ONSEMI MC10H113

SEMICONDUCTOR TECHNICAL DATA
The MC10H113 is a Quad Exclusive OR Gate with an enable common to all
four gates. The outputs may be wire–ORed together to perform a 4–bit
comparison function (A = B). The enable is active LOW.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
• Propagation Delay, 1.3 ns Typical
• Power Dissipation 175 mW Typ/Pkg (No Load)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
VEE
VI
–8.0 to 0
Vdc
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
0 to VEE
Vdc
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
Tstg
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range — Plastic
— Ceramic
LOGIC DIAGRAM
E
4
9
2
5
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0°
25°
75°
6
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
—
46
—
42
—
46
mA
—
—
—
430
510
1100
—
—
—
270
320
740
—
—
—
270
320
740
0.5
—
0.5
—
0.3
—
µA
Input Current High
Pins 5, 7, 11, 13
Pins 4, 6, 10, 12
Pin 9
IinH
Input Current Low
IinL
VOH
High Output Voltage
L
IN
L
E OUTPUT
L
L
L
H
L
H
H
L
L
H
H
H
L
L
X
X
H
L
µA
10
14
11
–1.02 –0.84 –0.98 –0.81 –0.92
–0.735
Vdc
12
–1.95 –1.63 –1.95 –1.63 –1.95
–1.60
Vdc
13
High Input Voltage
VOL
VIH
–1.17 –0.84 –1.13 –0.81 –1.07
–0.735
Vdc
Low Input Voltage
VIL
–1.95 –1.48 –1.95 –1.48 –1.95
–1.45
Vdc
Low Output Voltage
3
7
TRUTH TABLE
15
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
AC PARAMETERS
Propagation Delay
Data
Enable
Rise Time
Fall Time
tpd
tr
tf
DIP
PIN ASSIGNMENT
ns
0.4
0.5
1.7
2.3
0.4
0.5
1.8
2.4
0.5
0.6
1.9
2.5
0.5
1.8
0.6
1.9
0.6
2.0
ns
VCC1
1
16
VCC2
0.5
1.8
0.6
1.9
0.6
2.0
ns
AOUT
2
15
DOUT
BOUT
3
14
COUT
AIN
4
13
DIN
AIN
5
12
DIN
BIN
6
11
CIN
BIN
7
10
CIN
VEE
8
9
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated
through a 50–ohm resistor to –2.0 volts.
ENABLE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
9/96
 Motorola, Inc. 1996
2–213
REV 6
MC10H113
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
N
S
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–214
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MECL Data
DL122 — Rev 6
MC10H113
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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◊
MECL Data
DL122 — Rev 6
2–215
*MC10H113/D*
MC10H113/D
MOTOROLA