STMICROELECTRONICS BF3506TV

BF3506TV
FULL 50-60Hz RECTIFICATION BRIDGE
MAIN PRODUCT CHARACTERISTICS
.
.
.
IF(AV)
35A
VRRM
600V
VF (max)
1.3V
PRELIMINARY DATASHEET
+
FEATURES AND BENEFITS
-
COMPACT ISOTOP DESIGN COMPATIBLE
WITH FAST DIODES, TRANSISTORS AND
PASSIVE COMPONENTS.
EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK
UL PENDING
+
-
DESCRIPTION
The Bridges series from SGS-THOMSON has
been designed to allow a better standardization
of packages on boards principally designed with
ISOTOP packages. The insulated package of the
bridge will be able to sit on heatsink with other
components. Single phase and 3-phase high
power SMPS, UPS, MOTOR DRIVES and
WELDING equipment will primarily find advantage in these industry package products.
Screw version
ISOTOP
(Plastic)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
600
V
VRSM
Non repetitive peak reverse voltage
600
V
35
A
Surge non repetitive forward current
50Hz JEDEC method
300
A
Fusing
660
A2.s
- 65 to + 150
°C
Max. operating junction temperature
150
°C
Total power dissipation
50
W
IF(AV) total
IFSM
I2.t
Tstg
Tj
Pmax total
Average forward current
Tc=80°C
Sinus
Storage temperature range
TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics.
November 1995 Ed : 1
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BF3506TV
THERMAL RESISTANCE
Symbol
Rth (j-c)
total
Parameter
Value
Unit
0.5
°C/W
Junction to case
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol
Parameter
IR *
Reverse leakage current
VF **
Forward voltage drop
Test Conditions
VR = 0.8 VRRM
δ < 2%
tp = 5ms
IF = 35 A
δ < 2%
tp = 380µs
Min.
Typ.
Max.
Unit
Tj = 25°C
10
µA
Tj = 125°C
0.2
mA
Tj = 25°C
1.4
V
Tj = 125°C
1.3
V
Pulse test : * tp = 5 ms, duty cycle < 2 %
** tp = 380 µs, duty cycle < 2 %
For one diode: Pcond = 1.02 x IF(AV) + 0.008 x I2F(RMS) and Tj = Pcond x 4 x Rth(j-c) + Tc
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BF3506TV
PACKAGE DATA (millimeter)
ISOTOP (Plastic)
REF.
DIMENSIONS
Millimeters
M
A
G
O/ J
O
B
O/ I
O/ I
D
H
E
F
C
K
screw H M 4
P
L
Cooling method : C
Marking : Type number
Weight : 28 g. (without screws)
Inches
Min.
Max.
Min.
Max.
A
11.80
12.20
0.465
0.480
B
8.90
9.10
0.350
0.358
C
1.95
2.05
0.077
0.081
D
0.75
0.85
0.029
0.034
E
12.60
12.80
0.496
0.504
F
G
25.10
31.50
25.50
31.70
0.988
1.240
1.004
1.248
H
I
4.00
4.10
4.30
0.157
0.161
0.169
J
4.10
4.30
0.161
0.169
K
14.90
15.10
0.586
0.595
L
30.10
30.30
1.185
1.193
M
37.80
38.20
1.488
1.504
O
P
7.80
5.50
8.20
0.307
0.216
0.323
Electrical isolation : 2500V(RMS)
Capacitance : < 45 pF
Inductance : < 5 nH
- Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws
recommended for mounting the package on the heatsink and the 4 screws given with the screw
version).
- The screws supplied with the package are adapted for mounting on a board (or other types of
terminals) with a thickness of 0.6 mm min and 2.2 mm max.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
© 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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