S75PL-N MirrorBit™ ORNAND™ MCPs Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM S75PL-N MirrorBit™ ORNAND™ MCPs Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions. Publication Number S75PL-N_00 Revision 01E Issue Date April 21, 2006 Data Sheet ( A dva nce I nf or ma ti on) Notice On Data Sheet Designations Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion LLC applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office. ii S75PL-N MirrorBit™ ORNAND™ MCPs April 21, 2006 S75PL-N_00-01E S75PL-N MirrorBit™ ORNAND™ MCPs Stacked Multi-Chip Product (MCP) S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND interface) 3V pSRAM Data Sheet (Advance Information) Features Speed 107-Ball Fine-Pitch Ball Grid Array (FBGA) – PL-N: 70 ns (initial access, 30 ns page access) – ML-P: 30 ns (page access) – pSRAM: 70 ns – 9 x 12 x 1.4mm for ML512P based MCP's – 11 x 13 x 1.4mm for ML01GP based MCPs Operating Temperature Range – Temperature Range of –25°C to +85°C General Description This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following devices: S29PL-N S30ML-P 3 V pSRAM Flash/RAM Combinations Table pSRAM Density S29PL127N + 32 Mb S30ML512P S75PL127NBF 64 Mb S30ML01GP Product Selector Guide Device pSRAM Density pSRAM Type S75PL127NBF 32 Mb pSRAM Type 7 For detailed specifications, please refer to the individual data sheets: Document Publication Identification Number (PID) S29PL-N S29PL-N_M0 S30ML-P S30ML-GP_00 32M pSRAM Type 7 pSRAM_29 Publication Number S75PL-N_00 Revision 01E Issue Date April 21, 2006 This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice. Data 1. Sheet ( A dva nce I nf or ma ti on) Ordering Information The ordering part number is formed by a valid combination of the following: S75PL 127 N B F JF W GZ 0 PACKING TYPE 0 = Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER Refer to the Valid Combinations table below TEMPERATURE RANGE W = Wireless (–25°C to +85°C) PACKAGE TYPE AND MATERIAL JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package ORNAND DATA DENSITY F = S30ML512P G = S30ML01GP pSRAM DENSITY B = 32 Mb pSRAM C = 64 Mb pSRAM D = 128 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm MirrorBit™ Technology FLASH DENSITY 256 = 256 Mb 127 = 128 Mb (Single CE#) DEVICE FAMILY S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage ORNAND and pSRAM 2 S75PL-N MirrorBit™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006 D a ta 1.1 S h e e t ( A dv anc e In fo rm at ion ) Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. Valid Combinations Base Ordering Part Number (2) Package & Temperature Model Number Packing Type pSRAM Type PL-N Linear Mode Access Time ML-P Page Mode Access Time pSRAM Linear Mode Access Time S75PL127NBF JAW, JFW GZ 0, 2, 3 (1), (2) Type 7 70 ns 30 ns 70 ns Package Name FMH107 9x12x1.4mm, 107 ball Notes: 1. 7\SHLVVWDQGDUG6SHFLI\RWKHURSWLRQVDVUHTXLUHG 2. BGA package marking omits leading “S” and packing type designator from ordering part number. 3. Contact factory for availability for any of the OPNs listed since RAM type availability may vary over time. 2. Block Diagram (S29PL-N and pSRAM on Bus 1, S30ML-P on Bus 2) A0-A20 A0-A20 A21-A22 A21-A22 RY/BY# RY/BY# F-CE# OE# F-RST# F-ACC/WP# CE# OE# RESET# ACC/WP# WE# WE# DQ0-DQ15 DQ0-DQ15 S29PL127N VSS VSS VCC VCCQ F-VCC A0-A20 DQ0-DQ15 R-CE# CE# OE# R-LB# R-UB# LB# UB# WE# R-CE2 R-CE2 I/O0-I/O7 I/O0-I/O7 N-RY/BY# RY/BY# N-CLE N-CE# N-ALE CLE CE# ALE 32Mb pSRAM Memory S30ML512P x8 ORNAND VSS VCC VCCQ R-VCC VCC N-VCC FP# I/O0-I/O7 VSS S75PL-N_00_01E April 21, 2006 N-RE# N-WP# N-WE# RE# WP# WE# N-PRE PRE S75PL-N MirrorBit™ ORNAND™ MCPs I/O0-I/O7 N-VSS 3 Data Sheet ( A dva nce I nf or ma ti on) 3. Connection Diagrams 3.1 S75PL-N Pinout Figure 3.1 107-ball Fine-Pitch Ball Grid Array (S75PL127NBF) 1 2 DNU DNU 3 4 5 6 7 8 9 10 DNU DNU A B C Index No ball RFU VSS RFU RFU RFU RFU RFU RFU RFU N-RY/BY RFU A7 LB# WP#/ ACC WE# A8 A11 RFU RFU N-RE# A3 A6 UB# RST# R-CE2 A19 A12 A15 RFU N-CE# A2 A5 A18 RY/BY# A20 A9 A13 A21 RFU N-VCC A1 A4 A17 RFU RFU A10 A14 A22 VCCn N-VSS A0 VSS DQ1 RFU RFU DQ6 RFU A16 VSSn N-CLE F-CE# OE# DQ9 DQ3 DQ4 DQ13 DQ15 RFU I/O7 ORNAND Flash Only N-ALE R-CE1# DQ0 DQ10 F-VCC R-VCC DQ12 DQ7 VSS I/O6 pSRAM Only N-WE# N-WP# DQ8 DQ2 DQ11 RFU DQ5 DQ14 I/O4 I/O5 RFU VSS RFU I/O0 I/O1 I/O2 I/O3 N-PRE DNU DNU D E Legend F Reserved for Future Use G DNU H NOR Flash Only J K L M DNU RFU DNU DNU N P Note: Top view—balls facing down. The addresses that are shared vary by MCP combination as shown in the table below: S75PL127NBF PL-N Addresses PL-N/pSRAM Addresses A22-A21 A20:A0 Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. 4 S75PL-N MirrorBit™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006 D a ta 3.2 S h e e t ( A dv anc e In fo rm at ion ) FMH107—107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package Figure 3.2 FMH107 D1 A D eD 0.15 C (2X) 10 9 SE 8 7 7 6 E E1 5 4 eE 3 2 1 M L K J INDEX MARK PIN A1 CORNER B 9 TOP VIEW H G F E D C B A PIN A1 CORNER 7 SD 0.15 C (2X) BOTTOM VIEW 0.20 C A A2 A1 C 6 b 107X 0.08 C SIDE VIEW 0.15 M C A B 0.08 M C NOTES: PACKAGE FMH 107 JEDEC N/A DxE 12.00 mm x 9.00 mm PACKAGE SYMBOL MIN NOM MAX A --- --- 1.40 A1 0.17 --- --- A2 0.94 --- 1.11 PROFILE BALL HEIGHT BODY SIZE E 9.00 BSC. BODY SIZE D1 8.80 BSC. MATRIX FOOTPRINT E1 7.20 BSC. MD 12 MATRIX SIZE D DIRECTION ME 10 MATRIX SIZE E DIRECTION MATRIX FOOTPRINT 107 0.35 0.40 ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. BALL COUNT 0.45 0.80 BSC. BALL PITCH eD 0.80 BSC. BALL PITCH 0.40 BSC. SOLDER BALL PLACEMENT A3,A4,A5,A6,A7,A8, B1,M3,M4,M5,M6,M7,M8 WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. BALL DIAMETER eE SD / SE 2. BODY THICKNESS 12.00 BSC. n DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. NOTE D Øb 1. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. DEPOPULATED SOLDER BALLS 3512 \ 16-038.19 \ 8.9.05 S75PL-N_00_01E April 21, 2006 S75PL-N MirrorBit™ ORNAND™ MCPs 5 Data 4. Sheet ( A dva nce I nf or ma ti on) Revision History 4.1 Revision A (April 21, 2006) Initial release. Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners. 6 S75PL-N MirrorBit™ ORNAND™ MCPs S75PL-N_00_01E April 21, 2006