Freescale Semiconductor, Inc. MOTOROLA Order number: MC100ES6011 Rev 3, 05/2004 SEMICONDUCTOR TECHNICAL DATA MC100ES6011 2.5V / 3.3V ECL 1:2 Differential Fanout Buffer The MC100ES6011 is a differential 1:2 fanout buffer. The ES6011 is ideal for applications requiring lower voltage. The 100ES Series contains temperature compensation. Freescale Semiconductor, Inc... Features • • • • • • • D SUFFIX 8-LEAD SOIC PACKAGE CASE 751 270 ps Typical Propagation Delay Maximum Frequency > 3 GHz Typical PECL Mode Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V ECL Mode Operating Range: VCC = 0 V with VEE = -2.375 V to -3.8 V Open Input Default State Q Output Will Default LOW with Inputs Open or at VEE LVDS Input Compatible ORDERING INFORMATION Device Q0 1 8 SO-8 MC100ES6011DR2 SO-8 VCC PIN DESCRIPTION Pin Q0 2 7 D Q1 3 6 D Q1 4 5 VEE Package MC100ES6011D Function D1, D2 ECL Data Inputs Q0, Q0 Q1, Q1 ECL Data Outputs VCC Positive Supply VEE Negative Supply 1. Pins will default LOW when left open. 2. Pins will default to 0.572 VCC/2 when left open. Figure 1. 8-Lead Pinout (Top View) and Logic Diagram © Motorola, Inc. 2004 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. MC100ES6011 Table 1. Attributes Characteristics Value Internal Input Pulldown Resistor 75 kΩ Internal Input Pullup Resistor 56 kΩ ESD Protection Human Body Model Machine Model Charged Device Model > 4000 V > 200 V > 1500 V θJA Thermal Resistance (Junction to Ambient) 0 LFPM, 8 SOIC 500 LFPM, 8 SOIC 190°C/W 130°C/W Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Figure 1. Freescale Semiconductor, Inc... Table 2. Maximum Ratings1 Symbol Parameter Conditions Power Supply Voltage Difference between VCC & VEE VIN Input Voltage VCC–VEE < 3.6 V IOUT Output Current Continuous Surge VSUPPLY Rating Units 3.9 V VCC+0.3 VEE–0.3 V V 50 100 mA mA TA Operating Temperature Range –40 to +85 °C Tstg Storage Temperature Range –65 to +150 °C 1. Absolute maxim continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated conditions is not implied. Table 3. DC Characteristics (VCC = 0 V; VEE = –2.5 V ± 5% or VCC = 2.5 V ± 5%; VEE = 0 V)1 Symbol IEE Characteristic –40°C Min Power Supply Current 0°C to 85°C Typ Max 12 25 Min Unit Typ Max 12 25 mA VOH Output HIGH Voltage 2 VCC–1160 VCC–1005 VCC–880 VCC–1100 VCC–955 VCC–740 mV VOL Voltage2 VCC–1830 VCC–1605 VCC–1305 VCC–1810 VCC–1705 VCC–1405 mV VOUTPP Output LOW Output Peak-to-Peak Voltage 200 200 mV VIH Input HIGH Voltage (Single Ended) VCC–1165 VCC–880 VCC–1165 VCC–880 mV VIL Input LOW Voltage (Single Ended) VCC–1810 VCC–1475 VCC–1810 VCC–1475 mV VPP Differential Input Voltage3 0.12 1.3 0.12 1.3 V VEE+1.0 VCC–0.8 VEE+1.0 VCC–0.8 V ±150 µA VCMR IIN Differential Cross Point Voltage4 Input Current ±150 1. ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained. 2. Output termination voltage VTT = 0 V for VCC = 2.5 V operation is supported but the power consumption of the device will increase. 3. VPP (DC) is the minimum differential input voltage swing required to maintain device functionality. 4. VCMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range and the input swing lies within the VPP (DC) specification. MOTOROLA 2 For More Information On This Product, Go to: www.freescale.com TIMING SOLUTIONS Freescale Semiconductor, Inc. MC100ES6011 Table 4. DC Characteristics (VCC = 0 V; VEE = –3.8 to –3.135 or VCC = 3.8 to 3.135 V; VEE = 0 V)1 Symbol IEE Min Power Supply Current 0°C to 85°C Typ Max 12 25 Min Unit Typ Max 12 25 mA VOH Output HIGH Voltage 2 VCC–1160 VCC–1005 VCC–880 VCC–1100 VCC–955 VCC–740 mV VOL Voltage2 VCC–1830 VCC–1705 VCC–1405 VCC–1830 VCC–1705 VCC–1405 mV VOUTPP Output LOW Output Peak-to-Peak Voltage 200 200 mV VIH Input HIGH Voltage (Single Ended) VCC–1165 VCC–880 VCC–1165 VCC–880 mV VIL Input LOW Voltage (Single Ended) VCC–1810 VCC–1475 VCC–1810 VCC–1475 mV VPP VCMR Freescale Semiconductor, Inc... –40°C Characteristic IIN Differential Input Voltage3 Differential Cross Point Voltage 4 0.12 1.3 0.12 1.3 V VEE+1.0 VCC–0.8 VEE+1.0 VCC–0.8 V ±150 µA Input Current ±150 1. ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained. 2. Output termination voltage VTT = 0 V for VCC = 2.5 V operation is supported but the power consumption of the device will increase. 3. VPP (DC) is the minimum differential input voltage swing required to maintain device functionality. 4. VCMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range and the input swing lies within the VPP (DC) specification. Table 5. AC Characteristics (VCC = 0 V; VEE = –3.8 to –2.375 or VCC = 2.375 to 3.8 V; VEE = 0 V)1 Symbol fMAX Maximum Frequency tPLH, tPHL Propagation Delay (Differential) CLK to Q, Q tSKEW Within Device Skew Q, Q tJITTER Cycle-to-Cycle Jitter VPP VCMR tr tf –40°C Characteristic Min 25°C Max Min 170 RMS (1σ) Input Voltage Swing (Differential) Differential Cross Point Voltage 0°C to 85°C Typ >3 Device-to-Device Skew2 Output Rise/Fall Times (20% – 80%) Typ Max Min Typ >3 260 300 9 20 130 180 Max >3 270 310 9 20 130 1 210 Unit GHz 285 360 ps 9 20 150 ps 1 ps 1 150 1200 150 1200 150 1200 mV VEE+1.2 VCC–1.1 VEE+1.2 VCC–1.1 VEE+1.2 VCC–1.1 V 70 220 70 220 70 220 ps 1. Measured using a 750 mV source 50% Duty Cycle clock source. All loading with 50 Ω to VCC–2.0 V. 2. Skew is measured between outputs under identical transitions. Q D Receiver Device Driver Device Qb Db 50 Ω 50 Ω VTT VTT = VCC – 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation Figure 2. VOUTPP versus Frequency TIMING SOLUTIONS 3 For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. MC100ES6011 Marking Notes: Device Nomenclature 8-Lead SOIC Marking MC100ES6011D M6011 Trace Code Identification: “A” — The First character indicates the Assembly location. “L” — The Second character indicates the Source Wafer Lot Tracking Code. “Y” — The Third character indicates the “ALPHA CODE” of the year device was assembled. “W” — The Fourth character indicates the “ALPHA CODE” of the Work Week device was assembled. Freescale Semiconductor, Inc... Year The “Y” Year ALPHA CODES Month Work Week Code The “W” Work Week ALPHA CODES 1st 6 Months (WW01 – WW26) 2nd 6 Months (WW27 – WW52) A = 2003 FIRST 6 MONTHS WW01 – WW26 A = WW01 B = 2003 SECOND 6 MONTHS WW27 – WW52 B = WW02 A = WW27 B = WW28 C = 2004 FIRST 6 MONTHS WW01 – WW26 C = WW03 C = WW29 D = 2004 SECOND 6 MONTHS WW27 – WW52 D = WW04 D = WW30 E = 2005 FIRST 6 MONTHS WW01 – WW26 E = WW05 E = WW31 F = 2005 SECOND 6 MONTHS WW27 – WW52 F = WW06 F = WW32 G = 2006 FIRST 6 MONTHS WW01 – WW26 G = WW07 G = WW33 H = 2006 SECOND 6 MONTHS WW27 – WW52 H = WW08 H = WW34 I = 2007 FIRST 6 MONTHS WW01 – WW26 I = WW09 I = WW35 J = 2007 SECOND 6 MONTHS WW27 – WW52 J = WW10 J = WW36 K = 2008 FIRST 6 MONTHS WW01 – WW26 K = WW11 K = WW37 L = 2008 SECOND 6 MONTHS WW27 – WW52 L = WW12 L = WW38 M = 2009 FIRST 6 MONTHS WW01 – WW26 M = WW13 M = WW39 N = 2009 SECOND 6 MONTHS WW27 – WW52 N = WW14 N = WW40 O = 2010 FIRST 6 MONTHS WW01 – WW26 O = WW15 O = WW41 P = 2010 SECOND 6 MONTHS WW27 – WW52 P = WW16 P = WW42 Q = 2011 FIRST 6 MONTHS WW01 – WW26 Q = WW17 Q = WW43 R = 2011 SECOND 6 MONTHS WW27 – WW52 R = WW18 R = WW44 S = 2012 FIRST 6 MONTHS WW01 – WW26 S = WW19 S = WW45 T = 2012 SECOND 6 MONTHS WW27 – WW52 T = WW20 T = WW46 U = 2013 FIRST 6 MONTHS WW01 – WW26 U = WW21 U = WW47 V = 2013 SECOND 6 MONTHS WW27 – WW52 V = WW22 V = WW48 W = 2014 FIRST 6 MONTHS WW01 – WW26 W = WW23 W = WW49 X = 2014 SECOND 6 MONTHS WW27 – WW52 X = WW24 X = WW50 Y = 2015 FIRST 6 MONTHS WW01 – WW26 Y = WW25 Y = WW51 Z = 2015 SECOND 6 MONTHS WW27 – WW52 Z = WW26 Z = WW52 Marking Example: XABR = Assembly Location X = First Lot Assembled of this device in the designated Work Week A B = 2003 Second 6 Months, WW27 - WW52 R = WW44 of 2003 MOTOROLA 4 For More Information On This Product, Go to: www.freescale.com TIMING SOLUTIONS Freescale Semiconductor, Inc. MC100ES6011 OUTLINE DIMENSIONS D SUFFIX 8-LEAD SOIC PACKAGE CASE 751-06 ISSUE T D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 Freescale Semiconductor, Inc... 4 h B X 45˚ e θ A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A S DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0˚ 7˚ STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. EMITTER COLLECTOR COLLECTOR EMITTER EMITTER BASE BASE EMITTER STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. COLLECTOR, DIE, #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. DRAIN, DIE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. ANODE ANODE ANODE ANODE ANODE ANODE ANODE COMMON CATHODE STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. DRAIN DRAIN DRAIN DRAIN GATE GATE SOURCE SOURCE STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. SOURCE DRAIN DRAIN SOURCE SOURCE GATE GATE SOURCE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. INPUT EXTERNAL BYPASS THIRD STAGE SOURCE GROUND DRAIN GATE 3 SECOND STAGE Vd FIRST STAGE Vd STYLE 8: PIN 1. 2. 3. 4. 5. 6. 7. 8. COLLECTOR, DIE #1 BASE, #1 BASE, #2 COLLECTOR, #2 COLLECTOR, #2 EMITTER, #2 EMITTER, #1 COLLECTOR, #1 STYLE 9: PIN 1. 2. 3. 4. 5. 6. 7. 8. EMITTER, COMMON COLLECTOR, DIE #1 COLLECTOR, DIE #2 EMITTER, COMMON EMITTER, COMMON BASE, DIE #2 BASE, DIE #1 EMITTER, COMMON STYLE 10: PIN 1. 2. 3. 4. 5. 6. 7. 8. GROUND BIAS 1 OUTPUT GROUND GROUND BIAS 2 INPUT GROUND STYLE 11: PIN 1. 2. 3. 4. 5. 6. 7. 8. SOURCE 1 GATE 1 SOURCE 2 GATE 2 DRAIN 2 DRAIN 2 DRAIN 1 DRAIN 1 STYLE 12: PIN 1. 2. 3. 4. 5. 6. 7. 8. SOURCE SOURCE SOURCE GATE DRAIN DRAIN DRAIN DRAIN STYLE 13: PIN 1. 2. 3. 4. 5. 6. 7. 8. N.C. SOURCE SOURCE GATE DRAIN DRAIN DRAIN DRAIN STYLE 14: PIN 1. 2. 3. 4. 5. 6. 7. 8. N-SOURCE N-GATE P-SOURCE P-GATE P-DRAIN P-DRAIN N-DRAIN N-DRAIN STYLE 15: PIN 1. 2. 3. 4. 5. 6. 7. 8. ANODE 1 ANODE 1 ANODE 1 ANODE 1 CATHODE, COMMON CATHODE, COMMON CATHODE, COMMON CATHODE, COMMON STYLE 16: PIN 1. 2. 3. 4. 5. 6. 7. 8. EMITTER, DIE #1 BASE, DIE #1 EMITTER, DIE #2 BASE, DIE #2 COLLECTOR, DIE #2 COLLECTOR, DIE #2 COLLECTOR, DIE #1 COLLECTOR, DIE #1 STYLE 17: PIN 1. 2. 3. 4. 5. 6 VCC V2OUT V1OUT TXE RXE VEE STYLE 18: PIN 1. 2. 3. 4. 5. 6 ANODE ANODE SOURCE GATE DRAIN DRAIN TIMING SOLUTIONS 5 For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc. MC100ES6011 Freescale Semiconductor, Inc... NOTES MOTOROLA 6 For More Information On This Product, Go to: www.freescale.com TIMING SOLUTIONS Freescale Semiconductor, Inc. MC100ES6011 Freescale Semiconductor, Inc... NOTES TIMING SOLUTIONS 7 For More Information On This Product, Go to: www.freescale.com MOTOROLA Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. 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