24AA64/24LC64/24FC64 64K I2C™ Serial EEPROM Device Selection Table Description: Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA64 1.7-5.5 400 kHz(1) I 24LC64 2.5-5.5 400 kHz I, E 24FC64 1.7-5.5 1 MHz(2) I Note 1: 2: <2.5V 100 kHz for 400 kHz for VCC <2.5V VCC Features: • Single-supply with operation down to 1.7V for 24AA64/24FC64 devices, 2.5V for 24LC64 devices • Low-power CMOS technology: - Active current 1 mA, typical - Standby current 1 μA, typical • 2-wire serial interface, I2C™ compatible • Schmitt Trigger inputs for noise suppression • Output slope control to eliminate ground bounce • 100 kHz and 400 kHz clock compatibility • 1 MHz clock for FC versions • Page write time 5 ms, typical • Self-timed erase/write cycle • 32-byte page write buffer • Hardware write-protect • ESD protection > 4,000V • More than 1 million erase/write cycles • Data retention > 200 years • Factory programming available • Packages include 8-lead PDIP, SOIC, TSSOP, MSOP and DFN • Pb-free and RoHS compliant • Temperature ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C The Microchip Technology Inc. 24AA64/24LC64/ 24FC64 (24XX64*) is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V, with standby and active currents of only 1 μA and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24XX64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN and MSOP packages. Package Types SOIC, TSSOP PDIP, MSOP A0 1 8 VCC A0 1 8 VCC A1 2 7 WP A1 2 7 WP A2 3 6 SCL A2 3 6 SCL VSS 4 5 SDA VSS 4 5 SDA DFN A0 1 A1 2 A2 3 VSS 4 8 VCC 7 WP 6 SCL 5 SDA Block Diagram HV Generator WP I/O Control Logic Memory Control Logic XDEC EEPROM Array Page Latches I/O SCL YDEC SDA * 24XX64 is used in this document as a generic part number for the 24AA64/24LC64/24FC64 devices. © 2007 Microchip Technology Inc. VCC VSS Sense Amp. R/W Control DS21189L-page 1 24AA64/24LC64/24FC64 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS DC CHARACTERISTICS Param. No. Sym. Characteristic Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. Typ. Max. Units Conditions — — — — — — A0, A1, A2, WP, SCL and SDA pins D1 VIH High-level input voltage 0.7 VCC — — V — D2 VIL Low-level input voltage — — 0.3 VCC 0.2 VCC V V VCC ≥ 2.5V VCC < 2.5V D3 VHYS Hysteresis of Schmitt Trigger inputs (SDA, SCL pins) 0.05 VCC — — V VCC ≥ 2.5V (Note 1) D4 VOL Low-level output voltage — — 0.40 V IOL = 3.0 mA @ VCC = 4.5V IOL = 2.1 mA @ VCC = 2.5V D5 ILI Input leakage current — — ±1 μA VIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC D6 ILO Output leakage current — — ±1 μA VOUT = VSS or VCC D7 CIN, COUT Pin capacitance (all inputs/outputs) — — 10 pF VCC = 5.0V (Note 1) TA = 25°C, FCLK = 1 MHz D8 ICC write Operating current — 0.1 3 mA VCC = 5.5V, SCL = 400 kHz D9 ICC — 0.05 400 μA D10 ICCS — — .01 — 1 5 μA μA Note 1: 2: read Standby current Industrial Automotive SDA = SCL = VCC A0, A1, A2, WP = VSS This parameter is periodically sampled and not 100% tested. Typical measurements taken at room temperature. DS21189L-page 2 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C AC CHARACTERISTICS Param. No. Sym. Characteristic Min. Max. Units Conditions 1 FCLK Clock frequency — — — — 100 400 400 1000 kHz 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 2 THIGH Clock high time 4000 600 600 500 — — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 3 TLOW Clock low time 4700 1300 1300 500 — — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 4 TR SDA and SCL rise time (Note 1) — — — 1000 300 300 ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC ≤ 5.5V 24FC64 5 TF SDA and SCL fall time (Note 1) — — 300 100 ns All except, 24FC64 1.7V ≤ VCC ≤ 5.5V 24FC64 6 THD:STA Start condition hold time 4000 600 600 250 — — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 7 TSU:STA 4700 600 600 250 — — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 Start condition setup time 8 THD:DAT Data input hold time 0 — ns (Note 2) 9 TSU:DAT Data input setup time 250 100 100 — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC ≤ 5.5V 24FC64 10 TSU:STO Stop condition setup time 4000 600 600 250 — — — — ns 1.7 V ≤ VCC < 2.5V 2.5 V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5 V ≤ VCC ≤ 5.5V 24FC64 11 TSU:WP WP setup time 4000 600 600 — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC ≤ 5.5V 24FC64 12 THD:WP WP hold time 4700 1300 1300 — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC ≤ 5.5V 24FC64 Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. © 2007 Microchip Technology Inc. DS21189L-page 3 24AA64/24LC64/24FC64 Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C AC CHARACTERISTICS Param. No. Sym. Characteristic Min. Max. Units Conditions — — — — 3500 900 900 400 ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 4700 1300 1300 500 — — — — ns 1.7V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V 24FC64 2.5V ≤ VCC ≤ 5.5V 24FC64 10 + 0.1CB 250 250 ns All except, 24FC64 (Note 1) 24FC64 (Note 1) 13 TAA Output valid from clock (Note 2) 14 TBUF Bus free time: Time the bus must be free before a new transmission can start 15 TOF Output fall time from VIH minimum to VIL maximum CB ≤ 100 pF 16 TSP Input filter spike suppression (SDA and SCL pins) — 50 ns All except, 24FC64 (Notes 1 and 3) 17 TWC Write cycle time (byte or page) — 5 ms — 18 — Endurance 1,000,000 — cycles 25°C (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. FIGURE 1-1: BUS TIMING DATA 5 SCL SDA IN 7 3 4 D4 2 8 10 9 6 16 14 13 SDA OUT WP DS21189L-page 4 (protected) (unprotected) 11 12 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 2.0 FUNCTIONAL DESCRIPTION The 24XX64 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX64 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. 3.0 BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition Accordingly, the following bus conditions have been defined (Figure 3-1). 3.1 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 3.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. FIGURE 3-1: (A) Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically, unlimited (although only the last thirty two will be stored when doing a write operation). When an overwrite does occur, it will replace data in a first-in first-out (FIFO) fashion. 3.5 Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: Bus Not Busy (A) Both data and clock lines remain high. 3.2 3.4 The 24XX64 does not generate any Acknowledge bits if an internal programming cycle is in progress. The device that acknowledges has to pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX64) will leave the data line high to enable the master to generate the Stop condition. DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) Start Condition Address or Acknowledge Valid (D) (C) (A) SCL SDA © 2007 Microchip Technology Inc. Data Allowed to Change Stop Condition DS21189L-page 5 24AA64/24LC64/24FC64 3.6 FIGURE 3-2: Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX64, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX64 devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are, in effect, the three Most Significant bits of the word address. The last bit of the control byte defines the operation to be performed. When set to a ‘1’, a read operation is selected. When set to a ‘0’, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 3-3). Because only A12...A0 are used, the upper-three address bits are “don’t care” bits. The upper-address bits are transferred first, followed by the Less Significant bits. Following the Start condition, the 24XX64 monitors the SDA bus, checking the device-type identifier being transmitted. Upon receiving a ‘1010’ code and appropriate device-select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX64 will select a read or write operation. FIGURE 3-3: 0 Read/Write Bit Chip Select Bits Control Code S 1 0 1 0 A2 A1 A0 R/W ACK Slave Address Start Bit 3.7 Acknowledge Bit Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 512K bits by adding up to eight 24XX64 devices on the same bus. In this case, software can use A0 of the control byte as address bit A13; A1 as address bit A14; and A2 as address bit A15. It is not possible to sequentially read across device boundaries. ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte 1 CONTROL BYTE FORMAT 1 Control Code DS21189L-page 6 0 A 2 A 1 Chip Select bits Address High Byte A 0 R/W x x x A A A 12 11 10 Address Low Byte A 9 A 8 A 7 • • • • • • A 0 x = “don’t care” bit © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 4.0 WRITE OPERATIONS 4.1 Byte Write Following the Start condition from the master, the control code (four bits), the Chip Select (three bits) and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow once it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word address and will be written into the Address Pointer of the 24XX64. The next byte is the Least Significant Address Byte. After receiving another Acknowledge signal from the 24XX64, the master device will transmit the data word to be written into the addressed memory location. The 24XX64 acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX64 will not generate Acknowledge signals (Figure 4-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written and the device will immediately accept a new command. After a byte Write command, the internal address counter will point to the address location following the one that was just written. 4.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX64 in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 31 additional bytes which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the five lower Address Pointer bits are internally incremented by one. If the master should transmit more than 32 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 4-2). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written, and the device will immediately accept a new command. Note: 4.3 Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of [page size – 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. Write Protection The WP pin allows the user to write-protect the entire array (0000-1FFF) when the pin is tied to VCC. If tied to VSS the write protection is disabled. The WP pin is sampled at the Stop bit for every Write command (Figure 3-1). Toggling the WP pin after the Stop bit will have no effect on the execution of the write cycle. © 2007 Microchip Technology Inc. DS21189L-page 7 24AA64/24LC64/24FC64 FIGURE 4-1: BYTE WRITE S T A R T Bus Activity Master Control Byte Address High Byte AA S1 01 0A 2 10 0 SDA Line S T O P Data xxx P A C K Bus Activity Address Low Byte A C K A C K A C K x = “don’t care” bit FIGURE 4-2: PAGE WRITE Bus Activity Master S T A R T SDA Line AA S 10 10A 2 1 0 0 Bus Activity Control Byte Address High Byte Address Low Byte Data Byte 0 S T O P Data Byte 31 P xxx A C K A C K A C K A C K A C K x = “don’t care” bit DS21189L-page 8 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 5.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for a flow diagram of this operation. FIGURE 5-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? No Yes Next Operation © 2007 Microchip Technology Inc. DS21189L-page 9 24AA64/24LC64/24FC64 6.0 READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to one. There are three basic types of read operations: current address read, random read and sequential read. 6.1 Current Address Read The 24XX64 contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address ‘n’ (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to one, the 24XX64 issues an acknowledge and transmits the eight-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX64 discontinues transmission (Figure 6-1). 6.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX64 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. FIGURE 6-1: This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a one. The 24XX64 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition, which causes the 24XX64 to discontinue transmission (Figure 6-2). After a random Read command, the internal address counter will point to the address location following the one that was just read. 6.3 Sequential Read Sequential reads are initiated in the same way as random reads, except that once the 24XX64 transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX64 to transmit the next sequentially-addressed 8-bit word (Figure 6-3). Following the final byte being transmitted to the master, the master will NOT generate an acknowledge, but will generate a Stop condition. To provide sequential reads, the 24XX64 contains an internal Address Pointer which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address 1FFF to address 0000 if the master acknowledges the byte received from the array address 1FFF. CURRENT ADDRESS READ Bus Activity Master S T A R T SDA Line S Bus Activity Control Byte S T O P Data (n) P A C K N O A C K DS21189L-page 10 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 FIGURE 6-2: Bus Activity Master SDA Line RANDOM READ S T A R T Control Byte Address High Byte S1 01 0AAA0 2 1 0 Control Byte S T O P Data Byte S 1 0 1 0 A AA1 2 10 xxx A C K A C K Bus Activity S T A R T Address Low Byte A C K P N O A C K A C K x = “don’t care” bit FIGURE 6-3: Bus Activity Master SEQUENTIAL READ Control Byte Data n Data n + 1 Data n + 2 S T O P Data n + x P SDA Line Bus Activity © 2007 Microchip Technology Inc. A C K A C K A C K A C K N O A C K DS21189L-page 11 24AA64/24LC64/24FC64 7.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 7-1. TABLE 7-1: PIN FUNCTION TABLE Name PDIP SOIC TSSOP DFN MSOP A0 1 1 1 1 1 Chip Address Input A1 2 2 2 2 2 Chip Address Input 7.1 A2 3 3 3 3 3 Chip Address Input VSS 4 4 4 4 4 Ground SDA 5 5 5 5 5 Serial Address/Data I/O SCL 6 6 6 6 6 Serial Clock WP 7 7 7 7 7 Write-Protect Input VCC 8 8 8 8 8 +1.7V to 5.5V Power Supply A0, A1, A2 Chip Address Inputs The A0, A1 and A2 inputs are used by the 24XX64 for multiple device operation. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. Up to eight devices may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. In Most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic ‘0’ or logic ‘1’. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ‘0’ or logic ‘1’ before normal device operation can proceed. 7.2 Description 7.3 Serial Clock (SCL) The SCL input is used to synchronize the data transfer from and to the device. 7.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, write operations are enabled. If tied to VCC, write operations are inhibited but read operations are not affected. Serial Data (SDA) SDA is a bidirectional pin used to transfer addresses and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. DS21189L-page 12 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) Example: 24LC64 I/P e3 13F 0527 Example: 24LC64I SN e3 0527 13F XXXXXXXT XXXXYYWW NNN 8-Lead SOIC (5.28 mm) Example: 24LC64 I/SM e3 052713F XXXXXXXX T/XXXXXX YYWWNNN 8-Lead TSSOP Example: XXXX 4LB TYWW I527 NNN 13F 8-Lead MSOP Example: XXXXXT 4L64I YWWNNN 52713F 8-Lead 2x3 DFN XXX YWW NN © 2007 Microchip Technology Inc. Example: 274 527 I3 DS21189L-page 13 24AA64/24LC64/24FC64 1st Line Marking Codes Part Number 24AA64 TSSOP MSOP 4AB 4A64T DFN I Temp. E Temp. 271 — 24LC64 4LB 4L64T 274 275 24FC64 4FB 4F64T 27A 27B Note: T = Temperature grade (I, E) Legend: XX...X T Y YY WW NNN e3 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21189L-page 14 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 8 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 b1 .040 .060 .070 b .014 .018 .022 eB – – Upper Lead Width Lower Lead Width Overall Row Spacing § .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B © 2007 Microchip Technology Inc. DS21189L-page 15 24AA64/24LC64/24FC64 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e N E E1 NOTE 1 1 2 3 α h b h A2 A c φ L A1 L1 Units Dimension Limits Number of Pins β MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 1.25 – – Standoff § A1 0.10 – 0.25 Overall Width E Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC 1.75 6.00 BSC Chamfer (optional) h 0.25 – 0.50 Foot Length L 0.40 – 1.27 Footprint L1 1.04 REF Foot Angle φ 0° – 8° Lead Thickness c 0.17 – 0.25 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-057B DS21189L-page 16 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 1 2 e b α A2 A c φ β A1 Units Dimension Limits Number of Pins L MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A 1.77 1.27 BSC – Molded Package Thickness A2 1.75 – 1.98 Standoff § A1 0.05 – 0.25 Overall Width E 7.62 – 8.26 Molded Package Width E1 5.11 – 5.38 Overall Length D 5.13 – 5.33 Foot Length L 0.51 – 0.76 Foot Angle φ 0° – 8° Lead Thickness c 0.15 – 0.25 Lead Width b 0.36 – 0.51 Mold Draft Angle Top α – – 15° Mold Draft Angle Bottom β – – 15° 2.03 Notes: 1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. Microchip Technology Drawing C04-056B © 2007 Microchip Technology Inc. DS21189L-page 17 24AA64/24LC64/24FC64 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 0.65 BSC – Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 – 0.15 1.20 Overall Width E Molded Package Width E1 4.30 6.40 BSC 4.40 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint L1 4.50 1.00 REF Foot Angle φ 0° – 8° Lead Thickness c 0.09 – 0.20 Lead Width b 0.19 – 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-086B DS21189L-page 18 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 e b A2 A c φ L L1 A1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 0.65 BSC – Molded Package Thickness A2 0.75 0.85 0.95 Standoff A1 0.00 – 0.15 Overall Width E Molded Package Width E1 3.00 BSC Overall Length D 3.00 BSC Foot Length L Footprint L1 1.10 4.90 BSC 0.40 0.60 0.80 0.95 REF Foot Angle φ 0° – 8° Lead Thickness c 0.08 – 0.23 Lead Width b 0.22 – 0.40 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-111B © 2007 Microchip Technology Inc. DS21189L-page 19 24AA64/24LC64/24FC64 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e b N N L K E2 E EXPOSED PAD NOTE 1 2 1 NOTE 1 1 2 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Overall Width E Exposed Pad Length D2 1.30 – Exposed Pad Width E2 1.50 – 1.90 b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – Contact Width 0.50 BSC 3.00 BSC 1.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-123B DS21189L-page 20 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 APPENDIX A: REVISION HISTORY Revision H Corrections to Section 1.0, Electrical Characteristics. Revision J Added DFN package. Revision K Revised Sections 7.1 and 7.4. Revision L Added 24FC64 Part; Revised Device Selection Table; Revised Features Section; Deleted Rotated TSSOP Package; Revised Table 1-2; Revised Table 7-1; Revised Package Information; Replaced Package Drawings; Revised Product ID Section. © 2007 Microchip Technology Inc. DS21189L-page 21 24AA64/24LC64/24FC64 NOTES: DS21189L-page 22 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. DS21189L-page 23 24AA64/24LC64/24FC64 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA64/24LC64/24FC64 N Literature Number: DS21189L Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21189L-page 24 © 2007 Microchip Technology Inc. 24AA64/24LC64/24FC64 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Package Range Examples: a) b) Device: 24AA64: 24AA64T: 24LC64: 24LC64T: Temperature I Range: E = = 1.7V, 64 Kbit I2C Serial EEPROM 1.7V, 64 Kbit I2C Serial EEPROM (Tape and Reel) 2.5V, 64 Kbit I2C Serial EEPROM 2.5V, 64 Kbit I2C Serial EEPROM (Tape and Reel) -40°C to +85°C -40°C to +125°C c) d) 24AA64T-I/ST: Industrial Temperature, 1.7V, TSSOP package, tape and reel e) 24LC64-I/P: Industrial Temperature, 2.5V, PDIP package 24LC64-E/SN: Extended Temperature, 2.5V, SOIC package 24LC64-E/SM: Extended Temperature, 2.5V, SOIC (5.28 mm) package f) g) Package: P SN SM ST MS MC = = = = = = Plastic DIP (300 mil body), 8-lead Plastic SOIC (3.90 mm body), 8-lead Plastic SOIC (5.28 mm body), 8-lead Plastic TSSOP (4.4 mm), 8-lead Plastic Micro Small Outline (MSOP), 8-lead 2x3 DFN, 8-lead © 2007 Microchip Technology Inc. 24AA64-I/P: Industrial Temperature, 1.7V, PDIP package 24AA64-I/SN: Industrial Temperature, 1.7V, SOIC package 24AA64-I/SM: Industrial Temperature, 1.7V, SOIC (5.28 mm) package h) 24LC64-I/ST: Industrial Temperature, 2.5V, TSSOP package DS21189L-page25 24AA64/24LC64/24FC64 NOTES: DS21189L-page 26 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. DS21189L-page 27 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 12/08/06 DS21189L-page 28 © 2007 Microchip Technology Inc.