24AA32A/24LC32A 32K I2C™ Serial EEPROM Device Selection Table Description: Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA32A 1.7-5.5 400 kHz(1) I 2.5-5.5 400 kHz I, E 24LC32A Note 1: The Microchip Technology Inc. 24AA32A/24LC32A (24XX32A*) is a 32 Kbit Electrically Erasable PROM. The device is organized as a single block of 4K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V, with standby and active currents of only 1 A and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24XX32A also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32A is available in the standard 8-pin PDIP, surface mount SOIC, SOIJ, TSSOP, DFN, TDFN and MSOP packages. The 24XX32A is also available in the 5-lead SOT-23 and Chip Scale packages. 100 kHz for VCC <2.5V. Features: • Single Supply with Operation down to 1.7V for 24AA32A devices, 2.5V for 24LC32A devices • Low-Power CMOS Technology: - Active current 1 mA, typical - Standby current 1 A, typical • 2-Wire Serial Interface, I2C™ Compatible • Schmitt Trigger Inputs for Noise Suppression • Output Slope Control to Eliminate Ground Bounce • 100 kHz and 400 kHz Clock Compatibility • Page Write Time 5 ms max. • Self-Timed Erase/Write Cycle • 32-Byte Page Write Buffer • Hardware Write-Protect • ESD Protection > 4,000V • More than 1 Million Erase/Write Cycles • Data Retention > 200 Years • Factory Programming Available • Packages Include 8-lead PDIP, SOIC, SOIJ, TSSOP, MSOP, DFN, TDFN, 5-lead SOT-23 and Chip Scale • Pb-Free and RoHS Compliant • Temperature Ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Block Diagram A0 A1 A2 WP I/O Control Logic Memory Control Logic HV Generator EEPROM Array XDEC Page Latches I/O SCL YDEC SDA Vcc VSS Sense Amp. R/W Control Package Types PDIP/MSOP/SOIC/SOIJ/TSSOP A0 1 8 VCC DFN/TDFN SOT-23 SCL 1 5 WP A0 1 A1 2 A1 2 7 WP A2 3 6 SCL VSS 4 5 SDA Note 1: Pins A0, A1 and A2 are not used by the 24XX32A (no internal connections). 2: Available in I-temp, “AA” only. VSS SDA 2 3 4 VCC A2 3 VSS 4 8 VCC 7 WP 6 SCL 5 SDA CS (Chip Scale)(2) VCC WP SCL 1 2 VSS 5 SDA 3 4 (Top Down View, Balls Not Visible) *24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices. 2009 Microchip Technology Inc. DS21713K-page 1 24AA32A/24LC32A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS DC CHARACTERISTICS Param. Symbol No. Characteristic Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. Typ. Max. Units Conditions — — — — — D1 — A0, A1, A2, WP, SCL and SDA pins D2 VIH High-level input voltage 0.7 VCC — — V — D3 VIL Low-level input voltage — — 0.3 VCC 0.2 VCC V V VCC 2.5V VCC < 2.5V D4 VHYS Hysteresis of Schmitt Trigger inputs (SDA, SCL pins) 0.05 VCC — — V VCC 2.5V (Note 1) D5 VOL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, Vcc = 2.5V D6 ILI Input leakage current — — ±1 A VIN = VSS or VCC D7 ILO Output leakage current — — ±1 A VOUT = VSS or VCC D8 CIN, COUT Pin capacitance (all inputs/outputs) — — 10 pF VCC = 5.0V (Note 1) TA = 25°C, FCLK = 1 MHz D9 ICC write Operating current — 0.1 3 mA VCC = 5.5V, SCL = 400 kHz — 0.05 400 A — — 0.01 — 1 5 A A D10 ICC read D11 ICCS Note 1: 2: Standby current Industrial Automotive SDA = SCL = VCC = 5.5V A0, A1, A2, WP = VSS This parameter is periodically sampled and not 100% tested. Typical measurements taken at room temperature. DS21713K-page 2 2009 Microchip Technology Inc. 24AA32A/24LC32A TABLE 1-2: AC CHARACTERISTICS Industrial (I): Automotive (E): AC CHARACTERISTICS Param. Symbol No. Characteristic TA = -40°C to +85°C, VCC = +1.7V to +5.5V TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. Max. Units Conditions 1 FCLK Clock Frequency — — 400 100 kHz 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 2 THIGH Clock High Time 600 4000 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 3 TLOW Clock Low Time 1300 4700 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 4 TR SDA and SCL Rise Time (Note 1) — — 300 1000 ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 5 TF SDA and SCL Fall Time — 300 ns (Note 1) 6 THD:STA Start Condition Hold Time 600 4000 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 7 TSU:STA Start Condition Setup Time 600 4700 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 8 THD:DAT Data Input Hold Time 0 — ns (Note 2) 9 TSU:DAT Data Input Setup Time 100 250 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 10 TSU:STO Stop Condition Setup Time 600 4000 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 11 TSU:WP WP Setup Time 600 4000 — — ns 2.5V VCC 5.5V 1.7V VCC < 2.5V (24AA32A) 12 THD:WP WP Hold Time 1300 4700 — — ns 2.5V VCC 5.5V 1.7V VCC < 2.5V (24AA32A) 13 TAA Output Valid from Clock (Note 2) — — 900 3500 ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 14 TBUF Bus free time: Time the bus must be free before a new transmission can start 1300 4700 — — ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 15 TOF Output Fall Time from VIH Minimum to VIL Maximum 20+0.1CB — 250 250 ns 2.5V VCC 5.5V 1.7V VCC 2.5V (24AA32A) 16 TSP Input Filter Spike Suppression (SDA and SCL pins) — 50 ns (Notes 1 and 3) 17 TWC Write Cycle Time (byte or page) — 5 ms — 18 — Endurance 1M — Note 1: 2: 3: 4: cycles Page mode, 25°C, VCC 5.5V (Note 4) Not 100% tested. CB = total capacitance of one bus line in pF. As a transmitter the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site at www.microchip.com. 2009 Microchip Technology Inc. DS21713K-page 3 24AA32A/24LC32A FIGURE 1-1: BUS TIMING DATA 5 SCL SDA IN 7 3 4 D4 2 8 10 9 6 16 14 13 SDA OUT (protected) (unprotected) WP FIGURE 1-2: 12 11 BUS TIMING START/STOP D4 SCL 6 7 10 SDA Start DS21713K-page 4 Stop 2009 Microchip Technology Inc. 24AA32A/24LC32A 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Name PDIP SOIC SOIJ TSSOP DFN TDFN MSOP SOT-23 CS A0 1 1 1 A1 2 2 A2 3 3 VSS 4 SDA 5 Description 1 1 1 1 — — Chip Address Input 2 2 2 2 2 — — Chip Address Input 3 3 3 3 3 — — Chip Address Input 4 4 4 4 4 4 2 2 Ground 5 5 5 5 5 5 3 5 Serial Address/Data I/O SCL 6 6 6 6 6 6 6 1 4 Serial Clock WP 7 7 7 7 7 7 7 5 3 Write-Protect Input VCC 8 8 8 8 8 8 8 4 1 +1.7V to 5.5V Power Supply 2.1 A0, A1, A2 Chip Address Inputs The A0, A1 and A2 inputs are used by the 24XX32A for multiple device operation. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the comparison is true. Up to eight devices may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. In most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic ‘0’ or logic ‘1’. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ‘0’ or logic ‘1’ before normal device operation can proceed. Address pins are not available in the SOT-23 and chip scale packages. 2.2 2.3 Serial Clock (SCL) The SCL input is used to synchronize the data transfer to and from the device. 2.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, write operations are enabled. If tied to VCC, write operations are inhibited but read operations are not affected. Serial Data (SDA) SDA is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open-drain terminal, therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz) For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions. 2009 Microchip Technology Inc. DS21713K-page 5 24AA32A/24LC32A 3.0 FUNCTIONAL DESCRIPTION The 24XX32A supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX32A works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. 4.0 BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). 4.1 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 4.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. FIGURE 4-1: (A) Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically, unlimited (although only the last thirty-two bytes will be stored when doing a write operation). When an overwrite does occur, it will replace data in a first-in first-out (FIFO) fashion. 4.5 Acknowledge Each receiving device, when addressed, is obliged to generate an Acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: Bus Not Busy (A) Both data and clock lines remain high. 4.2 4.4 The 24XX32A does not generate any Acknowledge bits if an internal programming cycle is in progress. The device that acknowledges, has to pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the Acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX32A) will leave the data line high to enable the master to generate the Stop condition. DATA TRANSFER SEQUENCE ON THE SERIAL BUS (B) (D) Start Condition Address or Acknowledge Valid (D) (C) (A) SCL SDA DS21713K-page 6 Data Allowed to Change Stop Condition 2009 Microchip Technology Inc. 24AA32A/24LC32A 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code. For the 24XX32A, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX32A devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are in effect the three Most Significant bits of the word address. For the SOT-23 and chip scale packages, the address pins are not available. During device addressing, the A1, A2, and A0 Chip Selects bits (Figure 5-2) should be set to ‘0’. The last bit of the control byte defines the operation to be performed. When set to a ‘1’, a read operation is selected. When set to a zero, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 5-2). Because only A11 to A0 are used, the upper four address bits are “don’t care” bits. The upper address bits are transferred first, followed by the Less Significant bits. Following the Start condition, the 24XX32A monitors the SDA bus checking the device type identifier being transmitted and, upon receiving a ‘1010’ code and appropriate device select bits, the slave device outputs FIGURE 5-2: 0 1 Control Code FIGURE 5-1: CONTROL BYTE FORMAT Read/Write Bit Chip Select Bits Control Code S 1 0 1 A2 A1 A0 R/W ACK 0 Slave Address Start Bit 5.1 Acknowledge Bit Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 256K bits by adding up to eight 24XX32A devices on the same bus. In this case, software can use A0 of the control byte as address bit A12; A1 as address bit A13; and A2 as address bit A14. It is not possible to sequentially read across device boundaries. The SOT-23 and chip scale packages do not support multiple device addressing on the same bus. ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte 1 an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX32A will select a read or write operation. 0 A 2 A 1 Address High Byte A 0 R/W Chip Select Bits 2009 Microchip Technology Inc. x x x x A A 11 10 A 9 Address Low Byte A 8 A 7 • • • • • • A 0 x = “don’t care” bit DS21713K-page 7 24AA32A/24LC32A 6.0 WRITE OPERATIONS 6.1 Byte Write Following the Start condition from the master, the control code (4 bits), the Chip Select (3 bits), and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow once it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word address and will be written into the Address Pointer of the 24XX32A. The next byte is the Least Significant Address Byte. After receiving another Acknowledge signal from the 24XX32A, the master device will transmit the data word to be written into the addressed memory location. The 24XX32A acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX32A will not generate Acknowledge signals (Figure 6-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur. No data will be written and the device will immediately accept a new command. After a byte Write command, the internal address counter will point to the address location following the one that was just written. Note: 6.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX32A in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 31 additional bytes which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the five lower Address Pointer bits are internally incremented by ‘1’. If the master should transmit more than 32 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written, and the device will immediately accept a new command. Note: When doing a write of less than 32 bytes the data in the rest of the page is refreshed along with the data bytes being written. This will force the entire page to endure a write cycle, for this reason endurance is specified per page. 6.3 Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of [page size – 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. Write Protection The WP pin allows the user to write-protect the entire array (000-FFF) when the pin is tied to VCC. If tied to VSS the write protection is disabled. The WP pin is sampled at the Stop bit for every Write command (Figure 4-1). Toggling the WP pin after the Stop bit will have no effect on the execution of the write cycle. DS21713K-page 8 2009 Microchip Technology Inc. 24AA32A/24LC32A FIGURE 6-1: BYTE WRITE S T A R T Bus Activity Master Control Byte Address High Byte AA S 1 0 1 0A 210 0 SDA Line S T O P Data xxx x P A C K A C K A C K A C K Bus Activity Address Low Byte x = “don’t care” bit FIGURE 6-2: PAGE WRITE Bus Activity Master S T A R T SDA Line AA S10 1 0A 2100 Control Byte Bus Activity Address High Byte Address Low Byte Data Byte 0 S T O P P Data Byte 31 xxxx A C K A C K A C K A C K A C K x = “don’t care” bit 2009 Microchip Technology Inc. DS21713K-page 9 24AA32A/24LC32A 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for flow diagram of this operation. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? No Yes Next Operation DS21713K-page 10 2009 Microchip Technology Inc. 24AA32A/24LC32A 8.0 READ OPERATION 8.3 Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24XX32A contains an address counter that maintains the address of the last word accessed, internally incremented by ‘1’. Therefore, if the previous read access was to address ‘n’ (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to ‘1’, the 24XX32A issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX32A discontinues transmission (Figure 8-1). 8.2 Sequential Read Sequential reads are initiated in the same way as a random read, except that once the 24XX32A transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX32A to transmit the next sequentially addressed 8-bit word (Figure 8-3). Following the final byte transmitted to the master, the master will NOT generate an acknowledge, but will generate a Stop condition. To provide sequential reads, the 24XX32A contains an internal Address Pointer which is incremented by ‘1’ upon completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address FFF to address 000 if the master acknowledges the byte received from the array address FFF. Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX32A as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The master issues the control byte again, but with the R/W bit set to a ‘1’. The 24XX32A will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition which causes the 24XX32A to discontinue transmission (Figure 8-2). After a random Read command, the internal address counter will point to the address location following the one that was just read. FIGURE 8-1: CURRENT ADDRESS READ Bus Activity Master S T A R T SDA Line S Bus Activity 2009 Microchip Technology Inc. Control Byte S T O P Data (n) P A C K N O A C K DS21713K-page 11 24AA32A/24LC32A FIGURE 8-2: Bus Activity Master RANDOM READ S T A R T Control Byte Address High Byte AA xxxx S1010A 2100 A C Bus Activity K x = “don’t care” bit S T A R T Address Low Byte Bus Activity Master S T O P Data Byte S 1 0 1 0 A A A1 210 SDA Line FIGURE 8-3: Control Byte A C K A C K P N O A C K A C K SEQUENTIAL READ Control Byte Data n Data n + 1 Data n + 2 Data n + x S T O P P SDA Line Bus Activity DS21713K-page 12 A C K A C K A C K A C K N O A C K 2009 Microchip Technology Inc. 24AA32A/24LC32A 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead SOIC (5.28 mm) XXXXXXXX T/XXXXXX YYWWNNN Example: 24LC32A I/P e3 13F 0527 Example: 24LC32AI SN e3 0527 13F Example: 24LC32A I/SM e3 052713F 8-Lead TSSOP Example: XXXX 4LA TYWW I527 NNN 13F 8-Lead 2x3 DFN XXX YWW NN 8-Lead MSOP XXXXXT YWWNNN 2009 Microchip Technology Inc. Example: 264 527 13 Example: 4L32AI 52713F DS21713K-page 13 24AA32A/24LC32A Example: 8-Lead 2x3 TDFN A64 527 I3 XXX YWW NN Example: 5-Lead SOT-23 XXNN M6NN 5-Lead Chip Scale Example: 67 XW 1st Line Marking Codes Part Number TSSOP MSOP DFN I Temp. TDFN E Temp. I Temp. SOT-23 E Temp. I Temp. E Temp. 24AA32A 4AA 4A32AT 261 — A61 — B6NN — 24LC32A 4LA 4L32AT 264 265 A64 A65 M6NN N6NN Note: T = Temperature grade (I, E). Legend: XX...X T Y YY WW NNN e3 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21713K-page 14 2009 Microchip Technology Inc. 24AA32A/24LC32A /HDG3ODVWLF'XDO,Q/LQH3±PLO%RG\>3',[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ± 0ROGHG3DFNDJH7KLFNQHVV $ %DVHWR6HDWLQJ3ODQH $ ± ± 6KRXOGHUWR6KRXOGHU:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' 7LSWR6HDWLQJ3ODQH / /HDG7KLFNQHVV F E E H% ± ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6&%DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2009 Microchip Technology Inc. DS21713K-page 15 24AA32A/24LC32A /HDG3ODVWLF6PDOO2XWOLQH61±1DUURZPP%RG\>62,&@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e N E E1 NOTE 1 1 2 3 α h b h A2 A c φ L A1 β L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ ± ± 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 2YHUDOO/HQJWK ' %6& %6& &KDPIHURSWLRQDO K ± )RRW/HQJWK / ± )RRWSULQW / 5() )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 0ROG'UDIW$QJOH7RS ± 0ROG'UDIW$QJOH%RWWRP ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21713K-page 16 2009 Microchip Technology Inc. 24AA32A/24LC32A /HDG3ODVWLF6PDOO2XWOLQH61±1DUURZPP%RG\>62,&@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 2009 Microchip Technology Inc. DS21713K-page 17 24AA32A/24LC32A /HDG3ODVWLF6PDOO2XWOLQH60±0HGLXPPP%RG\>62,[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 1 2 e b α c φ A2 A β A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV L 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± )RRW/HQJWK / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 0ROG'UDIW$QJOH7RS ± ± 0ROG'UDIW$QJOH%RWWRP ± ± 1RWHV 62,--(,7$(,$-6WDQGDUGIRUPHUO\FDOOHG62,& 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21713K-page 18 2009 Microchip Technology Inc. 24AA32A/24LC32A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009 Microchip Technology Inc. DS21713K-page 19 24AA32A/24LC32A /HDG3ODVWLF7KLQ6KULQN6PDOO2XWOLQH67±PP%RG\>[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 0ROGHG3DFNDJH/HQJWK ' )RRW/HQJWK / )RRWSULQW / 5() )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21713K-page 20 2009 Microchip Technology Inc. 24AA32A/24LC32A /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH0&±[[PP%RG\>')[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ 6WDQGRII $ &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK ' ± ([SRVHG3DG:LGWK ( ± E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± &RQWDFW:LGWK %6& %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ && 2009 Microchip Technology Inc. DS21713K-page 21 24AA32A/24LC32A /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH0&±[[PP%RG\>')[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21713K-page 22 2009 Microchip Technology Inc. 24AA32A/24LC32A /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH01±[[PP%RG\>7')[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 2009 Microchip Technology Inc. DS21713K-page 23 24AA32A/24LC32A /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH01±[[PP%RG\>7')[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21713K-page 24 2009 Microchip Technology Inc. 24AA32A/24LC32A /HDG3ODVWLF0LFUR6PDOO2XWOLQH3DFNDJH06>[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 NOTE 1 1 2 e b A2 A c φ L L1 A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( %6& 2YHUDOO/HQJWK ' %6& )RRW/HQJWK / )RRWSULQW / %6& 5() )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2009 Microchip Technology Inc. DS21713K-page 25 24AA32A/24LC32A /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>[email protected] 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± %6& )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21713K-page 26 2009 Microchip Technology Inc. 24AA32A/24LC32A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009 Microchip Technology Inc. DS21713K-page 27 24AA32A/24LC32A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21713K-page 28 2009 Microchip Technology Inc. 24AA32A/24LC32A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009 Microchip Technology Inc. DS21713K-page 29 24AA32A/24LC32A APPENDIX A: REVISION HISTORY Revision D Corrections to Section 1.0, Electrical Characteristics. Revision E Added DFN package. Revision F Revised Sections 4.3, 7.2 and 7.4. Revision G Replaced 2x3 DFN (MC) Package Revision H Changed 1.8V to 1.7V; Revised Features Section; Replaced Package Drawings; Deleted Rotated TSSOP; Revised Product ID Section. Revision J Added TDFN and SOT-23 packages; Updated Package Drawings; Moved Pin Descriptions to Section 2.0; Renumbered Sections. Revision K (12/2009) Added Chip Scale Package. DS21713K-page 30 2009 Microchip Technology Inc. 24AA32A/24LC32A THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. 2009 Microchip Technology Inc. DS21713K-page 31 24AA32A/24LC32A READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA32A/24LC32A N Literature Number: DS21713K Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21713K-page 32 2009 Microchip Technology Inc. 24AA32A/24LC32A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. X PART NO. /XX Temperature Package Range Device I2C Device: 24AA32A: 1.7V, 32 Kbit Serial EEPROM 24AA32AT: 1.7V, 32 Kbit I2C Serial EEPROM (Tape and Reel) 24LC32A: 2.5V, 32 Kbit I2C Serial EEPROM 24LC32AT: 2.5V, 32 Kbit I2C Serial EEPROM (Tape and Reel) Temperature I Range: E Package: Note 1: 2: = = -40°C to +85°C -40°C to +125°C P = SN = SM = ST = MS = MC = MNY(1) = OT = CS16K(2) = Plastic DIP (300 mil body), 8-lead Plastic SOIC (3.90 mm body), 8-lead Plastic SOIJ (5.28 mm body), 8-lead Plastic TSSOP (4.4 mm), 8-lead Plastic Micro Small Outline (MSOP), 8-lead 2x3 DFN, 8-lead TDFN (2x3x0.75mm body), 8-lead SOT-23 (Tape and Reel only), 5-lead Chip Scale (CS), 5-lead (I-temp, “AA” Tape and Reel only) Examples: a) 24AA32A-I/P: Industrial Temperature,1.7V, PDIP package b) 24AA32A-I/SN: Industrial Temperature,1.7V, SOIC package c) 24AA32A-I/SM: Industrial Temperature.,1.7V, SOIJ (5.28 mm) package d) 24AA32A-I/ST: Industrial Temperature.,1.7V, TSSOP package e) 24LC32A-I/P: Industrial Temperature, 2.5V, PDIP package f) 24LC32A-E/SN: Automotive 2.5V SOIC package g) 24LC32A-E/SM: Automotive Temperature, 2.5V SOIJ (5.28 mm) package h) 24LC32AT-I/ST: Industrial Temperature, 2.5V, TSSOP package, Tape and Reel Temperature, “Y” indicates a Nickel Palladium Gold (NiPdAu) finish. “16K” indicates 160K technology. 2009 Microchip Technology Inc. DS21713K-page 33 24AA32A/24LC32A NOTES: DS21713K-page 34 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2009 Microchip Technology Inc. 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