanding voltage No flashover or insulation breakdown
3. Contact resistance
100 m ohms max.
4. Vibration
No electrical discontinuity of 1 µs or more.
No damage, cracks, or parts dislocation.
Frequency of 10 to 55 Hz, 0.75mm single amplitude, for 10
cycles in each of 3 directions
5. Shock
No electrical discontinuity of 1 µs. min.
No damage, cracks, or parts dislocation
Acceleration of 490 m/s2, 11 ms duration, sine half-wave
waveform, 3 cycles in each of the 3 axis.
6. Humidity
Contact resistance: 110 m ohms max.
Insulation resistance: 100 M ohms min.
No damage, cracks, or parts dislocation
96 hours/40ç/ humidity of 90% to 95%
7. Temperature cycle
Contact resistance: 110 m ohms max.
Insulation resistance: 100 M ohms min.
No damage, cracks, or parts dislocation
Temperature: -55ç/ +15ç to +35ç/ +85ç/ +15ç to +35ç
Duration: 30 / 2 to 3 / 30 / 2 to 3 (Minutes)
5 cycles
Contact resistance: 110 m ohms max.
8. Durability
(insertion/ withdrawal) No damage, cracks, or parts dislocation.
20 cycles
9. Resistance to
9. Soldering Heat
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
No deformation of components affecting performance.
Note1: If the connector is going to be used at a current in excess of the 0.4 A, please contact your Sales Representative.
Note2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
Note3: Contact resistance is for the 19mm stacking height assemblies.
■Material
Receptacles
Part
Insulator
Contacts
Metal fittings
Material
LCP
Phosphor bronze
Phosphor bronze
Finish
Color : Beige
Gold plating flash
Tin plating
Remarks
UL94V-0
Material
PBT
FR-4
Finish
Color : Black
Contact portion : Gold plating flash
Remarks
UL94V-0
-------------------
Transmission Module
Part
Insulator
Board
■Ordering information
Receptacles
IT 1 # - * S - SV (* *)
1
2
3
4
5
6
Transmission Module
IT 1 - * P / * - *H
1
1 Series name
2 Locating Post type Blank
3
4
: IT1
: With Locating Post
A
: Without Locating Post
: 168, 252
3 Number of contacts
4 Connector
S : Receptacle Socket
P : Transmission Plug Module
2
7
8
5 Lead
SV : Straight SMT
6 Packaging
Blank : Tray
(25) : Tray(connectors with attached tape
for a vacuum board placement)
7 Number of ground contacts : 28, 44
8 Board-to-board Distance: 19mm,23mm,30mm
----------
■Receptacles - 168 Contacts
20.5 (=0.5∞41)
b84
∞168
0.2 A
1.5
0.5
20.5 (=0.5∞41)
0.5
b2
b1
b1
A
8.8 ±0.5
0.2 ±0.05
1.5
1
a84
a2
2 ±0.2
a1
a1
A
( 0.6)
6 ±0.5
60.7 ±0.5
(52)
(3.55)
60.7 ±0.5
2-(Ø1.5 mm): Locating Post
Part Number
CL No.
Locating Post Type
IT1-168S-SV
641-0002-0
With Locating Post
IT1A-168S-SV
641-0012-4
Without Locating Post
BRecommended PCB mounting pattern
61.7 +0.1
0
0
56.9 -0.1
52 ±0.05
20.5 ( =0.5∞41)
0.5
0.06 A
b2
b1
0
3 +0.1
0
6.6 -0.1
b 84
A
a 84
a2
a1
1
+0.1
0
1.5
9.4
∞168
0.3 ±0.02
1.5
0.5
3.55 ±0.05
20.5 ( =0.5∞41)
1
2-Ø1.7±0.05
Not required for products without Locating Post.
3
■Receptacles - 252 Contacts
20.5 (=0.5∞41)
3
20.5 (=0.5∞41) 1.5
0.2 ±0.05 ∞252
0.2 A
20.5 (=0.5∞41)
0.5
b2
b1
1.
5
0.5
C
b126
1.5
A
8.8 ±0.5
b1
a1
a126
2 ±0.2
A
a1
a2
( 0.6 )
6 ±0.5
84.2 ±0.5
( 75.5 )
( 3.55 )
84.2 ±0.5
2-(Ø1.5 mm): Locating Post
Part Number
CL No.
IT1-252S-SV
641-0003-3
Locating Post Type
With Locating Post
IT1A-252S-SV
641-0013-7
Without Locating Post
BRecommended PCB mounting pattern
85.2
+0.1
0
80.4
0
-0.1
49.5
1.5
.
0.5
0.5
A
a2
a1
1
Not required for products without locating Post.
1
+0.1
0
9.4
3 +0.1
0
a 126
4
b1
6.6
b2
b 126
B
20.5 (=0.5∞41)
3.55
3
0.3 ±0.02 ∞252
0.06 A
26
20.5 (=0.5∞41) 1.5
0
-0.1
20.5 ( =0.5∞41)
2- Ø1.7 ±0.05
0.1 A.B
■Transmission Module - 168 Contacts
7.8 ±0.5
b row
a row
(4.2)
5.8 ±0.3
57±0.5
168
A
1
1
19
Locking Protrusion
(2 Sides)
5.8 ±0.3
Board Mounting side
6.6 ±0.5
Mating side
8.4 ±0.3 8.4 ±0.3
55±0.3
56±0.3
Part Number
CL No.
Board-to-board Distance
A
B
C
CL641-0192-8
IT1-168P/28-19H
19mm
18.4
18.4
16.6
CL641-0303-7
IT1-168P/28-30H
30mm
13.9
13.9
17.6
■Connection Table
The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1.
Signal
Ground
Fig. 1
Signal
Ground
Signal
Ground
Signal
Ground
a row
α-β
a01 - a84
a02 - a83
a03 - a82 Signal
a04 - a81
a05 - a80
a06 - a79
Ground
a07 - a78
a08 - a77
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
a17 - a68
a18 - a67
Ground
a19 - a66
a20 - a65
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
a29 - a56
a30 - a55
Ground
a31 - a54
a32 - a53
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
a41 - a44
a42 - a43
a43 - a42
α-β
a44 - a41
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a53 - a32
a54 - a31
a55 - a30
a56 - a29
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a65 - a20
a66 - a19
a67 - a18
a68 - a17
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a77 - a08
a78 - a07
a79 - a06
a80 - a05
a81 - a04
a82 - a03
a83 - a02
a84 - a01
Signal
Ground
Signal
Ground
Signal
Ground
Signal
Ground
b row
α-β
b01 - b84
b02 - b83
b03 - b82 Signal
b04 - b81
b05 - b80
b06 - b79
Ground
b07 - b78
b08 - b77
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
b17 - b68
b18 - b67
Ground
b19 - b66
b20 - b65
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
b29 - b56
b30 - b55
Ground
b31 - b54
b32 - b53
ı
ı
ı
ı
ı
ı Signal
ı
ı
ı
ı
b41 - b44
b42 - b43
b43 - b42
α-β
b44 - b41
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b53 - b32
b54 - b31
b55 - b30
b56 - b29
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b65 - b20
b66 - b19
b67 - b18
b68 - b17
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b77 - b08
b78 - b07
b79 - b06
b80 - b05
b81 - b04
b82 - b03
b83 - b02
b84 - b01
5
■Transmission Module - 252 Contacts
●2-row type
7.8±0.5
b row
a row
(4.2)
5.8±0.3
80.5 ±0.5
252
A
10.6 ±0.5
Mating side
10.4 ±0.3
78.5 ±0.3
23
Locking Protrusion
(2 Sides)
5.8±0.3
Board Mounting side
10.4 ±0.3
2
1
79.5 ±0.3
CL No.
Part Number
Board-to-board Distance
A
B
C
CL641-0231-8
IT1-252P/44-23H
23mm
10.4
10.4
10.6
CL641-0304-0
IT1-252P/44-30H
30mm
13.9
13.9
17.6
■Connection Table
The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1.
Signal
Ground
Signal
Fig.1
Ground
Signal
Ground
Signal
Ground
6
α-β
a01 - a126
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a05 - a122
a06 - a121
a07 - a120
a08 - a119
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a17 - a110
a18 - a109
a19 - a108
a20 - a107
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a29 - a98
a30 - a97
a31 - a96
a32 - a95
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a41 - a86
a42 - a85
a43 - a84
Signal
Ground
Signal
Ground
Signal
Ground
Signal
Ground
a row
α-β
a44 - a83
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a53 - a74
a54 - a73
a55 - a72
a56 - a71
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a62 - a65
a63 - a64
a64 - a63
a65 - a62
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a71 - a56
a72 - a55
a73 - a54
a74 - a53
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a83 - a44
a84 - a43
a85 - a42
Signal
Ground
Signal
Ground
Signal
Ground
Signal
α-β
a86 - a41
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a95 - a32
a96 - a31
a97 - a30
a98 - a29
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a107 - a20
a108 - a19
a109 - a18
a110 - a17
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a119 - a08
a120 - a07
a121 - a06
a122 - a05
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
a126 - a01
Signal
Ground
Signal
Ground
Signal
Ground
Signal
Ground
α-β
b01 - b126
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b05 - b122
b06 - b121
b07 - b120
b08 - b119
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b17 - b110
b18 - b109
b19 - b108
b20 - b107
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b29 - b98
b30 - b97
b31 - b96
b32 - b95
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b41 - b86
b42 - b85
b43 - b84
Signal
Ground
Signal
Ground
Signal
Ground
Signal
Ground
b row
α-β
b44 - b83
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b53 - b74
b54 - b73
b55 - b72
b56 - b71
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b62 - b65
b63 - b64
b64 - b63
b65 - b62
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b71 - b56
b72 - b55
b73 - b54
b74 - b53
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b83 - b44
b84 - b43
b85 - b42
Signal
Ground
Signal
Ground
Signal
Ground
Signal
α-β
b86 - b41
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b95 - b32
b96 - b31
b97 - b30
b98 - b29
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b107 - b20
b108 - b19
b109 - b18
b110 - b17
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b119 - b08
b120 - b07
b121 - b06
b122 - b05
ı
ı
ı
ı
ı
ı
ı
ı
ı
ı
b126 - b01
BIT1 Series Extraction Tool
Remarks
2-piece Package
(Ø2.5)
(42)
CL No.
641-1001-3
(3)
Part Number
IT1-PICKER(1)
(1.25)
(6)
(6)
7
Installation and Use Instruction Manual
Table of Contents
1. System Components ................................................................ 9
¡Receptacles
¡Transmission Module Assembly
¡Extraction Tool
2. Recommended Design Guidelines ..................................... 10
2-1 Recommended Solder Land Pattern
2-2 Board-to-Board Spacer Heights
3. Connector Placement ............................................................. 11
3-1 Receptacle Packaging Types
3-2 Receptacle Vacuum Pick-and-Place Areas
3-3 Receptacle Board Placement
3-4 Recommended Reflow Conditions
3-5 Solder Repairs
4. Mating Procedure ..................................................................... 14
5. Un-mating of Connectors ...................................................... 15
6. Removal of the Transmission Module from the stationary side. ..16
7. Precautions When Mounting Multiple Connectors ...... 17
¡Allowable Amount of Misalignment
¡Recommended Positional Location
8
BConnector Handling Precautions
1. System components
■Receptacles
¡Contacts
¡Row A and row B contacts are arranged alternately starting
with No.1 in row B. Placement on board is polarized.
¡Metal Fittings
¡Permanently inserted to provide lock with the Transmission
Module and additional solder areas with the PCB.
¡Insulator body.
¡Injection molded single unit provides protection and correct
self-alignment of all components.
Insulator body
Even numbered row: A contacts
Odd numbered row: B contacts
Metal fittings
■Transmission Module Assembly
¡Each Module has stationary side and a mating/un-mating
side.
¡When mounting multiple connectors, please keep uniform
orientation of the stationary side.
¡Transmission printed circuit boards used in the module are
based on JIS standards and quality standards applicable to
memory modules.
Guide frame
Mating/
un-mating
side
(Short)
Transmission
boards.
Stationary
side
(Longer)
■Extraction Tool
¡Used to release the transmission module from the
stationary receptacle.
Extraction Tool
(2 required)
Fully Connected Condition
The interconnection package consists of 3 main sub-assemblies: Two receptacles and the Transmission Module.
The transmission module, held securely by the guide frame has a mating/un-mating side and a stationary side.
Once the stationary side is inserted in the receptacle, it can not be removed without the use of extraction tool.
The mating/un-mating side allows repeated re-insertion of the receptacle on this side only.
Receptacles
Transmission
module
assembly
Mating/
unmating
side
Stationary
side
9
2. Recommended Design Guidelines
2-1 Solder Land Pattern
When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the
correct diameters of the holes (Fig. 1) are through the entire thickness of the board.
SLocating post hole diameterS
The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance
of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2).
Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies.
Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground
connection diagram of the transmission module.
Fig. 1 IT1-168S-SV Recommended Solder Land Pattern
(mm)
Automatic placement / (Locating post hole diameter) C dimension: 1.7 mm
Manual placement
/ (Locating post hole diameter) C dimension: 1.6 mm
/ A position accuracy of +
- 0.03 should be exercised from the
center of the hole to contact Number 84.
Fig. 2
2-2 Board-to-Board Spacer heights
The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them.
Fig. 3 indicates the connector height tolerance and the spacer’s height.
When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features,
which may affect the full mating of the connector.
Fig. 3 indicates design dimensions for the 19 mm board-to-board distance.
Fig. 3
10
(mm)
3. Connector Placement
3-1 Packaging Types
¡Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for
their automatic placement machines.
* Refer to the separate drawings for the detailed dimensions of the trays.
¡Semi-hard tray packaging
168 contacts receptacle: 40 pieces per tray
252 contacts receptacle: 30 pieces per tray
¡Hard tray packaging
168 contacts receptacle: 24 pieces per tray
252 contacts receptacle: 16 pieces per tray
(mm)
3-2 Automatic placement - Vacuum Pick-and-Place Areas
¡Specify "Vacuum Pick-up Tape Specification".
¡The area and position of the pick-and-place surface are indicated in the diagrams below.
(mm)
11
3-3 Receptacle Board Placement
¡When using automatic placement equipment, verify the packaging type and the Pick-and-place areas.
¡When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4.
* When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment.
SPrecautions for Manual PlacementS
The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board.
The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1.
Fig. 4-1 = Correct
3-4 Recommended Reflow Conditions
12
Fig. 4-2 = Incorrect
Fig. 4-3 = Incorrect
3-5 Solder Repairs
Assure that flux is not reaching the contact areas of the connector.
Wash the assembly as recommended below.
SCleaning ConditionsS
<Organic Solvent Cleaning>
<Water Based Cleaning>
When using water based cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers, which describes its effects on metals and resins. Care should be taken
not to leave moisture on the connectors.
<Cleaning Precautions>
Residual flux or cleaning agent remaining on the connectors when cleaning with organic solvents or water based cleaners
may cause deterioration of the electrical performance. It is important to check that a thorough washing has been performed.
13
4. Mating Procedure
Follow the procedure described below.
Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board.
¡The Transmission Module cannot be exposed to heat temperatures of the soldering process.
Step 1
Receptacle Placement on the board –
stationary side
Assure that the orientation posts are aligned
with the holes on the board.
When specifying receptacle assemblies without
the orientation posts exercise extra caution to
assure correct orientation and connection with
the solder pads.
Step 2
Insertion of the Transmission Module
Fully insert the Transmission Module in the
board-installed receptacle assembly.
It is critical that the insertion is done straight
and uniformly.
Step 3
Mating/un-mating
Assure that the receptacle assembly is correctly
aligned with the Transmission Module.
Fully insert the receptacle assembly on the
Transmission Module.
It is critical that the insertion is done straight
and uniformly.
Step 4
14
Connection completed
5. Un-mating of Connectors
Recommended Method
¡Pull uniformly straight up.
Prohibited un-mating Methods
15
6. Removal of the Transmission Module - stationary side
¡Requires use of dedicated extraction tool. Two are required.
Step 1
¡Fully insert the tools into each end of the receptacle assembly (Fig.
1) assuring that they will be over the hold areas of the Transmission
Module frame. Ref. Fig. 2
Fig. 1
Step 2
Pull out the transmission module holding the tools straight.
Fig. 2
extraction tool Insertion Area
Insertion area
Inappropriate area
16
7. Precautions When Mounting Multiple Connectors
Note: Observe the requirements as listed in paragraph 7-1 and 7-2.
The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for
mating / un-mating of multiple connector assemblies in a single operation.
7-1 Allowable Amount of Misalignment
Maximum allowable misalignment in X and Y directions is ±0.2 mm total.
Refer to the drawings below.
Length Orientation
X1-X2= +- 0.2
Width Orientation
Y1-Y2= +
- 0.2
7-2 Recommended Connector Placement
It is recommended to leave min. of 30 mm space between the adjacent connector assemblies.
7-3 Examples of Prohibited Placement Positions
To assure reliability of solder joints and mating/ un-mating without damage,
DO NOT PLACE MULTIPLE CONNECTORS as illustrated below.
17