FAIRCHILD FXMA2104

FXMA2104
Dual-Supply, 4-Bit Voltage Translator / Buffer /
Repeater / Isolator for Open-Drain Applications
Features
Description

Bi-Directional Interface between Any Two Levels:
1.65V to 5.5V


Direction Control not Needed
The FXMA2104 is a 4-bit high-performance,
configurable dual-voltage supply, open-drain translator
for bi-directional voltage translation over a wide range of
input and output voltages levels.



I2C 400pF Buffer / Repeater
System GPIO Resources Not Required when OE
Tied to VCCA
I2C-Bus® Isolation
A/B Port VOL = 175mV (Typical), VIL = 150mV,
IOL = 6mA


Open-Drain Inputs / Outputs



Supports I2C Clock Stretching & Multi-Master



Outputs Switch to 3-State if Either VCC is at GND

ESD Protection Exceeds:
- 5kV HBM ESD (per JESD22-A114)
- 2kV CDM (per JESD22-C101)
Accommodates Standard-Mode and Fast-Mode
I2C-Bus Devices
Fully Configurable: Inputs and Outputs Track VCC
Non-Preferential Power-Up; Either VCC May Be
Powered-Up First
Intended for use as a voltage translator in applications
2
®
using the I C-Bus interface, the input and output
voltage levels are compatible with I2C device
specification voltage levels. External pull-up resistors
are required.
The device is designed so that the A port tracks the
VCCA level and the B port tracks the VCCB level. This
allows for bi-directional A/B port voltage translation
between any two levels from 1.65V to 5.5V. VCCA can
equal VCCB from 1.65V to 5.5V.
Non-preferential power-up means either VCC can be
powered-up first. Internal power-down control circuits
place the device in 3-state if either VCC is removed.
The two ports of the device have automatic directionsense capability. Either port may sense an input signal
and transfer it as an output signal to the other port.
Tolerant Output Enable: 5V
Packaged in 12-Lead Ultrathin MLP
(1.8mm x 1.8mm)
Ordering Information
Part Number
Operating
Temperature
Range
Top
Mark
FXMA2104UMX
-40 to +85°C
BX
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
Package
12-Lead, Ultrathin, MLP, 1.8mm x 1.8mm
Packing
Method
5000 Units on
Tape and Reel
www.fairchildsemi.com
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
July 2012
OE
VCCB
Dynamic Driver
(with Time Out)
Internal Direction
Generator &
Control
VbiasB
VbiasA
B
A
VCCA
Internal Direction
Generator &
Control
Dynamic Driver
(with Time Out)
Figure 1. Block Diagram, 1 of 4 Channels
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Block Diagram
www.fairchildsemi.com
2
Figure 2. UMLP (Top-Through View)
Pin Definitions
Pin #
Name
Description
1
VCCB
B-Side Power Supply
2
VCCA
A-Side Power Supply
3, 4, 5, 6
A0, A1, A2, A3
7
GND
8
OE
9, 10, 11, 12
B3, B2, B1, B0,
A-Side Inputs or 3-State Outputs
Ground
Output Enable Input
B-Side Inputs or 3-State Outputs
Truth Table
Control
Outputs
OE
LOW Logic Level
3-State
HIGH Logic Level
Normal Operation
Note:
1. If the OE pin is driven LOW, the FXMA2104 is disabled and the A0, A1, A2, A3, B0, B1, B2 and B3 pins (including
dynamic drivers) are forced into 3-state.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Pin Configuration
www.fairchildsemi.com
3
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
-0.5
7.0
A Port
-0.5
7.0
B Port
-0.5
7.0
Control Input (OE)
-0.5
7.0
An Outputs 3-State
-0.5
7.0
Bn Outputs 3-State
-0.5
7.0
An Outputs Active
-0.5
VCCA + 0.5V
Bn Outputs Active
-0.5
VCCB + 0.5V
VCCA, VCCB Supply Voltage
VIN
VO
IIK
IOK
IOH / IOL
DC Input Voltage
Output Voltage(2)
DC Input Diode Current
DC Output Diode Current
At VIN < 0V
-50
At VO < 0V
-50
At VO > VCC
+50
DC Output Source/Sink Current
-50
Units
V
V
mA
mA
+50
mA
ICC
DC VCC or Ground Current per Supply Pin
±100
mA
PD
Power Dissipation
0.129
mW
+150
°C
At 400KHz
TSTG
Storage Temperature Range
ESD
Electrostatic Discharge
Capability
-65
Human Body Model, JESD22-A114
5
Charged Device Mode, JESD22-C101
2
kV
Note:
2. IO absolute maximum rating must be observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
VCCA, VCCB Power Supply Operating
A Port
VIN
Input Voltage
Min.
Max.
Units
1.65
5.50
V
0
5.5
B Port
0
5.5
Control Input (OE)
0
VCCA
ΘJA
Thermal Resistance
TA
Free Air Operating Temperature
-40
V
301.5
C°/W
+85
°C
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Absolute Maximum Ratings
Note:
3. All unused inputs and I/O pins must be held at VCCI or GND, VCCI is the VCC associated with the input side.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
4
Power-Up/Power-Down Sequencing
FXM translators offer an advantage in that either VCC
may be powered up first. This benefit derives from the
chip design. When either VCC is at 0V, outputs are in a
high-impedance state. The control input (OE) is
designed to track the VCCA supply. A pull-down resistor
tying OE to GND should be used to ensure that bus
contention, excessive currents, or oscillations do not
occur during power-up/power-down. The size of the pulldown resistor is based upon the current-sinking
capability of the device driving the OE pin.
The recommended power-up sequence is:
1. Apply power to the first VCC.
2. Apply power to the second VCC.
3. Drive the OE input HIGH to enable the device.
The recommended power-down sequence is:
1. Drive OE input LOW to disable the device.
2. Remove power from either VCC.
3. Remove power from other VCC.
Note:
4. Alternatively, the OE pin can be hardwired to VCCA
to save GPIO pins. If OE is hardwired to VCCA,
either VCC can be powered up or down first.
Application Circuit
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Functional Description
Figure 3. Application Circuit
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
5
between the ports until either of the port’s VCC/2
thresholds are reached. After the RC time constant has
reached the VCC/2 threshold of either port, the port’s
edge detector triggers both dynamic drivers to drive
their respective ports in the LOW-to-HIGH (LH)
direction, accelerating the rising edge. The resulting rise
time resembles the scope shot in Figure 4. Effectively,
two distinct slew rates appear in rise time. The first slew
rate (slower) is the RC time constant of the bus. The
second slew rate (much faster) is the dynamic driver
accelerating the edge.
The FXMA2104 has open-drain I/Os and requires
external pull-up resistors on the eight data I/O pins, as
shown in Figure 3. If a pair of data I/O pins (An/Bn) is not
used, both pins should be tied to GND (or both to VCC).
In this case, pull-down or pull-up resistors are not
required. The recommended values for the pull-up
resistors (RPUs) are 1KΩ to 10K, depending on the total
bus capacitance, the user is free to vary the pull-up
resistor value to meet the maximum I2C edge rate per
2
the I C specification (UM10204 rev. 03, June 19, 2007).
For example, the maximum edge rate (30% - 70%)
during Fast Mode (400kbit/s) is 300ns. If bus
capacitance is approaching the maximum 400pF, lower
the RPU value to keep the rise time below 300ns (Fast
Mode). Section 7.1 of the I2C specification provides an
excellent guideline for pull-up resistor sizing.
If both the A and B ports of the translator are HIGH, a
high-impedance path exists between the A and B ports
because both the Npassgates are turned off. If a master
or slave device decides to pull SCL or SDA LOW, that
device’s driver pulls down (Isink) SCL or SDA until the
edge reaches the A or B port VCC/2 threshold. When
either the A or B port threshold is reached, the port’s
edge detector triggers both dynamic drivers to drive
their respective ports in the HIGH-to-LOW (HL)
direction, accelerating the falling edge.
Theory of Operation
The FXMA2104 is designed for high-performance level
2
shifting and buffer / repeating in an I C application.
Figure 1 shows that each bi-directional channel contains
two series-Npassgates and two dynamic drivers. This
hybrid architecture is highly beneficial in an I2C
application where auto-direction is a necessity.
For example, during the following three I2C protocol
events:



Clock Stretching
Slave’s ACK Bit (9th bit = 0) following a Master’s
th
Write Bit (8 bit = 0)
Clock Synchronization and Multi Master
Arbitration
the bus direction needs to change from master-to-slave
to slave-to-master without the occurrence of an edge. If
there is an I2C translator between the master and slave
2
in these examples, the I C translator must change
direction when both A and B ports are LOW. The
Npassgates can accomplish this task very efficiently
because, when both A and B ports are LOW, the
Npassgates act as a low resistive short between the two
(A and B) ports.
Due to I2C’s open-drain topology, I2C masters and
slaves are not push-pull drivers. Logic LOWs are “pulled
down” (Isink), while logic HIGHs are “let go” (3-state). For
example, when the master lets go of SCL (SCL always
comes from the master), the rise time of SCL is largely
determined by the RC time constant, where R = RPU and
C = the bus capacitance. If the FXMA2104 is attached
to the master [on the A port] and there is a slave on the
B port, the Npassgates act as a low resistive short
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
Figure 4. Waveform C: 600pF, Total RPU: 2.2KΩ
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Application Information
www.fairchildsemi.com
6
The I2C specification mandates a maximum VIL (IOL of
3mA) of VCC • 0.3 and a maximum VOL of 0.4V. If there
is a master on the A port of an I2C translator with a VCC
2
of 1.65V and a slave on the I C translator B port with a
VCC of 3.3V, the maximum VIL of the master is (1.65V x
0.3) 495mV. The slave could legally transmit a valid
logic LOW of 0.4V to the master.
The FXMA2104 dynamic drivers have enough currentsourcing capability to drive a 400pF capacitive bus. This
is beneficial when an I2C buffer / repeater is required.
2
The I C specification stipulates a maximum bus
capacitance of 400pF. If an I2C segment exceeds
2
400pF, an I C buffer / repeater is required to split the
segment into two segments, each of which is less than
400pF. Figure 4 is a scope shot of an FXMA2104
driving a lumped load of 600pF. Notice the (30% - 70%)
rise time is only 112ns (total RPU = 2.2K). This is well
below the maximum edge rate of 300ns. Not only does
the FXMA2104 drive 400Pf; it also provides excellent
2
headroom below the I C specification maximum edge
rate of 300ns.
If the I2C translator’s channel resistance is too high, the
voltage drop across the translator could present a VIL to
the master greater than 495mV. To complicate matters,
2
the I C specification states that 6mA of IOL is
recommended for bus capacitances approaching
400pF. More IOL increases the voltage drop across the
2
2
2
I C translator. The I C application benefits when I C
translators exhibit low VOL performance. Figure 5
depicts typical FXMA2104 VOL performance vs. a
competitor, given a 0.4V VIL.
VOL: FXMA2104 vs. Device B, VIL = 0.4V
0.65
0.6
0.55
VOL (V):
Device B
VIL = 0.4V
FXMA2104
VIL = 0.4V
0.5
0.45
0.4
0
2
4
6
IOL (mA):
8
10
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
VOL vs. IOL
Buffer / Repeater Performance
Figure 5. VOL vs. IOL
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
7
The FXMA2104 supports I2C-Bus® isolation for the
following conditions:


Bus isolation if bus clear
Bus isolation if either VCC goes to ground
Bus Clear
Because the I2C specification defines the minimum SCL
frequency of DC, the SCL signal can be held LOW
forever; however, this condition shuts down the I2C bus.
2
The I C specification refers to this condition as Bus
Clear. In Figure 6, if slave #2 holds down SCL forever,
the master and slave #1 are not able to communicate
because the FXMA2104 passes the SCL stuck-LOW
Either VCC to GND
If slave #2 is a camera that is suddenly removed from
the I2C bus, resulting in VCCB transitioning from a valid
VCC (1.65V – 5.5V) to 0V; the FXMA2104 automatically
forces all I/Os on both its A and B ports into 3-state.
Once VCCB has reached 0V, full I2C communication
between the master and slave #1 remains undisturbed.
Slave #1
VCC = 1.8V
SCL1
SCL1
SCL1
SDA1
SDA 1
SDA1
Master
SDA 2
SCL2
VCCB
SCL1
SDA 2
VCC = 3.3V
SCL2
OE
SDA 2
OE: High Enable
Low Disable
VCCA :
1.65V – 5.5V VCC
Domain
VCCB :
1.65V – 5.5V VCC
Domain
Figure 6. Bus Isolation
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
Slave #2
SDA 1
SCL2
SDA 2
GPIO3
VCCA
FXMA 2104
I2C Buffer
Translator
VCC = 1.8V
SCL2
VCC = 3.3V
Slave #3
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
condition from slave #2 to slave #1 as well as the
master. However, if the OE pin is pulled LOW
(disabled), both ports (A and B) are 3-stated. This
results in the FXMA2104 isolating slave #2 from the
master and slave #1, allowing full communication
between the master and slave #1.
2
I C Bus Isolation
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8
TA = –40°C to +85°C.
Symbol
Parameter
VIHA
High Level Input
Voltage A
VIHB
High Level Input
Voltage B
VILA
Low Level Input
Voltage A
VILB
Low Level Input
Voltage B
VOL
Low Level Output
Voltage
IL
IOFF
IOZ
Input Leakage
Current
Power-Off Leakage
Current
3-State Output
Leakage(6)
Condition
VCCA (V)
VCCB (V)
Min.
Max.
Unit
Data Inputs An
1.65–5.50
1.65–5.50
VCCA – 0.4
Control Input OE
1.65–5.50
1.65–5.50
0.7 x VCCA
Data Inputs Bn
1.65–5.50
1.65–5.50
VCCB – 0.4
Data Inputs An
1.65–5.50
1.65–5.50
0.4
Control Input OE
1.65–5.50
1.65–5.50
0.3 x VCCA
Data Inputs Bn
1.65–5.50
1.65–5.50
0.4
V
1.65–5.50
1.65–5.50
0.4
V
1.65–5.50
1.65–5.50
±1
µA
V
V
V
VIL = 0.15V
IOL = 6mA
Control Input OE,
VIN = VCCA or GND
An
VIN or VO = 0V to
5.5V
0
5.50
±2
Bn
VIN or VO = 0V to
5.5V
5.50
0
±2
An,
Bn
VO = 0V to 5.5V,
OE = VIL
5.50
5.50
±2
An
VO = 0V to 5.5V,
OE = Don’t Care
5.50
0
±2
Bn
VO = 0V to 5.5V,
OE = Don’t Care
0
5.50
±2
µA
µA
ICCA/B
Quiescent Supply
Current(7,8)
VIN = VCCI or GND,
IO = 0
1.65–5.50
1.65–5.50
5
µA
ICCZ
Quiescent Supply
Current(7)
VIN = VCCI or GND,
IO = 0,
OE = VIL
1.65–5.50
1.65–5.50
5
µA
1.65–5.50
-2
ICCA
VIN = 5.5V or GND,
IO = 0,
OE = Don’t Care,
Bn to An
0
Quiescent Supply
Current(6)
1.65–5.50
0
2
0
-2
ICCB
VIN = 5.5V or GND,
IO = 0,
OE = Don’t Care,
An to Bn
1.65–5.50
Quiescent Supply
Current(6)
0
1.65–5.50
2
µA
µA
Notes:
5. This table contains the output voltage for static conditions. Dynamic drive specifications are given in Dynamic
Output Electrical Characteristics.
6. “Don’t Care” indicates any valid logic level.
7. VCCI is the VCC associated with the input side.
8. Reflects current per supply, VCCA or VCCB.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
DC Electrical Characteristics
www.fairchildsemi.com
9
Output Rise / Fall Time
Output load: CL = 50pF, RPU = 2.2kΩ, push / pull driver, and TA = -40°C to +85°C.
VCCO(10)
Symbol
4.5 to 5.5V 3.0 to 3.6V
Parameter
2.3 to 2.7V
1.65 to 1.95V
Unit
Typical
trise
tfall
Output Rise Time; A Port, B Port(11)
(12)
Output Fall Time; A Port, B Port
3
4
5
7
ns
11
8
6
4
ns
Notes:
9. Output rise and fall times guaranteed by design simulation and characterization; not production tested.
10. VCCO is the VCC associated with the output side.
11. See Figure 11.
12. See Figure 12.
( )
Maximum Data Rate 13
Output load: CL = 50pF, RPU = 2.2kΩ, push-pull driver, and TA = -40°C to +85°C.
VCCB
VCCA
Direction
4.5 to 5.5V
3.0 to 3.6V
2.3 to 2.7V
1.65 to 1.95V
Unit
Minimum
4.5V to 5.5V
3.0V to 3.6V
2.3V to 2.7V
1.65V to 1.95V
A to B
26
20
16
9
B to A
26
20
16
9
A to B
26
20
16
9
B to A
26
20
16
9
A to B
26
20
16
9
B to A
26
20
16
9
A to B
26
20
16
9
B to A
26
20
16
9
Note:
13. F-toggle guaranteed by design simulation; not production tested.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
MHz
MHz
MHz
MHz
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Dynamic Output Electrical Characteristics
www.fairchildsemi.com
10
Output Load: CL = 50pF, RPU = 2.2kΩ, and TA = -40°C to +85°C.
VCCB
Symbol
Parameter
VCCA = 4.5 to 5.5V
A to B
tPLH
B to A
A to B
tPHL
B to A
OE to A
tPZL
OE to B
OE to A
tPLZ
OE to B
tskew
A Port, B Port(14)
VCCA = 3.0 to 3.6V
A to B
tPLH
B to A
A to B
tPHL
B to A
OE to A
tPZL
OE to B
OE to A
tPLZ
OE to B
tskew
A Port, B Port(14)
VCCA = 2.3 to 2.7V
A to B
tPLH
B to A
A to B
tPHL
B to A
OE to A
tPZL
OE to B
OE to A
tPLZ
OE to B
tskew
A Port, B Port(14)
VCCA = 1.65 to 1.95V
A to B
tPLH
B to A
A to B
tPHL
B to A
OE to A
tPZL
OE to B
OE to A
tPLZ
OE to B
tskew
A Port, B Port(14)
1.65 to 1.95V Units
4.5 to 5.5V
3.0 to 3.6V
2.3 to 2.7V
Typ.
Max.
Typ.
Max.
Typ.
Max.
Typ.
Max.
1
1
2
2
4
3
65
5
0.5
3
3
4
4
5
5
100
9
1.5
1
2
3
2
6
4
65
6
0.5
3
4
5
5
10
7
105
10
1.0
1
3
4
2
5
5
65
7
0.5
3
5
6
6
9
8
105
12
1.0
1
4
6
5
7
10
65
9
0.5
3
7
7
7
15
15
105
16
1.0
2.0
1.5
2
2
4
4
100
5
0.5
5.0
3.0
4
4
8
8
115
10
1.5
1.5
1.5
2
2
5
6
100
4
0.5
3.0
4.0
4
4
9
9
115
8
1.0
1.5
2.0
2
2
6
8
100
5
0.5
3.0
6.0
5
5
11
11
115
10
1.0
1.5
3.0
6
3
7
10
100
9
0.5
3.0
9.0
7
5
15
14
115
15
1.0
2.5
1.5
2
2
5
4.0
100
65
0.5
5.0
3.0
5
5
10
8.0
115
110
1.5
2.5
2.0
2
2
5
4.5
100
65
0.5
5.0
4.0
5
5
10
9.0
115
110
1.0
2.0
3.0
2
2
6
5.0
100
65
0.5
4.0
6.0
5
5
12
10.0
115
115
1.0
1.0
5.0
5
3
9.0
9.0
100
12
0.5
3.0
10.0
6
6
18.0
18.0
115
25
1.0
4.0
1.0
5
4
11
7.0
2.0
8
8
15
40.
1.0
3
3
11
7.0
2.0
7
7
14
5.0
1.5
3
3
14
8.0
3.0
7
7
28
5.0
5.0
8
3
14
10.0
10.0
9
7
23
6
75
75
0.5
14
115
115
1.5
6
75
75
0.5
14
115
115
1.0
6
75
75
0.5
14
115
115
1.0
9
75
75
0.5
19
115
115
1.0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
AC Characteristics(17)
ns
ns
Note:
14. Skew is the variation of propagation delay between output signals and applies only to output signals on the same
port (An or Bn) and switching with the same polarity (LOW-to-HIGH or HIGH-to-LOW) (see Figure 14). Skew is
guaranteed, but not tested.
15. AC Characteristic is guaranteed by Design and Characterization.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
11
TA = +25°C.
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance Control Pin (OE)
VCCA = VCCB = GND
2.2
pF
CI/O
Input / Output Capacitance, An, Bn
VCCA = VCCB = 5.0V, OE = GND
13.0
pF
Cpd
Power Dissipation Capacitance
VCCA = VCCB = 5.0V, VIN = 0V or VCC, f = 400KHz
13.5
pF
Figure 7. AC Test Circuit
Table 1.
Table 2.
Propagation Delay Table(17)
Test
Input Signal
Output Enable Control
tPLH, tPHL
Data Pulses
VCCA
tPZL (OE to An, Bn)
0V
LOW to HIGH Switch
tPLZ (OE to An, Bn)
0V
HIGH to LOW Switch
VCCO
CL
RL
1.8 ± 0.15V
50pF
2.2kΩ
2.5 ± 0.2V
50pF
2.2kΩ
3.3 ± 0.3V
50pF
2.2kΩ
5.0 ± 0.5V
50pF
2.2kΩ
AC Load Table
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Capacitance
www.fairchildsemi.com
12
DATA
IN
VCCI
Vmi
tpxx
OUTPUT
CONTROL
GND
tpxx
DATA
OUT
VCCO
DATA
OUT
VCCA
Symbol
Vmi
GND
tPLZ
Vx
VOL
VY
VOL
Figure 9. 3-STATE Output Low Enable Time(16)
Figure 8. Waveform for Inverting and Non-Inverting
Functions(16)
DATA
OUT
GND
tPZL
Vmo
OUTPUT
CONTROL
VCCA
Vmi
VCC
Vmi
VCCI / 2
Vmo
VCCO / 2
VX
0.5 x VCCO
VY
0.1 x VCCO
(16)
Figure 10. 3-STATE Output High Enable Time
Figure 11. Active Output Rise Time
Figure 12. Active Output Fall Time
VCCO
DATA
OUTPUT
Vmo
Vmo
GND
tperiod
DATA
IN
VCCI / 2
VCCI / 2
tskew
VCCI
GND
VCCO
DATA
OUTPUT
F-toggle rate, f = 1 / tperiod
tskew
Vmo
Vmo
GND
tskew = (tpHLmax – tpHLmin) or (tpLHmax – tpLHmin)
Figure 13. F-Toggle Rate
Figure 14.
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Timing Diagrams
Output Skew Time
Notes:
16. Input tR = tF = 2.0ns, 10% to 90% at VIN = 1.65V to 1.95V;
Input tR = tF = 2.0ns, 10% to 90% at VIN = 2.3 to 2.7V;
Input tR = tF = 2.5ns, 10% to 90%, at VIN = 3.0V to 3.6V only;
Input tR = tF = 2.5ns, 10% to 90%, at VIN = 4.5V to 5.5 only.
17. VCCI = VCCA for control pin OE or Vmi = (VCCA / 2).
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
13
1.80
0.10 C
A
(11X)
2.10
B
0.563
0.588
2X
1
1.80
0.40
2.10
PIN#1 IDENT
TOP VIEW
0.55 MAX.
0.10 C
0.10 C
(12X) 0.20
2X
RECOMMENDED
LAND PATTERN
0.152
0.45
0.35
0.08 C
0.05
0.00
0.10
SEATING C
PLANE
SIDE VIEW
0.10
0.10
DETAIL A
SCALE : 2X
NOTES:
0.35
(11X)
0.45
3
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
6
0.40
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
12
9
BOTTOM VIEW
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
0.25
0.15 (12X)
0.10 C A B
0.05 C
E. DRAWING FILENAME: MKT-UMLP12Arev4.
PACKAGE
EDGE
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
Figure 15. 12-Lead Ultrathin MLP, 1.8mm x 1.8mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
Physical Dimensions
www.fairchildsemi.com
14
FXMA2104 — Dual-Supply, 4-Bit Voltage Translator / Buffer / Repeater / for Open-Drain Applications
15
www.fairchildsemi.com
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1