STMICROELECTRONICS TH562

SD1731 (TH562)
RF POWER BIPOLAR TRANSISTORS
HF SSB APPLICATIONS
FEATURES SUMMARY
■ OPTIMIZED FOR SSB
Figure 1. Package
■
30 MHz
■
50 VOLTS
■
EFFICIENCY 40%
■
COMMON EMITTER
■
GOLD METALLIZATION
■
POUT = 220 W PEP WITH 13 dB GAIN
DESCRIPTION
The SD1731 is a 50 V epitaxial silicon NPN planar
transistor designed primarily for SSB communications. This device utilizes emitter ballasting for improved ruggedness and reliability.
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.500 4L FL (M174)
epoxy sealed
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Figure 2. Pin Connection
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1. Collector
2. Emitter
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3. Base
4. Emitter
Table 1. Order Codes
Order Codes
Marking
Package
Packaging
SD1731 (TH562)
SD1731
M174
PLASTIC TRAYS
REV. 2
June 2004
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SD1731 (TH562)
Table 2. Absolute Maximum Ratings (Tcase = 25°C)
Symbol
Parameter
Value
Unit
VCBO
Collector-Base Voltage
110
V
VCEO
Collector-Emitter Voltage
55
V
VEBO
Emitter-Base Voltage
4.0
V
Device Current
20
A
Power Dissipation (Theatsink ≤ 25°C)
233
W
TJ
Junction Temperature
+200
°C
TSTG
Storage Temperature
– 65 to +150
°C
Value
Unit
IC
PDISS
Table 3. Thermal Data
Symbol
Parameter
RTH(j-c)
Junction-Case Thermal Resistance
0.55
RTH(c-s)
Case-Heatsink Thermal Resistance
0.2
ELECTRICAL SPECIFICATIONS
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Table 4. Static (Tcase = 25°C)
Symbol
Test Conditions
BVCBO
IC = 200 mA; IE = 0 mA
BVCEO
IC = 200 mA; IB = 0 mA
BVEBO
IE = 20 mA; IC = 0 mA
ICEO
VCE = 30 V; IE = 0 mA
ICES
VCE = 55 V; IE = 0 mA
hFE
VCE = 6 V; IC = 10 A
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°C/W
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Value
Unit
Min.
Typ.
Max.
110
—
—
V
55
—
—
V
4.0
—
—
V
—
—
5
mA
—
—
10
mA
15
—
80
—
Table 5. Dynamic (Theatsink = 25°C)
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Unit
Min.
Typ.
Max.
POUT
f = 30 MHz; VCE = 50 V; ICQ = 150 mA
220
—
—
W
GP(1)
POUT = 220 W PEP; VCE = 50 V; ICQ = 150 mA
13
—
—
dB
IMD(1)
POUT = 220 W PEP; VCE = 50 V; ICQ = 150 mA
—
—
–30
dBc
ηc(1)
POUT = 220 W PEP; VCE = 50 V; ICQ = 150 mA
40
—
—
%
COB
f = 1 MHz; VCB = 50 V
—
330
—
pF
Note: 1. f1 = 30.00 MHz, f2 = 30.001 MHz
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Value
Test Conditions
SD1731 (TH562)
TYPICAL PERFORMANCE
Figure 3. Power Output PEP vs Power Input
Figure 4. Collector Efficiency vs Power Output
PEP
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Figure 5. Intermodulation Distortion vs Power Output PEP
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SD1731 (TH562)
Figure 6. Power Gain vs Power Output PEP
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Figure 7. Collector Base Capacitance vs Collector Emitter Voltage
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SD1731 (TH562)
TEST CIRCUIT
Figure 8. Test Circuit
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Table 6. Test Circuit
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C1
Arco 426 + 220pF + 330pF Chips
C2
2 x 10nF Chips
C3
Arco 4615 + 2.2nF + 2 x 1nF LCC + 4.7nF + 560pf Chps
C4
Arco 4213 + 330pF Chip
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C5
10nF Chip
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C6
C7, C8, C9, C10, C11
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L1
L2, L3
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3 x 10nF Chips
1nF + 10nF + 100nF + 4.7µF, 63V + 100µF, 63V
3 Turns of 1.2mm Unenameled Wire Diameter, 7.1mm, Length 13mm
8 Turns of 0.55mm Enameled Wire on Ferrite Core Phillips 4C6 97170 (9 x 6 x 3)
10 Turns of 1.2mm Enameled Wire, Diameter 8.1mm, Length 20mm
L5
7 Turns of 1.2mm Enameled Wire on Ferrite Core Phillips 4C6 97180
T1
6:3.5 Impedance Transformer on toriod Phillips 4C6 97180
T2
Twisted Pair 4:1 Transformer, 4 Turns Made with 1.0mm Enameled on toriod Phillips
4C6 97180
T3
Feedback Transformer Primary: 2 Turns of 1mm Enameled Wire Secondary: 8 Turns
of 1mm Enameled Wire
T4
Twisted Pair 4:1 Transformer, 4 Turns of bifilar Twisted 1.2mm Wires on Ferrite Core
Phillips 4C6 97200
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SD1731 (TH562)
Figure 9. Mounting Circuit
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BIAS CIRCUIT
Figure 10. Bias Circuit
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SD1731 (TH562)
PACKAGE MECHANICAL
Table 7. M174 Mechanical Data
millimeters
Symbol
A
Min
Typ
5.59
B
inches
Max
Min
5.84
0.220
Typ
Max
0.230
3.18
0.125
C
6.22
6.48
0.245
0.255
D
18.28
18.54
0.720
0.730
E
3.18
0.125
F
24.64
24.89
0.970
0.980
G
12.57
12.83
0.495
0.505
H
0.08
0.18
0.003
0.007
I
2.29
2.79
0.090
0.110
J
4.06
4.45
0.160
K
7.11
L
26.67
uc
Figure 11. M174 Package Dimensions
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0.280
1.050
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Note: Drawing is not to scale.
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SD1731 (TH562)
REVISION HISTORY
Table 8. Revision History
Date
Revision
Description of Changes
July-1995
1
First Issue
8-June-2004
2
Stylesheet update. No content change.
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SD1731 (TH562)
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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