STMICROELECTRONICS M4T32

M41T56
512 bit (64 bit x8) Serial Access TIMEKEEPER® SRAM
FEATURES SUMMARY
■
■
■
■
■
■
■
■
■
■
■
■
■
5V ±10% SUPPLY VOLTAGE
COUNTERS FOR SECONDS, MINUTES,
HOURS, DAY, DATE, MONTH, YEARS, AND
CENTURY
YEAR 2000 COMPLIANT
SOFTWARE CLOCK CALIBRATION
AUTOMATIC POWER-FAIL DETECT AND
SWITCH CIRCUITRY
I2C BUS COMPATIBLE
56 BYTES OF GENERAL PURPOSE RAM
ULTRA-LOW BATTERY SUPPLY CURRENT
OF 450nA
LOW OPERATING CURRENT OF 300µA
OPERATING TEMPERATURE OF –40 to
85°C
AUTOMATIC LEAP YEAR COMPENSATION
SPECIAL SOFTWARE PROGRAMMABLE
OUTPUT
PACKAGING OPTIONS INCLUDE:
– 28-lead SOIC and SNAPHAT® TOP (to be
ordered separately)
– SO8
Figure 1. 8-pin SOIC Package
8
1
SO8 (M)
150mil Width
Figure 2. 28-pin SOIC Package
SNAPHAT (SH)
Battery & Crystal
28
1
SOH28 (MH)
June 2004
1/24
M41T56
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. 8-pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. 28-pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3.
Table 1.
Figure 4.
Figure 5.
Figure 6.
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8-pin SOIC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
28-pin SOIC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2-Wire Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Bus not busy.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Start data transfer.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Stop data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Data valid. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Acknowledge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 7. Serial Bus Data Transfer Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 8. Acknowledge Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 9. Bus Timing Requirements Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
READ Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 10.Slave Address Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 11.READ Mode Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 12.Alternative READ Mode Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
WRITE Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Data Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 13.WRITE Mode Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CLOCK OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14.Crystal Accuracy Across Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15.Clock Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Output Driver Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Initial Power-on Defaults. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 5. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/24
M41T56
Figure 16.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 7. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. Crystal Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17.Power Down/Up Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 9. Power Down/Up Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 10. Power Down/Up Trip Points DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 18.SO8 – 8-pin Plastic Small Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11. SO8 – 8-pin Plastic Small Outline, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . 18
Figure 19.SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Outline. 19
Table 12. SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Mech. Data . . . . . 19
Figure 20.SH – 4-pin SNAPHAT Housing for 48mAh Battery & Crystal, Package Outline . . . . . . . 20
Table 13. SH – 4-pin SNAPHAT Housing for 48mAh Battery & Crystal, Package Mech. Data. . . . 20
Figure 21.SH – 4-pin SNAPHAT Housing for 120mAh Battery & Crystal, Package Outline . . . . . . 21
Table 14. SH – 4-pin SNAPHAT Housing for 120mAh Battery & Crystal, Package Mech. Data. . . 21
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 15. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 16. SNAPHAT Battery/Crystal Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
M41T56
SUMMARY DESCRIPTION
The M41T56 TIMEKEEPER® is a low power, 512bit static CMOS RAM organized as 64 words by 8
bits. A built-in 32,768Hz oscillator (external crystal
controlled) and the first 8 bytes of the RAM are
used for the clock/calendar function and are configured in binary coded decimal (BCD) format. Addresses and data are transferred serially via a twoline, bi-directional bus. The built-in address register is incremented automatically after each WRITE
or READ data byte.
The M41T56 clock has a built-in power sense circuit which detects power failures and automatically switches to the battery supply during power
failures. The energy needed to sustain the RAM
and clock operations can be supplied from a small
lithium coin cell.
Typical data retention time is in excess of 10 years
with a 50mAh, 3V lithium cell. The M41T56 is supplied in an 8-lead Plastic SOIC package or a 28lead SNAPHAT® package.
The 28-pin, 330mil SOIC provides sockets with
gold plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design
allows the SNAPHAT battery package to be
mounted on top of the SOIC package after the
completion of the surface mount process. Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to
the high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion. The SOIC and battery/crystal packages are shipped separately in plastic antistatic tubes or in Tape & Reel form.
For the 28-lead SOIC, the battery/crystal package
(e.g., SNAPHAT) part number is “M4TxxBR12SH” (see Table 16., page 22).
Caution: Do not place the SNAPHAT battery/crystal package “M4Txx-BR12SH” in conductive foam
as this will drain the lithium button-cell battery.
Figure 3. Logic Diagram
Table 1. Signal Names
VCC
VBAT
OSCO
OSCI
SCL
M41T56
SDA
FT/OUT
VSS
AI02304B
4/24
OSCI
Oscillator Input
OCSO
Oscillator Output
FT/OUT
Frequency Test / Output Driver
(Open Drain)
SDA
Serial Data Address Input / Output
SCL
Serial Clock
VBAT
Battery Supply Voltage
VCC
Supply Voltage
VSS
Ground
M41T56
Figure 4. 8-pin SOIC Connections
OSCI
OSCO
VBAT
VSS
M41T56
1
8
2
7
3
6
4
5
VCC
FT/OUT
SCL
SDA
AI02306B
Figure 5. 28-pin SOIC Connections
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
VSS
VCC
NC
FT/OUT
NC
NC
NC
NC
NC
SCL
NC
NC
NC
SDA
NC
28
1
2
27
3
26
4
25
5
24
6
23
7
22
M41T56
8
21
9
20
10
19
11
18
12
17
13
16
14
15
AI03607
Figure 6. Block Diagram
1 Hz
OSCI
OSCILLATOR
32.768 kHz
DIVIDER
SECONDS
MINUTES
CENTURY/HOURS
OSCO
DAY
FT/OUT
VCC
VSS
VBAT
SCL
SDA
DATE
VOLTAGE
SENSE
and
SWITCH
CIRCUITRY
SERIAL
BUS
INTERFACE
MONTH
CONTROL
LOGIC
YEAR
CONTROL
RAM
(56 x 8)
ADDRESS
REGISTER
AI02566
5/24
M41T56
OPERATION
The M41T56 clock operates as a slave device on
the serial bus. Access is obtained by implementing
a start condition followed by the correct slave address (D0h). The 64 bytes contained in the device
can then be accessed sequentially in the following
order:
1. Seconds Register
2. Minutes Register
3. Century/Hours Register
4. Day Register
5. Date Register
6. Month Register
7. Years Register
8. Control Register
9 to 64.RAM
The clock continually monitors VCC for an out of
tolerance condition. Should VCC fall below VPFD,
the device terminates an access in progress and
resets the device address counter. Inputs to the
device will not be recognized at this time to prevent erroneous data from being written to the device from an out of tolerance system. When VCC
falls below VBAT, the device automatically switches over to the battery and powers down into an ultra low current mode of operation to conserve
battery life. Upon power-up, the device switches
from battery to VCC at VBAT and recognizes inputs
when VCC goes above VPFD volts.
2-Wire Bus Characteristics
This bus is intended for communication between
different ICs. It consists of two lines: one bi-directional for data signals (SDA) and one for clock signals (SCL). Both the SDA and the SCL lines must
be connected to a positive supply voltage via a
pull-up resistor.
The following protocol has been defined:
– Data transfer may be initiated only when the
bus is not busy.
– During data transfer, the data line must remain
stable whenever the clock line is High.
– Changes in the data line while the clock line is
High will be interpreted as control signals.
Accordingly, the following bus conditions have
been defined:
6/24
Bus not busy. Both data and clock lines remain
High.
Start data transfer. A change in the state of the
data line, from High to Low, while the clock is High,
defines the START condition.
Stop data transfer. A change in the state of the
data line, from Low to High, while the clock is High,
defines the STOP condition.
Data valid. The state of the data line represents
valid data when after a start condition, the data line
is stable for the duration of the High period of the
clock signal. The data on the line may be changed
during the Low period of the clock signal. There is
one
clock
pulse
per
bit
of
data.
Each data transfer is initiated with a start condition
and terminated with a stop condition. The number
of data bytes transferred between the start and
stop conditions is not limited. The information is
transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition, a device that gives out a message is
called “transmitter,” the receiving device that gets
the message is called “receiver.” The device that
controls the message is called “master.” The devices that are controlled by the master are called
“slaves.”
Acknowledge. Each byte of eight bits is followed
by one Acknowledge Bit. This Acknowledge Bit is
a low level put on the bus by the receiver, whereas
the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed is obliged to
generate an acknowledge after the reception of
each byte. Also, a master receiver must generate
an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter.
The device that acknowledges has to pull down
the SDA line during the acknowledge clock pulse
in such a way that the SDA line is a stable Low during the High period of the acknowledge related
clock pulse. Of course, setup and hold times must
be taken into account. A master receiver must signal an end-of-data to the slave transmitter by not
generating an acknowledge on the last byte that
has been clocked out of the slave. In this case, the
transmitter must leave the data line High to enable
the master to generate the STOP condition.
M41T56
Figure 7. Serial Bus Data Transfer Sequence
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
START
CONDITION
CHANGE OF
DATA ALLOWED
STOP
CONDITION
AI00587
Figure 8. Acknowledge Sequence
CLOCK PULSE FOR
ACKNOWLEDGEMENT
START
SCLK FROM
MASTER
DATA OUTPUT
BY TRANSMITTER
1
MSB
2
8
9
LSB
DATA OUTPUT
BY RECEIVER
AI00601
7/24
M41T56
Figure 9. Bus Timing Requirements Sequence
SDA
tBUF
tHD:STA
tHD:STA
tR
tF
SCL
tHIGH
P
S
tLOW
tSU:DAT
tHD:DAT
tSU:STA
tSU:STO
SR
P
AI00589
Table 2. AC Characteristics
Parameter(1)
Symbol
Min
Max
Unit
0
100
kHz
fSCL
SCL Clock Frequency
tLOW
Clock Low Period
4.7
µs
tHIGH
Clock High Period
4
µs
tR
SDA and SCL Rise Time
1
µs
tF
SDA and SCL Fall Time
300
ns
tHD:STA
START Condition Hold Time
(after this period the first clock pulse is generated)
tSU:STA
4
µs
START Condition Setup Time
(only relevant for a repeated start condition)
4.7
µs
tSU:DAT
Data Setup Time
250
ns
tHD:DAT(2)
Data Hold Time
0
µs
STOP Condition Setup Time
4.7
µs
Time the bus must be free before a new transmission can start
4.7
µs
tSU:STO
tBUF
Note: 1. Valid for Ambient Operating Temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).
2. Transmitter must internally provide a hold time to bridge the undefined region (300ns max.) of the falling edge of SCL.
8/24
M41T56
READ Mode
In this mode, the master reads the M41T56 slave
after setting the slave address (see Figure 10 and
Figure 11., page 9). Following the WRITE Mode
Control Bit (R/W = 0) and the Acknowledge Bit, the
word address An is written to the on-chip address
pointer. Next the START condition and slave address are repeated, followed by the READ Mode
Control Bit (R/W = 1). At this point, the master
transmitter becomes the master receiver. The data
byte which was addressed will be transmitted and
the master receiver will send an Acknowledge Bit
to the slave transmitter. The address pointer is
only incremented on reception of an Acknowledge
Bit. The M41T56 slave transmitter will now place
the data byte at address An + 1 on the bus. The
master receiver reads and acknowledges the new
byte and the address pointer is incremented to An
+ 2. This cycle of reading consecutive addresses
will continue until the master receiver sends a
STOP condition to the slave transmitter.
An alternate READ Mode may also be implemented, whereby the master reads the M41T56 slave
without first writing to the (volatile) address pointer. The first address that is read is the last one
stored in the pointer, see Figure 12., page 10.
Figure 10. Slave Address Location
R/W
START
A
LSB
MSB
SLAVE ADDRESS
1
1
0
1
0
0
0
AI00602
ACK
DATA n+1
ACK
DATA n
ACK
S
ACK
BUS ACTIVITY:
R/W
START
R/W
WORD
ADDRESS (n)
S
SLAVE
ADDRESS
STOP
SLAVE
ADDRESS
DATA n+X
P
NO ACK
SDA LINE
ACK
BUS ACTIVITY:
MASTER
START
Figure 11. READ Mode Sequence
AI00899
9/24
M41T56
STOP
DATA n+X
SLAVE
ADDRESS
P
NO ACK
BUS ACTIVITY:
DATA n+1
ACK
DATA n
ACK
S
ACK
SDA LINE
ACK
BUS ACTIVITY:
MASTER
R/W
START
Figure 12. Alternative READ Mode Sequence
AI00895
Data Retention Mode
With valid VCC applied, the M41T56 can be accessed as described above with READ or WRITE
cycles. Should the supply voltage decay, the
M41T56 will automatically deselect, write protecting itself when VCC falls between VPFD (max) and
VPFD (min). This is accomplished by internally inhibiting access to the clock registers and SRAM.
When VCC falls below the Battery Back-up
Switchover Voltage (VSO), power input is switched
from the VCC pin to the battery and the clock registers and SRAM are maintained from the attached
battery supply.
All outputs become high impedance. On power up,
when VCC returns to a nominal value, write protection continues for tREC.
For a further more detailed review of battery lifetime calculations, please see Application Note
AN1012.
WRITE Mode
In this mode the master transmitter transmits to
the M41T56 slave receiver. Bus protocol is shown
in Figure 13., page 10. Following the START condition and slave address, a logic '0' (R/W = 0) is
placed on the bus and indicates to the addressed
device that word address An will follow and is to be
written to the on-chip address pointer. The data
word to be written to the memory is strobed in next
and the internal address pointer is incremented to
the next memory location within the RAM on the
reception of an acknowledge clock. The M41T56
slave receiver will send an acknowledge clock to
the master transmitter after it has received the
slave address and again after it has received the
word address and each data byte (see Figure 10).
SLAVE
ADDRESS
DATA n+X
P
ACK
DATA n+1
ACK
DATA n
ACK
BUS ACTIVITY:
10/24
STOP
R/W
WORD
ADDRESS (n)
S
ACK
SDA LINE
ACK
BUS ACTIVITY:
MASTER
START
Figure 13. WRITE Mode Sequence
AI00591
M41T56
CLOCK OPERATION
The eight byte clock register (see Table 3) is used
to both set the clock and to read the date and time
from the clock, in a binary coded decimal format.
Seconds, Minutes, and Hours are contained within
the first three registers. Bits D6 and D7 of Clock
Register 2 (Hours Register) contain the CENTURY ENABLE Bit (CEB) and the CENTURY Bit
(CB). Setting CEB to a '1' will cause CB to toggle,
either from '0' to '1' or from '1' to '0' at the turn of
the century (depending upon its initial state). If
CEB is set to a '0,' CB will not toggle. Bits D0
through D2 of Register 3 contain the Day (day of
week). Registers 4, 5, and 6 contain the Date (day
of month), Month, and Years. The final register is
the Control Register (this is described in the Clock
Calibration section). Bit D7 of Register 0 contains
the STOP Bit (ST). Setting this bit to a '1' will cause
the oscillator to stop.
If the device is expected to spend a significant
amount of time on the shelf, the oscillator may be
stopped to reduce current drain. When reset to a
'0' the oscillator restarts within one second.
The seven Clock Registers may be read one byte
at a time, or in a sequential block. The Control
Register (Address location 7) may be accessed independently. Provision has been made to assure
that a clock update does not occur while any of the
seven clock addresses are being read. If a clock
address is being read, an update of the clock registers will be delayed by 250ms to allow the READ
to be completed before the update occurs. This
will prevent a transition of data during the READ.
Note: This 250ms delay affects only the clock register update and does not alter the actual clock
time.
Table 3. Register Map
Data
Function/Range
BCD Format
Address
D7
D5
D4
D3
D2
D1
D0
0
ST
10 Seconds
Seconds
Seconds
00-59
1
X
10 Minutes
Minutes
Minutes
00-59
2
CEB (1)
CB
Hours
Century/Hours
0-1/00-23
3
X
X
Day
01-07
4
X
X
Date
Date
01-31
5
X
X
Month
Month
01-12
Years
Year
00-99
6
7
Keys:
D6
10 Hours
X
10 Date
X
10 Years
OUT
FT
S = SIGN Bit
FT = FREQUENCY TEST Bit
ST = STOP Bit
OUT = Output level
X
S
10 M.
X
Day
Calibration
Control
X = Don't care
CEB = Century Enable Bit
CB = Century Bit
Note: 1. When CEB is set to '1,' CB will toggle from '0' to '1' or from '1' to '0' every 100 years (dependent upon the initial value set).
2. When CEB is set to '0,' CB will not toggle.
11/24
M41T56
Clock Calibration
The M41T56 is driven by a quartz-controlled oscillator with a nominal frequency of 32,768Hz. The
devices are tested not to exceed 35 ppm (parts per
million) oscillator frequency error at 25°C, which
equates to about ±1.53 minutes per month. With
the calibration bits properly set, the accuracy of
each M41T56 improves to better than ±2 ppm at
25°C.
The oscillation rate of any crystal changes with
temperature (see Figure 14., page 13). Most clock
chips compensate for crystal frequency and temperature shift error with cumbersome “trim” capacitors. The M41T56 design, however, employs
periodic counter correction. The calibration circuit
adds or subtracts counts from the oscillator divider
circuit at the divide by 256 stage, as shown in Figure 14., page 13. The number of times pulses are
blanked (subtracted, negative calibration) or split
(added, positive calibration) depends upon the
value loaded into the five-bit Calibration Byte
found in the Control Register. Adding counts
speeds the clock up, subtracting counts slows the
clock down.
The Calibration Byte occupies the five lower order
bits (D4-D0) in the Control Register (Addr 7). This
byte can be set to represent any value between 0
and 31 in binary form. Bit D5 is the Sign Bit; '1' indicates positive calibration, '0' indicates negative
calibration. Calibration occurs within a 64 minute
cycle. The first 62 minutes in the cycle may, once
per minute, have one second either shortened by
128 or lengthened by 256 oscillator cycles. If a binary '1' is loaded into the register, only the first 2
minutes in the 64 minutes cycle will be modified; if
a binary 6 is loaded, the first 12 will be affected,
and so on.
12/24
Therefore, each calibration step has the effect of
adding 512 or subtracting 256 oscillator cycles for
every 125,829,120 actual oscillator cycles, that is
+4.068 or –2.034 ppm of adjustment per calibration step in the calibration register. Assuming that
the oscillator is in fact running at exactly 32,768Hz,
each of the 31 increments in the Calibration Byte
would represent +10.7 or –5.35 seconds per
month which corresponds to a total range of +5.5
or –2.75 minutes per month.
Two methods are available for ascertaining how
much calibration a given M41T56 may require.
The first involves simply setting the clock, letting it
run for a month and comparing it to a known accurate reference (like WWV broadcasts). While that
may seem crude, it allows the designer to give the
end user the ability to calibrate his clock as his environment may require, even after the final product
is packaged in a non-user serviceable enclosure.
All the designer has to do is provide a simple utility
that accessed the Calibration Byte.
The second approach is better suited to a manufacturing environment, and involves the use of
some test equipment. When the Frequency Test
(FT) Bit, the seventh-most significant bit in the
Control Register, is set to a '1,' and the oscillator is
running at 32,768Hz, the FT/OUT pin of the device
will toggle at 512Hz. Any deviation from 512Hz indicates the degree and direction of oscillator frequency shift at the test temperature.
For example, a reading of 512.01024Hz would indicate a +20ppm oscillator frequency error, requiring a –10(XX001010) to be loaded into the
Calibration Byte for correction.
Note: Setting or changing the Calibration Byte
does not affect the Frequency Test output frequency.
M41T56
Figure 14. Crystal Accuracy Across Temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
∆F = K x (T –T )2
O
F
–100
K = –0.036 ppm/°C2 ± 0.006 ppm/°C2
–120
TO = 25°C ± 5°C
–140
–160
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
Temperature °C
AI00999b
Figure 15. Clock Calibration
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
AI00594B
13/24
M41T56
Output Driver Pin
When the FT Bit is not set, the FT/OUT pin becomes an output driver that reflects the contents of
D7 of the Control Register. In other words, when
D6 of location 7 is a '0' and D7 of location 7 is a '0'
and then the FT/OUT pin will be driven low.
Note: The FT/OUT pin is open drain which requires an external pull-up resistor.
Initial Power-on Defaults
Upon initial application of power to the device, the
FT Bit will be set to a '0' and the OUT Bit will be set
to a '1.' All other Register bits will initially power-on
in a random state.
MAXIMUM RATING
Stressing the device above the rating listed in the
“Absolute Maximum Ratings” table may cause
permanent damage to the device. These are
stress ratings only and operation of the device at
these or any other conditions above those indicated in the Operating sections of this specification is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability.
Refer
also
to
the
STMicroelectronics SURE Program and other relevant quality documents.
Table 4. Absolute Maximum Ratings
Symbol
TA
TSTG
TSLD(1,2)
Parameter
Ambient Operating Temperature
Storage Temperature (VCC Off, Oscillator Off)
Lead Solder Temperature for 10 seconds
Value
Unit
–40 to 85
°C
SNAPHAT
–40 to 85
SOIC
–55 to 125
°C
260
°C
VIO
Input or Output Voltages
–0.3 to 7
V
VCC
Supply Voltage
–0.3 to 7
V
IO
Output Current
20
mA
PD
Power Dissipation
0.25
W
Note: 1. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget not to exceed 180°C for
between 90 to 150 seconds).
2. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C
for greater than 30 seconds).
CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
14/24
M41T56
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, as well as the DC and AC
characteristics of the device. The parameters in
the following DC and AC Characteristic tables are
derived from tests performed under the Measure-
ment Conditions listed in the relevant tables. Designers should check that the operating conditions
in their projects match the measurement conditions when using the quoted parameters.
Table 5. Operating and AC Measurement Conditions
Parameter
Value
Unit
Supply Voltage (VCC)
4.5 to 5.5
V
Ambient Operating Temperature (TA)
–40 to 85
°C
Load Capacitance (CL)
100
pF
Input Rise and Fall Times
≤5
ns
0 to 3
V
1.5
V
Input Pulse Voltages
Input and Output Timing Ref. Voltages
Note: Output Hi-Z is defined as the point where data is no longer driven.
Figure 16. AC Measurement I/O Waveform
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI02568
Table 6. Capacitance
Symbol
CIN
COUT(3)
tLP
Parameter(1,2)
Max
Unit
Input Capacitance (SCL)
7
pF
Output Capacitance (SDA, FT/OUT)
10
pF
1
µs
Low-pass filter input time constant (SDA and SCL)
Min
0.25
Note: 1. Effective capacitance measured with power supply at 5V; sampled, not 100% tested.
2. At 25°C, f = 1MHz.
3. Outputs deselected.
15/24
M41T56
Table 7. DC Characteristics
Symbol
Test Condition(1)
Parameter
Min
Typ
Max
Unit
0V ≤ VIN ≤ VCC
±1
µA
0V ≤ VOUT ≤ VCC
±1
µA
Switch Frequency = 100kHz
300
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC1
Supply Current
ICC2
Supply Current (Standby)
VIL
Input Low Voltage
–0.3
1.5
V
VIH
Input High Voltage
3
VCC + 0.8
V
VOL
Output Low Voltage
0.4
V
3
3.5
V
450
550
nA
VBAT(2)
Battery Supply Voltage
IBAT
Battery Supply Current
SCL, SDA = VCC – 0.3V
100
µA
IOL = 5mA, VCC = 4.5V
2.5
TA = 25°C, VCC = 0V,
Oscillator ON, VBAT = 3V
Note: 1. Valid for Ambient Operating Temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).
2. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply.
Table 8. Crystal Electrical Characteristics
Symbol
Parameter(1,2,3)
fO
Resonant Frequency
RS
Series Resistance
CL
Load Capacitance
Min
Typ
Max
32.768
kHz
60
12.5
Unit
kΩ
pF
Note: 1. These values are externally supplied if using the SO8 package. STMicroelectronics recommends the KDS DT-38: 1TA/
1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S: 1TJS125FH2A212, (SMD) quartz crystal for industrial temperature
operations. KDS can be contacted at [email protected] or http://www.kdsj.co.jp for further information on this crystal type.
2. Load capacitors are integrated within the M41T56. Circuit board layout considerations for the 32.768 kHz crystal of minimum trace
lengths and isolation from RF generating signals should be taken into account.
3. All SNAPHAT battery/crystal tops meet these specifications.
16/24
M41T56
Figure 17. Power Down/Up Mode AC Waveforms
VCC
VPFD
VSO
tPD
tFB
tRB
SDA
SCL
tREC
IBAT
DATA RETENTION TIME
AI00595
Table 9. Power Down/Up Mode AC Characteristics
Symbol
Parameter(1)
tPD
SCL and SDA at VIH before Power Down
tFB
Min
Max
Unit
0
ns
VPFD (min) to VSS VCC Fall Time
300
µs
tRB
VSS to VPFD (min) VCC Rise Time
100
µs
tREC
SCL and SDA at VIH after Power Up
10
µs
Note: 1. Valid for Ambient Operating Temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).
Table 10. Power Down/Up Trip Points DC Characteristics
Symbol
Parameter(1,2)
VPFD
Power-fail Deselect Voltage
VSO
Battery Back-up Switchover Voltage
Min
Typ
Max
Unit
1.2 VBAT
1.25 VBAT
1.285 VBAT
V
VBAT
V
Note: 1. All voltages referenced to VSS.
2. Valid for Ambient Operating Temperature: TA = –40 to 85°C; VCC = 4.5 to 5.5V (except where noted).
17/24
M41T56
PACKAGE MECHANICAL INFORMATION
Figure 18. SO8 – 8-pin Plastic Small Package Outline
h x 45˚
A
C
B
CP
e
D
N
E
H
1
A1
α
L
SO-a
Note: Drawing is not to scale.
Table 11. SO8 – 8-pin Plastic Small Outline, Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
A
1.35
A1
Min
Max
1.75
0.053
0.069
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
–
–
–
–
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
0.90
0.016
0.035
α
0°
8°
0°
8°
N
8
e
CP
18/24
1.27
Typ
0.050
8
0.10
0.004
M41T56
Figure 19. SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Outline
A2
A
C
B
eB
e
CP
D
N
E
H
A1
α
L
1
SOH-A
Note: Drawing is not to scale.
Table 12. SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Mech. Data
mm
inches
Symb
Typ
Min
A
Max
Typ
Min
3.05
Max
0.120
A1
0.05
0.36
0.002
0.014
A2
2.34
2.69
0.092
0.106
B
0.36
0.51
0.014
0.020
C
0.15
0.32
0.006
0.012
D
17.71
18.49
0.697
0.728
E
8.23
8.89
0.324
0.350
–
–
–
–
eB
3.20
3.61
0.126
0.142
H
11.51
12.70
0.453
0.500
L
0.41
1.27
0.016
0.050
α
0°
8°
0°
8°
N
28
e
CP
1.27
0.050
28
0.10
0.004
19/24
M41T56
Figure 20. SH – 4-pin SNAPHAT Housing for 48mAh Battery & Crystal, Package Outline
A1
eA
A2
A3
A
B
L
eB
D
E
SHTK-A
Note: Drawing is not to scale.
Table 13. SH – 4-pin SNAPHAT Housing for 48mAh Battery & Crystal, Package Mech. Data
mm
inches
Symb
Typ
Min
A
Typ
Min
9.78
Max
0.385
A1
6.73
7.24
0.265
0.285
A2
6.48
6.99
0.255
0.275
A3
20/24
Max
0.38
0.015
B
0.46
0.56
0.018
0.022
D
21.21
21.84
0.835
0.860
E
14.22
14.99
0.560
0.590
eA
15.55
15.95
.6122
.6280
eB
3.20
3.61
0.126
0.142
L
2.03
2.29
0.080
0.090
M41T56
Figure 21. SH – 4-pin SNAPHAT Housing for 120mAh Battery & Crystal, Package Outline
A1
eA
A2
A3
A
B
L
eB
D
E
SHTK-B
Note: Drawing is not to scale.
Table 14. SH – 4-pin SNAPHAT Housing for 120mAh Battery & Crystal, Package Mech. Data
mm
inches
Symb
Typ
Min
A
Max
Typ
Min
10.54
Max
0.415
A1
8.00
8.51
0.315
0.335
A2
7.24
8.00
0.285
0.315
A3
0.38
0.015
B
0.46
0.56
0.018
0.022
D
21.21
21.84
0.835
0.860
E
17.27
18.03
0.680
0.710
eA
15.55
15.95
.6122
.6280
eB
3.20
3.61
0.126
0.142
L
2.03
2.29
0.080
0.090
21/24
M41T56
PART NUMBERING
Table 15. Ordering Information Scheme
Example:
M41T
56
M
6
E
Device Type
M41T
Supply Voltage and Write Protect Voltage
56 = VCC = 4.5 to 5.5V
Package
M = SO8
MH(1) = SOH28
Temperature Range
6 = –40 to 85°C
Shipping Method
For SO8:
blank = Tubes (Not for New Design - Use E)
E = Lead-free Package (ECO
PACK®), Tubes
F = Lead-free Package (ECO
PACK®), Tape & Reel
TR = Tape & Reel (Not for New Design - Use F)
For SOH28:
blank = Tubes (Not for New Design - Use E)
E = Lead-free Package (ECO
PACK®), Tubes
F = Lead-free Package (ECO
PACK®), Tape & Reel
TR = Tape & Reel (Not for New Design - Use F)
Note: 1. The SOIC package (SOH28) requires the SNAPHAT® battery package which is ordered separately under the part number
“M4Txx-BR12SHx” in plastic tube or “M4Txx-BR12SHxTR” in Tape & Reel form (see Table 16).
Caution: Do not place the SNAPHAT battery package “M4TXX-BR12SH” in conductive foam as it will drain the lithium button-cell battery.
For other options, or for more information on any aspect of this device, please contact the ST Sales Office
nearest you.
Table 16. SNAPHAT Battery/Crystal Table
Part Number
Description
Package
M4T28-BR12SH
Lithium Battery (48mAh)/Crystal SNAPHAT
SH
M4T32-BR12SH
Lithium Battery (120mAh)/Crystal SNAPHAT
SH
22/24
M41T56
REVISION HISTORY
Table 17. Document Revision History
Date
Rev. #
Revision Details
March 1999
1.0
First Issue
12/23/99
1.1
SOH28 package added
03/21/00
1.2
Series Resistance Max Value Changed (Table 8)
11/30/00
1.3
Added PSDIP8 package
01/25/01
1.4
Corrected graphic, measurements of PSDIP8 (Figure 20, Table 14)
02/16/01
2.0
Reformatted, table added (Table 16)
04/06/01
2.1
Add temp./voltage information to characteristics (Tables 7, 2); correct Series Resistance
(Table 8)
07/17/01
2.2
Basic formatting changes
08/02/02
2.3
Modify reflow time and temperature footnote (Table 4); modify Crystal Electrical
Characteristics table footnotes (Table 8); removed PSDIP8 package
11/07/02
2.4
Correct figure name (Figure 1)
15-Jun-04
3.0
Reformatted; add Lead-free information; update characteristics (Figure 14; Table 4, 15)
23/24
M41T56
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
© 2004 STMicroelectronics - All rights reserved
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24/24