SEMICONDUCTOR TECHNICAL DATA The MC10H/100H601 is a 9–bit, dual supply ECL to TTL translator. Devices in the Motorola 9–bit translator series utilize the 28–lead PLCC for optimal power pinning, signal flow–through and electrical performance. The devices feature a 48 mA TTL output stage, and AC performance is specified into both a 50 pF and 200 pF load capacitance. For the 3–state output disable, both ECL and TTL control inputs are provided, allowing maximum design flexibility. The 10H version is compatible with MECL 10H ECL logic levels. The 100H version is compatible with 100K levels. • • • • • • • • 9–Bit Ideal for Byte–Parity Applications 3–State TTL Outputs Flow–Through Configuration Extra TTL and ECL Power Pins to Minimize Switching Noise ECL and TTL 3–State Control Inputs Dual Supply 4.8 ns Max Delay into 50 pF, 9.6 ns into 200 pF (all outputs switching) PNP TTL Inputs for Low Loading FN SUFFIX 28–LEAD PLASTIC PLCC PACKAGE CASE 776–02 PIN NAMES OEECL OETTL PIN FUNCTION GND VCCE VCCT VEE D0 – D8 Q0 – Q8 OEECL OETTL TTL Ground (0 V) ECL VCC (0 V) TTL Supply (+ 5.0 V) ECL Supply (– 5.2 / – 4.5 V) Data Inputs (ECL) Data Outputs (TTL) 3–State Control (ECL) 3–State Control (TTL) TRUTH TABLE D0 Q0 D1 Q1 D2 Q2 D3 Q3 OEECL OETTL D Q L L H X L L X H L H X X L H Z Z Q5 GND VCCT Q6 GND Q7 Q8 ECL Q4 D4 D5 Q5 D6 Q6 25 24 23 22 21 20 26 18 D8 Q3 27 17 D7 VCCT 28 16 VCCE 15 D6 TTL Q2 GND 2 14 D5 Q1 3 13 D4 Q0 4 12 D3 5 6 7 8 9 10 11 Q7 D7 OETTL NC OEECL VEE D0 D1 Q8 D8 10/97 2–1 D2 Figure 1. 28–Lead Pinout (Top View) Figure 2. Logic Diagram Motorola, Inc. 1997 19 Q4 REV 7 MC10H601 MC100H601 10H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% 0°C S b l Symbol P Parameter Min 25°C Max Min 85°C Max Min Max U i Unit IEE Power Supply Current – 51 – 51 – 51 mA IIH IIL Input HIGH Current Input LOW Current 225 145 145 0.5 µA µA VIH VIL Input HIGH Voltage Input LOW Voltage –1170 –1950 – 720 –1445 mV 0.5 – 840 –1480 0.5 –1130 –1950 – 810 –1480 –1060 –1950 C di i Condition 100H ECL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 4.2 V to – 5.5 V 0°C S b l Symbol P Parameter Min 25°C Max IEE Power Supply Current IIH IIL Input HIGH Current Input LOW Current 0.5 VIH VIL Input HIGH Voltage Input LOW Voltage –1165 –1810 Min 85°C Max – 51 Min Max U i Unit – 53 mA 145 µA µA – 880 –1475 mV – 51 225 145 0.5 – 880 –1475 0.5 –1165 –1810 – 880 –1475 –1165 –1810 C di i Condition TTL DC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% (10H version); VEE = – 4.2 V to – 5.5 V (100H version) 0°C S b l Symbol P Parameter Min 25°C Max Min 85°C Max ICCH ICCL Power Supply Current ICCZ IIH IIL Input LOW Current IOS Output Short Circuit Current IOZH IOZL Output Disable Current HIGH Output Disable Current LOW VIHT VILT Input HIGH Voltage Input LOW Voltage 2.0 VOHT Output HIGH Voltage 2.5 2.0 VOLT Output LOW Voltage 0.55 0.55 VIK Input Clamp Voltage –1.2 –1.2 Min Max U i Unit mA C di i Condition 110 110 110 110 110 110 Power Supply Current 105 105 105 Input HIGH Current 20 100 20 100 20 100 µA VIN = 2.7 V VIN = 7.0 V – 0.6 –100 – 0.6 – 225 –100 – 225 50 – 50 –100 – 0.6 mA VIN = 0.5 V – 225 mA VOUT = 0 V 50 – 50 µA VOUT = 2.7 V VOUT = 0.5 V 50 – 50 2.0 2.0 0.8 V 0.8 2.5 2.0 0.8 2.5 2.0 V IOH = – 3.0 mA IOH = –15 mA 0.55 V IOL = 48 mA –1.2 V IIN = –18 mA AC CHARACTERISTICS: VCCT = 5.0 V ± 10%; VEE = – 5.2 V ± 5% (10H version); VEE = – 4.2 V to – 5.5 V (100H version) 0°C S b l Symbol P Parameter tPLH tPHL Propagation Delay to Output tPLZ tPHZ Output Disable Time tPLZ tPHZ tPZL tPZH Output Enable Time tPZL tPZH tR tF Output Rise/Fall Time 1.0 V – 2.0 V MOTOROLA 25°C 85°C Min Max Min Max Min Max U i Unit 1.7 3.4 4.8 9.6 1.7 3.4 4.8 9.6 1.7 3.4 4.8 9.6 ns ns CL = 50 pF CL = 200 pF OEECL 3.7 5.4 6.5 13 3.7 5.4 6.5 13 3.7 5.4 6.5 13 ns ns CL = 50 pF CL = 200 pF OETTL 4.3 7.0 7.5 15 4.3 7.0 7.5 15 4.3 7.0 7.5 15 ns ns CL = 50 pF CL = 200 pF OEECL 3.5 5.0 6.0 12 3.5 5.0 6.0 12 3.5 5.0 6.0 12 ns ns CL = 50 pF CL = 200 pF OETTL 4.2 6.0 7.0 14 4.2 6.0 7.0 14 4.2 6.0 7.0 14 ns ns CL = 50 pF CL = 200 pF 1.2 3.0 ns ns CL = 50 pF CL = 200 pF 1.2 3.0 1.2 3.0 2–2 C di i Condition MECL Data DL122 — Rev 6 MC10H601 MC100H601 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B T L–M M N S T L–M S S Y BRK –N– 0.007 (0.180) U M N S D Z –M– –L– W 28 D X G1 0.010 (0.250) T L–M S N S S V 1 VIEW D–D A 0.007 (0.180) R 0.007 (0.180) M T L–M S N S C M T L–M S N 0.007 (0.180) H Z M T L–M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) –T– T L–M S N S M T L–M S N S VIEW S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 0.007 (0.180) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10_ 0.410 0.430 0.040 ––– MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10_ 10.42 10.92 1.02 ––– MOTOROLA MC10H601 MC100H601 Motorola reserves the right to make changes without further notice to any products herein. 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