MICROCHIP MCP1318

MCP131X/2X
Voltage Supervisor
Features:
Package Types
SOT-23-5
• Low Supply Current: 1 µA (Typical),10 µA (Max.)
• Precision Monitoring Trip Point Options:
- 2.9V and 4.6V (Standard Offerings)
- 2.0V to 4.7V in 100 mV Increments,
(Contact the local Microchip Sales Office)
• Resets Microcontroller in a Power-loss Event
• Reset Delay Time-Out Option:
- 1.4 ms, 30 ms, 200 ms, or 1.6s (Typical)
• Watchdog Timer Input Time-Out Options:
- 6.3 ms, 102 ms, 1.6s, or 25.6s (Typical)
• Manual Reset (MR) Input (Active-low)
• Single and Complementary Reset Output(s)
• Reset Output Options:
- Push-Pull (Active-high or Active-low)
- Open-Drain (Internal or External Pull-up)
• Temperature Range:
- -40°C to +85°C for Trip Points 2.0 to 2.4V and,
- -40°C to + 125°C for Trip Points > 2.5V
• Voltage Range: 1.0V to 5.5V
• Lead Free Packaging
MCP1316/16M/20
RST
1
VSS
2
MR
3
MCP1317
VDD
5
4
WDI
MCP1318/18M/21
RST
1
VSS
2
RST
3
4
1
VSS
2
MR
3
5
VDD
4
WDI
MCP1319/19M/22
VDD
5
RST
WDI
RST
1
VSS
2
RST
3
5
VDD
4
MR
Block Diagram
VDD
Comparator
+
RST
–
Output
Driver
Reference
Voltage
RST
Description:
MR
The MCP131X/2X are voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. The table
below shows the available features for these devices.
Noise Filter
VSS
WDI
Watchdog
Note: Features available depend on the device.
Device Features
Reset Output A
Device
Type
MCP1316
Push-Pull
MCP1316M
Open-Drain
MCP1317
Pull-up
Resistor
Reset Output B
Active
Level
Type
Pull-up
Resistor
Active
Level
WDI Input
MR Input
—
Low
—
—
—
Yes
Yes
Internal
Low
—
—
—
Yes
Yes
Push-Pull
—
High
—
—
—
Yes
Yes
MCP1318
Push-Pull
—
Low
Push-Pull
—
High
Yes
No
MCP1318M
Open-Drain
Internal
Low
Push-Pull
—
High
Yes
No
MCP1319
Push-Pull
—
Low
Push-Pull
—
High
No
Yes
MCP1319M
Open-Drain
Internal
Low
Push-Pull
—
High
No
Yes
MCP1320
Open-Drain
External
Low
—
—
—
Yes
Yes
MCP1321
Open-Drain
External
Low
Push-Pull
—
High
Yes
No
MCP1322
Open-Drain
External
Low
Push-Pull
—
High
No
Yes
 2005-2012 Microchip Technology Inc.
DS21985D-page 1
MCP131X/2X
NOTES:
DS21985D-page 2
 2005-2012 Microchip Technology Inc.
MCP131X/2X
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (VDD to VSS) . . . . . . . . . . . . . . . . . . . . . . 7.0V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Voltage on all inputs and outputs, except Open-Drain RST
(with no internal pull-up resistor), w.r.t. VSS . .-0.6V to (VDD +
1.0V)
Voltage on Open-Drain RST
(with no internal pull-up resistor) w.r.t. VSS . . -0.6V to 13.5V
Storage temperature . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient temp. with power applied . . . . . . . .-40°C to +125°C
Maximum Junction temp. with power applied . . . . . . . +150°C
Power Dissipation (TA  +70°C):
5-Pin SOT-23A .......................................................240 mW
ESD protection on all pins  4 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Operating Voltage Range
VDD
1.0
—
5.5
V
Specified VDD Value to VOUT Low
VDD
1.0
—
—
V
I RST = 10 µA, V RST < 0.3V
Operating Current:
IDD
—
5
10
µA
Watchdog Timer Active
—
1
2
µA
Watchdog Timer Inactive
—
1
2
µA
VDD < VTRIP
—
5
10
µA
Reset Delay Timer Active
Note 1:
2:
3:
4:
5:
6:
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
 2005-2012 Microchip Technology Inc.
DS21985D-page 3
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
VDD Trip Point
Note 1:
2:
3:
4:
5:
6:
Sym
Min
Typ
Max
Units
VTRIP
1.970
2.00
2.030
V
TA = +25°C (Note 1)
(Note 6)
1.950
2.00
2.050
V
TA = -40°C to +85°C (Note 2)
MCP13XX-21
2.069
2.10
2.132
V
TA = +25°C (Note 1)
(Note 6)
2.048
2.10
2.153
V
TA = -40°C to +85°C (Note 2)
MCP13XX-22
2.167
2.20
2.233
V
TA = +25°C (Note 1)
(Note 6)
2.145
2.20
2.255
V
TA = -40°C to +85°C (Note 2)
MCP13XX-23
2.266
2.30
2.335
V
TA = +25°C (Note 1)
(Note 6)
2.243
2.30
2.358
V
TA = -40°C to +85°C (Note 2)
MCP13XX-24
2.364
2.40
2.436
V
TA = +25°C (Note 1)
(Note 6)
2.340
2.40
2.460
V
TA = -40°C to +85°C (Note 2)
MCP13XX-25
2.463
2.50
2.538
V
TA = +25°C (Note 1)
(Note 6)
2.438
2.50
2.563
V
TA = -40°C to +125°C (Note 2)
MCP13XX-26
2.561
2.60
2.639
V
TA = +25°C (Note 1)
(Note 6)
2.535
2.60
2.665
V
TA = -40°C to +125°C (Note 2)
MCP13XX-27
2.660
2.70
2.741
V
TA = +25°C (Note 1)
(Note 6)
2.633
2.70
2.768
V
TA = -40°C to +125°C (Note 2)
MCP13XX-28
2.758
2.80
2.842
V
TA = +25°C (Note 1)
(Note 6)
2.730
2.80
2.870
V
TA = -40°C to +125°C (Note 2)
MCP13XX-29
2.857
2.90
2.944
V
TA = +25°C (Note 1)
2.828
2.90
2.973
V
TA = -40°C to +125°C (Note 2)
MCP13XX-30
2.955
3.00
3.045
V
TA = +25°C (Note 1)
(Note 6)
2.925
3.00
3.075
V
TA = -40°C to +125°C (Note 2)
MCP13XX-31
3.054
3.10
3.147
V
TA = +25°C (Note 1)
(Note 6)
3.023
3.10
3.178
V
TA = -40°C to +125°C (Note 2)
MCP13XX-32
3.152
3.20
3.248
V
TA = +25°C (Note 1)
(Note 6)
3.120
3.20
3.280
V
TA = -40°C to +125°C (Note 2)
MCP13XX-33
3.251
3.30
3.350
V
TA = +25°C (Note 1)
(Note 6)
3.218
3.30
3.383
V
TA = -40°C to +125°C (Note 2)
MCP13XX-20
Conditions
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 4
 2005-2012 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
VDD Trip Point (Con’t)
Sym
Min
Typ
Max
Units
VTRIP
3.349
3.40
3.451
V
TA = +25°C (Note 1)
(Note 6)
3.315
3.40
3.385
V
TA = -40°C to +125°C (Note 2)
MCP13XX-35
3.448
3.50
3.553
V
TA = +25°C (Note 1)
(Note 6)
3.413
3.50
3.588
V
TA = -40°C to +125°C (Note 2)
MCP13XX-36
3.546
3.60
3.654
V
TA = +25°C (Note 1)
(Note 6)
3.510
3.60
3.690
V
TA = -40°C to +125°C (Note 2)
MCP13XX-37
3.645
3.70
3.756
V
TA = +25°C (Note 1)
(Note 6)
3.608
3.70
3.793
V
TA = -40°C to +125°C (Note 2)
MCP13XX-38
3.743
3.80
3.857
V
TA = +25°C (Note 1)
(Note 6)
3.705
3.80
3.895
V
TA = -40°C to +125°C (Note 2)
MCP13XX-39
3.842
3.90
3.959
V
TA = +25°C (Note 1)
(Note 6)
3.803
3.90
3.998
V
TA = -40°C to +125°C (Note 2)
MCP13XX-40
3.940
4.00
4.060
V
TA = +25°C (Note 1)
(Note 6)
3.900
4.00
4.100
V
TA = -40°C to +125°C (Note 2)
MCP13XX-41
4.039
4.10
4.162
V
TA = +25°C (Note 1)
(Note 6)
3.998
4.10
4.203
V
TA = -40°C to +125°C (Note 2)
MCP13XX-42
4.137
4.20
4.263
V
TA = +25°C (Note 1)
(Note 6)
4.095
4.20
4.305
V
TA = -40°C to +125°C (Note 2)
MCP13XX-43
4.236
4.30
4.365
V
TA = +25°C (Note 1)
(Note 6)
4.193
4.30
4.408
V
TA = -40°C to +125°C (Note 2)
MCP13XX-44
4.334
4.40
4.466
V
TA = +25°C (Note 1)
(Note 6)
4.290
4.40
4.510
V
TA = -40°C to +125°C (Note 2)
MCP13XX-45
4.433
4.50
4.568
V
TA = +25°C (Note 1)
(Note 6)
4.388
4.50
4.613
V
TA = -40°C to +125°C (Note 2)
MCP13XX-46
4.531
4.60
4.669
V
TA = +25°C (Note 1)
4.485
4.60
4.715
V
TA = -40°C to +125°C (Note 2)
MCP13XX-47
4.630
4.70
4.771
V
TA = +25°C (Note 1)
(Note 6)
4.583
4.70
4.818
V
TA = -40°C to +125°C (Note 2)
—
±40
—
ppm/°C
MCP13XX-34
VDD Trip Point Tempco
Note 1:
2:
3:
4:
5:
6:
TTPCO
Conditions
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
 2005-2012 Microchip Technology Inc.
DS21985D-page 5
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Threshold Hysteresis
Note 3)
MCP13XX-20
Sym
Min
Typ
Max
Units
VHYS
0.020
—
0.120
V
TA = +25°C (Note 3)
V
TA = -40°C to +85°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +85°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +85°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +85°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +85°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
(Note 6)
MCP13XX-21
(Note 6)
0.021
(Note 6)
MCP13XX-22
0.022
0.023
0.024
0.025
0.026
0.027
0.144
—
0.150
—
0.156
—
0.162
(Note 6)
0.028
(Note 6)
MCP13XX-29
—
(Note 6)
(Note 6)
MCP13XX-28
0.138
(Note 6)
(Note 6)
MCP13XX-27
—
(Note 6)
(Note 6)
MCP13XX-26
0.132
(Note 6)
(Note 6)
MCP13XX-25
—
(Note 6)
(Note 6)
MCP13XX-24
0.126
(Note 6)
(Note 6)
MCP13XX-23
—
—
0.168
(Note 6)
0.029
—
0.174
(Note 6)
MCP13XX-30
0.030
(Note 6)
MCP13XX-31
0.031
(Note 6)
Note 1:
2:
3:
4:
5:
6:
—
0.186
(Note 6)
0.032
(Note 6)
MCP13XX-33
0.180
(Note 6)
(Note 6)
MCP13XX-32
—
—
0.192
(Note 6)
0.033
—
(Note 6)
0.198
Conditions
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 6
 2005-2012 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Threshold Hysteresis
MCP13XX-34
(Continued) Note 3)
(Note 6)
MCP13XX-35
Sym
Min
Typ
Max
Units
VHYS
0.034
—
0.204
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 1)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
V
TA = +25°C (Note 3)
V
TA = -40°C to +125°C
(Note 6)
0.035
(Note 6)
MCP13XX-36
0.036
0.037
0.038
0.039
0.040
0.041
0.042
0.043
0.044
—
0.240
—
0.246
—
0.252
—
0.258
—
0.264
(Note 6)
0.045
(Note 6)
MCP13XX-46
0.234
(Note 6)
(Note 6)
MCP13XX-45
—
(Note 6)
(Note 6)
MCP13XX-44
0.228
(Note 6)
(Note 6)
MCP13XX-43
—
(Note 6)
(Note 6)
MCP13XX-42
0.222
(Note 6)
(Note 6)
MCP13XX-41
—
(Note 6)
(Note 6)
MCP13XX-40
0.216
(Note 6)
(Note 6)
MCP13XX-39
—
(Note 6)
(Note 6)
MCP13XX-38
0.210
(Note 6)
(Note 6)
MCP13XX-37
—
—
0.270
(Note 6)
0.046
—
0.276
(Note 6)
MCP13XX-47
(Note 6)
Note 1:
2:
3:
4:
5:
6:
0.047
—
(Note 6)
0.282
Conditions
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
 2005-2012 Microchip Technology Inc.
DS21985D-page 7
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
RST/RST Low-Level Output Voltage
RST/RST High-Level Output Voltage
Sym
Min
Typ
Max
Units
Conditions
VOL
—
—
0.3
V
IOL = 50 µA, 1.0V  VDD  1.5V
—
—
0.3
V
IOL = 100 µA,
1.5V  VDD  2.5V
—
—
0.3
V
IOL = 2 mA, 2.5V  VDD  4.5V
—
—
0.3
V
IOL = 4 mA, VDD  4.5V
VDD –
0.7
—
—
V
IOH = 2.5 mA, VDD  2.5V
VDD –
0.7
—
—
V
IOH = 500 µA, VDD  1.5V
VOH
(Push-Pull Outputs only)
Input Low Voltage (MR and WDI pins)
VIL
VSS
—
0.3VDD
V
Input High Voltage (MR and WDI pins)
VIH
0.7 VDD
—
VDD
V
V
Open-Drain Output pin only,
VDD = 3.0V, Time voltage >
5.5V applied  100 s,
current into pin limited to 2 mA,
+25°C operation
recommended
(Note 4, Note 5)
VSS  VPIN  VDD
VODH
—
—
13.5 (4)
Input Leakage Current (MR and WDI)
IIL
—
—
±1
µA
Open-Drain Output Leakage Current
(MCP1316M, MCP1318M,
MCP1319M, MCP1320, MCP1321,
and MCP1322 only)
IOD
—
0.003
1.0
µA
RPU
—
52
—
k
VDD = 5.5V
WDI pin
—
52
—
k
VDD = 5.5V
RST pin
—
4.7
—
k
VDD = 5.5V,
MCP131XM devices only
Open-Drain High Voltage on Output
(Note 4)
Pull-up Resistance
MR pin
Input Pin Capacitance (MR and WDI)
CI
—
100
—
pF
Output Pin Capacitive Loading
(RST and RST)
CO
—
—
50
pF
Note 1:
2:
3:
4:
5:
6:
This is the tester loading to
meet the AC timing
specifications.
Trip point is ±1.5% from typical value.
Trip point is ±2.5% from typical value.
Hysteresis is minimum = 1%, maximum = 6% at +25°C.
This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
This parameter is established by characterization and is not 100% tested.
Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 8
 2005-2012 Microchip Technology Inc.
MCP131X/2X
VTRIPMAX VTRIPAC + VHYS
VTRIPMIN
VDD
tRST
1V
tRR
tRST
tRPD
VTRIP
RST
RST
VDD < 1V is outside the device operating specification. The RST (or RST) output state is
unknown while VDD < 1V.
FIGURE 1-1:
TABLE 1-1:
Device Voltage and Reset Pin Waveforms.
DEVICE VOLTAGE AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Falling VDD Trip Point Detected
to RST or RST Active
tRPD
—
650
—
µs
VDD ramped from
VTRIPMAX + 250 mV down to
VTRIPMIN – 200 mV,
VDD falling @ 5 mV/µs,
CL = 50 pF (Note 1)
VDD Rise Rate
tRR
Reset active time
(MR Rising Edge, POR/BOR
Inactive, or WDT time out) to
RST/RST Inactive
tRST
RST Rise Time after RST Active
(Push-Pull Outputs only)
tRT
RST Rise Time after RST Inactive
(Push-Pull Outputs only)
RST Fall Time after RST Inactive
RST Fall Time after RST Active
Note 1:
2:
3:
tFT
Conditions
Note 3
1.0
1.4
2.0
ms
Note 2
20
30
40
ms
Note 2
140
200
280
ms
Standard Time Out
1120
1600
2240
ms
Note 2
—
5
—
µs
For RST 10% to 90% of VDD,
CL = 50 pF (Note 1)
—
5
—
µs
For RST 10% to 90% of VDD,
CL = 50 pF (Note 1)
—
5
—
µs
For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
—
5
—
µs
For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
These parameters are for design guidance only and are not 100% tested.
Custom ordered Reset active time; minimum order volume requirement.
Designed to be independent of VDD rise rate. Device characterization was done with a rise rate as slow as
0.1 V/s (@ +25°C).
 2005-2012 Microchip Technology Inc.
DS21985D-page 9
MCP131X/2X
tMR
MR
tRST
tNF
tMRD
RST
RST
FIGURE 1-2:
TABLE 1-2:
MR and Reset Pin Waveforms.
MR AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
MR Pulse Width
tMR
1
—
—
µs
MR Active to RST/RST Active
tMRD
—
235
—
ns
VDD = 5.0V
tNF
—
150
—
ns
VDD = 5.0V
MR Input Noise filter
Note 1:
These parameters are for design guidance only and are not 100% tested.
RST
RST
WDI (Note 1)
tRST
tWP
tWD
tWD
Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.
FIGURE 1-3:
TABLE 1-3:
WDI and Reset Pin Waveforms.
WDI AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
WDI Pulse Width
tWP
50
—
—
ns
Watchdog Time-Out Period
tWD
4.3
6.3
9.3
ms
Note 1
71
102
153
ms
Note 1
Note 1:
Conditions
1.12
1.6
2.4
sec
Standard Time Out
17.9
25.6
38.4
sec
Note 1
Custom ordered WatchDog Timer time out; minimum order volume requirement.
DS21985D-page 10
 2005-2012 Microchip Technology Inc.
MCP131X/2X
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1316), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
TA
-40
—
+85
°C
MCP13XX-25 (or below)
Except MCP13XX-25 (or below)
Temperature Ranges
Specified Temperature Range
TA
-40
—
+125
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
220.7
—
°C/W
Package Thermal Resistances
Thermal Resistance, 5L-SOT-23
 2005-2012 Microchip Technology Inc.
DS21985D-page 11
MCP131X/2X
NOTES:
DS21985D-page 12
 2005-2012 Microchip Technology Inc.
MCP131X/2X
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
1.2
1.5V
2.0V
3.0V
4.5V
4.8V
5.0V
5.5V
4.3V
0.6
0.4
0.2
4
3
2
1
0
-100
-50
0
50
100
0
-100
150
-50
Temperature (°C)
2.5V
2.7V
3.2V
4.0V
4.5V
5.0V
5.5V
0.6
0.2
1
50
100
0
-100
150
-50
FIGURE 2-2:
IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1319-2.9).
1.8V
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
0
50
100
150
2.5V
4.0V
4.5V
5.0V
5.5V
7
6
5
IDD (µA)
IDD (µA)
1.5V
5.5V
FIGURE 2-5:
IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1319-2.9).
2.2V
1.0V
5.0V
Temperature (°C)
Temperature (°C)
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-100
4.5V
3
2
0
4.0V
4
0.4
-50
150
5
0.8
0
-100
100
6
IDD (µA)
IDD (µA)
3.2V
1.5V
50
FIGURE 2-4:
IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1318M-4.6).
1.4
1.0V
0
Temperature (°C)
FIGURE 2-1:
IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1318M-4.6).
1
5.5V
5
0.8
1.2
5.0V
6
Idd (µA)
IDD (µA)
1
4.8V
1.0V
4
3
2
1
-50
0
50
100
150
Temperature (°C)
FIGURE 2-3:
IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1316-2.0).
 2005-2012 Microchip Technology Inc.
0
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-6:
IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1316-2.0).
DS21985D-page 13
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
4.8V
5.0V
5.5V
7
6
IDD (µA)
5
4
3
2
1
0
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-7:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1318M-4.6).
MCP1319 does not
have a Watchdog Timer
FIGURE 2-8:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1319-2.9).
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
7
6
IDD (µA)
5
4
3
2
1
0
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-9:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1316-2.0).
DS21985D-page 14
 2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
-45°C
1.2
1
-45°C
0.4
IDD (µA)
IDD (µA)
+25°C
+90°C
+130°C
5
+90°C
0.8
0.6
+25°C
6
+130°C
4
3
2
0.2
1
0
0
0.0
2.0
4.0
6.0
4.6
4.8
5.0
VDD (V)
5.2
5.4
5.6
VDD (V)
FIGURE 2-10:
IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive)
(MCP1318M-4.6).
FIGURE 2-13:
IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active)
(MCP1318M-4.6).
-45°C
1.4
+130°C
6
+90°C
5
+25°C
4
+25°C
+90°C
+130°C
1.2
0.8
-45°C
0.6
IDD (µA)
IDD (µA)
1
3
0.4
2
0.2
1
0
0
0.0
2.0
4.0
6.0
0.0
2.0
VDD (V)
FIGURE 2-11:
IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive)
(MCP1319-2.9).
6.0
FIGURE 2-14:
IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active)
(MCP1319-2.9).
-45°C
1.8
7
+90°C
6
1.2
+25°C
5
1
-45°C
1.4
0.8
0.6
IDD (µA)
+130°C
1.6
IDD (µA)
4.0
VDD (V)
+90°C
+130°C
4
3
0.4
2
0.2
1
0
+25°C
0
0.0
2.0
4.0
6.0
VDD (V)
FIGURE 2-12:
IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive)
(MCP1316-2.0).
 2005-2012 Microchip Technology Inc.
2.0
3.0
4.0
VDD (V)
5.0
6.0
FIGURE 2-15:
IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active)
(MCP1316-2.0).
DS21985D-page 15
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
VTRIP Up
VHYST
4.700
4.650
VTRIP Down
4.600
4.550
-50
0
50
100
1V
2V
3V
4.3V
0.1
0.08
0.06
0.02
0
0.00
2.00
4.00
6.00
IOL (mA)
FIGURE 2-19:
(MCP1318M-4.6).
VOL vs. IOL
0.16
3.4
0.14
3.3
2.960
3.3
2.940
3.2
3.2
2.920
VTRIP Down
2.900
2.880
0
50
100
2.7V
0.02
0
0.00
150
2.00
Temperature (°C)
FIGURE 2-20:
(MCP1319-2.9).
3.0
VTRIP Up
VHYST
2.030
2.0
2.020
1.5
2.010
1.0
VTRIP Down
2.000
0.5
1.990
0.0
-50
0
50
100
150
VOL (V)
2.5
VTRIP Hyst (%)
VTRIP (V)
2.040
0.02
0.018
0.016
0.014
0.012
0.01
0.008
0.006
0.004
0.002
0
0.00
DS21985D-page 16
5V
5.5V
4.00
6.00
IOL (mA)
8.00
10.00
VOL vs. IOL
1V
1.8V
0.05
0.10
0.15
0.20
0.25
IOL (mA)
Temperature (°C)
FIGURE 2-18:
VTRIP and VHYST vs.
Temperature (MCP1316-2.0).
4.5V
0.06
0.04
2.050
4V
0.1
3.1
FIGURE 2-17:
VTRIP and VHYST vs.
Temperature (MCP1319-2.9).
3.2V
10.00
0.08
3.1
3.0
-50
2.5V
8.00
0.12
VOL (V)
VHYST
3.4
VTRIP Hyst (%)
VTRIP (V)
1V
3.5
2.980
5.5V
0.04
FIGURE 2-16:
VTRIP and VHYST vs.
Temperature (MCP1318M-4.6).
3.000
5V
0.12
Temperature (°C)
VTRIP Up
4.8V
0.14
150
3.020
4.5V
0.16
VOL (V)
VTRIP (V)
4.750
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
VTRIP Hyst (%)
4.800
FIGURE 2-21:
(MCP1316-2.0).
VOL vs. IOL
 2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
0.12
4 mA
01
0.1
A
3 mA
VOH (V)
VOLL (V)
0.14
0.08
2 mA
0.06
0.04
1 mA
0.02
0 mA
0
-50
0
50
100
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0.00
4.5V
4.3V
3V
2V
1.5V
2.00
150
FIGURE 2-22:
VOL vs. Temperature
(MCP1318M-4.6 @ VDD = 4.5V).
4.00
6.00
IOH (mA)
FIGURE 2-25:
VOH vs. IOH
(MCP1318M-4.6 @ +25°C).
6
0.25
5.5V
5V
4.5V
4V
5
4 mA
4
VOH (V)
VOLL (V)
0.2
3 mA
0.15
2 mA
0.1
0.05
0
-50
0
50
1 mA
1
0 mA
0
0.00
100
3.2V
2
2.7V
2.5V
1.5V
2.00
150
4.00
6.00
IOH (mA)
FIGURE 2-26:
VOH vs. IOH
(MCP1319-2.9 @ +25°C).
FIGURE 2-23:
VOL vs. Temperature
(MCP1319-2.9 @ VDD = 2.7V).
0.016
6
0.2 mA
0.014
5.5V
5V
4.5V
4V
5
0.012
0.15 mA
0.01
0.1 mA
0.008
0.006
4
VOH (V)
VOL (V)
3
3
2
0.004
0.05 mA
0.002
0 mA
0
-50
0
50
100
Temperature (°C)
FIGURE 2-24:
VOL vs. Temperature
(MCP1316-2-0 @ VDD = 1.8V).
 2005-2012 Microchip Technology Inc.
150
2.2V
2.5V
1
0
0.00
2.00
4.00
6.00
IOH (mA)
FIGURE 2-27:
VOH vs. IOH
(MCP1316-2.0 @ +25°C).
DS21985D-page 17
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
4.8 V
300
5V
250
5.5V
220
150
100
215
210
205
200
50
195
-50
0
50
100
190
-100
150
-50
Temperature (°C)
FIGURE 2-28:
(MCP1318M-4.6).
FIGURE 2-31:
(MCP1318M-4.6).
tRPD vs. Temperature
4V
4.5V
5V
-50
0
50
3.2 V
5.5V
100
150
250
245
240
235
230
225
220
215
210
205
200
-100
2.5V
4.5V
5V
FIGURE 2-32:
(MCP1319-2.9).
300
tRPU (ms)
tRPD (µs)
250
200
150
100
50
-50
0
50
100
150
250
245
240
235
230
225
220
215
210
205
200
-100
-50
Temperature (°C)
FIGURE 2-30:
(MCP1316-2.0).
DS21985D-page 18
150
4V
4.5 V
0
5V
50
5.5 V
100
150
tRPD vs. Temperature
tRPU vs. Temperature
2.5 V
5.5V
350
0
-100
100
Temperature (°C)
tRPD vs. Temperature
4V
50
tRPU vs. Temperature
-50
Temperature (°C)
FIGURE 2-29:
(MCP1319-2.9).
0
Temperature (°C)
tRPU (ms)
tRPD (µs)
3.2V
450
400
350
300
250
200
150
100
50
0
-100
5.5 V
225
200
0
-100
5V
230
tRPU (ms)
tRPD (µs)
350
4V
4.5 V
0
5V
50
5.5 V
2.2 V
100
150
Temperature (°C)
FIGURE 2-33:
(MCP1316-2.0).
tRPU vs. Temperature
 2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
VRST=2.9V
3.2 V
VRST=4.6V
350
3000
300
2500
250
tMRD (ns)
Transient Duration (µs)
VRST=2.0V
3500
2000
1500
2.0V
1000
2.9V
4.5 V
5V
5.5 V
200
150
100
500
50
0
0.001
0.01
0.1
1
0
-100
10
-50
Reset Threshold Overdrive (V) VTRIPMin - VDD
FIGURE 2-34:
Transient Duration vs.
VTRIP (min) – VDD.
2.2 V
2.5 V
4V
4.5 V
5V
5.5 V
2.2 V
0.01
0.006
0.004
0.002
0
-100
-50
0
50
100
Temperature (°C)
FIGURE 2-35:
Open-Drain Leakage
Current vs. Temperature (MCP1320-2.0).
150
50
100
150
FIGURE 2-37:
MR Low to Reset
Propagation Delay (MCP1319-2.9).
0.012
0.008
0
Temperature (°C)
tMRD (ns)
Open-Drain Leakage (µA)
4V
450
400
350
300
250
200
150
100
50
0
-100
-50
2.5 V
4V
0
4.5 V
50
5V
100
5.5 V
150
Temperature (°C)
FIGURE 2-38:
MR Low to Reset
Propagation Delay (MCP1316-2.0).
MCP1318M does not
have an MR pin
FIGURE 2-36:
MR Low to Reset
Propagation Delay (MCP1318M-4.6).
 2005-2012 Microchip Technology Inc.
DS21985D-page 19
MCP131X/2X
1000
900
800
700
600
500
400
300
200
100
0
-100
Normalized Reset Timeout
Period
tRPD (µs)
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
5V to 4.5V
5V to 0V
-50
0
50
100
0.145
0.14
0.135
0.13
0.125
0.12
0.115
-100
150
MCP1318M-4.6
-50
Temperature (°C)
tRPD (µs)
Normalized Reset Timeout
Period
250
5V to 2.7V
VTRIP Typ + 0.3V to
VTRIP Min - 0.2V
150
100
50
5V to 0V
0
-100
-50
0
50
100
0.14
MCP1319-2.9
0.135
0.13
-50
tRPD (µs)
150
VTRIP Typ + 0.2V to
VTRIP Min - 0.2V
50
5V to 0V
0
50
100
150
Temperature (°C)
FIGURE 2-41:
VDD Falling to Reset
Propagation Delay vs. Temperature (MCP13162.0).
DS21985D-page 20
50
100
150
FIGURE 2-43:
Normalized Reset Time-Out
Period vs. Temperature (MCP1319-2.9).
Normalized Reset Timeout
Period
5V to 1.8V
-50
0
Temperature (°C)
250
0
-100
150
0.145
0.125
-100
150
FIGURE 2-40:
VDD Falling to Reset
Propagation Delay vs. Temperature (MCP13192.9).
100
100
0.15
Temperature (°C)
200
50
FIGURE 2-42:
Normalized Reset Time-Out
Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-39:
VDD Falling to Reset
Propagation Delay vs. Temperature
(MCP1318M-4.6).
200
0
Temperature (°C)
0.15
0.145
0.14
MCP1316-2.0
0.135
0.13
0.125
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-44:
Normalized Reset Time-Out
Period vs. Temperature (MCP1316-2.0).
 2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
VRST=2.0V
1.15
1.1
MCP1318M-4.6
1.05
1
`
0.95
0.9
-100
VRST=2.9V
VRST=4.6V
0.1
1
600
1.2
Transient Duration (µS)
Normalized Watchdog
Timeout Period
1.25
-50
0
50
100
150
500
400
300
200
100
0
0.001
0.01
10
Reset Threshold Overdrive (V) VTRIPMin - VDD
Temperature (°C)
FIGURE 2-45:
Normalized Watchdog TimeOut Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-48:
Max VDD Transient Duration
vs. Reset Threshold Overdrive.
MCP1319 does not
have a Watchdog Timer
Normalized Watchdog Timeout
Period
FIGURE 2-46:
Normalized Watchdog TimeOut Period vs. Temperature (MCP1319-2.9).
FIGURE 2-49:
“M” Part Number Pull-up
Characteristics (MCP1318M-4.6).
1.25
1.2
1.15
1.1
MCP1316-2.0
1.05
1
`
0.95
0.9
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-47:
Normalized Watchdog TimeOut Period vs. Temperature (MCP1316-2.0).
 2005-2012 Microchip Technology Inc.
DS21985D-page 21
MCP131X/2X
NOTES:
DS21985D-page 22
 2005-2012 Microchip Technology Inc.
MCP131X/2X
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Device
Symbol
Pin
Type
MCP1316M (1),
MCP1318M (1),
MCP1319M (1),
MCP1320,
MCP1321,
MCP1322
RST
O
SOT23-5
1
Buffer/
Driver
Type
Function
Open-Drain Reset Output (active-low)
Goes active (Low) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
Open-Drain = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
Open-Drain = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1316,
MCP1318,
MCP1319
O
Push-Pull
VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1317
RST
O
Push-Pull
Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
2
Note 1:
All
VSS
—
P
The ground reference for the device.
Open-Drain output with internal pull-up resistor.
 2005-2012 Microchip Technology Inc.
DS21985D-page 23
MCP131X/2X
TABLE 3-1:
PIN FUNCTION TABLE (CONTINUED)
Pin No.
Symbol
Pin
Type
Buffer/
Driver
Type
MCP1316,
MCP1316M,
MCP1317,
MCP1320
MR
I
ST
MCP1318,
MCP1318M,
MCP1319,
MCP1319M,
MCP1321,
MCP1322
RST
O
Push-Pull
Device
SOT23-5
3
Function
Manual Reset input for a Reset switch.
This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
4
MCP1316,
MCP1316M,
MCP1317,
MCP1318,
MCP1318M,
MCP1320,
MCP1321
WDI
I
ST
Watchdog Timer Input
The WDT period is specified at the time of device order.
The Standard WDT period is 1.6s typical.
An edge transition on the WDI pin resets the Watchdog
Timer counter (no time out). A Falling Edge is required to
start the WDT Timer.
MCP1319,
MCP1319M,
MCP1322
MR
I
ST
Manual Reset input for a Reset switch.
This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
VDD
—
P
The positive supply for the device.
5
Note 1:
All
Open-Drain output with internal pull-up resistor.
DS21985D-page 24
 2005-2012 Microchip Technology Inc.
MCP131X/2X
3.1
Ground Terminal (VSS)
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
3.2
Supply Voltage (VDD)
VDD can be used for power supply monitoring or a
voltage level that requires monitoring.
3.3
Reset Output (RST and RST)
There are four types of Reset output pins. These are:
1.
2.
3.
4.
Open-Drain active-low Reset, External pull-up
resistor required
Open-Drain active-low Reset, Internal pull-up
resistor
Push-Pull active-low Reset
Push-Pull active-high Reset
Some devices have both an active-low and active-high
Reset output.
3.3.1
ACTIVE-LOW (RST) – OPEN-DRAIN,
EXTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will float, and an external pull-up resistor is
required to bring the output to the high state.
3.3.2
3.4
Manual Reset Input (MR)
The Manual Reset (MR) input pin allows a push button
switch to easily be connected to the system. When the
push button is depressed, it forces a system Reset.
This pin has circuitry that filters noise that may be
present on the MR signal.
The MR pin is active-low and has an internal pull-up
resistor.
3.5
Watchdog Input
In some systems, it is desirable to have an external
Watchdog Timer to monitor the operation of the
system. This is done by requiring the embedded
controller to “pet” the Watchdog Timer within a
predetermined time frame (TWD). If the MCP131X/2X is
not “petted” within this time frame, the MCP131X/2X
will force the Reset pin(s) active.
The embedded controller “pets” the MCP131X/2X by
forcing an edge transition on the WDI pin. The WDT
Timer is activated by the first falling edge on the WDI
pin.
The standard offering devices have a typical Watchdog
Timer period (TWD) of 1.6 s. Table 1-3 shows the
available Watchdog Timer periods.
ACTIVE-LOW (RST) – OPEN-DRAIN,
INTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be pulled high by an internal pull-up
resistor (typically 4.7 k).
3.3.3
ACTIVE-LOW (RST) – PUSH-PULL
The RST push-pull output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the high state.
3.3.4
ACTIVE-HIGH (RST) – PUSH-PULL
The RST push-pull output remains high while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the low state.
 2005-2012 Microchip Technology Inc.
DS21985D-page 25
MCP131X/2X
NOTES:
DS21985D-page 26
 2005-2012 Microchip Technology Inc.
MCP131X/2X
4.0
OPERATIONAL DESCRIPTION
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momentarily. The second most common cause is when a
slowly decaying power supply causes the
microcontroller to begin executing instructions without
sufficient voltage to sustain volatile memory (RAM),
thus producing indeterminate results. Figure 4-1 shows
a typical application circuit.
The MCP131X/2X family of voltage supervisor devices
are designed to keep a microcontroller in Reset, until
the system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level.
Some MCP131X/2X family members include a Watchdog Timer feature that after being enabled (by a falling
edge on the WDI pin), monitors the WDI pin for falling
or rising edges. If an edge transition is not detected
within the expected time frame, the MCP131X/2X
devices will force the Reset pin active. This is useful to
ensure that the embedded system’s Host Controller
program is operating as expected.
Some MCP131X/2X family members include a Manual
Reset feature that allow a push button switch to be
directly connected to the MCP131X/2X devices (on the
MR pin). This allows the system to easily be reset from
the external control of the push button switch.
A superset block diagram is shown in Figure 4-2, with
device specific block diagrams shown in Figure 4-3
through Figure 4-12.
VDD
0.1
µF
VDD
VDD
RPU(1)
MCP13XX
MCLR
(Reset input)
(active-low)
RST
RST (2)
MR
PIC®
Microcontroller
I/O
WDI
VSS
VSS
To system
device that
requires activehigh resets
Push button
switch
Note 1: Resistor RPU may be required with the
MCP1320, MCP1321 or MCP1322 due
to the open-drain output.
Resistor RPU may not be required with
the MCP1316M, MCP1318M or
MCP1319M due to the internal pull-up
resistor.
The MCP1316, MCP1317, MCP1318
and MCP1319 do not require the
external pull-up resistor.
2: Not all devices offer the active-high
Reset output pin.
FIGURE 4-1:
Typical Application Circuit.
VDD
Comparator
+
–
MR
WDI
RST
Reference
Voltage
Output
Driver
RST
Noise Filter
VSS
Watchdog
Note: Features available depend on the device.
FIGURE 4-2:
 2005-2012 Microchip Technology Inc.
Family Block Diagram.
DS21985D-page 27
MCP131X/2X
4.0.1
DEVICE SPECIFIC BLOCK
DIAGRAMS
VDD
VDD
Comparator
Comparator
+
+
–
MR
Reference
Voltage
Output
Driver
RST
–
RST
Reference
Voltage
Output
Driver
RST
Noise Filter
VSS
WDI
Watchdog
FIGURE 4-3:
MCP1316 Block Diagram.
VSS
WDI
Watchdog
FIGURE 4-6:
VDD
VDD
Comparator
Comparator
+
+
–
MR
MCP1318 Block Diagram.
Reference
Voltage
Output
Driver
RST
–
RST
Reference
Voltage
Output
Driver
RST
Noise Filter
VSS
WDI
Watchdog
FIGURE 4-4:
MCP1316M Block Diagram.
WDI
FIGURE 4-7:
VSS
Watchdog
MCP1318M Block Diagram.
VDD
Comparator
+
–
MR
WDI
Reference
Voltage
Output
Driver
RST
Noise Filter
VSS
Watchdog
FIGURE 4-5:
DS21985D-page 28
MCP1317 Block Diagram.
 2005-2012 Microchip Technology Inc.
MCP131X/2X
VDD
VDD
Comparator
Comparator
+
RST
–
MR
+
Reference
Voltage
Output
Driver
–
RST
Reference
Voltage
Output
Driver
RST
RST
Noise Filter
VSS
FIGURE 4-8:
MCP1319 Block Diagram.
VSS
WDI
Watchdog
FIGURE 4-11:
VDD
VDD
Comparator
Comparator
+
MR
+
RST
–
Reference
Voltage
Output
Driver
–
RST
MR
Noise Filter
Reference
Voltage
MCP1319M Block Diagram.
Output
Driver
RST
RST
Noise Filter
VSS
FIGURE 4-9:
MCP1321 Block Diagram.
VSS
FIGURE 4-12:
MCP1322 Block Diagram.
.
VDD
Comparator
+
–
MR
WDI
Reference
Voltage
Output
Driver
RST
Noise Filter
VSS
Watchdog
FIGURE 4-10:
MCP1320 Block Diagram.
 2005-2012 Microchip Technology Inc.
DS21985D-page 29
MCP131X/2X
4.1
Reset Voltage Trip Point (VTRIP)
Operation
The device’s Reset voltage trip point (VTRIP) is selected
when the device is ordered. As the voltage on the
device’s VDD pin is above or below this selected trip
point, the output of the Reset pin (RST/RST) will be
forced to either the inactive or active state.
For the voltage trip point, there is a minimum trip voltage
(VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The
voltage that the device “actually” trips at will be referred
to as VTRIP. The trip voltage is specified for the falling of
the device VDD.
The Reset pin (RST or RST) will be forced active if any
of the following occur:
•
•
•
•
The Manual Reset input (MR) goes low
The Watchdog Timer times out
VDD goes below the threshold
During device power-up
After the device exits the Reset condition, the delay
circuitry will hold the RST and RST pins active until the
appropriate Reset delay time (tRST) has elapsed.
There is also a hysteresis (VHYS) on the trip point. This
is so that noise on the device voltage (VDD) does not
cause the Reset pin (RST/RST) to “jitter” (change
between driving an active and inactive state).
TABLE 4-1:
RESET PIN STATES
State of RST Pin when:
Device
MCP1316
State of RST (3) Pin when:
Output Driver
VDD <
VTRIP
VDD > VTRIP +
VHYS
VDD <
VTRIP
VDD > VTRIP +
VHYS
L
H
—
—
Push-pull
—
—
Open-drain (2)
MCP1316M
L
MCP1317
—
—
H
L
Push-pull
MCP1318
L
H
H
L
Push-pull
H
L
Open-drain (2)
MCP1318M
L
MCP1319
L
H
(2)
H
(2)
H
H
L
Push-pull
(2)
H
L
Open-drain (2)
MCP1319M
L
H
MCP1320
L
H (1)
—
—
Open-drain (1)
MCP1321
L
H (1)
H
L
Open-drain (1)
MCP1322
L
H (1)
H
L
Open-drain (1)
Note 1:
2:
3:
Requires External Pull-up resistor.
Has Internal Pull-up resistor.
The RST pin output is always push-pull.
DS21985D-page 30
 2005-2012 Microchip Technology Inc.
MCP131X/2X
4.1.1
POWER-UP/RISING VDD
As the device VDD rises, the device’s Reset circuit will
remain active until the voltage rises above the “actual”
trip point (VTRIP) plus the hysteresis (VHYS).
Figure 4-13 shows a power-up sequence and the
waveform of the RST and RST pins.
As the device powers up, the voltage will start below
the valid operating voltage of the device. At this
voltage, the Reset output value is not valid. Once the
voltage is above the minimum operating voltage (1V)
and below the selected VTRIP, the Reset output will be
active.
Once the device voltage rises above the “actual” trip
point (VTRIP) plus the hysteresis (VHYS), the Reset delay
timer (tRST) starts. When the Reset delay timer times
out, the Reset output (RST/RST) is driven inactive.
Note:
While the Reset delay timer (tRST) is
active,
additional system current is
consumed.
VTRIPMAX
VTRIPMIN
VDD
FIGURE 4-13:
Power-up.
4.1.2
POWER-DOWN/BROWN-OUTS
As the device powers-down/brown-outs, the voltage
(VDD) falls from a voltage above the device’s trip point
(VTRIP). The device’s “actual” trip point voltage (VTRIP)
will be between the minimum trip point (VTRIPMIN) and
the maximum trip point (VTRIPMAX). Once the device
voltage (VDD) goes below this voltage, the Reset pin(s)
will be forced to the active state. There is a hysteresis
on this trip point. This is so noise on the device voltage
(VDD) does not cause the Reset pin (RST/RST) to
“jitter” (change between driving an active and inactive).
Figure 4-14 shows the waveform of the RST pin as
determined by the VDD voltage, while Table 4-1 shows
the state of the RST pin.
4.1.2.1
Note:
VTRIP + VHYS
Operation of RST pin with Internal
Pull-Up Resistor
Only the MCP1316M, MCP1318M and
MCP1319M devices have an open-drain
RST output pin with an internal pull-up
resistor.
The internal pull-up resistor has a typical value of
4.7 k. The internal pull-up eliminates the need for an
external resistor.
tRST
1V
Reset Pin Operation on a
VTRIP
To reduce the current consumption of the device, when
the RST pin is driving low, the resistor is disconnected.
RST
RST
VDD
VTRIP + VHYS
VTRIPMAX
VTRIP
VTRIPMIN
VTRIP
1V
RST
tRST
tRPD
FIGURE 4-14:
< 1V is outside the
device specifications
tRPD
tRST
RST Operation as Determined by the VTRIP and VHYS.
 2005-2012 Microchip Technology Inc.
DS21985D-page 31
MCP131X/2X
Reset Delay Timer (tRST)
The Reset delay timer ensures that the MCP131X/2X
device will “hold” the embedded system in Reset until
the system voltage has stabilized. There are several
time-out options to better meet the requirements of
different applications. These Reset delay timer timeouts are shown in Table 4-2. The Standard offering
time-out is typically 200 ms.
The Reset delay timer (tRST) starts after the device voltage rises above the “actual” trip point (VTRIP) plus the
hysteresis (VHYS). When the Reset delay timer timesout, the Reset output pin (RST/RST) is driven inactive.
Figure 4-15 illustrates when the Reset delay timer
(tRST) is active or inactive.
VDD
VTRIP
RST
While the Reset delay timer (tRST) is
active, additional system current is consumed.
Note:
TABLE 4-2:
See Figures 2-12,
2-10 and 2-11
Units
Min
Typ
Max
1.0
1.4
2.0
ms
20
30
40
ms
140
200
280
ms
1120
1.6
2.24
sec


This is the
minimum time that
the Reset delay
timer will “hold” the
Reset pin active
after VDD rises
above
VTRIP + VHYS
This is the
maximum time
that the Reset
delay timer will
“hold” the Reset
pin active after
VDD rises above
VTRIP + VHYS
Note 1:
Reset Delay
Timer Inactive
RESET DELAY TIMER
TIME OUTS (1)
tRST
tRST
Reset Delay
Timer Active
4.2
Reset
Delay
Timer
Inactive
See Figures 2-12,
2-10 and 2-11
See Figures 2-15,
2-14 and 2-13
FIGURE 4-15:
Waveform.
4.2.1
Reset Power-up Timer
EFFECT OF TEMPERATURE ON
RESET POWER-UP TIMER (TRPU)
The Reset delay timer time-out period (tRST)
determines how long the device remains in the Reset
condition. This time-out is affected by both the device
VDD and temperature. Typical responses for different
VDD values and temperatures are shown in Figures 233, 2-32 and 2-31.
Shaded rows are custom ordered time
outs.
DS21985D-page 32
 2005-2012 Microchip Technology Inc.
MCP131X/2X
4.3
Negative Going VDD Transients
4.4
Manual Reset Input
The minimum pulse width (time) required to cause a
Reset may be an important criteria in the
implementation of a Power-on Reset (POR) circuit.
This time is referred to as transient duration. The
MCP131X/2X devices are designed to reject a level of
negative-going transients (glitches) on the power
supply line.
The Manual Reset input pin (MR) allows the Reset pins
(RST/RST) to be manually forced to their active states.
The MR pin has circuitry to filter noise pulses that may
be present on the pin. Figure 4-17 shows a block
diagram for using the MCP131X/2X with a push-button
switch. To minimize the required external components,
the MR input has an internal pull-up resistor.
Transient duration is the amount of time needed for
these supervisory devices to respond to a drop in VDD.
The transient duration time (tTRAN) is dependant on the
magnitude of VTRIP – VDD (overdrive). Any combination
of duration and overdrive that lies under the
duration/overdrive curve will not generate a Reset
signal. Generally speaking, the transient duration time
decreases with, and increases in, the VTRIP – VDD
voltage. Combinations of duration and overdrive that lie
above the duration/overdrive curve are detected as a
brown-out or power-down condition.
A mechanical push button or active logic signal can
drive the MR input.
Once MR has been low for a time, tMRD (the Manual
Reset delay time), the Reset output pins are forced
active. The Reset output pins will remain in their active
states for the Reset delay timer time-out period (tRST).
Figure 4-18 shows a waveform for the Manual Reset
switch input and the Reset pins output.
+5V
Figure 4-16 shows a typical transient duration versus
Reset comparator overdrive, for which the
MCP131X/2X will not generate a Reset pulse. It shows
that the farther below the trip point the transient pulse
goes, the duration of the pulse required to cause a
Reset gets shorter. Figure 4-16 shows the transient
response characteristics for the MCP131X/2X.
VDD
MR
Supply Voltage
0V
I/O
MCP13XX
RST
PIC® MCU
MCLR
VSS
Transient immunity can be improved by adding a
bypass capacitor (typically 0.1 µF) as close as possible
to the VDD pin of the MCP131X/2X device.
FIGURE 4-17:
Watchdog Timer.
5V
WDI
Push Button Reset and
VTRIP(MAX)
VTRIP(MIN)
VTRIP(MIN) - VDD
(Overdrive)
tTRANS
(Duration)
tMR
MR
VIH
VIL
Time (µs)
FIGURE 4-16:
Example of Typical
Transient Duration Waveform.
tMRD
tRST
RST
RST
The MR input typically ignores input pulses
of 100 ns.
FIGURE 4-18:
4.4.1
MR Input – Push Button.
NOISE FILTER
The noise filter filters out noise spikes (glitches) on the
Manual Reset pin (MR). Noise spikes less than 100 ns
(typical) are filtered.
 2005-2012 Microchip Technology Inc.
DS21985D-page 33
MCP131X/2X
4.5
Watchdog Timer
The purpose of the Watchdog Timer (WDT) is to
increase system reliability. The Watchdog Timer
feature can be used to detect when the Host
Controller’s program flow is not as expected. The
Watchdog Timer monitors for activity on the Watchdog
Input pin (WDI). The WDI pin is expected to be strobed
within a given time frame. When this time frame is
exceeded, without an edge transition on the WDI pin,
the Reset pin is driven active to reset the system. This
stops the Host Controller from continuing its erratic
behavior (“run-away” code execution).
The Watchdog Timer is external to the main portion of
the control system and monitors the operation of the
system. This feature is enabled by a falling edge on the
WDI pin (after device POR). Monitoring is then done by
requiring the embedded controller to force an edge
transition (falling or rising) on the WDI pin (“pet the
Watchdog”) within a predetermined time frame (TWD).
If the MCP131X/2X does not detect an edge on the
WDI pin within the expected time frame, the
MCP131X/2X device will force the Reset pin active.
Figure 4-19 shows a block diagram for using the
MCP131X/2X with a PIC® microcontroller (MCU) and
the Watchdog input.
TABLE 4-3:
WATCHDOG TIMER
PERIODS (1)
tWDT
Typ
Max
4.3
6.3
9.3
The Device Powers up
A POR event occurred
A WDT event occurred
A Manual Reset (MR) event occurred
When the Watchdog Timer is in the disabled state, the
WDI pin has an internal smart pull-up resistor enabled.
This pull-up resistor has a typical value of 52 k. This
pull-up resistor holds the WDI signal in the high state,
until it is forced to another state.
After the embedded controller has initialized, if the
Watchdog Timer feature is to be used, then the embedded controller can force the WDI pin low (VIL). This also
enables the Watchdog Timer feature and disables the
WDI pull-up resistor. Disabling the pull-up resistor
reduces the device’s current consumption. The pull-up
resistor will remain disconnected until the device has a
power-on, a Reset event occurs, or after the WDT time
out.
Once the Watchdog Timer has been enabled, the Host
Controller must force an edge transition (falling or rising) on the WDI pin before the minimum Watchdog
Timer time out to ensure that the Watchdog Timer does
not force the Reset pins (RST/RST) to the active state.
If an edge transition does not occur before the maximum time out occurs, then the MCP131X/2X will force
the Reset pins to their active state.
The MCP131X/2X supports four time outs. The standard offering devices have a typical Watchdog Timer
period (TWDT) of 1.6 s. Table 4-3 shows the available
Watchdog Timer periods. The tWDT time-out is a
function of the device voltage and temperature.
DS21985D-page 34
ms
71
102
153
ms
1.12
1.6
2.4
sec
17.9
25.6
38.4
sec


If the time between
WDI edges is less
than this, it
ensures that the
MCP131X/2X
never forces a
Reset
If the time
between WDI
edges is greater
than this, it
ensures that the
MCP131X/2X
always forces a
Reset
The Watchdog Timer is in the disabled state when:
•
•
•
•
Units
Min
Note 1:
Shaded rows are custom ordered Watchdog Timer Periods (tWDT) time outs. For
information on ordering devices with
these tWDT time outs, please contact your
local Microchip sales office. Minimum
purchase volumes are required.
+5V
MCP13XX
3-Terminal
Regulator
(example:
MCP1700)
+5V
VCC
RST
0.1
µF
FIGURE 4-19:
WDI
GND
10 k
MCLR
PIC®
MCU
I/O
Watchdog Timer.
The software routine that strobes WDI is critical. The
code must be in a section of software that is executed
frequently enough so the time between edge
transitions is less than the Watchdog time-out period.
One common technique controls the Host Controllers
I/O line from two sections of the program. The software
might set the I/O line high while operating in the
Foreground mode and set it low while in the
Background or Interrupt modes. If both modes do not
execute correctly, the Watchdog Timer issues Reset
pulses.
 2005-2012 Microchip Technology Inc.
MCP131X/2X
5.0
APPLICATION INFORMATION
Using in PIC® Microcontroller,
ICSP™ Applications
5.3
This section shows application-related information that
may be useful for your particular design requirements.
Note:
5.1
This operation can only be done using the
device with the Open-Drain RST pin
(MCP1320, MCP1321, and MCP1322).
Devices that have the internal pull-up
resistor are not recommended due to the
current path of the internal pull-up resistor.
Supply Monitor Noise Sensitivity
The MCP131X/2X devices are optimized for fast
response to negative-going changes in VDD. Systems
with an inordinate amount of electrical noise on VDD
(such as systems using relays) may require a 0.01 µF
or 0.1 µF bypass capacitor to reduce detection
sensitivity. This capacitor should be installed as close
to the MCP131X/2X as possible to keep the capacitor
lead length short.
0.1 µF
VDD
Note:
MCP131X/2X
WDI
MR
Figure 5-4 shows the typical application circuit for using
the MCP132X for a voltage supervisory function when
the PIC® microcontroller will be programmed via the InCircuit Serial Programming™ (ICSP™) feature. Additional information is available in TB087, “Using Voltage
Supervisors with PIC® Microcontroller Systems which
Implement
In-Circuit
Serial
Programming™”
(DS91087).
It is recommended that the current into the
RST pin be current limited by a 1 k
resistor.
RST
RST
VSS
VDD/VPP
FIGURE 5-1:
Typical Application Circuit
with Bypass Capacitor.
0.1 µF
RPU
VDD
MCP132X
5.2
Conventional Voltage Monitoring
Figure 5-2 and Figure 5-3 show the MCP131X/2X in
conventional voltage monitoring applications.
+
–
VDD
MCP131X/2X
RST
BATLOW
RST
VSS
1 k
VDD
PIC®
Microcontroller
MCLR
Reset input)
(Active-Low)
VSS
FIGURE 5-4:
Typical Application Circuit
for PIC® Microcontroller with the ICSP™ Feature.
VSS
FIGURE 5-2:
Battery Voltage Monitor.
VDD
+
Pwr
Sply
RST
MCP131X/2X
Power Good
–
VSS
FIGURE 5-3:
Power Good Monitor.
 2005-2012 Microchip Technology Inc.
DS21985D-page 35
MCP131X/2X
5.4
Modifying The Trip Point, VTRIP
Although the MCP131X/2X device has a fixed voltage
trip point (VTRIP), it is sometimes necessary to make
custom adjustments. This can be accomplished by
connecting an external resistor divider to the
MCP131X/2X VDD pin. This causes the VSOURCE
voltage to be at a higher voltage than when the
MCP131X/2X input equals its VTRIP voltage
(Figure 5-5).
5.5
MOSFET Low-Drive Protection
Low operating power and small physical size make the
MCP131X/2X series ideal for many voltage detector
applications. Figure 5-6 shows a low-voltage gate drive
protection circuit that prevents overheating of the logiclevel MOSFET due to insufficient gate voltage. When
the input signal is below the threshold of the
MCP131X/2X, its output grounds the gate of the
MOSFET.
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 10 µA maximum operating current required by the
MCP131X/2X. A reasonable value for this bleeder
current is 1 mA (100 times the 10 µA required by the
MCP131X/2X). For example, if VTRIP = 2V and the
desired trip point is 2.5V, the value of R1 + R2 is 2.5 k
(2.5V/1 mA). The value of R1 + R2 can be rounded to
the nearest standard value and plugged into the
equation of Figure 5-5 to calculate values for R1 and
R2. 1% tolerance resistors are recommended.
VTRIP
270
VDD
MCP131X/2X
VDD
RL
RST
MTP3055EL
VSS
VSOURCE
FIGURE 5-6:
Protection.
MOSFET Low-Drive
R2
VDD
MCP131X/2X RST
or RST
R1
VSS
R
V
1
 -------------------SOURCE
R +R
1
2
 V TRIP
5.6
Low-Power Applications
In some low-power applications, the longer the microcontroller (such as a PIC® MCU) can be in the “Sleep
mode”, the lower the average system current consumption will be.
The WDT feature can be used to “wake-up” the PIC MCU
at a regular interval to service the required tasks before
returning to sleep. This “wake-up” occurs after the PIC
MCU detects a MCLR reset during Sleep mode (for midrange family; POR = 1, BOR = 1, TO = 1, and PD = 1).
Where:
VSOURCE = Voltage to be monitored
VTRIP = Threshold Voltage setting
Note:
In this example, VSOURCE must be
greater than (VTRIP)
FIGURE 5-5:
Modify Trip-Point using
External Resistor Divider.
DS21985D-page 36
 2005-2012 Microchip Technology Inc.
MCP131X/2X
5.7
Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional Reset pins.
Depending on the current drive capability of the
controller pin, an indeterminate logic level may result if
there is a logic conflict. This can be avoided by adding
a 4.7 k resistor in series with the output of the
MCP131X/2X (Figure 5-7). If there are other
components in the system that require a Reset signal,
they should be buffered so as not to load the Reset line.
If the other components are required to follow the
Reset I/O of the microcontroller, the buffer should be
connected as shown with the solid line.
Buffer
VDD
Buffered Reset
To Other System
Components
PIC®
MCU
MCP13XX
4.7 k
RST
GND
MCLR
GND
FIGURE 5-7:
Interfacing the
MCP131X/2X Push-Pull Outputs to a
Bidirectional Reset I/O.
5.8
RESET Signal Integrity During
Power-Down
The MCP131X/2X Reset output is valid to VDD = 1.0V.
Below this 1.0V, the output becomes an "open circuit"
and does not sink or source current. This means
CMOS logic inputs to the microcontroller will be floating
at an undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where the Reset signal must be
maintained valid to VDD = 0V, external circuitry is
required.
For devices where the Reset signal is active-low, a pulldown resistor must be connected from the
MCP131X/2X Reset pin(s) to ground to discharge stray
capacitances and hold the output low (Figure 5-8).
Similarly, for devices where the Reset signal is activehigh, a pull-up resistor to VDD is required to ensure a
valid high Reset signal for VDD below 1.0V.
This resistor value, though not critical, should be
chosen such that it does not appreciably load the Reset
pin(s) under normal operation (100 k will be suitable
for most applications).
VDD
VDD
MCP13XX
RST
GND
R1
100 k
FIGURE 5-8:
Ensuring a Valid Active-low
Reset Pin Output State as VDD Approaches 0V.
 2005-2012 Microchip Technology Inc.
DS21985D-page 37
MCP131X/2X
NOTES:
DS21985D-page 38
 2005-2012 Microchip Technology Inc.
MCP131X/2X
6.0
STANDARD DEVICE
OFFERINGS
6.1
Custom Configurations
Table 6-2 shows the codes that specify the desired
Reset time out (tRST) and Watchdog Timer time-out
(tWDT) for custom devices.
Table 6-1 shows the standard devices that are
available and their respective configuration. The
configuration includes:
The voltage trip point (VTRIP) is specified by the two
digits of the desired typical trip point voltage. As an
example, if the desired VTRIP selection has a typical
VTRIP of 2.7V, the code is 27.
• Voltage Trip Point (VTRIP)
• Reset Time Out (tRST)
• Watchdog Time Out (tWDT)
Table 6-1 also shows the order number for that given
device configuration.
TABLE 6-1:
STANDARD VERSIONS
Reset Time Out (ms)
Reset
Threshold (V) Minimum Typical
Device
Watchdog Time Out (s)
Minimum
Typical
Order Number
MCP1316
2.90
140
200
1.12
1.6
MCP1316T-29LE/OT
MCP1316
4.60
140
200
1.12
1.6
MCP1316T-46LE/OT
MCP1316M
2.90
140
200
1.12
1.6
MCP1316MT-29LE/OT
MCP1316M
4.60
140
200
1.12
1.6
MCP1316MT-46LE/OT
MCP1317
2.90
140
200
1.12
1.6
MCP1317T-29LE/OT
MCP1317
4.60
140
200
1.12
1.6
MCP1317T-46LE/OT
MCP1318
2.90
140
200
1.12
1.6
MCP1318T-29LE/OT
MCP1318
4.60
140
200
1.12
1.6
MCP1318T-46LE/OT
MCP1318M
2.90
140
200
1.12
1.6
MCP1318MT-29LE/OT
MCP1318M
4.60
140
200
1.12
1.6
MCP1318MT-46LE/OT
MCP1319
2.90
140
200
—
—
MCP1319T-29LE/OT
MCP1319
4.60
140
200
—
—
MCP1319T-46LE/OT
MCP1319M
2.90
140
200
—
—
MCP1319MT-29LE/OT
MCP1319M
4.60
140
200
—
—
MCP1319MT-46LE/OT
MCP1320
2.90
140
200
1.12
1.6
MCP1320T-29LE/OT
MCP1320
4.60
140
200
1.12
1.6
MCP1320T-46LE/OT
MCP1321
2.90
140
200
1.12
1.6
MCP1321T-29LE/OT
MCP1321
4.60
140
200
1.12
1.6
MCP1321T-46LE/OT
MCP1322
2.90
140
200
—
—
MCP1322T-29LE/OT
MCP1322
4.60
140
200
—
—
MCP1322T-46LE/OT
TABLE 6-2:
Code
DELAY TIME-OUT ORDERING CODES
Typical Delay Time (ms)
Reset
WDT
Comment
Code
Typical Delay Time (ms)
Reset
WDT
Comment
A
B
1.6
1.6
6.3
102.0
Note 1
Note 1
J
K
200.0
200.0
6.3
102.0
Note 1
Note 1
C
1.6
1600.0
Note 1
L
200.0
1600.0
D
1.6
25600.0
Note 1
M
200.0
25600.0
Delay timings for standard
device offerings
Note 1
E
F
30.0
30.0
6.3
102.0
Note 1
Note 1
N
P
1600.0
1600.0
6.3
102.0
Note 1
Note 1
G
H
30.0
30.0
1600.0
25600.0
Note 1
Note 1
Q
R
1600.0
1600.0
1600.0
25600.0
Note 1
Note 1
Note 1:
This delay timing combination is not the standard offering. For information on ordering devices with these
delay times, contact your local Microchip sales office. Minimum purchase volumes are required.
 2005-2012 Microchip Technology Inc.
DS21985D-page 39
MCP131X/2X
NOTES:
DS21985D-page 40
 2005-2012 Microchip Technology Inc.
MCP131X/2X
7.0
DEVELOPMENT TOOLS
7.1
Evaluation/Demonstration Boards
The SOT-23-5/6 Evaluation Board (VSUPEV2) can be
used to evaluate the characteristics of the
MCP131X/2X devices.
This blank PCB has footprints for:
•
•
•
•
Pull-up Resistor
Pull-down Resistor
Loading Capacitor
In-line Resistor
There is also a power supply filtering capacitor.
For evaluating the MCP131X/2X devices, the selected
device should be installed into the Option A footprint.
FIGURE 1:
SOT-23-5/6 Voltage
Supervisor Evaluation Board (VSUPEV2).
This board may be purchased directly from the
Microchip web site at www.microchip.com.
 2005-2012 Microchip Technology Inc.
DS21985D-page 41
MCP131X/2X
NOTES:
DS21985D-page 42
 2005-2012 Microchip Technology Inc.
MCP131X/2X
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
5-Pin SOT-23
Example:
Part Number
MCP1316T-29LE/OT
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
SOT-23
QANN
MCP1316MT-29LE/OT
QBNN
MCP1317T-29LE/OT
QCNN
MCP1318T-29LE/OT
QDNN
MCP1318MT-29LE/OT
QENN
MCP1319T-29LE/OT
QFNN
MCP1319MT-29LE/OT
QGNN
MCP1320T-29LE/OT
QHNN
MCP1321T-29LE/OT
QJNN
MCP1322T-29LE/OT
QKNN
MCP1316T-46LE/OT
QLNN
MCP1316MT-46LE/OT
QMNN
MCP1317T-46LE/OT
QPNN
MCP1318T-46LE/OT
QQNN
MCP1318MT-46LE/OT
QRNN
MCP1319T-46LE/OT
QSNN
MCP1319MT-46LE/OT
QTNN
MCP1320T-46LE/OT
QUNN
MCP1321T-46LE/OT
QVNN
MCP1322T-46LE/OT
QWNN
QA25
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2005-2012 Microchip Technology Inc.
DS21985D-page 43
MCP131X/2X
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DS21985D-page 44
 2005-2012 Microchip Technology Inc.
MCP131X/2X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2005-2012 Microchip Technology Inc.
DS21985D-page 45
MCP131X/2X
8.2
Product Tape and Reel Specifications
FIGURE 8-1:
EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)
Top
Cover
Tape
A0
W
B0
K0
P
TABLE 8-1:
CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline
OT
Carrier
Dimensions
Package
Type
SOT-23
FIGURE 8-2:
3L
Cavity
Dimensions
W
mm
P
mm
A0
mm
B0
mm
K0
mm
8
4
3.23
3.17
1.37
Output
Quantity
Units
Reel
Diameter in
mm
3000
180
5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Device
Marking
User Direction of Feed
Pin 1
W, Width
of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
DS21985D-page 46
Reverse Reel Component Orientation
 2005-2012 Microchip Technology Inc.
MCP131X/2X
APPENDIX A:
REVISION HISTORY
Revision D (August 2012)
The following is the list of modifications:
1.
Updated Figure 2-22 and Figure 2-23.
Revision C (February 2012)
The following is the list of modifications:
1.
2.
3.
4.
Updated package temperature in the
Temperature Characteristics table.
Corrected text in Section 4.0, Operational
Description.
Updated package specification in Section 8.0,
Packaging Information to show all drawings
available.
Other minor typographical corrections.
Revision B (October 2007)
The following is the list of modifications:
1.
Clarified that devices with a Voltage Trip Point
 2.4V are tested from -40C to + 85C. Devices
with a Voltage Trip Point  2.5V are tested from
-40C to +125C.
Revision A (November 2005)
• Original Release of this Document.
 2005-2012 Microchip Technology Inc.
DS21985D-page 47
MCP131X/2X
NOTES:
DS21985D-page 48
 2005-2012 Microchip Technology Inc.
MCP131X/2X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
Device
Tape/Reel
Option
Device:
X
XX
X
/
XX
VTRIP Time-Out Temperature Package
Options Options
MCP1316T:
Range
MicroPower Voltage Detector
(Tape and Reel)
MCP1316MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1317T:
MicroPower Voltage Detector
(Tape and Reel)
MCP1318T:
MicroPower Voltage Detector
(Tape and Reel)
MCP1318MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1319T:
MicroPower Voltage Detector
(Tape and Reel)
MCP1319MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1320T:
MicroPower Voltage Detector
(Tape and Reel)
MCP1321T:
MicroPower Voltage Detector
(Tape and Reel)
MCP1322T:
MicroPower Voltage Detector
(Tape and Reel)
VTRIP Options:
(Note 1)
29
46
= 2.90V
= 4.60V
Time-Out Options:
(Note 1)
L
= tRST = 200 ms (typ.),
tWDT = 1.6 s (typ.)
Temperature Range:
I
= -40°C to +85°C
(Only for trip points 2.0V to 2.4V)
= -40°C to +125°C
(For trip point  2.5V)
E
Package:
Note 1:
Examples:
a)
b)
c)
d)
MCP1316T-29LE/OT:
MCP1316T-46LE/OT:
MCP1316MT-29LE/OT:
MCP1316MT-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
MCP1317T-29LE/OT:
MCP1317T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
c)
d)
MCP1318T-29LE/OT:
MCP1318MT-29LE/OT:
MCP1318T-46LE/OT:
MCP1318MT-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
c)
d)
MCP1319T-29LE/OT:
MCP1318MT-29LE/OT:
MCP1319T-46LE/OT:
MCP1318MT-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
MCP1320T-29LE/OT:
MCP1320T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
MCP1321T-29LE/OT:
MCP1321T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
a)
b)
MCP1322T-29LE/OT:
MCP1322T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
OT = SOT-23, 5-lead
Custom ordered voltage trip points and time outs available. Please
contact your local Microchip sales office for additional information.
Minimum purchase volumes are required.
 2005-2012 Microchip Technology Inc.
DS21985D-page 49
MCP131X/2X
NOTES:
DS21985D-page 50
 2005-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-513-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21985D-page 51
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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EUROPE
Corporate Office
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Technical Support:
http://www.microchip.com/
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DS21985D-page 52
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11/29/11
 2005-2012 Microchip Technology Inc.