TC3400 +1.8V, Low Power, 16-Bit Sigma-Delta A/D Converter Package Type Features • 16-bit Resolution at Eight Conversions Per Second, Adjustable Down to 10-bit Resolution at 512 Conversions Per Second • 1.8V – 5.5V Operation, Low Power Operating 260µA; Sleep: 0.75µA • microPort™ Serial Bus Requires only two Interface Lines • Uses Internal or External Reference • Automatically Enters Sleep Mode when not in use 8-Pin SOIC IN+ 1 IN- 2 REFIN GND 8 VDD 7 SCLK 3 6 SDAT 4 5 REFOUT TC3400 8-Pin PDIP Applications • Consumer Electronics, Thermostats, CO Monitors, Humidity Meters, Security Sensors • Embedded Systems, Data Loggers, Portable Equipment • Medical Instruments Device Selection Table Part Number Package Temperature Range TC3400VPA 8-Pin PDIP (Narrow) 0°C to +85°C TC3400VOA 8-Pin SOIC (Narrow) 0°C to +85°C IN+ 1 IN- 2 REFIN GND 8 VDD 7 SCLK 3 6 SDAT 4 5 REFOUT TC3400 General Description The TC3400 is a low cost, low power analog-to-digital converter based on Microchip’s Sigma-Delta technology. It will perform 16-bit conversions (15-bit plus sign) at up to eight per second. The TC3400 is optimized for use as a microcontroller peripheral in low cost, battery operated systems. A voltage reference is included, or an external reference can be used. The TC3400’s 2-wire microPort™ digital interface is used for starting conversions and for reading out the data. Driving the SCLK line low starts a conversion. After the conversion starts, each additional falling edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit and cuts conversion time in half. After a conversion is completed, clocking the SCLK line puts the MSB through LSB of the resulting data word onto the SDAT line, much like a shift register. The part automatically sleeps when not performing a data conversion. The TC3400 is available in a 8-Pin PDIP and a 8-Pin SOIC package. 2002 Microchip Technology Inc. DS21409B-page 1 TC3400 Typical Application VBATT V + IN1+ VCC DD I/01 I/02 SDAT SCLK IN1- µ Controller TC3400 REFIN REFOUT R3 390 C1 0.1µF Functional Block Diagram VDD REFOUT 1.193V TC3400 x2 IN- – Data Shift Reg. S–D Modulator CONVCLK SDAT CLKOUT + CONV Done IN+ REFIN Clock Generator and Control Circuitry SCLK GND DS21409B-page 2 2002 Microchip Technology Inc. TC3400 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ..................................................... 6.0V Input Voltage (All Other Pins): ............................... (GND – 0.3V) to (VDD + 0.3V) Operating Temperature Range ................. 0°C to 85°C Storage Temperature ........................ -65°C to +150°C TC3400 DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol Parameter Min Typ Max Unit 1.8 — 5.5 V µA µA µA Test Conditions Power Supply VDD Supply Voltage IDD Supply Current, During Data Conversion — 260 — IDD SLEEP Supply Current, Sleep Mode — 0.75 1.5 — 1.2 3.0 TA = +25°C Accuracy (Differential Inputs) RES Resolution — 16 — Bits INL Integral Non-Linearity — .0038 — %FSR VDD = 2.7V VOS Offset Error — — ±0.9 %FSR IN+, IN- = 0V VNOISE Referred to input — 60 — µVrms CMR Common Mode Rejection — 75 — dB FSE Full Scale Error — 0.4% — %FS PSRR Power Supply Rejection Ratio — 75 — dB VDD = 2.5V to 3.5V Differential Input Voltage — — 2.5 V Note 1 Absolute Voltage Range on IN+, IN- — — VDD V At DC IN+, INVIN ± Input Bias Current — 1 100 nA CIN Input Sampling Capacitance — 2 — pF RIN Differential Input Resistance — 2.0 — MΩ Note 2 REFIN, REFOUT VREF REFIN Voltage Range 0 — 1.25 V IREF REFIN Input Current — 1 — µA VREFOUT REFOUT Voltage — 1.193 — V REFSINK REFOUT Current Sink Capability — 10 — µA REFSRC REFOUT Current Source Capability 300 — — µA Note 1: Differential input voltage defined as (VIN+ – VIN -). 2: Resistance from INn+ to INn- or INn to GND. 3: @ VDD = 1.8V, ISOURCE ≤ 200µA. 2002 Microchip Technology Inc. DS21409B-page 3 TC3400 TC3400 DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol Parameter Min Typ Max Unit V Test Conditions SCLK VIL Input Low Voltage — — 0.3 x VDD VIH Input High Voltage 0.7 x VDD — — V ILEAK Leakage Current — 1 — µA — — 0.4 V IOL = 1.5mA 0.9 x VDD — — V ISOURCE = 400µA (Note 3) SDAT VOL Output Low Voltage VOH Output High Voltage (SDAT) Note 1: Differential input voltage defined as (VIN+ – VIN -). 2: Resistance from INn+ to INn- or INn to GND. 3: @ VDD = 1.8V, ISOURCE ≤ 200µA. TC3400 AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz. Symbol Parameter Min Typ Max Unit Test Conditions t1 Resolution Reduction Clock Width 1 — — µsec Width of SCLK (Negative) t2 Resolution Reduction Clock Width 1 — — µsec Width of SCLK (Positive) t3 Conversion Time (15-bit Plus Sign) — 125 — msec 16-bit Conversion, TA = 25°C (Note 1) Conversion Time (14-bit Plus Sign) — t3/2.0 — msec 15-bit Conversion Conversion Time (13-bit Plus Sign) — t3/4.0 — msec 14-bit Conversion Conversion Time (12-bit Plus Sign) — t3/7.8 — msec 13-bit Conversion Conversion Time (11-bit Plus Sign) — t3/15.1 — msec 12-bit Conversion Conversion Time (10-bit Plus Sign) — t3/28.6 — msec 11-bit Conversion Conversion Time (9-bit Plus Sign) — t3/51.4 — msec 10-bit Conversion t4 Resolution Reduction Window — t3/85.7 — msec Width of SCLK t5 SCLK to Data Valid 1000 — — nsec SCLK Falling Edge to SDAT Valid t8 Acknowledge Delay — — 1000 nsec SCLK to SDAT Delay Note 1: Nominal temperature drift is -2830ppm/C° for temperature less than 25°C and -1340ppm/°C for temperatures greater than 25°C. DS21409B-page 4 2002 Microchip Technology Inc. TC3400 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin PDIP) Symbol 1 IN+ Analog Input. This is the positive terminal of a true differential input consisting of IN+ and IN-. VIN1 = (IN+ – IN-). See Section 1.0 Electrical Characteristics. 2 IN- Analog Input. This is the negative terminal of a true differential input consisting of IN+ and IN-. VIN = (IN+ – IN-) IN- can swing to, but not below, ground. 3 REFIN Description Analog Input. The converter’s reference voltage is the differential between this pin and ground times two. It may be tied directly to REFOUT or scaled using a resistor divider. Any user supplied reference voltage less than 1.25V may be used in place of REFOUT. 4 GND 5 REFOUT Ground Terminal. 6 SDAT Digital Output (push-pull). This is the microPort™ serial data output. SDAT is driven low while the TC3400 is converting data, effectively providing a “busy” signal. After the conversion is complete, every high to low transition on the SCLK pin puts a bit from the resulting data word on the SDAT pin (from MSB to LSB). 7 SCLK Digital Input. This is the microPort™ serial clock input. The TC3400 comes out of sleep mode and a conversion cycle begins when this pin is driven low. After the conversion starts, each additional falling edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit. When the conversion is complete, the data word can be shifted out on the SDAT pin by clocking the SCLK pin. 8 VDD Analog Output. The internal reference connects to this pin. It may be scaled externally, if desired, and tied to the REFIN input to provide the converter’s reference voltage. Care must be taken in connecting external circuitry to this pin. Power Supply Input. 2002 Microchip Technology Inc. DS21409B-page 5 TC3400 3.0 DETAILED DESCRIPTION TABLE 3-1: The TC3400 is a 16-bit sigma-delta A/D converter with one differential input. See the Typical Application circuit and the Functional Block diagram. The key components of the TC3400 are described below. Also refer to Figure 3-4, A/D Operational Flowchart and the Timing Diagrams, Figure 3-1, Figure 3-2 and Figure 3-3). 3.1 A/D Converter Operation When the TC3400 is not converting, it is in sleep mode with both the SCLK and SDAT lines high. An A/D conversion is initiated by a high to low transition on the SCLK line at which time the internal clock of the TC3400 is started. Each additional high to low transition of SCLK (following the initial SCLK falling edge) during the time interval t4, will decrement the conversion resolution by one bit and reduce the conversion time by one half. The time interval t4 is referred to as the resolution reduction window. The minimum conversion resolution is 10-bits so any more than 6 SCLK transitions during t4 will be ignored. After each high to low transition of SCLK, in the t4 interval, the SDAT output is driven high by the TC3400 to acknowledge that the conversion has been decremented. When the SCLK returns high or the t4 interval ends, the SDAT line returns low (see Figure 3-2). When the conversion is complete SDAT is driven high. The TC3400 now enters sleep mode and the conversion value can be read as a serial data word on the SDAT line. 3.2 DATA CONVERSION WORD VS. VOLTAGE INPUT (REFIN = 1.193V) Data Word INn+ – INn- (Volts) 0111 1111 1111 1111 2.38596 (Positive Full Scale) 0000 0000 0000 0001 72.8 E -6 0000 0000 0000 0000 0 1111 1111 1111 1111 -72.8 E -6 1000 0000 0000 0001 -2.38596 (Negative Full Scale) 1000 0000 0000 0000 Reserved Code The SCLK input has a filter which rejects any positive or negative pulse of width less than 50nsec to reduce noise. The rejection width of this pulse can vary between 50nsec and 750nsec depending on processing parameters and supply voltage. Figure 3-1 and Table 3-2 show information for determining the mode of operation for the TC3400 part by recording the value of SDAT for SCLK in a high, then low, then high state. For example, if SCLK goes through a 1-0-1 transition and the corresponding values of SDAT are 1-1-0, then the SCLK falling edge started a new data conversion. A 0-1-0 for SDAT would have indicated a resolution reduction had occurred. This is useful if the microcontroller has a watchdog reset or otherwise loses track of where the TC3400 is in the conversion and data readout sequence. The microcontroller can simply transition SCLK until it “finds” a Start Conversion condition. FIGURE 3-1: SCLK, SDAT LOGIC STATE DIAGRAM Reading the Data Word After the conversion is complete and SDAT goes high, the conversion value can be clocked serially onto the SDAT line by high to low transitions of the SCLK. The data word is in two’s compliment format with the sign bit clocked onto the SDAT line, first followed by the MSB and ending in the LSB. For a 16-bit conversion the data word would consist of a sign bit followed by 15 magnitude bits, Table 3-1 shows the data word versus input voltage for a 16-bit conversion. Note that the full scale input voltage range is ±(2 REFIN – 1LSB). When REFOUT is fed back directly to REFIN, an LSB is 73µV for a 16-bit conversion, as REFOUT is typically 1.193V. Figure 3-3 shows typical SCLK and SDAT waveforms for 16, 12 and 10-bit conversions. Note that any complete convert and read cycle requires 17 negative edge clock pulses. The first is the convert command. Then, up to six of these can occur in the resolution reduction window, t4, to decrement resolution. The remaining pulses clock out the conversion data word. DS21409B-page 6 SCLK SDAT A B TABLE 3-2: C SCLK, SDAT LOGIC STATE A B C Status 1 1 0 Start Conversion 0 1 0 Resolution Reduction x 1 1 Data Transfer x 0 0 Data Transfer or Busy* *Note: The code X00 has a dual meaning: Data Transfer or Busy converting. To avoid confusion, the user should send only the required number of pulses for the desired resolution, then wait for SDAT to rise to 1, indicating conversion is complete before clocking SCLK again to read out data bits. 2002 Microchip Technology Inc. TC3400 FIGURE 3-2: CONVERSION AND DATA OUTPUT TIMING t2 SCLK t1 t4 t8 t8 Sleep Mode t5 SDAT DN (MSB) DN-1 DN-2 D0 (LSB) t3 Data Conversion Complete Start Conversion and Resolution Control Timing FIGURE 3-3: Data Output Timing SCLK AND SDAT WAVEFORMS FOR 16, 12 AND 10-BIT CONVERSIONS 16-bit Data Conversion, Data Word A5A5h SCLK t3a SDAT Data Conversion Complete 16-bit Data Conversion, Long Start Pulse, Data Word 5A5Ah SCLK > t3a SDAT Data Conversion Complete 12-bit Conversion, Data Word = AB3h SCLK < t4 t3e SDAT Data Conversion Complete 10-bit Conversion with "Extra" Data Reduction Clocks, Data Word = 3A4h SCLK < t4 t3g SDAT Data Conversion Complete 2002 Microchip Technology Inc. DS21409B-page 7 TC3400 FIGURE 3-4: A/D OPERATIONAL FLOWCHART SDAT = Low POR CONVCLK = 2m? (Conversion Done?) No Sleep SDAT = High Yes No SCLK Hgh to Low? Power Down Analog, Conversion Complete, SDAT = High Yes Power Up Analog, Start CONVCLK (= 0), Start Conversion, Resolution = 2m (m = 16), Latch Input Channel Address (if applicable). SCLK High to Low? No Yes SCLK Low to High transition? No SDAT = Dm; m=m–1 Yes SDAT = Low m ≥ 0? CONVCLK < 29? Yes No No Yes No SDAT = High Internal Reset SCLK High to Low? Sleep Yes No A/D Resolution > 210? Yes Reduce A/D Resolution by 1-bit (m = m – 1); SDAT = High DS21409B-page 8 2002 Microchip Technology Inc. TC3400 4.0 PACKAGING INFORMATION 4.1 Package Marking Information Package marking data not available at this time. 4.2 Taping Forms Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) 2002 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21409B-page 9 TC3400 4.3 Package Dimensions 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .015 (0.38) .008 (0.20) 3° MIN. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° MAX. .050 (1.27) .016 (0.40) Dimensions: inches (mm) DS21409B-page 10 2002 Microchip Technology Inc. TC3400 NOTES: 2002 Microchip Technology Inc. DS21409B-page 11 TC3400 NOTES: DS21409B-page 12 2002 Microchip Technology Inc. TC3400 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2002 Microchip Technology Inc. DS21409B-page 13 TC3400 NOTES: DS21409B-page 14 © 2002 Microchip Technology Inc. TC3400 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 *DS21409B* DS21409B-page 16 2002 Microchip Technology Inc.