MOLEX 48050-0001

1.30mm (.051") Pitch miniSD
Memory Card Connector
FEATURES AND SPECIFICATIONS
Molex offers 2 more miniSD card connector to its existing range
47457
Top Mount
Push-push
SMT
Small and compact, the miniSD connector is about 30% smaller than the
original Secure Digital (SD*) connector. This reduction in size allows the
design of smaller applications with SD architecture interface. The miniSD card
is backward compatible with the SD connector via a card an adaptor which
provides user the flexibility of having a miniSD card for both SD and miniSD
applications.
Some of the design features include molded spring for strong card retention,
effective metal shielding against EMI, RFI and ESD. A detect switch is
deployed to ensure the connectivity of card to connector. The push-push
feature aids user in inserting and extracting the card.
Molex miniSD card connector comes in standard and reverse mount versions.
Please refer to Molex's Website and the Miniature Memory Card Catalog
available in Literature Central for Molex's full range of miniSD connectors.
Features
48050
Bottom Mount
Push-Push
SMT
Benefits
• Card detect switch
• Confirms card presence
• Read/Write protection switch
• Provides protection of content in the SD
Card
• Low profile, compact size
• Space savings
• Metal shield
• EMI/RFI and ESD protection
• Solder tabs
• Strong retention of connector to PCB
• Beveled spring terminal design
• Secure mating of card to connector
*miniSD and SD is a registered trademark of Secure Digital Association
SPECIIFICATIONS
Reference Information
Packaging: Embossed Tape on Reel
UL File No.:
CSA File No.:
Uses With: miniSD memory card
Designed In: mm
Electrical
Current: 0.5A
Voltage: 10V max
Contact Resistance: 40 milliohms max.
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 milliohms min
Mechanical
Insertion Force: 5±1.5 N (0.51±0.15 kgf)
Unmating Force: 5±1.5 N (0.51±0.15
kgf)
Durability: 10,000 cycles
Physical
Housing: Thermoplastic, High
Temperature,
UL 94V-0
Contact: Copper (Cu) Alloy
Plating:
Contact Area — Gold (Au)
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 1.2mm (.045")
Operating Temperature: -25°C to +90°C
1.30mm (.051") Pitch miniSD
Memory Card Connector
MARKETS AND APPLICATIONS
Markets and Applications
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47457
Top Mount
Push-push
SMT
Mobile phones
PDA
Digital Still Camera
Digital Video Camera
Portable digital audio player
GPS
Mobile phone
DSC
48050
Bottom Mount
Push-Push
SMT
DVC
GPS
PDA
Portable audio player
ORDERING INFORMATION
Description
1.30mm (.051") Pitch miniSD Memory Card Connector,
Top Mount Type
1.30mm (.051") Pitch miniSD Memory Card Connector,
Reverse Mount Type
Americas Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
1-800-78MOLEX
[email protected]
Asia Pacific North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
[email protected]
Lead free
Order No.
Remarks
47457-8001
With post
47457-8002
Without post
48050-0001
__
Asia Pacific South Headquarters
Jurong, Singapore
65-6-268-6868
[email protected]
European Headquarters
Munich, Germany
49-89-413092-0
[email protected]
Corporate Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
630-969-4550
Visit our Web site at http://www.molex.com
Order No. SNG-074
©2007, Molex