DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 DESCRIPTION The MCT9001 Optocoupler has two channels for density applications. For four channel applications, two-packages fit into a standard 16-pin DIP socket. Each channel is an NPN silicon planar phototransistor optically coupled to a gallium arsenide infrared emitting diode. 8 1 FEATURES • Two isolated channels per package • Two packages fit into a 16 lead DIP socket • Underwriters Laboratory (U.L.) recognized File E90700 8 8 1 APPLICATIONS 1 SCHEMATIC • • • • • • AC Line/Digital Logic - isolate high voltage transients Digital Logic/Digital Logic - Eliminate spurious grounds Digital Logic/AC Triac Control - isolate high voltage transients Twisted pair line receiver - Eliminate ground loop feedthrough Telephone/Telegraph line receiver - isolate high voltage transients High Frequency Power Supply Feedback Control - Maintain floating grounds and transients • Relay contact monitor - isolate floating grounds and transients • Power supply monitor - Isolate transients ANODE 1 8 COLLECTOR CATHODE 2 7 EMITTER ANODE 3 6 COLLECTOR CATHODE 4 5 EMITTER Equivalent Circuit ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit IF 60 mA IF(pk) 3 A EMITTER (Each channel) Forward Current - Continuous Forward Current - Peak (PW = 1µs, 300pps) Reverse Voltage LED Power Dissipation @ TA = 25°C Derate above 25°C (Total Input) VR 5.0 V PD 100 1.1 mW mW/°C DETECTOR (Each channel) Collector Current - Continuous IC 30 mA PD 150 1.67 mW mW/°C Storage Temperature TSTG -55 to +150 °C Operating Temperature TOPR -55 to +100 °C Lead Solder Temperature TSOL 250 for 10 sec °C PD 400 4.83 mW mW/°C Detector Power Dissipation @ TA = 25°C Derate above 25°C TOTAL DEVICE Total Device Power Dissipation @ TA = 25°C Derate above 25°C © 2003 Fairchild Semiconductor Corporation Page 1 of 8 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions EMITTER Input Forward Voltage Reverse Current Junction Capacitance DETECTOR Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage (IF = 10 mA) (VR = 5 V) (VF = 0 V, f = 1 MHz) (IC = 0.5 mA, IF = 0) (IE = 100 µA, IF = 0) (VCE = 24 V, IF = 0) (VCE = 24 V, TA = 85°C) (VCE = 0 V, f = 1 MHz) Collector-Emitter Dark Current Capacitance Symbol Min VF IR CJ BVCEO BVECO Typ** Max Unit 1.0 1.3 10 V µA pF 50 55 7 5 ICEO CCE 100 50 8 V V nA µA pF TRANSFER CHARACTERISTICS AC Characteristic SWITCHING TIMES Non-Saturated Turn-on Time Turn-off Time Rise Time Fall Time Saturated Turn-on Time Turn-off Time Test Conditions Symbol Min Typ** (RL = 100 Ω, IC = 2 mA, VCC = 10 V) ton toff tr tf 3 3 2.4 2.4 (IF = 16 mA, RL = 1.9 kΩ, VCE = 5 V) ton toff 2.4 25.0 Max Units µs TRANSFER CHARACTERISTICS DC Characteristic Current Transfer Ratio, Collector-Emitter Saturation Voltage Test Conditions (IF = 5 mA, VCE = 5 V) (IF = 8 mA, VCE = 0.4 V) (IF = 8 mA, IC = 2.4 mA) Symbol Min CTR CTR(sat) VCE(sat) 50 30 Typ** Max 600 0.40 Units % V ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance ** All typicals at TA = 25°C © 2003 Fairchild Semiconductor Corporation Test Conditions (II-O ≤ 1 µA, t = 1 min.) (VI-O = 500 VDC) (f = 1 MHz) Page 2 of 8 Symbol Min VISO RISO CISO 5300 1011 Typ** 0.5 Max Units Vac(rms) Ω pf 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 Normalized CTR vs. Ambient Temperature Normalized CTR vs. Forward Current 1.6 1.4 VCE = 5.0V TA = 25˚C Normalized to IF = 10 mA 1.2 1.4 IF = 5 mA NORMALIZED CTR NORMALIZED CTR 1.0 0.8 0.6 1.2 IF = 10 mA 1.0 0.8 0.4 0.6 0.2 0.0 0 5 10 15 Normalized to IF = 10 mA TA = 25˚C 0.4 -75 20 -50 IF = 20 mA -25 0 25 50 75 100 125 TA - AMBIENT TEMPERATURE (˚C) IF - FORWARD CURRENT (mA) Dark Current vs. Ambient Temperature ICEO - COLLECTOR-EMITTER DARK CURRENT (µA) 101 VCE = 10 V 100 10-1 10-2 10-3 10-4 10-5 10-6 0 25 50 75 100 125 TA - AMBIENT TEMPERATURE (˚C) © 2003 Fairchild Semiconductor Corporation Page 3 of 8 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 LED Forward Voltage vs. Forward Current Switching Speed vs. Load Resistor 1.8 1000 IF = 10 mA VCC = 10 V TA = 25˚C 1.7 VF - FORWARD VOLTAGE (V) SWITCHING SPEED - (µs) 100 Toff Tf 10 Ton Tr 1 1.6 1.5 1.4 TA = 55˚C 1.3 TA = 25˚C 1.2 1.1 TA = 100˚C 0.1 1.0 0.1 1 10 100 1 R-LOAD RESISTOR (kΩ) 10 100 IF - LED FORWARD CURRENT (mA) VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) Collector-Emitter Saturation Voltage vs Collector Current 100 TA = 25˚C 10 1 IF = 2.5 mA 0.1 0.01 IF = 10 mA IF = 20 mA IF = 5 mA 0.001 0.01 0.1 1 10 IC - COLLECTOR CURRENT (mA) © 2003 Fairchild Semiconductor Corporation Page 4 of 8 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 Package Dimensions (Through Hole) Package Dimensions (Surface Mount) 0.390 (9.91) 0.370 (9.40) PIN 1 ID. 4 3 2 1 4 3 2 1 PIN 1 ID. 0.270 (6.86) 0.250 (6.35) 5 6 7 0.270 (6.86) 0.250 (6.35) 8 SEATING PLANE 0.390 (9.91) 0.370 (9.40) 5 6 0.070 (1.78) 0.045 (1.14) 7 8 0.300 (7.62) TYP 0.070 (1.78) 0.045 (1.14) 0.020 (0.51) MIN 0.200 (5.08) 0.140 (3.55) 0.020 (0.51) MIN 0.016 (0.41) 0.008 (0.20) 0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.016 (0.40) 0.008 (0.20) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 15° MAX 0.300 (7.62) TYP 0.100 (2.54) TYP Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4"Lead Spacing) 4 3 2 0.045 [1.14] 0.315 (8.00) MIN 0.405 (10.30) MIN Recommended Pad Layout for Surface Mount Leadform PIN 1 ID. 1 0.070 (1.78) 0.270 (6.86) 0.250 (6.35) 0.060 (1.52) 5 6 7 8 SEATING PLANE 0.390 (9.91) 0.370 (9.40) 0.100 (2.54) 0.295 (7.49) 0.070 (1.78) 0.045 (1.14) 0.415 (10.54) 0.030 (0.76) 0.004 (0.10) MIN 0.200 (5.08) 0.140 (3.55) 0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.016 (0.40) 0.008 (0.20) 0.100 (2.54) TYP 0° to 15° 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) © 2003 Fairchild Semiconductor Corporation Page 5 of 8 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 ORDERING INFORMATION Option S Order Entry Identifier Description .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4” Lead Spacing MARKING INFORMATION 1 V 3 MCT9001 2 XX YY T1 6 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 Two digit year code, e.g., ‘03’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code © 2003 Fairchild Semiconductor Corporation Page 6 of 8 10/20/04 DUAL PHOTOTRANSISTOR OPTOCOUPLERS MCT9001 Carrier Tape Specifications 12.0 ± 0.1 4.90 ± 0.20 4.0 ± 0.1 Ø1.55 ± 0.05 4.0 ± 0.1 0.30 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 13.2 ± 0.2 10.30 ± 0.20 Ø1.6 ± 0.1 10.30 ± 0.20 0.1 MAX 16.0 ± 0.3 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile Temperature (°C) 300 215 C, 10–30 s 250 225 C peak 200 150 Time above 183C, 60–150 sec 100 50 Ramp up = 3C/sec 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) • Peak reflow temperature: 225C (package surface temperature) • Time of temperature higher than 183C for 60–150 seconds • One time soldering reflow is recommended © 2003 Fairchild Semiconductor Corporation Page 7 of 8 10/20/04 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST ActiveArray™ FASTr™ Bottomless™ FPS™ CoolFET™ FRFET™ CROSSVOLT™ GlobalOptoisolator™ DOME™ GTO™ EcoSPARK™ HiSeC™ E2CMOS™ I2C™ EnSigna™ i-Lo™ FACT™ ImpliedDisconnect™ FACT Quiet Series™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC Across the board. Around the world.™ OPTOPLANAR™ PACMAN™ The Power Franchise POP™ Programmable Active Droop™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I13