FREESCALE 56F8347

56F8347/56F8147
Data Sheet
Preliminary Technical Data
56F8300
16-bit Digital Signal Controllers
MC56F8347
Rev.11
01/2007
freescale.com
Document Revision History
Version History
Description of Change
Rev 0
Initial release
Rev 1.0
Fixed typos in Section 1.1.3, Replace any reference to Flash Interface Unit with Flash Module,
corrected pin number for D14 in Table 2-2, added note to Vcap pin in Table 2-2, corrected
thermal numbers for 160 LQFP in Table 10-4,removed unneccessary notes in Table 10-13;
corrected temperature range in Table 10-14; added ADC calibration information to Table 10-24
and new graphs in Figure 10-22.
Rev 2.0
Clarification to Table 10-23, corrected Digital Input Current Low (pull-up enabled)
numbers in Table 10-5. Removed text and Table 10-2; replaced with note to Table 10-1.
Rev 3.0
Added 56F8147 information; edited to indicate differences in 56F8347 and 56F8147.
Reformatted for Freescale look and feel. Updated Temperature Sensor and ADC tables, then
updaated balance of electrical tables for consistency throughout the family. Clarified I/O power
description in Table 2-2, added note to Table 10-7 and clarified Section 12.3.
Rev 4.0
Correcting Figure 4-1 Boot Flash Start = $02_0000
Rev 5.0
Added output voltage maximum value and note to clarify in Table 10-1; also removed overall life
expectancy note, since life expectancy is dependent on customer usage and must be
determined by reliability engineering. Clarified value and unit measure for Maximum allowed PD
in Table 10-3. Corrected note about average value for Flash Data Retention in Table 10-4.
Added new RoHS-compliant orderable part numbers in Table 13-1.
Rev 6.0
Added 160MAPBGA information, TA equation updated in Table 10-4 and additional minor edits
throughout data sheet
Rev 7.0
Updated Table 10-24 to reflect new value for maximum Uncalibrated Gain Error
Rev 8.0
Deleted formula for Max Ambient Operating Temperature (Automotive) and Max Ambient
Operating Temperature (Industrial) and corrected Flash Endurance to 10,000 in Table 10-4.
Added RoHS-compliance and “pb-free” language to back cover.
Rev 9.0
Corrected Section 6.4 title (from Operation Mode Register to Operating Mode Register).
Updated JTAG ID in Section 6.5.4. Added information/corrected state during reset in Table 2-2.
Clarified external reference crystal frequency for PLL in Table 10-14 by increasing maximum
value to 8.4MHz.
Rev 10.0
Replaced “Tri-stated” with an explanation in State During Reset column in Table 2-2.
Rev. 11
• Added the following note to the description of the TMS signal in Table 2-2:
Note:
Always tie the TMS pin to VDD through a 2.2K resistor.
• Added the following note to the description of the TRST signal in Table 2-2:
Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging
environment, TRST may be tied to VSS through a 1K resistor.
Please see http://www.freescale.com for the most current data sheet revision.
56F8347 Technical Data, Rev.11
2
Freescale Semiconductor
Preliminary
56F8347/56F8147 General Description
Note: Features in italics are NOT available in the 56F8147 device.
• Up to 60 MIPS at 60MHz core frequency
• Four 4-channel, 12-bit ADCs
• DSP and MCU functionality in a unified,
C-efficient architecture
• Temperature Sensor
• Access up to 4MB of off-chip program and 32MB of
data memory
• FlexCAN module
• Chip Select Logic for glueless interface to ROM and
SRAM
• Up to two Serial Peripheral Interfaces (SPIs)
• Up to two Quadrature Decoders
• Two Serial Communication Interfaces (SCIs)
• 128KB of Program Flash
• Up to four general-purpose Quad Timers
• 4KB of Program RAM
• Computer Operating Properly (COP) / Watchdog
• 8KB of Data Flash
• JTAG/Enhanced On-Chip Emulation (OnCE™) for
unobtrusive, real-time debugging
• 8KB of Data RAM
• Up to 76 GPIO lines
• 8KB of Boot Flash
• 160-pin LQFP Package and 160MAPBGA
• Up to two 6-channel PWM modules
RSTO
EMI_MODE
RESET
Current Sense Inputs or GPIOC
4
Fault Inputs
6
3
4
4
4
5
4
4
4
2
2
2
Program Controller
and
Hardware Looping Unit
PWMB
PWM Outputs
Current Sense Inputs or GPIOD
Fault Inputs
AD0
AD1
VREF
AD0
AD1
ADCB
Quadrature
Decoder 0 or
Quad
Timer A or
GPIOC
FlexCAN
VDDA
7
2
6
Analog Reg
Digital Reg
Low Voltage
Supervisor
16-Bit
56800E Core
Data ALU
16 x 16 + 36 Æ 36-Bit MAC
Three 16-bit Input Registers
Four 36-bit Accumulators
Address
Generation Unit
* Configuration
shown for on-chip
2.5V regulator
VSSA
Bit
Manipulation
Unit
R/W Control
Memory
XDB2
XAB1
XAB2
PAB
PDB
CDBR
CDBW
Program Memory
64K x 16 Flash
2K x 16 RAM
Boot ROM
4K x 16 Flash
Data Memory
6
2
External
Address Bus
Switch
System Bus
Control
4K x 16 RAM
4K x 16 Flash
Quadrature
Decoder 1 or
Quad
Timer B or
SPI1 or GPIOC
Quad
Timer C or
GPIOE
Quad
Timer D or
GPIOE
4
OCR_DIS
VDD
VSS
PAB
PDB
CDBR
CDBW
ADCA
Temp_Sense
4
2
JTAG/
EOnCE
Port
PWMA
PWM Outputs
5
EXTBOOT
VCAP*
External Bus
Interface Unit
6
3
VPP
8
4
1
3
External Data
Bus Switch
RW
Control
IPAB
IPWDB
Bus Control
IPRDB
D0-6 or GPIOF9-15
9
D7-15 or GPIOF0-8
6
Clock
resets
4
SCI1 or
GPIOD
2
SCI0 or
GPIOE
2
COP/
Watchdog
Interrupt
Controller
IRQA
WR
RD
GPIOD0-5 or CS2-7
PS (CS0 or GPIOD8)
DS (CS1 or GPIOD9)
Decoding
Peripherals
SPI0 or
GPIOE
A6-7 or GPIOE2-3
A8-15 or GPIOA0-7
GPIOB0-3 (A16-19)
GPIOB4 (A20,
prescaler_clock)
GPIOB5-7 (A21-23,
clk0-3**)
7
IPBus Bridge (IPBB)
Peripheral
Device Selects
A0-5 or GPIOA8-13
IRQB
P
System
O
Integration R
Module
CLKO
**See Table 2-2
for explanation
PLL
O
Clock
S
Generator C
XTAL
EXTAL
CLKMODE
56F8347/56F8147 Block Diagram
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
3
Table of Contents
Part 1: Overview. . . . . . . . . . . . . . . . . . . . . . . 5
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
56F8347/56F8147 Features . . . . . . . . . . . . . 5
Device Description . . . . . . . . . . . . . . . . . . . . 7
Award-Winning Development Environment . 9
Architecture Block Diagram . . . . . . . . . . . . . 10
Product Documentation . . . . . . . . . . . . . . . . 14
Data Sheet Conventions . . . . . . . . . . . . . . 14
Part 2: Signal/Connection Descriptions . . . 15
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 18
Part 3: On-Chip Clock Synthesis (OCCS) . 38
3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2. External Clock Operation . . . . . . . . . . . . . . 38
3.3. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Part 4: Memory Map . . . . . . . . . . . . . . . . . . . 40
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
4.7.
4.8.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . .
Program Map. . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Vector Table . . . . . . . . . . . . . . . . .
Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Map . . . . . . . . . . . . . . . . . . .
EOnCE Memory Map . . . . . . . . . . . . . . . . .
Peripheral Memory Mapped Registers . . . .
Factory Programmed Memory. . . . . . . . . . .
40
41
42
45
46
47
48
73
Part 5: Interrupt Controller (ITCN) . . . . . . . 74
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 74
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Functional Description . . . . . . . . . . . . . . . . 74
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 76
Operating Modes . . . . . . . . . . . . . . . . . . . . 76
Register Descriptions . . . . . . . . . . . . . . . . . 77
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Part 6: System Integration Module (SIM) . 103
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
6.9.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Modes . . . . . . . . . . . . . . . . . . . .
Operating Mode Register . . . . . . . . . . . . .
Register Descriptions . . . . . . . . . . . . . . . .
Clock Generation Overview. . . . . . . . . . . .
Power-Down Modes Overview . . . . . . . . .
Stop and Wait Mode Disable Function . . .
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . .
103
103
104
104
105
118
118
119
119
Part 8: General Purpose Input/Output
(GPIO) . . . . . . . . . . . . . . . . . . . . . . . 123
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . 123
8.2. Memory Maps . . . . . . . . . . . . . . . . . . . . . . 123
8.3. Configuration. . . . . . . . . . . . . . . . . . . . . . . 123
Part 9: Joint Test Action Group (JTAG) . 128
9.1. JTAG Information . . . . . . . . . . . . . . . . . . . 128
Part 10: Specifications. . . . . . . . . . . . . . . . 128
10.1. General Characteristics. . . . . . . . . . . . . . 128
10.2. DC Electrical Characteristics . . . . . . . . . . 132
10.3. AC Electrical Characteristics . . . . . . . . . . 136
10.4. Flash Memory Characteristics. . . . . . . . . 136
10.5. External Clock Operation Timing . . . . . . 137
10.6. Phase Locked Loop Timing. . . . . . . . . . . . 137
10.7. Crystal Oscillator Timing . . . . . . . . . . . . . 138
10.8. External Memory Interface Timing . . . . . . 138
10.9. Reset, Stop, Wait, Mode Select,
and Interrupt Timing . . . . . . . . . . 141
10.10. Serial Peripheral Interface (SPI) Timing . 143
10.11. Quad Timer Timing . . . . . . . . . . . . . . . . 147
10.12. Quadrature Decoder Timing . . . . . . . . . . 147
10.13. Serial Communication Interface
(SCI) Timing . . . . . . . . . . . . . . . . 148
10.14. Controller Area Network (CAN) Timing . 149
10.15. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 149
10.16. Analog-to-Digital Converter
(ADC) Parameter . . . . . . . . . . . . 151
10.17. Equivalent Circuit for ADC Inputs . . . . . 154
10.18. Power Consumption . . . . . . . . . . . . . . . 154
Part 11: Packaging . . . . . . . . . . . . . . . . . . . 156
11.1. 56F8347 Package and Pin-Out
Information . . . . . . . . . . . . . . . . . 156
11.2. 56F8147 Package and Pin-Out
Information . . . . . . . . . . . . . . . . . 163
Part 12: Design Considerations . . . . . . . . 167
12.1. Thermal Design Considerations . . . . . . . . 167
12.2. Electrical Design Considerations . . . . . . . 168
12.3. Power Distribution and I/O Ring
Implementation . . . . . . . . . . . . . . 169
Part 13: Ordering Information . . . . . . . . . . 170
Part 7: Security Features . . . . . . . . . . . . . . 120
7.1. Operation with Security Enabled . . . . . . . 120
7.2. Flash Access Blocking Mechanisms . . . . . 120
56F8347 Technical Data, Rev.11
4
Freescale Semiconductor
Preliminary
56F8347/56F8147 Features
Part 1 Overview
1.1 56F8347/56F8147 Features
1.1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.1.2
Core
Efficient 16-bit 56800E family controller engine with dual Harvard architecture
Up to 60 Million Instructions Per Second (MIPS) at 60 MHz core frequency
Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
Four 36-bit accumulators, including extension bits
Arithmetic and logic multi-bit shifter
Parallel instruction set with unique DSP addressing modes
Hardware DO and REP loops
Three internal address buses
Four internal data buses
Instruction set supports both DSP and controller functions
Controller-style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/EOnCE debug programming interface
Differences Between Devices
Table 1-1 outlines the key differences between the 56F8347 and 56F8147 devices.
Table 1-1 Device Differences
Feature
56F8347
56F8147
Guaranteed Speed
60MHz/60 MIPS
40MHZ/40MIPS
Program RAM
4KB
Not Available
Data Flash
8KB
Not Available
PWM
2x6
1x6
CAN
1
Not Available
Quad Timer
4
2
Quadrature Decoder
2x4
1x4
Temperature Sensor
1
Not Available
Dedicated GPIO
—
7
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
5
1.1.3
Memory
Note: Features in italics are NOT available in the 56F8147 device.
•
•
•
Harvard architecture permits as many as three simultaneous accesses to program and data memory
Flash security protection feature
On-chip memory, including a low-cost, high-volume Flash solution
— 128KB of Program Flash
— 4KB of Program RAM
— 8KB of Data Flash
— 8KB of Data RAM
— 8KB of Boot Flash
•
Off-chip memory expansion capabilities provide a simple method for interfacing additional external
memory and/or peripheral devices
— Access up to 4MB of external program memory or 32MB of external data memory
— External accesses supported at up to 60MHz (zero wait states)
•
1.1.4
EEPROM emulation capability
Peripheral Circuits
Note: Features in italics are NOT available in the 56F8147 device.
•
Pulse Width Modulator:
— In the 56F8347, two Pulse Width Modulator modules, each with six PWM outputs, three Current Sense
inputs, and three Fault inputs; fault-tolerant design with dead time insertion; supports both
center-aligned and edge-aligned modes
— In the 56F8147, one Pulse Width Modulator module, with six PWM outputs, three Current Sense inputs,
and three Fault inputs; fault-tolerant design with dead time insertion; supports both center-aligned and
edge-aligned modes
•
•
Four 12-bit, Analog-to-Digital Converters (ADCs), which support four simultaneous conversions with
quad, 4-pin multiplexed inputs; ADC and PWM modules can be synchronized through Timer C, channels
2 and 3
Quadrature Decoder:
— In the 56F8347, two four-input Quadrature Decoders or two additional Quad Timers
— In the 56F8147, one four-input Quadrature Decoder, which works in conjunction with Quad Timer A
•
•
Temperature Sensor diode can be connected, on the board, to any of the ADC inputs to monitor the on-chip
temperature
Quad Timer:
— In the 56F8347, four dedicated general-purpose Quad Timers totaling six dedicated pins: Timer C with
two pins and Timer D with four pins
— In the 56F8147, two general-purpose Quad Timers; Timer A works in conjunction with Quadrature
Decoder 0 or GPIO and Timer C works in conjunction with GPIO
•
FlexCAN (CAN Version 2.0 B-compliant ) module with 2-pin port for transmit and receive
56F8347 Technical Data, Rev.11
6
Freescale Semiconductor
Preliminary
Device Description
•
•
Two Serial Communication Interfaces (SCIs), each with two pins (or four additional GPIO lines)
Up to two Serial Peripheral Interfaces (SPIs), both with configurable 4-pin port (or eight additional GPIO
lines)
— In the 56F8347, SPI1 can also be used as Quadrature Decoder 1 or Quad Timer B
— In the 56F8147, SPI1 can alternately be used only as GPIO
•
•
•
•
•
•
•
1.1.5
•
•
•
•
•
•
Computer Operating Properly (COP) / Watchdog timer
Two dedicated external interrupt pins
Up to 76 General Purpose I/O (GPIO) pins
External reset input pin for hardware reset
External reset output pin for system reset
JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent, real-time
debugging
Software-programmable, Phase Lock Loop (PLL)-based frequency synthesizer for the core clock
Energy Information
Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs
On-board 3.3V down to 2.6V voltage regulator for powering internal logic and memories; can be disabled
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
Wait and Stop modes available
ADC smart power management
Each peripheral can be individually disabled to save power
1.2 Device Description
The 56F8347 and 56F8147 are members of the 56800E core-based family of controllers. Each combines,
on a single chip, the processing power of a Digital Signal Processor (DSP) and the functionality of a
microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because
of its low cost, configuration flexibility, and compact program code, the 56F8347 and 56F8147 are
well-suited for many applications. The device includes many peripherals that are especially useful for
motion control, smart appliances, steppers, encoders, tachometers, limit switches, power supply and
control, automotive control (56F8347 only), engine management, noise suppression, remote utility
metering, industrial control for power, lighting, and automation applications.
The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in
parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and
optimized instruction set allow straightforward generation of efficient, compact DSP and control code.
The instruction set is also highly efficient for C/C++ Compilers to enable rapid development of optimized
control applications.
The 56F8347 and 56F8147 support program execution from internal or external memories. Two data
operands can be accessed from the on-chip data RAM per instruction cycle. These devices also provide
two external dedicated interrupt lines and up to 76 General Purpose Input/Output (GPIO) lines, depending
on peripheral configuration.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
7
1.2.1
56F8347 Features
The 56F8347 controller includes 128KB of Program Flash and 8KB of Data Flash (each programmable
through the JTAG port) with 4KB of Program RAM and 8KB of Data RAM. It also supports program
execution from external memory.
A total of 8KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software
routines that can be used to program the main Program and Data Flash memory areas. Both Program and
Data Flash memories can be independently bulk erased or erased in pages. Program Flash page erase size
is 1KB. Boot and Data Flash page erase size is 512 bytes. The Boot Flash memory can also be either bulk
or page erased.
A key application-specific feature of the 56F8347 is the inclusion of two Pulse Width Modulator (PWM)
modules. These modules each incorporate three complementary, individually programmable PWM signal
output pairs (each module is also capable of supporting six independent PWM functions, for a total of 12
PWM outputs) to enhance motor control functionality. Complementary operation permits programmable
dead time insertion, distortion correction via current sensing by software, and separate top and bottom
output polarity control. The up-counter value is programmable to support a continuously variable PWM
frequency. Edge-aligned and center-aligned synchronous pulse width control (0% to 100% modulation) is
supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors); both
BDC and BLDC (Brush and Brushless DC motors); SRM and VRM (Switched and Variable Reluctance
Motors); and stepper motors. The PWMs incorporate fault protection and cycle-by-cycle current limiting
with sufficient output drive capability to directly drive standard optoisolators. A “smoke-inhibit”,
write-once protection feature for key parameters is also included. A patented PWM waveform distortion
correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit
integral reload rates to be programmable from 1 to 16. The PWM modules provide reference outputs to
synchronize the Analog-to-Digital Converters through two channels of Quad Timer C.
The 56F8347 incorporates two Quadrature Decoders capable of capturing all four transitions on the
two-phase inputs, permitting generation of a number proportional to actual position. Speed computation
capabilities accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the
Quadrature Decoder can be programmed with a time-out value to alert when no shaft motion is detected.
Each input is filtered to ensure only true transitions are recorded.
This controller also provides a full set of standard programmable peripherals that include two Serial
Communications Interfaces (SCIs); two Serial Peripheral Interfaces (SPIs); and four Quad Timers. Any of
these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. A
Flex Controller Area Network (FlexCAN) interface (CAN Version 2.0 B-compliant) and an internal
interrupt controller are a part of the 56F8347.
1.2.2
56F8147 Features
The 56F8147 controller includes 128KB of Program Flash, programmable through the JTAG port, with
8KB of Data RAM. It also supports program execution from external memory.
A total of 8KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software
routines that can be used to program the main Program Flash memory area, which can be independently
56F8347 Technical Data, Rev.11
8
Freescale Semiconductor
Preliminary
Award-Winning Development Environment
bulk erased or erased in pages. Program Flash page erase size is 1KB. Boot Flash page erase size is 512
bytes and the Boot Flash memory can also be either bulk or page erased.
A key application-specific feature of the 56F8147 is the inclusion of one Pulse Width Modulator (PWM)
module. This module incorporates three complementary, individually programmable PWM signal output
pairs and can also support six independent PWM functions to enhance motor control functionality.
Complementary operation permits programmable dead time insertion, distortion correction via current
sensing by software, and separate top and bottom output polarity control. The up-counter value is
programmable to support a continuously variable PWM frequency. Edge-aligned and center-aligned
synchronous pulse width control (0% to 100% modulation) is supported. The device is capable of
controlling most motor types: ACIM (AC Induction Motors); both BDC and BLDC (Brush and Brushless
DC motors); SRM and VRM (Switched and Variable Reluctance Motors); and stepper motors. The PWM
incorporates fault protection and cycle-by-cycle current limiting with sufficient output drive capability to
directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters
is also included. A patented PWM waveform distortion correction circuit is also provided. Each PWM is
double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1
to 16. The PWM module provides reference outputs to synchronize the Analog-to-Digital Converters
through two channels of Quad Timer C.
The 56F8147 incorporates a Quadrature Decoder capable of capturing all four transitions on the two-phase
inputs, permitting generation of a number proportional to actual position. Speed computation capabilities
accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the Quadrature Decoder
can be programmed with a time-out value to alert when no shaft motion is detected. Each input is filtered
to ensure only true transitions are recorded.
This controller also provides a full set of standard programmable peripherals that include two Serial
Communications Interfaces (SCIs); two Serial Peripheral Interfaces (SPIs); and two Quad Timers. Any of
these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. An
internal interrupt controller is also a part of the 56F8147.
1.3 Award-Winning Development Environment
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards
will support concurrent engineering. Together, PE, CodeWarrior and EVMs create a complete, scalable
tools solution for easy, fast, and efficient development.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
9
1.4 Architecture Block Diagram
Note: Features in italics are NOT available in the 56F8147 device and are shaded in the following figures.
The 56F8347/56F8147 architecture is shown in Figure 1-1 and Figure 1-2. Figure 1-1 illustrates how the
56800E system buses communicate with internal memories, the external memory interface and the IPBus
Bridge. Table 1-2 lists the internal buses in the 56800E architecture and provides a brief description of
their function. Figure 1-2 shows the peripherals and control blocks connected to the IPBus Bridge. The
figures do not show the on-board regulator and power and ground signals. They also do not show the
multiplexing between peripherals or the dedicated GPIOs. Please see Part 2, Signal/Connection
Descriptions, to see which signals are multiplexed with those of other peripherals.
Also shown in Figure 1-2 are connections between the PWM, Timer C and ADC blocks. These
connections allow the PWM and/or Timer C to control the timing of the start of ADC conversions. The
Timer C channel indicated can generate periodic start (SYNC) signals to the ADC to start its conversions.
In another operating mode, the PWM load interrupt (SYNC output) signal is routed internally to the Timer
C input channel as indicated. The timer can then be used to introduce a controllable delay before
generating its output signal. The timer output then triggers the ADC. To fully understand this interaction,
please see the 56F8300 Peripheral User’s Manual for clarification on the operation of all three of these
peripherals.
56F8347 Technical Data, Rev.11
10
Freescale Semiconductor
Preliminary
Architecture Block Diagram
5
JTAG /
EOnCE
Boot
Flash
pdb_m[15:0}
pab[20:0}
Program
Flash
cdbw[31:0}
Program
RAM
56800E
24
CHIP
TAP
Controller
TAP
Linking
Module
EMI
16
10
xab1[23:0}
Address
Data
Control
Data RAM
xab2[23:0}
External JTAG
Port
Data Flash
cdbr_m[31:0}
xdb2_m[15:0}
IPBus
Bridge
To Flash
Control Logic
Flash
Memory
Module
NOT available on the 56F8147 device.
IPBus
Figure 1-1 System Bus Interfaces
Note:
Flash memories are encapsulated within the Flash Memory (FM) Module. Flash control is
accomplished by the I/O to the FM over the peripheral bus, while reads and writes are completed
between the core and the Flash memories.
Note:
The primary data RAM port is 32 bits wide. Other data ports are 16 bits.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
11
To/From IPBus Bridge
Interrupt
Controller
CLKGEN
(OSC/PLL)
Low-Voltage Interrupt
Timer A
4
POR & LVI
System POR
Quadrature Decoder 0
4
RESET
SIM
Timer D
COP Reset
Timer B
4
COP
2
FlexCAN
Quadrature Decoder 1
SPI 1
13
PWMA
GPIOA
PWMB
GPIOB
SYNC Output
13
SYNC Output
GPIOC
ch3i
GPIOD
Timer C
ch3o
ch2i
2
ch2o
GPIOE
GPIOF
4
2
2
8
ADCB
SPI0
8
ADCA
SCI0
TEMP_SENSE
SCI1
NOT available on the 56F8147 device.
IPBus
1
Note: ADCA and ADCB use the same voltage reference circuit with VREFH, VREFP
VREFMID, VREFN, and VREFLO pins.
Figure 1-2 Peripheral Subsystem
56F8347 Technical Data, Rev.11
12
Freescale Semiconductor
Preliminary
Architecture Block Diagram
Table 1-2 Bus Signal Names
Name
Function
Program Memory Interface
pdb_m[15:0]
Program data bus for instruction word fetches or read operations.
cdbw[15:0]
Primary core data bus used for program memory writes. (Only these 16 bits of the cdbw[31:0] bus
are used for writes to program memory.)
pab[20:0]
Program memory address bus. Data is returned on pdb_m bus.
Primary Data Memory Interface Bus
cdbr_m[31:0] Primary core data bus for memory reads. Addressed via xab1 bus.
cdbw[31:0]
Primary core data bus for memory writes. Addressed via xab1 bus.
xab1[23:0]
Primary data address bus. Capable of addressing bytes1, words, and long data types. Data is written
on cdbw and returned on cdbr_m. Also used to access memory-mapped I/O.
Secondary Data Memory Interface
xdb2_m[15:0] Secondary data bus used for secondary data address bus xab2 in the dual memory reads.
xab2[23:0]
Secondary data address bus used for the second of two simultaneous accesses. Capable of
addressing only words. Data is returned on xdb2_m.
Peripheral Interface Bus
IPBus [15:0]
Peripheral bus accesses all on-chip peripherals registers. This bus operates at the same clock rate
as the Primary Data Memory and therefore generates no delays when accessing the processor.
Write data is obtained from cdbw. Read data is provided to cdbr_m.
1. Byte accesses can only occur in the bottom half of the memory address space. The MSB of the address will be forced
to 0.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
13
1.5 Product Documentation
The documents in Table 1-3 are required for a complete description and proper design with the 56F8347
and 56F8147 devices. Documentation is available from local Freescale distributors, Freescale
semiconductor sales offices, Freescale Literature Distribution Centers, or online at
http://www.freescale.com/dsp.
Table 1-3 Chip Documentation
Topic
Description
Order Number
DSP56800E
Reference Manual
Detailed description of the 56800E family architecture,
and 16-bit controller core processor and the instruction
set
DSP56800ERM
56F8300 Peripheral
User Manual
Detailed description of peripherals of the 56F8300
devices
MC56F8300UM
56F8300 SCI/CAN
Bootloader User
Manual
Detailed description of the SCI/CAN Bootloaders
56F8300 family of devices
MC56F83xxBLUM
56F8347/56F8147
Technical Data Sheet
Electrical and timing specifications, pin descriptions,
and package descriptions (this document)
MC56F8347
Errata
Details any chip issues that might be present
MC56F8347E
MC56F8147E
1.6 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
“asserted”
A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”
A high true (active high) signal is low or a low true (active low) signal is high.
Examples:
Signal/Symbol
Logic State
Signal State
Voltage1
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
56F8347 Technical Data, Rev.11
14
Freescale Semiconductor
Preliminary
Introduction
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F8347 and 56F8147 are organized into functional groups, as detailed
in Table 2-1 and as illustrated in Figure 2-2. In Table 2-2, each table row describes the signal or signals
present on a pin.
Table 2-1 Functional Group Pin Allocations
Functional Group
Number of Pins in Package
56F8347
56F8147
Power (VDD or VDDA)
9
9
Power Option Control
1
1
Ground (VSS or VSSA)
7
7
Supply Capacitors1 & VPP
6
6
PLL and Clock
4
4
Address Bus
24
24
Data Bus
16
16
Bus Control
10
10
Interrupt and Program Control
6
6
Pulse Width Modulator (PWM) Ports
26
13
Serial Peripheral Interface (SPI) Port 0
4
4
Serial Peripheral Interface (SPI) Port 1
—
4
2
4
4
Quadrature Decoder Port 13
4
—
Serial Communications Interface (SCI) Ports2
4
4
CAN Ports
2
—
Analog to Digital Converter (ADC) Ports
21
21
Timer Module Ports
6
2
JTAG/Enhanced On-Chip Emulation (EOnCE)
5
5
Temperature Sense
1
—
Dedicated GPIO
—
7
Quadrature Decoder Port 0
1. If the on-chip regulator is disabled, the VCAP pins serve as 2.5V VDD_CORE power inputs
2. Alternately, can function as Quad Timer pins
3. Pins in this section can function as Quad Timer, SPI #1, or GPIO
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
15
Power
Power
Power
Ground
Ground
VDD_IO
VDDA_OSC_PLL
VDDA_ADC
VSS
VSSA_ADC
OCR_DIS
Other
Supply
Ports
PLL
and
Clock
*VCAP1 - VCAP4
VPP1 & VPP2
CLKMODE
EXTAL
XTAL
CLKO
A0 - A5 (GPIOA8 - 13)
A6 - A7 (GPIOE2 - 3)
External
Address
Bus
or GPIO
A8 - A15 (GPIOA0 - 7)
GPIOB0 - 3 (A16 - 19)
GPIOB4 (A20, prescaler_clock)
GPIOB5 (A21, SYS_CLK)
GPIOB6 (A22, SYS_CLK2)
GPIOB7 (A23, oscillator_clock)
External
Data
Bus
D0 - D6 (GPIOF9 - 15)
D7 - D15 (GPIOF0 - 8)
RD
External
Bus
Control
WR
PS / CS0 (GPIODF8)
DS / CS1 (GPIOFD9)
GPIOD0 - 5 (CS2 - 7)
SCI 0 or
GPIO
TXD0 (GPIOE0)
RXD0 (GPIOE1)
SCI 1
or GPIO
TXD1 (GPIOD6)
RXD1 (GPIOD7)
JTAG/
EOnCE
Port
TCK
TMS
TDI
TDO
TRST
* When the on-chip regulator is disabled, these
four pins become 2.5V VDD_CORE.
7
1
1
6
1
1
4
2
1
1
1
1
56F8347
1
1
1
1
1
1
1
1
1
1
1
6
6
2
3
8
4
1
PHASEA0 (TA0, GPIOC4)
PHASEB0 (TA1, GPIOC5)
INDEX0 (TA2, GPIOC6)
Quadrature
Decoder 0
or Quad
Timer A
HOME0 (TA3, GPIOC7)
SCLK0 (GPIOE4)
MOSI0 (GPIOE5)
MISO0 (GPIOE6)
SPI0 or
GPIO
SS0 (GPIOE7)
PHASEA1(TB0, SCLK1, GPIOC0)
PHASEB1 (TB1, MOSI1, GPIOC1)
INDEX1 (TB2, MISO1, GPIOC2)
HOME1 (TB3, SS1, GPIOC3)
Quadrature
Decoder 1 or
Quad Timer B
or SPI 1 or
GPIO
PWMA0 - 5
ISA0 - 2 (GPIOC8 - 10)
FAULTA0 - 3
PWMA
4
1
1
1
1
7
9
6
3
4
8
5
8
1
1
1
PWMB0 - 5
ISB0 - 2 (GPIOD10 - 12)
PWMB
FAULTB0 - 3
ANA0 - 7
VREF
ADCA
ANB0 - 7
ADCB
Temp_Sense
Temperature
Sense Diode
CAN_RX
CAN_TX
FlexCAN
1
1
6
1
1
1
1
1
1
2
4
1
1
1
1
1
1
1
1
1
1
1
TC0 - 1 (GPIOE8 - 9)
TD0 - 3 (GPIOE10 - 13)
Quad Timer
C and D or
GPIO
IRQA
IRQB
EXTBOOT
EMI_MODE
RESET
INTERRUPT/
PROGRAM
CONTROL
RSTO
Figure 2-1 56F8347 Signals Identified by Functional Group1 (160-pin LQFP)
1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.
56F8347 Technical Data, Rev.11
16
Freescale Semiconductor
Preliminary
Introduction
VDD_IO
Power
Power
VDDA_ADC
Power
VDDA_OSC_PLL
Ground
VSS
Ground
VSSA_ADC
7
1
4
2
VPP1 & VPP2
CLKMODE
EXTAL
XTAL
CLKO
A0 - A5 (GPIOA8 - 13)
GPIOB0 - 3 (A16 - 19)
D0 - D6 (GPIOF9 - 15)
D7 - D15 (GPIOF0 - 8)
JTAG/
EOnCE
Port
1
1
1
1
3
1
6
3
1
4
7
8
9
5
8
RD
SCLK0 (GPIOE4)
MOSI0 (GPIOE5)
MISO0 (GPIOE6)
SPI0 or
GPIO
SS0 (GPIOE7)
(SCLK1, GPIOC0)
(MOSI1, GPIOC1)
(MISO1, GPIOC2)
(SS1, GPIOC3)
SPI 1 or
GPIO
(GPIOC8 - 10)
GPIO
PWMB0 - 5
ISB0 - 2 (GPIOD10 - 12)
FAULTB0 - 3
PWMB or
GPIO
ANA0 - 7
VREF
ADCA
ANB0 - 7
ADCB
TC0 - 1 (GPIOE8 - 9)
QUAD
TIMER C or
GPIO
1
WR
1
PS (CS0, GPIOD8)
1
DS (CS1, GPIOD9)
1
GPIOD0 - 5 (CS2 - 7)
SCI 1
or GPIO
1
1
GPIOB7 (A23, oscillator_clock)
TXD1 (GPIOD6)
RXD1 (GPIOD7)
1
HOME0 (TA3, GPIOC7)
Quadrature
Decoder 0
or Quad
Timer A or
GPIO
4
GPIOB6 (A22, SYS_CLK2)
TXD0 (GPIOE0)
RXD0 (GPIOE1)
1
1
1
GPIOB5 (A21, SYS_CLK)
SCI 0 or
GPIO
1
1
1
8
GPIOB4 (A20, prescaler_clock)
External
Bus
Control or
GPIO
1
2
A8 - A15 (GPIOA0 - 7)
External
Data Bus
or GPIO
56F8147
PHASEA0 (TA0, GPIOC4)
PHASEB0 (TA1, GPIOC5)
INDEX0 (TA2, GPIOC6)
6
A6 - A7 (GPIOE2 - 3)
External
Address
Bus
or GPIO
1
1
*VCAP1 - VCAP4
PLL
and
Clock
6
1
OCR_DIS
Other
Supply
Ports
1
1
1
1
6
1
1
2
4
1
1
TCK
TMS
1
1
1
TDI
TDO
TRST
1
1
1
1
1
1
1
1
(GPIOE10 - 13)
IRQA
IRQB
EXTBOOT
EMI_MODE
RESET
INTERRUPT/
PROGRAM
CONTROL
RSTO
* When the on-chip regulator is disabled,
these four pins become 2.5V VDD_CORE.
Figure 2-2 56F8147 Signals Identified by Functional Group1 (160-pin LQFP)
1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
17
2.2 Signal Pins
After reset, all pins are by default the primary function. Any alternate functionality must be programmed.
Note: Signals in italics are NOT available in the 56F8147 device.
If the “State During Reset” lists more than one state for a pin, the first state is the actual reset state. Other
states show the reset condition of the alternate function, which you get if the alternate pin function is
selected without changing the configuration of the alternate peripheral. For example, the A8/GPIOA0 pin
shows that it is tri-stated during reset. If the GPIOA_PER is changed to select the GPIO function of the
pin, it will become an input if no other registers are changed.
Note: LQFP Pin numbers and MBGA Ball numbers do not always correlate in Table 2-2. Please contact
factory for exact correlation.
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
VDD_IO
1
F4
Supply
VDD_IO
16
K5
I/O Power — This pin supplies 3.3V power to the chip I/O
interface and also the Processor core throught the on-chip
voltage regulator, if it is enabled.
VDD_IO
31
E5
VDD_IO
42
K7
VDD_IO
77
E9
VDD_IO
96
K10
VDD_IO
134
F11
VDDA_ADC
114
C14
Supply
ADC Power — This pin supplies 3.3V power to the ADC
modules. It must be connected to a clean analog power
supply.
VDDA_OSC_
92
K13
Supply
Oscillator and PLL Power — This pin supplies 3.3V power
to the OSC and to the internal regulator that in turn supplies
the Phase Locked Loop. It must be connected to a clean
analog power supply.
PLL
Signal Description
56F8347 Technical Data, Rev.11
18
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
VSS
27
J4
Supply
VSS
41
K11
VSS — These pins provide ground for chip logic and I/O
drivers.
VSS
74
G11
VSS
80
E7
VSS
125
J11
VSS
160
E6
VSSA_ADC
115
D12
Supply
ADC Analog Ground — This pin supplies an analog ground
to the ADC modules.
OCR_DIS
91
K14
Input
Input
Signal Description
On-Chip Regulator Disable —
Tie this pin to VSS to enable the on-chip regulator.
Tie this pin to VDD to disable the on-chip regulator.
This pin is intended to be a static DC signal from
power-up to shut down. Do no try to toggle this pin for
power savings during operation.
VCAP1*
62
K8
VCAP2*
144
E8
VCAP3*
95
H11
VCAP4*
15
G4
Supply
Supply
VCAP1 - 4 — When OCR_DIS is tied to VSS (regulator
enabled), connect each pin to a 2.2μF or greater bypass
capacitor in order to bypass the core logic voltage regulator,
required for proper chip operation. When OCR_DIS is tied to
VDD (regulator disabled), these pins become VDD_CORE and
should be connected to a regulated 2.5V power supply.
Note: This bypass is required even if the chip is powered
with an external supply.
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE.
VPP1
141
A7
VPP2
2
C2
CLKMODE
99
H12
Input
Input
VPP1 - 2 — These pins should be left unconnected as an
open circuit for normal functionality.
Input
Input
Clock Input Mode Selection — This input determines the
function of the XTAL and EXTAL pins.
1 = External clock input on XTAL is used to directly drive the
input clock of the chip. The EXTAL pin should be grounded.
0 = A crystal or ceramic resonator should be connected
between XTAL and EXTAL.
EXTAL
94
J12
Input
Input
External Crystal Oscillator Input — This input can be
connected to an 8MHz external crystal. Tie this pin low if
XTAL is driven by an external clock source.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
19
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
XTAL
93
K12
Type
State
During
Reset
Input/
Output
Chipdriven
Signal Description
Crystal Oscillator Output — This output connects the
internal crystal oscillator output to an external crystal.
If an external clock is used, XTAL must be used as the input
and EXTAL connected to GND.
The input clock can be selected to provide the clock directly
to the core. This input clock can also be selected as the input
clock for the on-chip PLL.
CLKO
3
D3
Output
In reset,
output is
disabled
Clock Output — This pin outputs a buffered clock signal.
Using the SIM CLKO Select Register (SIM_CLKOSR), this
pin can be programmed as any of the following: disabled,
CLK_MSTR (system clock), IPBus clock, oscillator output,
prescaler clock and postscaler clock. Other signals are also
available for test purposes.
See Part 6.5.7 for details.
A0
154
C3
Output
In reset,
output is
disabled,
pull-up is
enabled
Address Bus — A0 - A5 specify six of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), A0 - A5 and EMI control signals are
tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(GPIOA8)
A1
(GPIOA9)
10
E3
A2
(GPIOA10)
11
E4
A3
(GPIOA11)
12
F2
A4
(GPIOA12)
13
F1
A5
(GPIOA13)
14
F3
Input/
Output
Port A GPIO — These six GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOA_PUR register.
Example: GPIOA8, clear bit 8 in the GPIOA_PUR register.
56F8347 Technical Data, Rev.11
20
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
A6
17
G1
Output
In reset,
output is
disabled,
pull-up is
enabled
Signal Description
Address Bus — A6 - A7 specify two of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), A6 - A7 and EMI control signals are
tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(GPIOE2)
A7
(GPIOE3)
18
G3
Schmitt
Input/
Output
Port E GPIO — These two GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOE_PUR register.
Example: GPIOE2, clear bit 2 in the GPIOE_PUR register.
A8
19
G2
Output
In reset,
output is
disabled,
pull-up is
enabled
Address Bus— A8 - A15 specify eight of the address lines
for external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), A8 - A15 and EMI control signals are
tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(GPIOA0)
A9
(GPIOA1)
20
H1
A10
(GPIOA2)
21
H2
A11
(GPIOA3)
22
H4
A12
(GPIOA4)
23
H3
A13
(GPIOA5)
24
J1
A14
(GPIOA6)
25
J2
A15
(GPIOA7)
26
J3
Schmitt
Input/
Output
Port A GPIO — These eight GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOA_PUR register.
Example: GPIOA0, clear bit 0 in the GPIOA_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
21
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
GPIOB0
33
L1
(A16)
Type
State
During
Reset
Schmitt
Input/
Output
Input,
pull-up
enabled
Output
GPIOB1
(A17)
34
GPIOB2
(A18)
35
L2
GPIOB3
(A19)
36
M1
Signal Description
Port B GPIO — These four GPIO pins can be programmed
as input or output pins.
Address Bus — A16 - A19 specify one of the address lines
for external program or data memory accesses.
L3
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), A16 - A19 and EMI control signals are
tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
After reset, the startup state of GPIOB0 - GPIOB3 (GPIO or
address) is determined as a function of EXTBOOT,
EMI_MODE and the Flash security setting. See Table 4-4 for
further information on when this pin is configured as an
address pin at reset. In all cases, this state may be changed
by writing to GPIOB_PER.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOB_PUR register.
GPIOB4
37
M2
(A20)
Schmitt
Input/
Output
Output
Input,
pull-up
enabled
Port B GPIO — These four GPIO pins can be programmed
as input or output pins.
Address Bus — A20 - A23 specify one of the address lines
for external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), A20–A23 and EMI control signals are tri-stated
when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(prescaler_
clock)
Output
GPIOB5
(A21)
(SYS_CLK)
46
N4
GPIOB6
(A22)
(SYS_CLK2)
47
P3
GPIOB7
(A23)
(oscillator_
Clock)
48
M4
Clock Outputs — can be used to monitor the
prescaler_clock, SYS_CLK, SYS_CLK2 or oscillator-clock
on GPIOB4 through GPIOB7, respectively.
After reset, the default state is GPIO.
These pins can also be used to extend the external address
bus to its full length or to view any of several system clocks.
In these cases, the GPIO_B_PER can be used to individually
disable the GPIO. The CLKOSR register in the SIM ( see
Part 6.5.7) can then be used to choose between address
and clock functions.
56F8347 Technical Data, Rev.11
22
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
D0
70
P10
State
During
Reset
Type
Input/
Output
In reset,
output is
disabled,
pull-up is
enabled
Signal Description
Data Bus — D0 - D6 specify part of the data for external
program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), D0–D6 are tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(GPIOF9)
D1
(GPIOF10)
71
N10
D2
(GPIOF11)
83
P14
D3
(GPIOF12)
86
L13
D4
(GPIOF13)
88
L14
D5
(GPIOF14)
89
L12
D6
(GPIOF15)
90
L11
Input/
Output
Port F GPIO — These seven GPIO pins can be individually
programmed as input or output pins.
After reset, these pins default to the EMI Data bus function.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOF_PUR register.
Example: GPIOF9, clear bit 9 in the GPIOF_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
23
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
D7
28
K1
State
During
Reset
Type
Input/
Output
In reset,
output is
disabled,
pull-up is
enabled
Signal Description
Data Bus — D7 - D15 specify part of the data for external
program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), D7 - D15 are tri-stated when the
external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
(GPIOF0)
D8
(GPIOF1)
29
K3
D9
(GPIOF2)
30
K2
D10
(GPIOF3)
32
K4
D11
(GPIOF4)
149
A5
D12
(GPIOF5)
150
A4
D13
(GPIOF6)
151
B5
D14
(GPIOF7)
152
C4
D15
(GPIOF8)
153
A3
RD
52
P5
Input/
Output
Port F GPIO — These nine GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to data bus functionality.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOF_PUR register.
Example: GPIOF0, clear bit 0 in the GPIOF_PUR register.
Output
In reset,
output is
disabled,
pull-up is
enabled
Read Enable — RD is asserted during external memory
read cycles. When RD is asserted low, pins D0 - D15
become inputs and an external device is enabled onto the
data bus. When RD is deasserted high, the external data is
latched inside the device. When RD is asserted, it qualifies
the A0 - A16, PS, and DS pins. RD can be connected directly
to the OE pin of a static RAM or ROM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), RD is tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in
the SIM_PUDR register.
56F8347 Technical Data, Rev.11
24
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
WR
51
L4
Output
In reset,
output is
disabled,
pull-up is
enabled
Signal Description
Write Enable — WR is asserted during external memory
write cycles. When WR is asserted low, pins D0 - D15
become outputs and the device puts data on the bus. When
WR is deasserted high, the external data is latched inside
the external device. When WR is asserted, it qualifies the A0
- A16, PS, and DS pins. WR can be connected directly to the
WE pin of a static RAM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), WR is tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in
the SIM_PUDR register.
PS
53
N6
Output
(CS0)
In reset,
output is
disabled,
pull-up is
enabled
Program Memory Select — This signal is actually CS0 in
the EMI, which is programmed at reset for compatibility with
the 56F80x PS signal. PS is asserted low for external
program memory access.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), CS0 is tri-stated when the external bus is
inactive.
CS0 resets to provide the PS function as defined on the
56F80x devices.
(GPIOD8)
Input/
Output
Port D GPIO — This GPIO pin can be individually
programmed as an input or output pin.
To deactivate the internal pull-up resistor, clear bit 8 in the
GPIOD_PUR register.
DS
54
L5
Output
(CS1)
In reset,
output is
disabled,
pull-up is
enabled
Data Memory Select — This signal is actually CS1 in the
EMI, which is programmed at reset for compatibility with the
56F80x DS signal. DS is asserted low for external data
memory access.
Depending upon the state of the DRV bit in the EMI bus
control register (BCR), A0 - A23 and EMI control signals are
tri-stated when the external bus is inactive.
CS1 resets to provide the DS function as defined on the
56F80x devices.
(GPIOD9)
Input/
Output
Port D GPIO — This GPIO pin can be individually
programmed as an input or output pin.
To deactivate the internal pull-up resistor, clear bit 9 in the
GPIOD_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
25
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
GPIOD0
55
P6
State
During
Reset
Type
Input/
Output
Input,
pull-up
enabled
Output
(CS2)
GPIOD1
(CS3)
56
L6
GPIOD2
(CS4)
57
K6
GPIOD3
(CS5)
58
N7
GPIOD4
(CS6)
59
P7
GPIOD5
(CS7)
60
L7
Signal Description
Port D GPIO — These six GPIO pins can be individually
programmed as input or output pins.
Chip Select — CS2 - CS7 may be programmed within the
EMI module to act as chip selects for specific areas of the
external memory map.
Depending upon the state of the DRV bit in the EMI Bus
Control Register (BCR), CS2 - CS7 are tri-stated when the
external bus is inactive.
Most designs will want to change the DRV state to DRV = 1
instead of using the default setting.
At reset, these pins are configured as GPIO.
To deactivate the internal pull-up resistor, clear the
appropriate GPIO bit in the GPIOD_PUR register.
Example: GPIOD0, clear bit 0 in the GPIOD_PUR register.
TXD0
4
B1
(GPIOE0)
Output
Input/
Output
In reset,
output is
disabled,
pull-up is
enabled
Transmit Data — SCI0 transmit data output
Port E GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 0 in the
GPIOE_PUR register.
RXD0
(GPIOE1)
5
D2
Input
Input/
Output
Input,
pull-up
enabled
Receive Data — SCI0 receive data input
Port E GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 1 in the
GPIOE_PUR register.
56F8347 Technical Data, Rev.11
26
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
TXD1
49
P4
Output
(GPIOD6)
Input/
Output
In reset,
output is
disabled,
pull-up is
enabled
Signal Description
Transmit Data — SCI1 transmit data output
Port D GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 6 in the
GPIOD_PUR register.
RXD1
50
N5
(GPIOD7)
Input
Input/
Output
Input,
pull-up
enabled
Receive Data — SCI1 receive data input
Port D GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is SCI input.
To deactivate the internal pull-up resistor, clear bit 7 in the
GPIOD_PUR register.
TCK
137
D8
Schmitt
Input
Input,
pulled low
internally
Test Clock Input — This input pin provides a gated clock to
synchronize the test logic and shift serial data to the
JTAG/EOnCE port. The pin is connected internally to a
pull-down resistor.
TMS
138
A8
Schmitt
Input
Input,
pulled
high
internally
Test Mode Select Input — This input pin is used to
sequence the JTAG TAP controller’s state machine. It is
sampled on the rising edge of TCK and has an on-chip
pull-up resistor.
To deactivate the internal pull-up resistor, set the JTAG bit in
the SIM_PUDR register.
Note:
TDI
139
B8
Schmitt
Input
Input,
pulled
high
internally
Always tie the TMS pin to VDD through a 2.2K resistor.
Test Data Input — This input pin provides a serial input data
stream to the JTAG/EOnCE port. It is sampled on the rising
edge of TCK and has an on-chip pull-up resistor.
To deactivate the internal pull-up resistor, set the JTAG bit in
the SIM_PUDR register.
TDO
140
D7
Output
In reset,
output is
disabled,
pull-up is
enabled
Test Data Output — This tri-stateable output pin provides a
serial output data stream from the JTAG/EOnCE port. It is
driven in the shift-IR and shift-DR controller states, and
changes on the falling edge of TCK.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
27
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
TRST
136
D9
State
During
Reset
Type
Schmitt
Input
Input,
pulled
high
internally
Signal Description
Test Reset — As an input, a low signal on this pin provides a
reset signal to the JTAG TAP controller. To ensure complete
hardware reset, TRST should be asserted whenever RESET
is asserted. The only exception occurs in a debugging
environment when a hardware device reset is required and
the JTAG/EOnCE module must not be reset. In this case,
assert RESET, but do not assert TRST.
To deactivate the internal pull-up resistor, set the JTAG bit in
the SIM_PUDR register.
Note: For normal operation, connect TRST directly to VSS. If
the design is to be used in a debugging environment, TRST may be
tied to VSS through a 1K resistor.
PHASEA0
155
A2
Schmitt
Input
Input,
pull-up
enabled
Phase A — Quadrature Decoder 0, PHASEA input
(TA0)
Schmitt
Input/
Output
TA0 — Timer A, Channel 0
(GPIOC4)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is PHASEA0.
To deactivate the internal pull-up resistor, clear bit 4 of the
GPIOC_PUR register.
PHASEB0
156
B4
Schmitt
Input
Input,
pull-up
enabled
Phase B — Quadrature Decoder 0, PHASEB input
(TA1)
Schmitt
Input/
Output
TA1 — Timer A, Channel
(GPIOC5)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is PHASEB0.
To deactivate the internal pull-up resistor, clear bit 5 of the
GPIOC_PUR register.
56F8347 Technical Data, Rev.11
28
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
INDEX0
157
A1
State
During
Reset
Type
Schmitt
Input
Input,
pull-up
enabled
Signal Description
Index — Quadrature Decoder 0, INDEX input
(TA2)
Schmitt
Input/
Output
TA2 — Timer A, Channel 2
(GPOPC6)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is INDEX0.
To deactivate the internal pull-up resistor, clear bit 6 of the
GPIOC_PUR register.
HOME0
158
B3
Schmitt
Input
Input,
pull-up
enabled
Home — Quadrature Decoder 0, HOME input
(TA3)
Schmitt
Input/
Output
TA3 — Timer A, Channel 3
(GPIOC7)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is HOME0.
To deactivate the internal pull-up resistor, clear bit 7 of the
GPIOC_PUR register.
SCLK0
146
(GPIOE4)
A6
Schmitt
Input/
Output
Schmitt
Input/
Output
Input,
pull-up
enabled
SPI 0 Serial Clock — In the master mode, this pin serves as
an output, clocking slaved listeners. In slave mode, this pin
serves as the data clock input.
Port E GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is SCLK0.
To deactivate the internal pull-up resistor, clear bit 4 in the
GPIOE_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
29
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
MOSI0
148
B6
(GPIOE5)
State
During
Reset
Type
Input/
Output
In reset,
output is
disabled,
pull-up is
enabled
Input/
Output
Signal Description
SPI 0 Master Out/Slave In — This serial data pin is an
output from a master device and an input to a slave device.
The master device places data on the MOSI line a half-cycle
before the clock edge the slave device uses to latch the data.
Port E GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is MOSI0.
To deactivate the internal pull-up resistor, clear bit 5 in the
GPIOE_PUR register.
MISO0
147
D4
(GPIOE6)
Input/
Output
Input,
pull-up
enabled
Input/
Output
SPI 0 Master In/Slave Out — This serial data pin is an input
to a master device and an output from a slave device. The
MISO line of a slave device is placed in the high-impedance
state if the slave device is not selected. The slave device
places data on the MISO line a half-cycle before the clock
edge the master device uses to latch the data.
Port E GPIO — This GPIO pin can be individually
programmed as an input or output pin.
After reset, the default state is MISO0.
To deactivate the internal pull-up resistor, clear bit 6 in the
GPIOE_PUR register.
SS0
(GPIOE7)
145
D5
Input
Input,
pull-up
enabled
Input/
Output
SPI 0 Slave Select — SS0 is used in slave mode to indicate
to the SPI module that the current transfer is to be received.
Port E GPIO — This GPIO pin can be individually
programmed as input or output pin.
After reset, the default state is SS0.
To deactivate the internal pull-up resistor, clear bit 7 in the
GPIOE_PUR register.
56F8347 Technical Data, Rev.11
30
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
PHASEA1
6
C1
State
During
Reset
Type
Schmitt
Input
Input,
pull-up
enabled
Signal Description
Phase A1 — Quadrature Decoder 1, PHASEA input for
decoder 1.
(TB0)
Schmitt
Input/
Output
TB0 — Timer B, Channel 0
(SCLK1)
Schmitt
Input/
Output
SPI 1 Serial Clock — In the master mode, this pin serves as
an output, clocking slaved listeners. In slave mode, this pin
serves as the data clock input. To activate the SPI function,
set the PHSA_ALT bit in the SIM_GPS register. For details,
see Part 6.5.8.
(GPIOC0)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
In the 56F8347, the default state after reset is PHASEA1.
In the 56F8147, the default state is not one of the functions
offered and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 0 in the
GPIOC_PUR register.
PHASEB1
7
D1
Schmitt
Input
Input,
pull-up
enabled
Phase B1 — Quadrature Decoder 1, PHASEB input for
decoder 1.
(TB1)
Schmitt
Input/
Output
TB1 — Timer B, Channel 1
(MOSI1)
Schmitt
Input/
Output
SPI 1 Master Out/Slave In — This serial data pin is an
output from a master device and an input to a slave device.
The master device places data on the MOSI line a half-cycle
before the clock edge the slave device uses to latch the data.
To activate the SPI function, set the PHSB_ALT bit in the
SIM_GPS register. For details, see Part 6.5.8.
(GPIOC1)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
In the 56F8347, the default state after reset is PHASEB1.
In the 56F8147, the default state is not one of the functions
offered and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 1 in the
GPIOC_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
31
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
INDEX1
8
E2
State
During
Reset
Type
Schmitt
Input
Input,
pull-up
enabled
Signal Description
Index1 — Quadrature Decoder 1, INDEX input
(TB2)
Schmitt
Input/
Output
TB2 — Timer B, Channel 2
(MISO1)
Schmitt
Input/
Output
SPI 1 Master In/Slave Out — This serial data pin is an input
to a master device and an output from a slave device. The
MISO line of a slave device is placed in the high-impedance
state if the slave device is not selected. The slave device
places data on the MISO line a half-cycle before the clock
edge the master device uses to latch the data. To activate
the SPI function, set the INDEX_ALT bit in the SIM_GPS
register. For details, see Part 6.5.8.
(GPIOC2)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
In the 56F8347, the default state after reset is INDEX1.
In the 56F8147, the default state is not one of the functions
offered and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 2 in the
GPIOC_PUR register.
HOME1
9
E1
Schmitt
Input
Input,
pull-up
enabled
Home — Quadrature Decoder 1, HOME input
(TB3)
Schmitt
Input/
Output
TB3 — Timer B, Channel 3
(SS1)
Schmitt
Input
SPI 1 Slave Select — In the master mode, this pin is used to
arbitrate multiple masters. In slave mode, this pin is used to
select the slave. To activate the SPI function, set the
HOME_ALT bit in the SIM_GPS register. For details, see
Part 6.5.8.
(GPIOC3)
Schmitt
Input/
Output
Port C GPIO — This GPIO pin can be individually
programmed as an input or output pin.
In the 56F8347, the default state after reset is HOME1.
In the 56F8147, the default state is not one of the functions
offered and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 3 in the
GPIOC_PUR register.
56F8347 Technical Data, Rev.11
32
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
PWMA0
73
M11
Output
PWMA0 - 5 — These are six PWMA outputs.
PWMA1
75
P12
PWMA2
76
N11
In reset,
output is
disabled,
pull-up is
enabled
PWMA3
78
M12
PWMA4
79
P13
PWMA5
81
N12
ISA0
126
A11
Schmitt
Input
Input,
pull-up
enabled
ISA0 - 2 — These three input current status pins are used for
top/bottom pulse width correction in complementary channel
operation for PWMA.
(GPIOC8)
ISA1
(GPIOC9)
127
ISA2
(GPIOC10)
128
C11
Schmitt
Input/
Output
Signal Description
Port C GPIO — These GPIO pins can be individually
programmed as input or output pins.
In the 56F8347, these pins default to ISA functionality after
reset.
D11
In the 56F8147, the default state is not one of the functions
offered and must be reconfigured.
To deactivate the internal pull-up resistor, clear the
appropriate bit of the GPIOC_PUR register. For details, see
Part 6.5.8.
FAULTA0
82
N13
FAULTA1
84
N14
FAULTA2
85
M13
FAULTA3
87
M14
Schmitt
Input
Input,
pull-up
enabled
FAULTA0 - 2 — These three fault input pins are used for
disabling selected PWMA outputs in cases where fault
conditions originate off-chip.
To deactivate the internal pull-up resistor, set the PWMA0 bit
in the SIM_PUDR register. For details, see Part 6.5.8.
Schmitt
Input
Input,
pull-up
enabled
FAULTA3 — This fault input pin is used for disabling
selected PWMA outputs in cases where fault conditions
originate off-chip.
To deactivate the internal pull-up resistor, set the PWMA1 bit
in the SIM_PUDR register. See Part 6.5.6 for details.
PWMB0
38
N1
PWMB1
39
P1
PWMB2
40
N2
PWMB3
43
N3
PWMB4
44
P2
PWMB5
45
M3
Output
In reset,
output is
disabled,
pull-up is
enabled
PWMB0 - 5 — Six PWMB output pins.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
33
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
ISB0
61
N8
(GPIOD10)
ISB1
(GPIOD11)
63
L8
ISB2
(GPIOD12)
64
P8
FAULTB0
67
N9
FAULTB1
68
L9
FAULTB2
69
L10
FAULTB3
72
P11
ANA0
100
G13
ANA1
101
H13
ANA2
102
G12
ANA3
103
F13
ANA4
104
F12
ANA5
105
H14
ANA6
106
G14
ANA7
107
E13
VREFH
113
VREFP
Type
Schmitt
Input
State
During
Reset
Signal Description
Input,
pull-up
enabled
ISB0 - 2 — These three input current status pins are used for
top/bottom pulse width correction in complementary channel
operation for PWMB.
Schmitt
Input/
Output
Port D GPIO — These GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to ISB functionality.
To deactivate the internal pull-up resistor, clear the
appropriate bit of the GPIOD_PUR register. For details, see
Part 6.5.8.
Schmitt
Input
Input,
pull-up
enabled
FAULTB0 - 3 — These four fault input pins are used for
disabling selected PWMB outputs in cases where fault
conditions originate off-chip.
To deactivate the internal pull-up resistor, set the PWMB bit
in the SIM_PUDR register. For details, see Part 6.5.8.
Input
Analog
Input
ANA0 - 3 — Analog inputs to ADC A, channel 0
Input
Analog
Input
ANA4 - 7 — Analog inputs to ADC A, channel 1
D14
Input
Analog
Input
VREFH — Analog Reference Voltage High. VREFH must be
less than or equal to VDDA_ADC.
112
D13
Input/
Output
VREFMID
111
E14
Analog
Input/
Output
VREFP, VREFMID & VREFN — Internal pins for voltage
reference which are brought off-chip so they can be
bypassed. Connect to a 0.1μF low ESR capacitor.
VREFN
110
F14
VREFLO
109
E12
Input
Analog
Input
VREFLO — Analog Reference Voltage Low. This should
normally be connected to a low-noise VSS.
56F8347 Technical Data, Rev.11
34
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
State
During
Reset
Signal Name
Pin
No.
Ball
No.
Type
ANB0
116
C13
Input
ANB0 - 3 — Analog inputs to ADC B, channel 0
ANB1
117
B14
Analog
Input
ANB2
118
C12
ANB3
119
B13
ANB4
120
A14
Input
ANB4 - 7 — Analog inputs to ADC B, channel 1
ANB5
121
A13
Analog
Input
ANB6
122
B12
ANB7
123
A12
TEMP_
SENSE
108
E11
Output
Analog
Output
Temperature Sense Diode — This signal connects to an
on-chip diode that can be connected to one of the ADC
inputs and used to monitor the temperature of the die. Must
be bypassed with a 0.01μF capacitor.
CAN_RX
143
B7
Schmitt
Input
Input,
pull-up
enabled
FlexCAN Receive Data — This is the CAN input. This pin
has an internal pull-up resistor.
Signal Description
To deactivate the internal pull-up resistor, set the CAN bit in
the SIM_PUDR register.
CAN_TX
142
D6
Open
Drain
Output
Open
Drain
Output
FlexCAN Transmit Data — CAN output with internal pull-u[
enable at reset.*
* Note: If a pin is configured as open drain output mode,
internal pull-up will automatically be disabled when it outputs
low. Internal pull-up will be enabled unless it has been
manually disabled by clearing the corresponding bit in the
PUREN register of the GPIO module, when it outputs high.
If a pin is configured as push-pull output mode, internal
pull-up will automatically be disabled, whether it outputs low
or high.
TC0
133
A9
(GPIOE8)
TC1
(GPIOE9)
135
B9
Schmitt
Input/
Output
Schmitt
Input/
Outpu
Input,
pull-up
enabled
TC0 - 1— Timer C, Channel 0 and 1
Port E GPIO — These GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to Timer functionality.
To deactivate the internal pull-up resistor, clear bit 8 of the
GPIOE_PUR register.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
35
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
TD0
129
B10
(GPIOE10)
TD1
(GPIOE11)
130
A10
TD2
(GPIOE12)
131
D10
TD3
(GPIOE13)
132
E10
IRQA
65
K9
IRQB
66
P9
Type
State
During
Reset
Schmitt
Input/
Output
Input,
pull-up
enabled
Signal Description
TD0 - 3 — Timer D, Channels 0, 1, 2 and 3
Port E GPIO — These GPIO pins can be individually
programmed as input or output pins.
Schmitt
Input/
Output
At reset, these pins default to Timer functionality.
To deactivate the internal pull-up resistor, clear the
appropriate bit of the GPIOE_PUR register. See Part 6.5.6
for details.
Schmitt
Input
Input,
pull-up
enabled
External Interrupt Request A and B — The IRQA and
IRQB inputs are asynchronous external interrupt requests
during Stop and Wait mode operation. During other
operating modes, they are synchronized external interrupt
requests, which indicate an external device is requesting
service. They can be programmed to be level-sensitive or
negative-edge triggered.
To deactivate the internal pull-up resistor, set the IRQ bit in
the SIM_PUDR register. See Part 6.5.6 for details.
RESET
98
J14
Schmitt
Input
Input,
pull-up
enabled
Reset — This input is a direct hardware reset on the
processor. When RESET is asserted low, the device is
initialized and placed in the reset state. A Schmitt trigger
input is used for noise immunity. When the RESET pin is
deasserted, the initial chip operating mode is latched from
the EXTBOOT pin. The internal reset signal will be
deasserted synchronous with the internal clocks after a fixed
number of internal clocks.
To ensure complete hardware reset, RESET and TRST
should be asserted together. The only exception occurs in a
debugging environment when a hardware device reset is
required and the JTAG/EOnCE module must not be reset. In
this case, assert RESET but do not assert TRST.
Note: The internal Power-On Reset will assert on initial
power-up.
To deactivate the internal pull-up resistor, set the RESET bit
in the SIM_PUDR register. See Part 6.5.6 for details.
RSTO
97
J13
Output
Output
Reset Output — This output reflects the internal reset state
of the chip.
56F8347 Technical Data, Rev.11
36
Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
Signal Name
Pin
No.
Ball
No.
EXTBOOT
124
B11
State
During
Reset
Type
Schmitt
Input
Input,
pull-up
enabled
Signal Description
External Boot — This input is tied to VDD to force the device
to boot from off-chip memory (assuming that the on-chip
Flash memory is not in a secure state). Otherwise, it is tied to
ground. For details, see Table 4-4.
Note: When this pin is tied low, the customer boot software
should disable the internal pull-up resistor by setting the
XBOOT bit of the SIM_PUDR; see Part 6.5.6.
EMI_MODE
159
B2
Schmitt
Input
Input,
pull-up
enabled
External Memory Mode — This input is tied to VDD in order
to enable an extra four address lines, for a total of 20
address lines out of reset. This function is also affected by
EXTBOOT and the Flash security mode. For details, see
Table 4-4.
If a 20-bit address bus is not desired, then this pin is tied to
ground.
Note: When this pin is tied low, the customer boot software
should disable the internal pull-up resistor by setting the
EMI_MODE bit of the SIM_PUDR; see Part 6.5.6.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
37
Part 3 On-Chip Clock Synthesis (OCCS)
3.1 Introduction
Refer to the OCCS chapter of the 56F8300 Peripheral User Manual for a full description of the OCCS.
The material contained here identifies the specific features of the OCCS design. Figure 3-1 shows the
specific OCCS block diagram to reference in the OCCS chapter of the 56F8300 Peripheral User Manual.
CLKMODE
XTAL
ZSRC
MUX
Prescaler CLK
EXTAL
PLLCID
PLL
FOUT
x (1 to 128)
FEEDBACK
MSTR_OSC
PLLCOD
PLLDB
FREF
Prescaler
÷ (1,2,4,8)
MUX
Crystal
OSC
÷2
FOUT/2 Postscaler
÷ (1,2,4,8)
Postscaler CLK
Bus Interface & Control
Bus
Interface
LCK
Lock
Detector
Loss of
Reference
Clock
Detector
SYS_CLK2
Source to SIM
Loss of Reference
Clock Interrupt
Figure 3-1 OCCS Block Diagram
3.2 External Clock Operation
The system clock can be derived from an external crystal, ceramic resonator, or an external system clock
signal. To generate a reference frequency using the internal oscillator, a reference crystal or ceramic
resonator must be connected between the EXTAL and XTAL pins.
3.2.1
Crystal Oscillator
The internal oscillator is designed to interface with a parallel-resonant crystal resonator in the frequency
range specified for the external crystal in Table 10-15. A recommended crystal oscillator circuit is shown
in Figure 3-2. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal
56F8347 Technical Data, Rev.11
38
Freescale Semiconductor
Preliminary
External Clock Operation
parameters determine the component values required to provide maximum stability and reliable start-up.
The crystal and associated components should be mounted as near as possible to the EXTAL and XTAL
pins to minimize output distortion and start-up stabilization time.
Crystal Frequency = 4 - 8MHz (optimized for 8MHz)
EXTAL XTAL
Rz
EXTAL XTAL
Rz
Sample External Crystal Parameters:
Rz = 750 KΩ
Note: If the operating temperature range is limited to
below 85oC (105oC junction), then Rz = 10 Meg Ω
CLKMODE = 0
CL1
CL2
Figure 3-2 Connecting to a Crystal Oscillator
Note:
The OCCS_COHL bit must be set to 1 when a crystal oscillator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed
in the 56F8300 Peripheral User’s Manual.
3.2.2
Ceramic Resonator (Default)
It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system
design can tolerate the reduced signal integrity. A typical ceramic resonator circuit is shown in Figure 3-3.
Refer to the supplier’s recommendations when selecting a ceramic resonator and associated components.
The resonator and components should be mounted as near as possible to the EXTAL and XTAL pins.
Resonator Frequency = 4 - 8MHz (optimized for 8MHz)
3 Terminal
2 Terminal
EXTAL
XTAL
EXTAL
Rz
CL1
XTAL
Rz
CL2
Sample External Ceramic Resonator Parameters:
Rz = 750 KΩ
CLKMODE = 0
C1
C2
Figure 3-3 Connecting a Ceramic Resonator
Note:
The OCCS_COHL bit must be set to 0 when a ceramic resonator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed
in the 56F8300 Peripheral User’s Manual.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
39
3.2.3
External Clock Source
The recommended method of connecting an external clock is given in Figure 3-4. The external clock
source is connected to XTAL and the EXTAL pin is grounded. When using an external clock source, set
the OCCS_COHL bit high as well.
XTAL
EXTAL
External
Clock
VSS
Note: When using an external clocking source
with this configuration, the input “CLKMODE”
should be high and the COHL bit in the OSCTL
register should be set to 1.
Figure 3-4 Connecting an External Clock Register
3.3 Registers
When referring to the register definitions for the OCCS in the 56F8300 Peripheral User Manual, use the
register definitions without the internal Relaxation Oscillator, since the 56F8347/56F8147 do NOT
contain this oscillator.
Part 4 Memory Map
4.1 Introduction
The 56F8347 and 56F8147 devices are 16-bit motor-control chips based on the 56800E core. These parts
use a Harvard-style architecture with two independent memory spaces for Data and Program. On-chip
RAM and Flash memories are used in both spaces.
This section provides memory maps for:
•
•
Program Address Space, including the Interrupt Vector Table
Data Address Space, including the EOnCE Memory and Peripheral Memory Maps
On-chip memory sizes for each device are summarized in Table 4-1. Flash memories’ restrictions are
identified in the “Use Restrictions” column of Table 4-1.
Note: Data Flash and Program RAM are NOT available on the 56F8147 device.
Table 4-1 Chip Memory Configurations
On-Chip Memory
56F8347
56F8147
128KB
128KB
Erase/Program via Flash interface unit and word writes to
CDBW
Data Flash
8KB
—
Erase/Program via Flash interface unit and word writes to
CDBW. Data Flash can be read via either CDBR or XDB2,
but not by both simultaneously
Program RAM
4KB
—
None
Data RAM
8KB
8KB
None
Program Boot Flash
8KB
8KB
Erase/Program via Flash Interface unit and word to CDBW
Program Flash
Use Restrictions
56F8347 Technical Data, Rev.11
40
Freescale Semiconductor
Preliminary
Program Map
4.2 Program Map
The operating mode control bits (MA and MB) in the Operating Mode Register (OMR) control the
Program memory map. At reset, these bits are set as indicated in Table 4-2. Table 4-4 shows the memory
map configurations that are possible at reset. After reset, the OMR MA bit can be changed and will have
an effect on the P-space memory map, as shown in Table 4-3. Changing the OMR MB bit will have no
effect.
Table 4-2 OMR MB/MA Value at Reset
OMR MB =
Flash Secured
State1, 2
OMR MA =
EXTBOOT Pin
0
0
Mode 0 – Internal Boot; EMI are configured to use 16 address lines; Flash Memory is
secured; external P-space is not allowed; the EOnCE is disabled
0
1
Not valid; cannot boot externally if the Flash is secured and will actually configure to
00 state
1
0
Mode 0 – Internal Boot; EMI is configured to use 16 address lines
1
1
Mode 1 – External Boot; Flash Memory is not secured; EMI configuration is
determined by the state of the EMI_MODE pin
Chip Operating Mode
1. This bit is only configured at reset. If the Flash secured state changes, this will not be reflected in MB until the next reset.
2. Changing MB in software will not affect Flash memory security.
Table 4-3 Changing OMR MA Value During Normal Operation
OMR MA
Chip Operating Mode
0
Use internal P-space memory map configuration
1
Use external P-space memory map configuration – If MB = 0 at reset, changing this bit has no effect.
The device’s external memory interface (EMI) can operate much like the 56F80x family’s EMI, or it can
be operated in a mode similar to that used on other products in the 56800E family. Initially, CS0 and CS1
are configured as PS and DS, in a mode compatible with earlier 56800 devices.
Eighteen address lines are required to shadow the first 192K of internal program space when booting
externally for development purposes. Therefore, the entire complement of on-chip memory cannot be
accessed using a 16-bit 56800-compatible address bus. To address this situation, the EMI_MODE pin can
be used to configure four GPIO pins as Address[19:16] upon reset (Software reconfiguration of the highest
address lines [A20-23] is required if the full address range is to be used.)
The EMI_MODE pin also affects the reset vector address, as provided in Table 4-4. Additional pins must
be configured as address or chip select signals to access addresses at P:$10 0000 and above.
Note: Program RAM is NOT available on the 56F8147 device.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
41
Table 4-4 Program Memory Map at Reset
Begin/End
Address
P:$1F FFFF
P:$10 0000
Mode 0 (MA = 0)
Mode 11 (MA = 1)
Internal Boot
External Boot
Internal Boot
16-Bit External Address Bus
External Program Memory5
EMI_MODE = 02,3
16-Bit External Address Bus
External Program Memory5
EMI_MODE = 14
20-Bit External Address Bus
External Program Memory5
P:$0F FFFF
P:$03 0000
P:$02 FFFF
P:$02 F800
On-Chip Program RAM
4KB
P:$02 F7FF
P:$02 1000
Reserved
116KB
P:$02 0FFF
P:$02 0000
Boot Flash
8KB
COP Reset Address = 02 0002
Boot Location = 02 0000
Boot Flash
8KB
(Not Used for Boot in this Mode)
P:$01 FFFF
P:$01 0000
External Program RAM5
Internal Program Flash7
128KB
P:$00 FFFF
P:$00 0000
Internal Program Flash
128KB
External Program RAM
COP Reset Address = 00 0002
Boot Location = 00 0000
External Program RAM
COP Reset Address = 02 0002
Boot Location = 02 00006
1. If Flash Security Mode is enabled, EXTBOOT Mode 1 cannot be used. See Security Features, Part 7.
2. This mode provides maximum compatibility with 56F80x parts while operating externally.
3. “EMI_MODE = 0”, EMI_MODE pin is tied to ground at boot up.
4. “EMI_MODE = 1”, EMI_MODE pin is tied to VDD at boot up.
5. Not accessible in reset configuration, since the address is above P$0x00 FFFF. The higher bit address/GPIO (and/or chip
selects) pins must be reconfigured before this external memory is accessible.
6. Booting from this external address allows prototyping of the internal Boot Flash.
7. The internal Program Flash is relocated in this mode, making it accessible.
4.3 Interrupt Vector Table
Table 4-5 provides the reset and interrupt priority structure, including on-chip peripherals. The table is
organized with higher-priority vectors at the top and lower-priority interrupts lower in the table. The
priority of an interrupt can be assigned to different levels, as indicated, allowing some control over
interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority
level, the lowest vector number has the highest priority.
The location of the vector table is determined by the Vector Base Address (VBA) register. Please see Part
5.6.11 for the reset value of the VBA.
In some configurations, the reset address and COP reset address will correspond to vector 0 and 1 of the
interrupt vector table. In these instances, the first two locations in the vector table must contain branch or
JMP instructions. All other entries must contain JSR instructions.
56F8347 Technical Data, Rev.11
42
Freescale Semiconductor
Preliminary
Interrupt Vector Table
Note: PWMA, FlexCAN, Quadrature Decoder 1, and Quad Timers B and D are NOT available on the
56F8147 device.
Table 4-5 Interrupt Vector Table Contents1
Peripheral
Vector
Number
Priority
Level
Vector Base
Address +
Interrupt Function
Reserved for Reset Overlay2
Reserved for COP Reset Overlay2
core
2
3
P:$04
Illegal Instruction
core
3
3
P:$06
SW Interrupt 3
core
4
3
P:$08
HW Stack Overflow
core
5
3
P:$0A
Misaligned Long Word Access
core
6
1-3
P:$0C
OnCE Step Counter
core
7
1-3
P:$0E
OnCE Breakpoint Unit 0
Reserved
core
9
1-3
P:$12
OnCE Trace Buffer
core
10
1-3
P:$14
OnCE Transmit Register Empty
core
11
1-3
P:$16
OnCE Receive Register Full
Reserved
core
14
2
P:$1C
SW Interrupt 2
core
15
1
P:$1E
SW Interrupt 1
core
16
0
P:$20
SW Interrupt 0
core
17
0-2
P:$22
IRQA
core
18
0-2
P:$24
IRQB
Reserved
LVI
20
0-2
P:$28
Low Voltage Detector (power sense)
PLL
21
0-2
P:$2A
PLL
FM
22
0-2
P:$2C
FM Access Error Interrupt
FM
23
0-2
P:$2E
FM Command Complete
FM
24
0-2
P:$30
FM Command, data and address Buffers Empty
Reserved
FLEXCAN
26
0-2
P:$34
FLEXCAN Bus Off
FLEXCAN
27
0-2
P:$36
FLEXCAN Error
FLEXCAN
28
0-2
P:$38
FLEXCAN Wake Up
FLEXCAN
29
0-2
P:$3A
FLEXCAN Message Buffer Interrupt
GPIOF
30
0-2
P:$3C
GPIOF
GPIOE
31
0-2
P:$3E
GPIOE
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
43
Table 4-5 Interrupt Vector Table Contents1 (Continued)
Vector
Number
Priority
Level
Vector Base
Address +
GPIOD
32
0-2
P:$40
GPIOD
GPIOC
33
0-2
P:$42
GPIOC
GPIOB
34
0-2
P:$44
GPIOB
GPIOA
35
0-2
P:$46
GPIOA
Peripheral
Interrupt Function
Reserved
SPI1
38
0-2
P:$4C
SPI 1 Receiver Full
SPI1
39
0-2
P:$4E
SPI 1 Transmitter Empty
SPI0
40
0-2
P:$50
SPI 0 Receiver Full
SPI0
41
0-2
P:$52
SPI 0 Transmitter Empty
SCI1
42
0-2
P:$54
SCI 1 Transmitter Empty
SCI1
43
0-2
P:$56
SCI 1 Transmitter Idle
Reserved
SCI1
45
0-2
P:$5A
SCI 1 Receiver Error
SCI1
46
0-2
P:$5C
SCI 1 Receiver Full
DEC1
47
0-2
P:$5E
Quadrature Decoder #1 Home Switch or Watchdog
DEC1
48
0-2
P:$60
Quadrature Decoder #1 INDEX Pulse
DEC0
49
0-2
P:$62
Quadrature Decoder #0 Home Switch or Watchdog
DEC0
50
0-2
P:$64
Quadrature Decoder #0 INDEX Pulse
Reserved
TMRD
52
0-2
P:$68
Timer D, Channel 0
TMRD
53
0-2
P:$6A
Timer D, Channel 1
TMRD
54
0-2
P:$6C
Timer D, Channel 2
TMRD
55
0-2
P:$6E
Timer D, Channel 3
TMRC
56
0-2
P:$70
Timer C, Channel 0
TMRC
57
0-2
P:$72
Timer C, Channel 1
TMRC
58
0-2
P:$74
Timer C, Channel 2
TMRC
59
0-2
P:$76
Timer C, Channel 3
TMRB
60
0-2
P:$78
Timer B, Channel 0
TMRB
61
0-2
P:$7A
Timer B, Channel 1
TMRB
62
0-2
P:$7C
Timer B, Channel 2
TMRB
63
0-2
P:$7E
Timer B, Channel 3
TMRA
64
0-2
P:$80
Timer A, Channel 0
TMRA
65
0-2
P:$82
Timer A, Channel 1
TMRA
66
0-2
P:$84
Timer A, Channel 2
TMRA
67
0-2
P:$86
Timer A, Channel 3
56F8347 Technical Data, Rev.11
44
Freescale Semiconductor
Preliminary
Data Map
Table 4-5 Interrupt Vector Table Contents1 (Continued)
Vector
Number
Priority
Level
Vector Base
Address +
SCI0
68
0-2
P:$88
SCI 0 Transmitter Empty
SCI0
69
0-2
P:$8A
SCI 0 Transmitter Idle
Peripheral
Interrupt Function
Reserved
SCI0
71
0-2
P:$8E
SCI 0 Receiver Error
SCI0
72
0-2
P:$90
SCI 0 Receiver Full
ADCB
73
0-2
P:$92
ADC B Conversion Compete / End of Scan
ADCA
74
0-2
P:$94
ADC A Conversion Complete / End of Scan
ADCB
75
0-2
P:$96
ADC B Zero Crossing or Limit Error
ADCA
76
0-2
P:$98
ADC A Zero Crossing or Limit Error
PWMB
77
0-2
P:$9A
Reload PWM B
PWMA
78
0-2
P:$9C
Reload PWM A
PWMB
79
0-2
P:$9E
PWM B Fault
PWMA
80
0-2
P:$A0
PWM A Fault
core
81
-1
P:$A2
SW Interrupt LP
1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced from the
vector table, providing only 19 bits of address.
2. If the VBA is set to 0200 (or VBA = 0000 for Mode 1, EMI_MODE = 0), the first two locations of the vector table are the chip
reset addresses; therefore, these locations are not interrupt vectors.
4.4 Data Map
Note: Data Flash is NOT available on the 56F8147 device.
Table 4-6 Data Memory Map1
Begin/End
Address
EX = 02
EX = 1
X:$FF FFFF
X:$FF 0000
EOnCE
256 locations allocated
EOnCE
256 locations allocated
X:$FF FEFF
X:$01 0000
External Memory
External Memory
X:$00 FFFF
X:$00 F000
On-Chip Peripherals
4096 locations allocated
On-Chip Peripherals
4096 locations allocated
X:$00 EFFF
X:$00 2000
External Memory
External Memory
X:$00 1FFF
X:$00 1000
On-Chip Data Flash
8KB
X:$00 0FFF
X:$00 0000
On-Chip Data RAM
8KB3
1. All addresses are 16-bit Word addresses, not byte addresses.
2. In the Operating Mode Register (OMR).
3. The Data RAM is organized as a 2K x 32-bit memory to allow single-cycle long-word operations.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
45
4.5 Flash Memory Map
Figure 4-1 illustrates the Flash Memory (FM) map on the system bus.
The Flash Memory is divided into three functional blocks. The Program and boot memories reside on the
Program Memory buses. They are controlled by one set of banked registers. Data Memory Flash resides
on the Data Memory buses and is controlled separately by its own set of banked registers.
The top nine words of the Program Memory Flash are treated as special memory locations. The content of
these words is used to control the operation of the Flash Controller. Because these words are part of the
Flash Memory content, their state is maintained during power-down and reset. During chip initialization,
the content of these memory locations is loaded into Flash Memory control registers, detailed in the Flash
Memory chapter of the 56F8300 Peripheral User Manual. These configuration parameters are located
between $00_FFF7 and $00_FFFF.
Data Memory
Program Memory
BOOT_FLASH_START + $1FFF
FM_BASE + $14
8KB
Boot
BOOT_FLASH_START = $02_0000
FM_BASE + $00
Reserved
Banked Registers
Unbanked Registers
DATA_FLASH_START + $0FFF
8KB
DATA_FLASH_START + $0000
Configure Field
FM_PROG_MEM_TOP = $00_FFFF
Block 0 Odd
Block 0 Even
Note: Data Flash is
NOT available in the
56F8147 device.
...
PROG_FLASH_START + $00_FFFF
PROG_FLASH_START + $00_FFF7
PROG_FLASH_START + $00_FFF6
128K Bytes
BLOCK 0 Odd (2 Bytes) $00_0003
BLOCK 0 Even (2 Bytes) $00_0002
BLOCK 0 Odd (2 Bytes) $00_0001
BLOCK 0 Even (2 Bytes) $00_0000
PROG_FLASH_START = $00_0000
Figure 4-1 Flash Array Memory Maps
Table 4-7 shows the page and sector sizes used within each Flash memory block on the chip.
Note: Data Flash is NOT available on the 56F8147 device.
Table 4-7. Flash Memory Partitions
Flash Size
Sectors
Sector Size
Page Size
Program Flash
128KB
16
4K x 16 bits
512 x 16 bits
Data Flash
8KB
16
256 x 16 bits
256 x 16 bits
Boot Flash
8KB
4
1K x 16 bits
256 x 16 bits
Please see 56F8300 Peripheral User Manual for additional Flash information.
56F8347 Technical Data, Rev.11
46
Freescale Semiconductor
Preliminary
EOnCE Memory Map
4.6 EOnCE Memory Map
Table 4-8 EOnCE Memory Map
Address
Register Acronym
Register Name
Reserved
X:$FF FF8A
OESCR
External Signal Control Register
Reserved
X:$FF FF8E
OBCNTR
Breakpoint Unit [0] Counter
Reserved
X:$FF FF90
OBMSK (32 bits)
Breakpoint 1 Unit [0] Mask Register
X:$FF FF91
—
Breakpoint 1 Unit [0] Mask Register
X:$FF FF92
OBAR2 (32 bits)
Breakpoint 2 Unit [0] Address Register
X:$FF FF93
—
Breakpoint 2 Unit [0] Address Register
X:$FF FF94
OBAR1 (24 bits)
Breakpoint 1 Unit [0] Address Register
X:$FF FF95
—
Breakpoint 1 Unit [0] Address Register
X:$FF FF96
OBCR (24 bits)
Breakpoint Unit [0] Control Register
X:$FF FF97
—
Breakpoint Unit [0] Control Register
X:$FF FF98
OTB (21-24 bits/stage)
Trace Buffer Register Stages
X:$FF FF99
—
Trace Buffer Register Stages
X:$FF FF9A
OTBPR (8 bits)
Trace Buffer Pointer Register
X:$FF FF9B
OTBCR
Trace Buffer Control Register
X:$FF FF9C
OBASE (8 bits)
Peripheral Base Address Register
X:$FF FF9D
OSR
Status Register
X:$FF FF9E
OSCNTR (24 bits)
Instruction Step Counter
X:$FF FF9F
—
Instruction Step Counter
X:$FF FFA0
OCR (bits)
Control Register
Reserved
X:$FF FFFC
OCLSR (8 bits)
Core Lock / Unlock Status Register
X:$FF FFFD
OTXRXSR (8 bits)
Transmit and Receive Status and Control Register
X:$FF FFFE
OTX / ORX (32 bits)
Transmit Register / Receive Register
X:$FF FFFF
OTX1 / ORX1
Transmit Register Upper Word
Receive Register Upper Word
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
47
4.7 Peripheral Memory Mapped Registers
On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may
be accessed with the same addressing modes used for ordinary Data memory, except all peripheral
registers should be read/written using word accesses only.
Table 4-9 summarizes base addresses for the set of peripherals on the 56F8347 and 56F8147 devices.
Peripherals are listed in order of the base address.
The following tables list all of the peripheral registers required to control or access the peripherals.
Note: Features in italics are NOT available on the 56F8147 device.
Table 4-9 Data Memory Peripheral Base Address Map Summary
Peripheral
Prefix
Base Address
Table Number
External Memory Interface
EMI
X:$00 F020
4-10
Timer A
TMRA
X:$00 F040
4-11
Timer B
TMRB
X:$00 F080
4-12
Timer C
TMRC
X:$00 F0C0
4-13
Timer D
TMRD
X:$00 F100
4-14
PWM A
PWMA
X:$00 F140
4-15
PWM B
PWMB
X:$00 F160
4-16
Quadrature Decoder 0
DEC0
X:$00 F180
4-17
Quadrature Decoder 1
DEC1
X:$00 F190
4-18
ITCN
ITCN
X:$00 F1A0
4-19
ADC A
ADCA
X:$00 F200
4-20
ADC B
ADCB
X:$00 F240
4-21
Temperature Sensor
TSENSOR
X:$00 F270
4-22
SCI #0
SCI0
X:$00 F280
4-23
SCI #1
SCI1
X:$00 F290
4-24
SPI #0
SPI0
X:$00 F2A0
4-25
SPI #1
SPI1
X:$00 F2B0
4-26
COP
COP
X:$00 F2C0
4-27
CLK, PLL, OSC, TEST
CLKGEN
X:$00 F2D0
4-28
GPIO Port A
GPIOA
X:$00 F2E0
4-29
GPIO Port B
GPIOB
X:$00 F300
4-30
GPIO Port C
GPIOC
X:$00 F310
4-31
GPIO Port D
GPIOD
X:$00 F320
4-32
GPIO Port E
GPIOE
X:$00 F330
4-33
56F8347 Technical Data, Rev.11
48
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-9 Data Memory Peripheral Base Address Map Summary (Continued)
Peripheral
Prefix
Base Address
Table Number
GPIO Port F
GPIOF
X:$00 F340
4-34
SIM
SIM
X:$00 F350
4-35
Power Supervisor
LVI
X:$00 F360
4-36
FM
FM
X:$00 F400
4-37
FlexCAN
FC
X:$00 F800
4-38
Table 4-10 External Memory Integration Registers Address Map
(EMI_BASE = $00 F020)
Register Acronym
CSBAR 0
Address Offset
$0
Register Description
Chip Select Base Address Register 0
Reset Value
0x0004 = 64K when
EXT_BOOT = 0 or
EMI_MODE = 0
0x0008 = 1M when
EMI_MODE = 1
(Selects entire program space
for CS0)
CSBAR 1
$1
Chip Select Base Address Register 1
0x0004 = 64K when
EXT_BOOT = 0
0x0008 = 1M when
EMI_MODE = 1
(Selects A0 - A19 addressable
data space for CS1)
CSBAR 2
$2
Chip Select Base Address Register 2
CSBAR 3
$3
Chip Select Base Address Register 3
CSBAR 4
$4
Chip Select Base Address Register 4
CSBAR 5
$5
Chip Select Base Address Register 5
CSBAR 6
$6
Chip Select Base Address Register 6
CSBAR 7
$7
Chip Select Base Address Register 7
CSOR 0
$8
Chip Select Option Register 0
0x5FCB programmed for chip
select for program space, word
wide, read and write, 11 waits
CSOR 1
$9
Chip Select Option Register 1
0x5FAB programmed for chip
select for data space, word
wide, read and write, 11 waits
CSOR 2
$A
Chip Select Option Register 2
CSOR 3
$B
Chip Select Option Register 3
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
49
Table 4-10 External Memory Integration Registers Address Map (Continued)
(EMI_BASE = $00 F020)
Register Acronym
Address Offset
Register Description
CSOR 4
$C
Chip Select Option Register 4
CSOR 5
$D
Chip Select Option Register 5
CSOR 6
$E
Chip Select Option Register 6
CSOR 7
$F
Chip Select Option Register 7
CSTC 0
$10
Chip Select Timing Control Register 0
CSTC 1
$11
Chip Select Timing Control Register 1
CSTC 2
$12
Chip Select Timing Control Register 2
CSTC 3
$13
Chip Select Timing Control Register 3
CSTC 4
$14
Chip Select Timing Control Register 4
CSTC 5
$15
Chip Select Timing Control Register 5
CSTC 6
$16
Chip Select Timing Control Register 6
CSTC 7
$17
Chip Select Timing Control Register 7
BCR
$18
Bus Control Register
Reset Value
0x016B sets the default
number of wait states to 11 for
both read and write accesses
Table 4-11 Quad Timer A Registers Address Map
(TMRA_BASE = $00 F040)
Register Acronym
Address Offset
Register Description
TMRA0_CMP1
$0
Compare Register 1
TMRA0_CMP2
$1
Compare Register 2
TMRA0_CAP
$2
Capture Register
TMRA0_LOAD
$3
Load Register
TMRA0_HOLD
$4
Hold Register
TMRA0_CNTR
$5
Counter Register
TMRA0_CTRL
$6
Control Register
TMRA0_SCR
$7
Status and Control Register
TMRA0_CMPLD1
$8
Comparator Load Register 1
TMRA0_CMPLD2
$9
Comparator Load Register 2
TMRA0_COMSCR
$A
Comparator Status and Control Register
Reserve
TMRA1_CMP1
$10
Compare Register 1
TMRA1_CMP2
$11
Compare Register 2
TMRA1_CAP
$12
Capture Register
TMRA1_LOAD
$13
Load Register
56F8347 Technical Data, Rev.11
50
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-11 Quad Timer A Registers Address Map (Continued)
(TMRA_BASE = $00 F040)
Register Acronym
Address Offset
Register Description
TMRA1_HOLD
$14
Hold Register
TMRA1_CNTR
$15
Counter Register
TMRA1_CTRL
$16
Control Register
TMRA1_SCR
$17
Status and Control Register
TMRA1_CMPLD1
$18
Comparator Load Register 1
TMRA1_CMPLD2
$19
Comparator Load Register 2
TMRA1_COMSCR
$1A
Comparator Status and Control Register
Reserved
TMRA2_CMP1
$20
Compare Register 1
TMRA2_CMP2
$21
Compare Register 2
TMRA2_CAP
$22
Capture Register
TMRA2_LOAD
$23
Load Register
TMRA2_HOLD
$24
Hold Register
TMRA2_CNTR
$25
Counter Register
TMRA2_CTRL
$26
Control Register
TMRA2_SCR
$27
Status and Control Register
TMRA2_CMPLD1
$28
Comparator Load Register 1
TMRA2_CMPLD2
$29
Comparator Load Register 2
TMRA2_COMSCR
$2A
Comparator Status and Control Register
Reserved
TMRA3_CMP1
$30
Compare Register 1
TMRA3_CMP2
$31
Compare Register 2
TMRA3_CAP
$32
Capture Register
TMRA3_LOAD
$33
Load Register
TMRA3_HOLD
$34
Hold Register
TMRA3_CNTR
$35
Counter Register
TMRA3_CTRL
$36
Control Register
TMRA3_SCR
$37
Status and Control Register
TMRA3_CMPLD1
$38
Comparator Load Register 1
TMRA3_CMPLD2
$39
Comparator Load Register 2
TMRA3_COMSC
$3A
Comparator Status and Control Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
51
Table 4-12 Quad Timer B Registers Address Map
(TMRB_BASE = $00 F080)
Quad Timer B is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
TMRB0_CMP1
$0
Compare Register 1
TMRB0_CMP2
$1
Compare Register 2
TMRB0_CAP
$2
Capture Register
TMRB0_LOAD
$3
Load Register
TMRB0_HOLD
$4
Hold Register
TMRB0_CNTR
$5
Counter Register
TMRB0_CTRL
$6
Control Register
TMRB0_SCR
$7
Status and Control Register
TMRB0_CMPLD1
$8
Comparator Load Register 1
TMRB0_CMPLD2
$9
Comparator Load Register 2
TMRB0_COMSCR
$A
Comparator Status and Control Register
Reserved
TMRB1_CMP1
$10
Compare Register 1
TMRB1_CMP2
$11
Compare Register 2
TMRB1_CAP
$12
Capture Register
TMRB1_LOAD
$13
Load Register
TMRB1_HOLD
$14
Hold Register
TMRB1_CNTR
$15
Counter Register
TMRB1_CTRL
$16
Control Register
TMRB1_SCR
$17
Status and Control Register
TMRB1_CMPLD1
$18
Comparator Load Register 1
TMRB1_CMPLD2
$19
Comparator Load Register 2
TMRB1_COMSCR
$1A
Comparator Status and Control Register
Reserved
TMRB2_CMP1
$20
Compare Register 1
TMRB2_CMP2
$21
Compare Register 2
TMRB2_CAP
$22
Capture Register
TMRB2_LOAD
$23
Load Register
TMRB2_HOLD
$24
Hold Register
TMRB2_CNTR
$25
Counter Register
TMRB2_CTRL
$26
Control Register
56F8347 Technical Data, Rev.11
52
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-12 Quad Timer B Registers Address Map (Continued)
(TMRB_BASE = $00 F080)
Quad Timer B is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
TMRB2_SCR
$27
Status and Control Register
TMRB2_CMPLD1
$28
Comparator Load Register 1
TMRB2_CMPLD2
$29
Comparator Load Register 2
TMRB2_COMSCR
$2A
Comparator Status and Control Register
Reserved
TMRB3_CMP1
$30
Compare Register 1
TMRB3_CMP2
$31
Compare Register 2
TMRB3_CAP
$32
Capture Register
TMRB3_LOAD
$33
Load Register
TMRB3_HOLD
$34
Hold Register
TMRB3_CNTR
$35
Counter Register
TMRB3_CTRL
$36
Control Register
TMRB3_SCR
$37
Status and Control Register
TMRB3_CMPLD1
$38
Comparator Load Register 1
TMRB3_CMPLD2
$39
Comparator Load Register 2
TMRB3_COMSCR
$3A
Comparator Status and Control Register
Table 4-13 Quad Timer C Registers Address Map
(TMRC_BASE = $00 F0C0)
Register Acronym
Address Offset
Register Description
TMRC0_CMP1
$0
Compare Register 1
TMRC0_CMP2
$1
Compare Register 2
TMRC0_CAP
$2
Capture Register
TMRC0_LOAD
$3
Load Register
TMRC0_HOLD
$4
Hold Register
TMRC0_CNTR
$5
Counter Register
TMRC0_CTRL
$6
Control Register
TMRC0_SCR
$7
Status and Control Register
TMRC0_CMPLD1
$8
Comparator Load Register 1
TMRC0_CMPLD2
$9
Comparator Load Register 2
TMRC0_COMSCR
$A
Comparator Status and Control Register
Reserved
TMRC1_CMP1
$10
Compare Register 1
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
53
Table 4-13 Quad Timer C Registers Address Map (Continued)
(TMRC_BASE = $00 F0C0)
Register Acronym
Address Offset
Register Description
TMRC1_CMP2
$11
Compare Register 2
TMRC1_CAP
$12
Capture Register
TMRC1_LOAD
$13
Load Register
TMRC1_HOLD
$14
Hold Register
TMRC1_CNTR
$15
Counter Register
TMRC1_CTRL
$16
Control Register
TMRC1_SCR
$17
Status and Control Register
TMRC1_CMPLD1
$18
Comparator Load Register 1
TMRC1_CMPLD2
$19
Comparator Load Register 2
TMRC1_COMSCR
$1A
Comparator Status and Control Register
Reserved
TMRC2_CMP1
$20
Compare Register 1
TMRC2_CMP2
$21
Compare Register 2
TMRC2_CAP
$22
Capture Register
TMRC2_LOAD
$23
Load Register
TMRC2_HOLD
$24
Hold Register
TMRC2_CNTR
$25
Counter Register
TMRC2_CTRL
$26
Control Register
TMRC2_SCR
$27
Status and Control Register
TMRC2_CMPLD1
$28
Comparator Load Register 1
TMRC2_CMPLD2
$29
Comparator Load Register 2
TMRC2_COMSCR
$2A
Comparator Status and Control Register
Reserved
TMRC3_CMP1
$30
Compare Register 1
TMRC3_CMP2
$31
Compare Register 2
TMRC3_CAP
$32
Capture Register
TMRC3_LOAD
$33
Load Register
TMRC3_HOLD
$34
Hold Register
TMRC3_CNTR
$35
Counter Register
TMRC3_CTRL
$36
Control Register
TMRC3_SCR
$37
Status and Control Register
TMRC3_CMPLD1
$38
Comparator Load Register 1
TMRC3_CMPLD2
$39
Comparator Load Register 2
TMRC3_COMSCR
$3A
Comparator Status and Control Register
56F8347 Technical Data, Rev.11
54
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-14 Quad Timer D Registers Address Map
(TMRD_BASE = $00 F100)
Quad Timer D is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
TMRD0_CMP1
$0
Compare Register 1
TMRD0_CMP2
$1
Compare Register 2
TMRD0_CAP
$2
Capture Register
TMRD0_LOAD
$3
Load Register
TMRD0_HOLD
$4
Hold Register
TMRD0_CNTR
$5
Counter Register
TMRD0_CTRL
$6
Control Register
TMRD0_SCR
$7
Status and Control Register
TMRD0_CMPLD1
$8
Comparator Load Register 1
TMRD0_CMPLD2
$9
Comparator Load Register 2
TMRD0_COMSCR
$A
Comparator Status and Control Register
Reserved
TMRD1_CMP1
$10
Compare Register 1
TMRD1_CMP2
$11
Compare Register 2
TMRD1_CAP
$12
Capture Register
TMRD1_LOAD
$13
Load Register
TMRD1_HOLD
$14
Hold Register
TMRD1_CNTR
$15
Counter Register
TMRD1_CTRL
$16
Control Register
TMRD1_SCR
$17
Status and Control Register
TMRD1_CMPLD1
$18
Comparator Load Register 1
TMRD1_CMPLD2
$19
Comparator Load Register 2
TMRD1_COMSCR
$1A
Comparator Status and Control Register
Reserved
TMRD2_CMP1
$20
Compare Register 1
TMRD2_CMP2
$21
Compare Register 2
TMRD2_CAP
$22
Capture Register
TMRD2_LOAD
$23
Load Register
TMRD2_HOLD
$24
Hold Register
TMRD2_CNTR
$25
Counter Register
TMRD2_CTRL
$26
Control Register
TMRD2_SCR
$27
Status and Control Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
55
Table 4-14 Quad Timer D Registers Address Map (Continued)
(TMRD_BASE = $00 F100)
Quad Timer D is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
TMRD2_CMPLD1
$28
Comparator Load Register 1
TMRD2_CMPLD2
$29
Comparator Load Register 2
TMRD2_COMSCR
$2A
Comparator Status and Control Register
Reserved
TMRD3_CMP1
$30
Compare Register 1
TMRD3_CMP2
$31
Compare Register 2
TMRD3_CAP
$32
Capture Register
TMRD3_LOAD
$33
Load Register
TMRD3_HOLD
$34
Hold Register
TMRD3_CNTR
$35
Counter Register
TMRD3_CTRL
$36
Control Register
TMRD3_SCR
$37
Status and Control Register
TMRD3_CMPLD1
$38
Comparator Load Register 1
TMRD3_CMPLD2
$39
Comparator Load Register 2
TMRD3_COMSCR
$3A
Comparator Status and Control Register
Table 4-15 Pulse Width Modulator A Registers Address Map
(PWMA_BASE = $00 F140)
PWMA is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
PWMA_PMCTL
$0
Control Register
PWMA_PMFCTL
$1
Fault Control Register
PWMA_PMFSA
$2
Fault Status Acknowledge Register
PWMA_PMOUT
$3
Output Control Register
PWMA_PMCNT
$4
Counter Register
PWMA_PWMCM
$5
Counter Modulo Register
PWMA_PWMVAL0
$6
Value Register 0
PWMA_PWMVAL1
$7
Value Register 1
PWMA_PWMVAL2
$8
Value Register 2
PWMA_PWMVAL3
$9
Value Register 3
PWMA_PWMVAL4
$A
Value Register 4
PWMA_PWMVAL5
$B
Value Register 5
PWMA_PMDEADTM
$C
Dead Time Register
56F8347 Technical Data, Rev.11
56
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-15 Pulse Width Modulator A Registers Address Map (Continued)
(PWMA_BASE = $00 F140)
PWMA is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
PWMA_PMDISMAP1
$D
Disable Mapping Register 1
PWMA_PMDISMAP2
$E
Disable Mapping Register 2
PWMA_PMCFG
$F
Configure Register
PWMA_PMCCR
$10
Channel Control Register
PWMA_PMPORT
$11
Port Register
PWMA_PMICCR
$12
PWM Internal Correction Control Register
Table 4-16 Pulse Width Modulator B Registers Address Map
(PWMB_BASE = $00 F160)
Register Acronym
Address Offset
Register Description
PWMB_PMCTL
$0
Control Register
PWMB_PMFCTL
$1
Fault Control Register
PWMB_PMFSA
$2
Fault Status Acknowledge Register
PWMB_PMOUT
$3
Output Control Register
PWMB_PMCNT
$4
Counter Register
PWMB_PWMCM
$5
Counter Modulo Register
PWMB_PWMVAL0
$6
Value Register 0
PWMB_PWMVAL1
$7
Value Register 1
PWMB_PWMVAL2
$8
Value Register 2
PWMB_PWMVAL3
$9
Value Register 3
PWMB_PWMVAL4
$A
Value Register 4
PWMB_PWMVAL5
$B
Value Register 5
PWMB_PMDEADTM
$C
Dead Time Register
PWMB_PMDISMAP1
$D
Disable Mapping Register 1
PWMB_PMDISMAP2
$E
Disable Mapping Register 2
PWMB_PMCFG
$F
Configure Register
PWMB_PMCCR
$10
Channel Control Register
PWMB_PMPORT
$11
Port Register
PWMB_PMICCR
$12
PWM Internal Correction Control Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
57
Table 4-17 Quadrature Decoder 0 Registers Address Map
(DEC0_BASE = $00 F180)
Register Acronym
Address Offset
Register Description
DEC0_DECCR
$0
Decoder Control Register
DEC0_FIR
$1
Filter Interval Register
DEC0_WTR
$2
Watchdog Time-out Register
DEC0_POSD
$3
Position Difference Counter Register
DEC0_POSDH
$4
Position Difference Counter Hold Register
DEC0_REV
$5
Revolution Counter Register
DEC0_REVH
$6
Revolution Hold Register
DEC0_UPOS
$7
Upper Position Counter Register
DEC0_LPOS
$8
Lower Position Counter Register
DEC0_UPOSH
$9
Upper Position Hold Register
DEC0_LPOSH
$A
Lower Position Hold Register
DEC0_UIR
$B
Upper Initialization Register
DEC0_LIR
$C
Lower Initialization Register
DEC0_IMR
$D
Input Monitor Register
Table 4-18 Quadrature Decoder 1 Registers Address Map
(DEC1_BASE = $00 190)
Quadrature Decoder 1 is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
DEC1_DECCR
$0
Decoder Control Register
DEC1_FIR
$1
Filter Interval Register
DEC1_WTR
$2
Watchdog Time-out Register
DEC1_POSD
$3
Position Difference Counter Register
DEC1_POSDH
$4
Position Difference Counter Hold Register
DEC1_REV
$5
Revolution Counter Register
DEC1_REVH
$6
Revolution Hold Register
DEC1_UPOS
$7
Upper Position Counter Register
DEC1_LPOS
$8
Lower Position Counter Register
DEC1_UPOSH
$9
Upper Position Hold Register
DEC1_LPOSH
$A
Lower Position Hold Register
DEC1_UIR
$B
Upper Initialization Register
DEC1_LIR
$C
Lower Initialization Register
DEC1_IMR
$D
Input Monitor Register
56F8347 Technical Data, Rev.11
58
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-19 Interrupt Control Registers Address Map
(ITCN_BASE = $00 F1A0)
Register Acronym
Address Offset
Register Description
IPR 0
$0
Interrupt Priority Register 0
IPR 1
$1
Interrupt Priority Register 1
IPR 2
$2
Interrupt Priority Register 2
IPR 3
$3
Interrupt Priority Register 3
IPR 4
$4
Interrupt Priority Register 4
IPR 5
$5
Interrupt Priority Register 5
IPR 6
$6
Interrupt Priority Register 6
IPR 7
$7
Interrupt Priority Register 7
IPR 8
$8
Interrupt Priority Register 8
IPR 9
$9
Interrupt Priority Register 9
VBA
$A
Vector Base Address Register
FIM0
$B
Fast Interrupt Match Register 0
FIVAL0
$C
Fast Interrupt Vector Address Low 0 Register
FIVAH0
$D
Fast Interrupt Vector Address High 0 Register
FIM1
$E
Fast Interrupt Match Register 1
FIVAL1
$F
Fast Interrupt Vector Address Low 1 Register
FIVAH1
$10
Fast Interrupt Vector Address High 1 Register
IRQP 0
$11
IRQ Pending Register 0
IRQP 1
$12
IRQ Pending Register 1
IRQP 2
$13
IRQ Pending Register 2
IRQP 3
$14
IRQ Pending Register 3
IRQP 4
$15
IRQ Pending Register 4
IRQP 5
$16
IRQ Pending Register 5
Reserved
ICTL
$1D
Interrupt Control Register
Table 4-20 Analog-to-Digital Converter Registers Address Map
(ADCA_BASE = $00 F200)
Register Acronym
Address Offset
Register Description
ADCA_CR 1
$0
Control Register 1
ADCA_CR 2
$1
Control Register 2
ADCA_ZCC
$2
Zero Crossing Control Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
59
Table 4-20 Analog-to-Digital Converter Registers Address Map (Continued)
(ADCA_BASE = $00 F200)
Register Acronym
Address Offset
Register Description
ADCA_LST 1
$3
Channel List Register 1
ADCA_LST 2
$4
Channel List Register 2
ADCA_SDIS
$5
Sample Disable Register
ADCA_STAT
$6
Status Register
ADCA_LSTAT
$7
Limit Status Register
ADCA_ZCSTAT
$8
Zero Crossing Status Register
ADCA_RSLT 0
$9
Result Register 0
ADCA_RSLT 1
$A
Result Register 1
ADCA_RSLT 2
$B
Result Register 2
ADCA_RSLT 3
$C
Result Register 3
ADCA_RSLT 4
$D
Result Register 4
ADCA_RSLT 5
$E
Result Register 5
ADCA_RSLT 6
$F
Result Register 6
ADCA_RSLT 7
$10
Result Register 7
ADCA_LLMT 0
$11
Low Limit Register 0
ADCA_LLMT 1
$12
Low Limit Register 1
ADCA_LLMT 2
$13
Low Limit Register 2
ADCA_LLMT 3
$14
Low Limit Register 3
ADCA_LLMT 4
$15
Low Limit Register 4
ADCA_LLMT 5
$16
Low Limit Register 5
ADCA_LLMT 6
$17
Low Limit Register 6
ADCA_LLMT 7
$18
Low Limit Register 7
ADCA_HLMT 0
$19
High Limit Register 0
ADCA_HLMT 1
$1A
High Limit Register 1
ADCA_HLMT 2
$1B
High Limit Register 2
ADCA_HLMT 3
$1C
High Limit Register 3
ADCA_HLMT 4
$1D
High Limit Register 4
ADCA_HLMT 5
$1E
High Limit Register 5
ADCA_HLMT 6
$1F
High Limit Register 6
ADCA_HLMT 7
$20
High Limit Register 7
ADCA_OFS 0
$21
Offset Register 0
ADCA_OFS 1
$22
Offset Register 1
ADCA_OFS 2
$23
Offset Register 2
ADCA_OFS 3
$24
Offset Register 3
ADCA_OFS 4
$25
Offset Register 4
56F8347 Technical Data, Rev.11
60
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-20 Analog-to-Digital Converter Registers Address Map (Continued)
(ADCA_BASE = $00 F200)
Register Acronym
Address Offset
Register Description
ADCA_OFS 5
$26
Offset Register 5
ADCA_OFS 6
$27
Offset Register 6
ADCA_OFS 7
$28
Offset Register 7
ADCA_POWER
$29
Power Control Register
ADCA_CAL
$2A
ADC Calibration Register
Table 4-21 Analog-to-Digital Converter Registers Address Map
(ADCB_BASE = $00 F240)
Register Acronym
Address Offset
Register Description
ADCB_CR 1
$0
Control Register 1
ADCB_CR 2
$1
Control Register 2
ADCB_ZCC
$2
Zero Crossing Control Register
ADCB_LST 1
$3
Channel List Register 1
ADCB_LST 2
$4
Channel List Register 2
ADCB_SDIS
$5
Sample Disable Register
ADCB_STAT
$6
Status Register
ADCB_LSTAT
$7
Limit Status Register
ADCB_ZCSTAT
$8
Zero Crossing Status Register
ADCB_RSLT 0
$9
Result Register 0
ADCB_RSLT 1
$A
Result Register 1
ADCB_RSLT 2
$B
Result Register 2
ADCB_RSLT 3
$C
Result Register 3
ADCB_RSLT 4
$D
Result Register 4
ADCB_RSLT 5
$E
Result Register 5
ADCB_RSLT 6
$F
Result Register 6
ADCB_RSLT 7
$10
Result Register 7
ADCB_LLMT 0
$11
Low Limit Register 0
ADCB_LLMT 1
$12
Low Limit Register 1
ADCB_LLMT 2
$13
Low Limit Register 2
ADCB_LLMT 3
$14
Low Limit Register 3
ADCB_LLMT 4
$15
Low Limit Register 4
ADCB_LLMT 5
$16
Low Limit Register 5
ADCB_LLMT 6
$17
Low Limit Register 6
ADCB_LLMT 7
$18
Low Limit Register 7
ADCB_HLMT 0
$19
High Limit Register 0
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
61
Table 4-21 Analog-to-Digital Converter Registers Address Map (Continued)
(ADCB_BASE = $00 F240)
Register Acronym
Address Offset
Register Description
ADCB_HLMT 1
$1A
High Limit Register 1
ADCB_HLMT 2
$1B
High Limit Register 2
ADCB_HLMT 3
$1C
High Limit Register 3
ADCB_HLMT 4
$1D
High Limit Register 4
ADCB_HLMT 5
$1E
High Limit Register 5
ADCB_HLMT 6
$1F
High Limit Register 6
ADCB_HLMT 7
$20
High Limit Register 7
ADCB_OFS 0
$21
Offset Register 0
ADCB_OFS 1
$22
Offset Register 1
ADCB_OFS 2
$23
Offset Register 2
ADCB_OFS 3
$24
Offset Register 3
ADCB_OFS 4
$25
Offset Register 4
ADCB_OFS 5
$26
Offset Register 5
ADCB_OFS 6
$27
Offset Register 6
ADCB_OFS 7
$28
Offset Register 7
ADCB_POWER
$29
Power Control Register
ADCB_CAL
$2A
ADC Calibration Register
Table 4-22 Temperature Sensor Register Address Map
(TSENSOR_BASE = $00 F270)
Temperature Sensor is NOT available in the 56F8147 device
Register Acronym
TSENSOR_CNTL
Address Offset
$0
Register Description
Control Register
Table 4-23 Serial Communication Interface 0 Registers Address Map
(SCI0_BASE = $00 F280)
Register Acronym
Address Offset
Register Description
SCI0_SCIBR
$0
Baud Rate Register
SCI0_SCICR
$1
Control Register
Reserved
SCI0_SCISR
$3
Status Register
SCI0_SCIDR
$4
Data Register
56F8347 Technical Data, Rev.11
62
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-24 Serial Communication Interface 1 Registers Address Map
(SCI1_BASE = $00 F290)
Register Acronym
Address Offset
Register Description
SCI1_SCIBR
$0
Baud Rate Register
SCI1_SCICR
$1
Control Register
Reserved
SCI1_SCISR
$3
Status Register
SCI1_SCIDR
$4
Data Register
Table 4-25 Serial Peripheral Interface 0 Registers Address Map
(SPI0_BASE = $00 F2A0)
Register Acronym
Address Offset
Register Description
SPI0_SPSCR
$0
Status and Control Register
SPI0_SPDSR
$1
Data Size Register
SPI0_SPDRR
$2
Data Receive Register
SPI0_SPDTR
$3
Data Transmitter Register
Table 4-26 Serial Peripheral Interface 1 Registers Address Map
(SPI1_BASE = $00 F2B0)
Register Acronym
Address Offset
Register Description
SPI1_SPSCR
$0
Status and Control Register
SPI1_SPDSR
$1
Data Size Register
SPI1_SPDRR
$2
Data Receive Register
SPI1_SPDTR
$3
Data Transmitter Register
Table 4-27 Computer Operating Properly Registers Address Map
(COP_BASE = $00 F2C0)
Register Acronym
Address Offset
Register Description
COPCTL
$0
Control Register
COPTO
$1
Time Out Register
COPCTR
$2
Counter Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
63
Table 4-28 Clock Generation Module Registers Address Map
(CLKGEN_BASE = $00 F2D0)
Register Acronym
Address Offset
Register Description
PLLCR
$0
Control Register
PLLDB
$1
Divide-By Register
PLLSR
$2
Status Register
Reserved
SHUTDOWN
$4
Shutdown Register
OSCTL
$5
Oscillator Control Register
Table 4-29 GPIOA Registers Address Map
(GPIOA_BASE = $00 F2E0)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOA_PUR
$0
Pull-up Enable Register
0 x 3FFF
GPIOA_DR
$1
Data Register
0 x 0000
GPIOA_DDR
$2
Data Direction Register
0 x 0000
GPIOA_PER
$3
Peripheral Enable Register
0 x 3FFF
GPIOA_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOA_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOA_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOA_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOA_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOA_PPMODE
$9
Push-Pull Mode Register
0 x 3FFF
GPIOA_RAWDATA
$A
Raw Data Input Register
—
56F8347 Technical Data, Rev.11
64
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-30 GPIOB Registers Address Map
(GPIOB_BASE = $00 F300)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOB_PUR
$0
Pull-up Enable Register
0 x 3FFF
GPIOB_DR
$1
Data Register
0 x 0000
GPIOB_DDR
$2
Data Direction Register
0 x 0000
GPIOB_PER
$3
Peripheral Enable Register
0 x 000F for 20-bit EMI
addresss at reset.
0 x 0000 for all other cases.
See Table 4-4 for details.
GPIOB_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOB_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOB_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOB_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOB_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOB_PPMODE
$9
Push-Pull Mode Register
0 x 3FFF
GPIOB_RAWDATA
$A
Raw Data Input Register
—
Table 4-31 GPIOC Registers Address Map
(GPIOC_BASE = $00 F310)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOC_PUR
$0
Pull-up Enable Register
0 x 07FF
GPIOC_DR
$1
Data Register
0 x 0000
GPIOC_DDR
$2
Data Direction Register
0 x 0000
GPIOC_PER
$3
Peripheral Enable Register
0 x 07FF
GPIOC_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOC_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOC_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOC_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOC_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOC_PPMODE
$9
Push-Pull Mode Register
0 x 07FF
GPIOC_RAWDATA
$A
Raw Data Input Register
—
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
65
Table 4-32 GPIOD Registers Address Map
(GPIOD_BASE = $00 F320)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOD_PUR
$0
Pull-up Enable Register
0 x 1FFF
GPIOD_DR
$1
Data Register
0 x 0000
GPIOD_DDR
$2
Data Direction Register
0 x 0000
GPIOD_PER
$3
Peripheral Enable Register
0 x 1FC0
GPIOD_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOD_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOD_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOD_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOD_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOD_PPMODE
$9
Push-Pull Mode Register
0 x 1FFF
GPIOD_RAWDATA
$A
Raw Data Input Register
—
Table 4-33 GPIOE Registers Address Map
(GPIOE_BASE = $00 F330)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOE_PUR
$0
Pull-up Enable Register
0 x 3FFF
GPIOE_DR
$1
Data Register
0 x 0000
GPIOE_DDR
$2
Data Direction Register
0 x 0000
GPIOE_PER
$3
Peripheral Enable Register
0 x 3FFF
GPIOE_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOE_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOE_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOE_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOE_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOE_PPMODE
$9
Push-Pull Mode Register
0 x 3FFF
GPIOE_RAWDATA
$A
Raw Data Input Register
—
56F8347 Technical Data, Rev.11
66
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-34 GPIOF Registers Address Map
(GPIOF_BASE = $00 F340)
Register Acronym
Address Offset
Register Description
Reset Value
GPIOF_PUR
$0
Pull-up Enable Register
0 x FFFF
GPIOF_DR
$1
Data Register
0 x 0000
GPIOF_DDR
$2
Data Direction Register
0 x 0000
GPIOF_PER
$3
Peripheral Enable Register
0 x FFFF
GPIOF_IAR
$4
Interrupt Assert Register
0 x 0000
GPIOF_IENR
$5
Interrupt Enable Register
0 x 0000
GPIOF_IPOLR
$6
Interrupt Polarity Register
0 x 0000
GPIOF_IPR
$7
Interrupt Pending Register
0 x 0000
GPIOF_IESR
$8
Interrupt Edge-Sensitive Register
0 x 0000
GPIOF_PPMODE
$9
Push-Pull Mode Register
0 x FFFF
GPIOF_RAWDATA
$A
Raw Data Input Register
—
Table 4-35 System Integration Module Registers Address Map
(SIM_BASE = $00 F350)
Register Acronym
Address Offset
Register Description
SIM_CONTROL
$0
Control Register
SIM_RSTSTS
$1
Reset Status Register
SIM_SCR0
$2
Software Control Register 0
SIM_SCR1
$3
Software Control Register 1
SIM_SCR2
$4
Software Control Register 2
SIM_SCR3
$5
Software Control Register 3
SIM_MSH_ID
$6
Most Significant Half JTAG ID
SIM_LSH_ID
$7
Least Significant Half JTAG ID
SIM_PUDR
$8
Pull-up Disable Register
Reserved
SIM_CLKOSR
$A
Clock Out Select Register
SIM_GPS
$B
Quad Decoder 1 / Timer B / SPI 1 Select Register
SIM_PCE
$C
Peripheral Clock Enable Register
SIM_ISALH
$D
I/O Short Address Location High Register
SIM_ISALL
$E
I/O Short Address Location Low Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
67
Table 4-36 Power Supervisor Registers Address Map
(LVI_BASE = $00 F360)
Register Acronym
Address Offset
Register Description
LVI_CONTROL
$0
Control Register
LVI_STATUS
$1
Status Register
Table 4-37 Flash Module Registers Address Map
(FM_BASE = $00 F400)
Register Acronym
Address Offset
Register Description
FMCLKD
$0
Clock Divider Register
FMMCR
$1
Module Control Register
Reserved
FMSECH
$3
Security High Half Register
FMSECL
$4
Security Low Half Register
Reserved
Reserved
FMPROT
$10
Protection Register (Banked)
FMPROTB
$11
Protection Boot Register (Banked)
Reserved
FMUSTAT
$13
User Status Register (Banked)
FMCMD
$14
Command Register (Banked)
Reserved
Reserved
FMOPT 0
$1A
16-Bit Information Option Register 0
Hot temperature ADC reading of Temperature Sensor;
value set during factory test
FMOPT 1
$1B
16-Bit Information Option Register 1
Not used
FMOPT 2
$1C
16-Bit Information Option Register 2
Room temperature ADC reading of Temperature Sensor;
value set during factory test
56F8347 Technical Data, Rev.11
68
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-38 FlexCAN Registers Address Map
(FC_BASE = $00 F800)
FlexCAN is NOT available in the 56F8147 device
Register Acronym
FCMCR
Address Offset
$0
Register Description
Module Configuration Register
Reserved
FCCTL0
$3
Control Register 0 Register
FCCTL1
$4
Control Register 1 Register
FCTMR
$5
Free-Running Timer Register
FCMAXMB
$6
Maximum Message Buffer Configuration Register
Reserved
FCRXGMASK_H
$8
Receive Global Mask High Register
FCRXGMASK_L
$9
Receive Global Mask Low Register
FCRX14MASK_H
$A
Receive Buffer 14 Mask High Register
FCRX14MASK_L
$B
Receive Buffer 14 Mask Low Register
FCRX15MASK_H
$C
Receive Buffer 15 Mask High Register
FCRX15MASK_L
$D
Receive Buffer 15 Mask Low Register
Reserved
FCSTATUS
$10
Error and Status Register
FCIMASK1
$11
Interrupt Masks 1 Register
FCIFLAG1
$12
Interrupt Flags 1 Register
FCR/T_ERROR_CNTRS
$13
Receive and Transmit Error Counters Register
Reserved
Reserved
Reserved
FCMB0_CONTROL
$40
Message Buffer 0 Control / Status Register
FCMB0_ID_HIGH
$41
Message Buffer 0 ID High Register
FCMB0_ID_LOW
$42
Message Buffer 0 ID Low Register
FCMB0_DATA
$43
Message Buffer 0 Data Register
FCMB0_DATA
$44
Message Buffer 0 Data Register
FCMB0_DATA
$45
Message Buffer 0 Data Register
FCMB0_DATA
$46
Message Buffer 0 Data Register
Reserved
FCMSB1_CONTROL
$48
Message Buffer 1 Control / Status Register
FCMSB1_ID_HIGH
$49
Message Buffer 1 ID High Register
FCMSB1_ID_LOW
$4A
Message Buffer 1 ID Low Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
69
Table 4-38 FlexCAN Registers Address Map (Continued)
(FC_BASE = $00 F800)
FlexCAN is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
FCMB1_DATA
$4B
Message Buffer 1 Data Register
FCMB1_DATA
$4C
Message Buffer 1 Data Register
FCMB1_DATA
$4D
Message Buffer 1 Data Register
FCMB1_DATA
$4E
Message Buffer 1 Data Register
Reserved
FCMB2_CONTROL
$50
Message Buffer 2 Contro l /Status Register
FCMB2_ID_HIGH
$51
Message Buffer 2 ID High Register
FCMB2_ID_LOW
$52
Message Buffer 2 ID Low Register
FCMB2_DATA
$53
Message Buffer 2 Data Register
FCMB2_DATA
$54
Message Buffer 2 Data Register
FCMB2_DATA
$55
Message Buffer 2 Data Register
FCMB2_DATA
$56
Message Buffer 2 Data Register
Reserved
FCMB3_CONTROL
$58
Message Buffer 3 Control / Status Register
FCMB3_ID_HIGH
$59
Message Buffer 3 ID High Register
FCMB3_ID_LOW
$5A
Message Buffer 3 ID Low Register
FCMB3_DATA
$5B
Message Buffer 3 Data Register
FCMB3_DATA
$5C
Message Buffer 3 Data Register
FCMB3_DATA
$5D
Message Buffer 3 Data Register
FCMB3_DATA
$5E
Message Buffer 3 Data Register
Reserved
FCMB4_CONTROL
$60
Message Buffer 4 Control / Status Register
FCMB4_ID_HIGH
$61
Message Buffer 4 ID High Register
FCMB4_ID_LOW
$62
Message Buffer 4 ID Low Register
FCMB4_DATA
$63
Message Buffer 4 Data Register
FCMB4_DATA
$64
Message Buffer 4 Data Register
FCMB4_DATA
$65
Message Buffer 4 Data Register
FCMB4_DATA
$66
Message Buffer 4 Data Register
Reserved
FCMB5_CONTROL
$68
Message Buffer 5 Control / Status Register
FCMB5_ID_HIGH
$69
Message Buffer 5 ID High Register
FCMB5_ID_LOW
$6A
Message Buffer 5 ID Low Register
56F8347 Technical Data, Rev.11
70
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-38 FlexCAN Registers Address Map (Continued)
(FC_BASE = $00 F800)
FlexCAN is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
FCMB5_DATA
$6B
Message Buffer 5 Data Register
FCMB5_DATA
$6C
Message Buffer 5 Data Register
FCMB5_DATA
$6D
Message Buffer 5 Data Register
FCMB5_DATA
$6E
Message Buffer 5 Data Register
Reserved
FCMB6_CONTROL
$70
Message Buffer 6 Control / Status Register
FCMB6_ID_HIGH
$71
Message Buffer 6 ID High Register
FCMB6_ID_LOW
$72
Message Buffer 6 ID Low Register
FCMB6_DATA
$73
Message Buffer 6 Data Register
FCMB6_DATA
$74
Message Buffer 6 Data Register
FCMB6_DATA
$75
Message Buffer 6 Data Register
FCMB6_DATA
$76
Message Buffer 6 Data Register
Reserved
FCMB7_CONTROL
$78
Message Buffer 7 Control / Status Register
FCMB7_ID_HIGH
$79
Message Buffer 7 ID High Register
FCMB7_ID_LOW
$7A
Message Buffer 7 ID Low Register
FCMB7_DATA
$7B
Message Buffer 7 Data Register
FCMB7_DATA
$7C
Message Buffer 7 Data Register
FCMB7_DATA
$7D
Message Buffer 7 Data Register
FCMB7_DATA
$7E
Message Buffer 7 Data Register
Reserved
FCMB8_CONTROL
$80
Message Buffer 8 Control / Status Register
FCMB8_ID_HIGH
$81
Message Buffer 8 ID High Register
FCMB8_ID_LOW
$82
Message Buffer 8 ID Low Register
FCMB8_DATA
$83
Message Buffer 8 Data Register
FCMB8_DATA
$84
Message Buffer 8 Data Register
FCMB8_DATA
$85
Message Buffer 8 Data Register
FCMB8_DATA
$86
Message Buffer 8 Data Register
Reserved
FCMB9_CONTROL
$88
Message Buffer 9 Control / Status Register
FCMB9_ID_HIGH
$89
Message Buffer 9 ID High Register
FCMB9_ID_LOW
$8A
Message Buffer 9 ID Low Register
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
71
Table 4-38 FlexCAN Registers Address Map (Continued)
(FC_BASE = $00 F800)
FlexCAN is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
FCMB9_DATA
$8B
Message Buffer 9 Data Register
FCMB9_DATA
$8C
Message Buffer 9 Data Register
FCMB9_DATA
$8D
Message Buffer 9 Data Register
FCMB9_DATA
$8E
Message Buffer 9 Data Register
Reserved
FCMB10_CONTROL
$90
Message Buffer 10 Control / Status Register
FCMB10_ID_HIGH
$91
Message Buffer 10 ID High Register
FCMB10_ID_LOW
$92
Message Buffer 10 ID Low Register
FCMB10_DATA
$93
Message Buffer 10 Data Register
FCMB10_DATA
$94
Message Buffer 10 Data Register
FCMB10_DATA
$95
Message Buffer 10 Data Register
FCMB10_DATA
$96
Message Buffer 10 Data Register
Reserved
FCMB11_CONTROL
$98
Message Buffer 11 Control / Status Register
FCMB11_ID_HIGH
$99
Message Buffer 11 ID High Register
FCMB11_ID_LOW
$9A
Message Buffer 11 ID Low Register
FCMB11_DATA
$9B
Message Buffer 11 Data Register
FCMB11_DATA
$9C
Message Buffer 11 Data Register
FCMB11_DATA
$9D
Message Buffer 11 Data Register
FCMB11_DATA
$9E
Message Buffer 11 Data Register
Reserved
FCMB12_CONTROL
$A0
Message Buffer 12 Control / Status Register
FCMB12_ID_HIGH
$A1
Message Buffer 12 ID High Register
FCMB12_ID_LOW
$A2
Message Buffer 12 ID Low Register
FCMB12_DATA
$A3
Message Buffer 12 Data Register
FCMB12_DATA
$A4
Message Buffer 12 Data Register
FCMB12_DATA
$A5
Message Buffer 12 Data Register
FCMB12_DATA
$A6
Message Buffer 12 Data Register
Reserved
FCMB13_CONTROL
$A8
Message Buffer 13 Control / Status Register
FCMB13_ID_HIGH
$A9
Message Buffer 13 ID High Register
FCMB13_ID_LOW
$AA
Message Buffer 13 ID Low Register
56F8347 Technical Data, Rev.11
72
Freescale Semiconductor
Preliminary
Factory Programmed Memory
Table 4-38 FlexCAN Registers Address Map (Continued)
(FC_BASE = $00 F800)
FlexCAN is NOT available in the 56F8147 device
Register Acronym
Address Offset
Register Description
FCMB13_DATA
$AB
Message Buffer 13 Data Register
FCMB13_DATA
$AC
Message Buffer 13 Data Register
FCMB13_DATA
$AD
Message Buffer 13 Data Register
FCMB13_DATA
$AE
Message Buffer 13 Data Register
Reserved
FCMB14_CONTROL
$B0
Message Buffer 14 Control / Status Register
FCMB14_ID_HIGH
$B1
Message Buffer 14 ID High Register
FCMB14_ID_LOW
$B2
Message Buffer 14 ID Low Register
FCMB14_DATA
$B3
Message Buffer 14 Data Register
FCMB14_DATA
$B4
Message Buffer 14 Data Register
FCMB14_DATA
$B5
Message Buffer 14 Data Register
FCMB14_DATA
$B6
Message Buffer 14 Data Register
Reserved
FCMB15_CONTROL
$B8
Message Buffer 15 Control / Status Register
FCMB15_ID_HIGH
$B9
Message Buffer 15 ID High Register
FCMB15_ID_LOW
$BA
Message Buffer 15 ID Low Register
FCMB15_DATA
$BB
Message Buffer 15 Data Register
FCMB15_DATA
$BC
Message Buffer 15 Data Register
FCMB15_DATA
$BD
Message Buffer 15 Data Register
FCMB15_DATA
$BE
Message Buffer 15 Data Register
Reserved
4.8 Factory Programmed Memory
The Boot Flash memory block is programmed during manufacturing with a default Serial Bootloader
program. The Serial Bootloader application can be used to load a user application into the Program and
Data Flash (NOT available in the 56F8147 device) memories of the device. The 56F83xx SCI/CAN
Bootloader User Manual (MC56F83xxBLUM) provides detailed information on this firmware. An
application note, Production Flash Programming (AN1973), details how the Serial Bootloader program
can be used to perform production Flash programming of the on-board Flash memories as well as other
potential methods.
Like all the Flash memory blocks, the Boot Flash can be erased and programmed by the user. The Serial
Bootloader application is programmed as an aid to the end user, but is not required to be used or maintained
in the Boot Flash memory.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
73
Part 5 Interrupt Controller (ITCN)
5.1 Introduction
The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to
signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in
order to service this interrupt.
5.2 Features
The ITCN module design includes these distinctive features:
•
•
•
•
Programmable priority levels for each IRQ
Two programmable Fast Interrupts
Notification to SIM module to restart clocks out of Wait and Stop modes
Drives initial address on the address bus after reset
For further information, see Table 4-5, Interrupt Vector Table Contents.
5.3 Functional Description
The Interrupt Controller is a slave on the IPBus. It contains registers allowing each of the 82 interrupt
sources to be set to one of four priority levels, excluding certain interrupts of fixed priority. Next, all of
the interrupt requests of a given level are priority encoded to determine the lowest numerical value of the
active interrupt requests for that level. Within a given priority level, zero is the highest priority, while
number 81 is the lowest.
5.3.1
Normal Interrupt Handling
Once the ITCN has determined that an interrupt is to be serviced and which interrupt has the highest
priority, an interrupt vector address is generated. Normal interrupt handling concatenates the VBA and the
vector number to determine the vector address. In this way, an offset is generated into the vector table for
each interrupt.
5.3.2
Interrupt Nesting
Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be
serviced. The following tables define the nesting requirements for each priority level.
Table 5-1 Interrupt Mask Bit Definition
SR[9]1
SR[8]1
0
0
Priorities 0, 1, 2, 3
None
0
1
Priorities 1, 2, 3
Priority 0
1
0
Priorities 2, 3
Priorities 0, 1
1
1
Priority 3
Priorities 0, 1, 2
Permitted Exceptions
Masked Exceptions
1. Core status register bits indicating current interrupt mask within the core.
56F8347 Technical Data, Rev.11
74
Freescale Semiconductor
Preliminary
Functional Description
Table 5-2. Interrupt Priority Encoding
IPIC_LEVEL[1:0]1
Current Interrupt Priority
Level
Required Nested
Exception Priority
00
No Interrupt or SWILP
Priorities 0, 1, 2, 3
01
Priority 0
Priorities 1, 2, 3
01
Priority 1
Priorities 2, 3
11
Priorities 2 or 3
Priority 3
1. See IPIC field definition in Part 5.6.30.2
5.3.3
Fast Interrupt Handling
Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes
fast interrupts before the core does.
A fast interrupt is defined (to the ITCN) by:
1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers
2. Setting the FIMn register to the appropriate vector number
3. Setting the FIVALn and FIVAHn registers with the address of the code for the fast interrupt
When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a
match occurs, and it is a level 2 interrupt, the ITCN handles it as a fast interrupt. The ITCN takes the vector
address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an
offset from the VBA.
The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts
its fast interrupt handling.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
75
5.4 Block Diagram
any0
Priority
Level
INT1
Level 0
82 -> 7
Priority
Encoder
2 -> 4
Decode
7
INT
VAB
CONTROL
IPIC
any3
Level 3
Priority
Level
INT82
82 -> 7
Priority
Encoder
7
IACK
SR[9:8]
PIC_EN
2 -> 4
Decode
Figure 5-1 Interrupt Controller Block Diagram
5.5 Operating Modes
The ITCN module design contains two major modes of operation:
•
Functional Mode
The ITCN is in this mode by default.
•
Wait and Stop Modes
During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal
a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ
can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode. Also, the IRQA
and IRQB signals automatically become low-level sensitive in these modes even if the control register bits
are set to make them falling-edge sensitive. This is because there is no clock available to detect the falling
edge.
A peripheral which requires a clock to generate interrupts will not be able to generate interrupts during Stop
mode. The FlexCAN module can wake the device from Stop mode, and a reset will do just that, or IRQA
and IRQB can wake it up.
56F8347 Technical Data, Rev.11
76
Freescale Semiconductor
Preliminary
Register Descriptions
5.6 Register Descriptions
A register address is the sum of a base address and an address offset. The base address is defined at the
system level and the address offset is defined at the module level. The ITCN peripheral has 24 registers.
Table 5-3 ITCN Register Summary
(ITCN_BASE = $00 F1A0)
Register
Acronym
Base Address +
Register Name
Section Location
IPR0
$0
Interrupt Priority Register 0
5.6.1
IPR1
$1
Interrupt Priority Register 1
5.6.2
IPR2
$2
Interrupt Priority Register 2
5.6.3
IPR3
$3
Interrupt Priority Register 3
5.6.4
IPR4
$4
Interrupt Priority Register 4
5.6.5
IPR5
$5
Interrupt Priority Register 5
5.6.6
IPR6
$6
Interrupt Priority Register 6
5.6.7
IPR7
$7
Interrupt Priority Register 7
5.6.8
IPR8
$8
Interrupt Priority Register 8
5.6.9
IPR9
$9
Interrupt Priority Register 9
5.6.10
VBA
$A
Vector Base Address Register
5.6.11
FIM0
$B
Fast Interrupt 0 Match Register
5.6.12
FIVAL0
$C
Fast Interrupt 0 Vector Address Low Register
5.6.13
FIVAH0
$D
Fast Interrupt 0 Vector Address High Register
5.6.14
FIM1
$E
Fast Interrupt 1 Match Register
5.6.15
FIVAL1
$F
Fast Interrupt 1 Vector Address Low Register
5.6.16
FIVAH1
$10
Fast Interrupt 1 Vector Address High Register
5.6.17
IRQP0
$11
IRQ Pending Register 0
5.6.18
IRQP1
$12
IRQ Pending Register 1
5.6.19
IRQP2
$13
IRQ Pending Register 2
5.6.20
IRQP3
$14
IRQ Pending Register 3
5.6.21
IRQP4
$15
IRQ Pending Register 4
5.6.22
IRQP5
$16
IRQ Pending Register 5
5.6.23
Reserved
ICTL
$1D
Interrupt Control Register
5.6.30
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
77
Add. Register
Offset Name
$0
IPR0
$1
IPR1
$2
IPR2
$3
IPR3
$4
IPR4
$5
IPR5
$6
IPR6
$7
IPR7
$8
IPR8
$9
IPR9
$A
VBA
$B
VBA0
$C
FIVAL0
$D
FIVAH0
$E
FIM1
$F
FIVAL1
$10
FIVAH1
$11
IRQP0
$12
IRQP1
$13
IRQP2
$14
IRQP3
$15
IRQP4
$16
IRQP5
R
W
R
W
R
15
14
0
0
0
0
13
12
BKPT_U0 IPL
0
FMCBE IPL
0
FMCC IPL
W
R
GPIOD
GPIOE
IPL
IPL
W
R
SPI0_RCV IPL SPI1_XMIT IPL
W
R
DEC1_XIRQ IPL DEC1_HIRQ IPL
W
R
W
R
W
R
10
STPCNT IPL
0
0
FMERR IPL
GPIOF
IPL
SPI1_RCV
IPL
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LOCK IPL
FCMSGBUF IPL
0
0
SCI1_RCV
IPL
SCI1_RERR IPL
RX_REG IPL
0
LVI IPL
FCWKUP IPL
0
0
0
0
0
TX_REG IPL
IRQB IPL
TRBUF IPL
IRQA IPL
0
0
FCERR IPL
FCBOFF IPL
GPIOA
IPL
GPIOB
IPL
GPIOC
IPL
SCI1_TIDL IPL
SCI1_XMIT IPL
SPI0_XMIT IPL
0
0
TMRC0 IPL
TMRD3 IPL
TMRD2 IPL
TMRD1 IPL
TMRD0 IPL
TMRA0 IPL
TMRB3 IPL
TMRB2 IPL
TMRB1 IPL
TMRB0 IPL
TMRC3 IPL
TMRC2 IPL
TMRC1 IPL
SCI0_TIDL IPL
SCI0_XMIT IPL
TMRA3 IPL
TMRA2 IPL
TMRA1 IPL
PWMB_RL IPL
ADCA_ZC IPL
ABCB_ZC IPL
ADCA_CC IPL
ADCB_CC IPL
R
SCI0_RCV IPL SCI0_RERR IPL
W
R
PWMA F IPL
PWMB F IPL
W
0
0
0
R
W
0
0
0
0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
11
0
0
PWMA_RL
IPL
DEC0_XIRQ IPL DEC0_HIRQ IPL
VECTOR BASE ADDRESS
0
0
0
0
0
FAST INTERRUPT 0
FAST INTERRUPT 0
VECTOR ADDRESS LOW
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 0
VECTOR ADDRESS HIGH
FAST INTERRUPT 1
FAST INTERRUPT 1
VECTOR ADDRESS LOW
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 1
VECTOR ADDRESS HIGH
PENDING [16:2]
1
PENDING [32:17]
PENDING [48:33]
PENDING [64:49]
PENDING [80:65]
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IRQB
STATE
IRQA
STATE
1
PENDING
[81]
IRQB
EDG
IRQA
EDG
W
Reserved
$1D
ICTL
R
INT
IPIC
VAB
INT_DIS
W
= Reserved
Figure 5-2 ITCN Register Map Summary
56F8347 Technical Data, Rev.11
78
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.1
Interrupt Priority Register 0 (IPR0)
Base + $0
15
14
Read
0
0
0
0
13
BKPT_U0 IPL
Write
RESET
12
0
11
10
STPCNT IPL
0
0
0
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 5-3 Interrupt Priority Register 0 (IPR0)
5.6.1.1
Reserved—Bits 15–14
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.1.2
EOnCE Breakpoint Unit 0 Interrupt Priority Level (BKPT_U0 IPL)—
Bits13–12
This field is used to set the interrupt priority levels for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.3
EOnCE Step Counter Interrupt Priority Level (STPCNT IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.4
Reserved—Bits 9–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.2
Interrupt Priority Register 1 (IPR1)
Base + $1
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
5
4
RX_REG IPL
0
0
3
2
TX_REG IPL
0
0
1
0
TRBUF IPL
0
0
Figure 5-4 Interrupt Priority Register 1 (IPR1)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
79
5.6.2.1
Reserved—Bits 15–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.2.2
EOnCE Receive Register Full Interrupt Priority Level
(RX_REG IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.2.3
EOnCE Transmit Register Empty Interrupt Priority Level
(TX_REG IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.2.4
EOnCE Trace Buffer Interrupt Priority Level (TRBUF IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.3
Interrupt Priority Register 2 (IPR2)
Base + $2
Read
Write
RESET
15
14
13
FMCBE IPL
0
0
12
FMCC IPL
0
0
11
10
FMERR IPL
0
0
9
8
LOCK IPL
0
0
7
6
LVI IPL
0
0
5
4
0
0
0
0
3
2
1
0
IRQB IPL
IRQA IPL
0
0
0
0
Figure 5-5 Interrupt Priority Register 2 (IPR2)
56F8347 Technical Data, Rev.11
80
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.3.1
Flash Memory Command, Data, Address Buffers Empty Interrupt
Priority Level (FMCBE IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.2
Flash Memory Command Complete Priority Level (FMCC IPL)—
Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.3
Flash Memory Error Interrupt Priority Level (FMERR IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.4
PLL Loss of Lock Interrupt Priority Level (LOCK IPL)—Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.5
Low Voltage Detector Interrupt Priority Level (LVI IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
81
5.6.3.6
Reserved—Bits 5–4
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.3.7
External IRQ B Interrupt Priority Level (IRQB IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.8
External IRQ A Interrupt Priority Level (IRQA IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4
Interrupt Priority Register 3 (IPR3)
Base + $3
Read
Write
RESET
15
14
13
12
11
10
GPIOD
IPL
GPIOE
IPL
GPIOF
IPL
0
0
0
0
0
0
9
8
FCMSGBUF IPL
0
0
7
6
FCWKUP IPL
0
0
5
4
FCERR IPL
0
0
3
2
FCBOFF IPL
0
0
1
0
0
0
0
0
Figure 5-6 Interrupt Priority Register 3 (IPR3)
5.6.4.1
GPIOD Interrupt Priority Level (GPIOD IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
82
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.4.2
GPIOE Interrupt Priority Level (GPIOE IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.3
GPIOF Interrupt Priority Level (GPIOF IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.4
FlexCAN Message Buffer Interrupt Priority Level (FCMSGBUF IPL)—
Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.5
FlexCAN Wake Up Interrupt Priority Level (FCWKUP IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.6
FlexCAN Error Interrupt Priority Level (FCERR IPL)— Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
83
5.6.4.7
FlexCAN Bus Off Interrupt Priority Level (FCBOFF IPL)— Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.8
Reserved—Bits 1–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.5
Interrupt Priority Register 4 (IPR4)
Base + $4
Read
15
14
SPI0_RCV
IPL
Write
RESET
0
0
13
12
SPI1_XMIT
IPL
0
0
11
10
9
8
7
6
SPI1_RCV
IPL
0
0
0
0
0
0
0
0
0
0
5
4
GPIOA
IPL
0
0
3
2
1
GPIOB
IPL
0
0
0
GPIOC
IPL
0
0
Figure 5-7 Interrupt Priority Register 4 (IPR4)
5.6.5.1
SPI0 Receiver Full Interrupt Priority Level (SPI0_RCV IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.2
SPI1 Transmit Empty Interrupt Priority Level (SPI1_XMIT IPL)—
Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
84
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.5.3
SPI1 Receiver Full Interrupt Priority Level (SPI1_RCV IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.4
Reserved—Bits 9–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.5.5
GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.6
GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.7
GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
85
5.6.6
Interrupt Priority Register 5 (IPR5)
Base + $5
Read
15
14
13
DEC1_XIRQ
IPL
Write
RESET
0
0
12
DEC1_HIRQ
IPL
0
0
11
10
SCI1_RCV
IPL
0
0
9
8
SCI1_RERR
IPL
0
0
7
6
0
0
0
0
5
4
SCI1_TIDL
IPL
0
0
3
2
SCI1_XMIT
IPL
0
0
1
0
SPI0_XMIT
IPL
0
0
Figure 5-8 Interrupt Priority Register 5 (IPR5)
5.6.6.1
Quadrature Decoder 1 INDEX Pulse Interrupt Priority Level
(DEC1_XIRQ IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.2
Quadrature Decoder 1 HOME Signal Transition or Watchdog Timer
Interrupt Priority Level (DEC1_HIRQ IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.3
SCI 1 Receiver Full Interrupt Priority Level (SCI1_RCV IPL)—
Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
86
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.6.4
SCI 1 Receiver Error Interrupt Priority Level (SCI1_RERR IPL)—
Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.5
Reserved—Bits 7–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.6.6
SCI 1 Transmitter Idle Interrupt Priority Level (SCI1_TIDL IPL)—
Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.7
SCI 1 Transmitter Empty Interrupt Priority Level (SCI1_XMIT IPL)—
Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.8
SPI 0 Transmitter Empty Interrupt Priority Level (SPI0_XMIT IPL)—
Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
87
5.6.7
Interrupt Priority Register 6 (IPR6)
Base + $6
Read
15
14
13
TMRC0 IPL
Write
RESET
0
0
12
TMRD3 IPL
0
0
11
10
TMRD2 IPL
0
0
9
8
TMRD1 IPL
0
0
7
6
TMRD0 IPL
0
0
5
4
0
0
0
0
3
2
DEC0_XIRQ
IPL
0
0
1
0
DEC0_HIRQ
IPL
0
0
Figure 5-9 Interrupt Priority Register 6 (IPR6)
5.6.7.1
Timer C, Channel 0 Interrupt Priority Level (TMRC0 IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.2
Timer D, Channel 3 Interrupt Priority Level (TMRD3 IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.3
Timer D, Channel 2 Interrupt Priority Level (TMRD2 IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.4
Timer D, Channel 1 Interrupt Priority Level (TMRD1 IPL)—Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
88
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.7.5
Timer D, Channel 0 Interrupt Priority Level (TMRD0 IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.6
Reserved—Bits 5–4
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.7.7
Quadrature Decoder 0, INDEX Pulse Interrupt Priority Level
(DEC0_XIRQ IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.8
Quadrature Decoder 0, HOME Signal Transition or Watchdog Timer
Interrupt Priority Level (DEC0_HIRQ IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8
Interrupt Priority Register 7 (IPR7)
Base + $7
Read
Write
RESET
15
14
TMRA0 IPL
0
0
13
12
TMRB3 IPL
0
0
11
10
TMRB2 IPL
0
0
9
8
TMRB1 IPL
0
0
7
6
TMRB0 IPL
0
0
5
4
TMRC3 IPL
0
0
3
2
TMRC2 IPL
0
0
1
0
TMRC1 IPL
0
0
Figure 5-10 Interrupt Priority Register (IPR7)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
89
5.6.8.1
Timer A, Channel 0 Interrupt Priority Level (TMRA0 IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.2
Timer B, Channel 3 Interrupt Priority Level (TMRB3 IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.3
Timer B, Channel 2 Interrupt Priority Level (TMRB2 IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.4
Timer B, Channel 1 Interrupt Priority Level (TMRB1 IPL)—Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.5
Timer B, Channel 0 Interrupt Priority Level (TMRB0 IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
90
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.8.6
Timer C, Channel 3 Interrupt Priority Level (TMRC3 IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.7
Timer C, Channel 2 Interrupt Priority Level (TMRC2 IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.8.8
Timer C, Channel 1 Interrupt Priority Level (TMRC1 IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.9
Interrupt Priority Register 8 (IPR8)
Base + $8
Read
15
14
SCI0_RCV
IPL
Write
RESET
0
0
13
12
SCI0_RERR
IPL
0
0
11
10
0
0
0
0
9
8
SCI0_TIDL
IPL
0
0
7
6
SCI0_XMIT
IPL
0
0
5
4
TMRA3 IPL
0
0
3
2
TMRA2 IPL
0
0
1
0
TMRA1 IPL
0
0
Figure 5-11 Interrupt Priority Register 8 (IPR8)
5.6.9.1
SCI0 Receiver Full Interrupt Priority Level (SCI0_RCV IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
91
5.6.9.2
SCI0 Receiver Error Interrupt Priority Level (SCI0_RERR IPL)—
Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.9.3
Reserved—Bits 11–10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.9.4
SCI0 Transmitter Idle Interrupt Priority Level (SCI0_TIDL IPL)—
Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.9.5
SCI0 Transmitter Empty Interrupt Priority Level (SCI0_XMIT IPL)—
Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.9.6
Timer A, Channel 3 Interrupt Priority Level (TMRA3 IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
92
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.9.7
Timer A, Channel 2 Interrupt Priority Level (TMRA2 IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.9.8
Timer A, Channel 1 Interrupt Priority Level (TMRA1 IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10
Interrupt Priority Register 9 (IPR9)
Base + $9
Read
15
14
PWMA_F IPL
Write
RESET
0
0
13
12
PWMB_F IPL
0
0
11
10
PWMA_RL
IPL
0
0
9
8
PWM_RL IPL
0
0
7
6
5
4
ADCA_ZC IPL ABCB_ZC IPL
0
0
0
0
3
2
ADCA_CC
IPL
0
0
1
0
ADCB_CC
IPL
0
0
Figure 5-12 Interrupt Priority Register 9 (IPR9)
5.6.10.1
PWM A Fault Interrupt Priority Level (PWMA_F IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10.2
PWM B Fault Interrupt Priority Level (PWMB_F IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
93
5.6.10.3
Reload PWM A Interrupt Priority Level (PWMA_RL IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10.4
Reload PWM B Interrupt Priority Level (PWMB_RL IPL)—Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10.5
ADC A Zero Crossing or Limit Error Interrupt Priority Level
(ADCA_ZC IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10.6
ADC B Zero Crossing or Limit Error Interrupt Priority Level
(ADCB_ZC IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8347 Technical Data, Rev.11
94
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.10.7
ADC A Conversion Complete Interrupt Priority Level
(ADCA_CC IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.10.8
ADC B Conversion Complete Interrupt Priority Level
(ADCB_CC IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.11
Vector Base Address Register (VBA)
Base + $A
15
14
13
Read
0
0
0
0
0
0
12
11
10
9
8
6
5
4
3
2
1
0
0
0
0
0
0
VECTOR BASE ADDRESS
Write
RESET
7
0
0
0
0
0
0
0
0
Figure 5-13 Vector Base Address Register (VBA)
5.6.11.1
Reserved—Bits 15–13
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.11.2
Interrupt Vector Base Address (VECTOR BASE ADDRESS)—Bits 12–0
The contents of this register determine the location of the Vector Address Table. The value in this register
is used as the upper 13 bits of the interrupt Vector Address Bus (VAB[20:0]). The lower eight bits are
determined based upon the highest-priority interrupt. They are then appended onto VBA before presenting
the full VAB to the 56800E core; see Part 5.3.1 for details.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
95
5.6.12
Fast Interrupt 0 Match Register (FIM0)
Base + $B
15
14
13
12
11
10
9
8
7
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
5
3
2
1
0
0
0
FAST INTERRUPT 0
Write
RESET
4
0
0
0
0
0
Figure 5-14 Fast Interrupt 0 Match Register (FIM0)
5.6.12.1
Reserved—Bits 15–7
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.12.2
Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 6–0
This value determines which IRQ will be a Fast Interrupt 0. Fast interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first; see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will
occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the
highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared
as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each
IRQ, refer to Table 4-5.
5.6.13
Fast Interrupt 0 Vector Address Low Register (FIVAL0)
Base + $C
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
FAST INTERRUPT 0
VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
Figure 5-15 Fast Interrupt 0 Vector Address Low Register (FIVAL0)
5.6.13.1
Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15–0
The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.14
Fast Interrupt 0 Vector Address High Register (FIVAH0)
Base + $D
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 0
VECTOR ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-16 Fast Interrupt 0 Vector Address High Register (FIVAH0)
5.6.14.1
Reserved—Bits 15–5
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
56F8347 Technical Data, Rev.11
96
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.14.2
Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0
The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.15
Fast Interrupt 1 Match Register (FIM1)
Base + $E
15
14
13
12
11
10
9
8
7
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
5
3
2
1
0
0
0
FAST INTERRUPT 1
Write
RESET
4
0
0
0
0
0
Figure 5-17 Fast Interrupt 1 Match Register (FIM1)
5.6.15.1
Reserved—Bits 15–7
This bit field is reserved or not implemented. It is read as 0, but cannot be modified by writing.
5.6.15.2
Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 6–0
This value determines which IRQ will be a Fast Interrupt 1. Fast interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first; see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will
occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the
highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared
as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each
IRQ, refer to Table 4-5.
5.6.16
Fast Interrupt 1 Vector Address Low Register (FIVAL1)
Base + $F
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
FAST INTERRUPT 1
VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
Figure 5-18 Fast Interrupt 1 Vector Address Low Register (FIVAL1)
5.6.16.1
Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0
The lower 16 bits of vector address are used for Fast Interrupt 1. This register is combined with FIVAH1
to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.17
Fast Interrupt 1 Vector Address High Register (FIVAH1)
Base + $10
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 1
VECTOR ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-19 Fast Interrupt 1 Vector Address High Register (FIVAH1)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
97
5.6.17.1
Reserved—Bits 15–5
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.17.2
Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0
The upper five bits of the vector address are used for Fast Interrupt 1. This register is combined with
FIVAL1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.18
IRQ Pending 0 Register (IRQP0)
Base + $11
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
PENDING [16:2]
0
1
Write
RESET
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Figure 5-20 IRQ Pending 0 Register (IRQP0)
5.6.18.1
IRQ Pending (PENDING)—Bits 16–2
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.18.2
Reserved—Bit 0
This bit is reserved or not implemented. It is read as 1 and cannot be modified by writing.
5.6.19
IRQ Pending 1 Register (IRQP1)
$Base + $12
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING [32:17]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-21 IRQ Pending 1 Register (IRQP1)
5.6.19.1
IRQ Pending (PENDING)—Bits 32–17
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
56F8347 Technical Data, Rev.11
98
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.20
IRQ Pending 2 Register (IRQP2)
Base + $13
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING [48:33]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-22 IRQ Pending 2 Register (IRQP2)
5.6.20.1
IRQ Pending (PENDING)—Bits 48–33
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.21
IRQ Pending 3 Register (IRQP3)
Base + $14
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING [64:49]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-23 IRQ Pending 3 Register (IRQP3)
5.6.21.1
IRQ Pending (PENDING)—Bits 64–49
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.22
IRQ Pending 4 Register (IRQP4)
Base + $15
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING [80:65]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-24 IRQ Pending 4 Register (IRQP4)
5.6.22.1
IRQ Pending (PENDING)—Bits 80–65
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
99
5.6.23
IRQ Pending 5 Register (IRQP5)
Base + $16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
PENDING
[81]
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Write
RESET
Figure 5-25 IRQ Pending Register 5 (IRQP5)
5.6.23.1
Reserved—Bits 96–82
This bit field is reserved or not implemented. The bits are read as 1 and cannot be modified by writing.
5.6.23.2
IRQ Pending (PENDING)—Bit 81
This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2
through 81.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.24
Reserved—Base + 17
5.6.25
Reserved—Base + 18
5.6.26
Reserved—Base + 19
5.6.27
Reserved—Base + 1A
5.6.28
Reserved—Base + 1B
5.6.29
Reserved—Base + 1C
5.6.30
ITCN Control Register (ICTL)
Base + $1D
15
Read
INT
14
13
12 11 10
IPIC
9
8
7
6
VAB
INT_DIS
Write
RESET
0
0
0
1
0
0
0
5
0
0
0
0
4
3
2
1
0
1
IRQB STATE
IRQA STATE
IRQB
EDG
IRQA
EDG
1
1
1
0
0
Figure 5-26 ITCN Control Register (ICTL)
5.6.30.1
Interrupt (INT)—Bit 15
This read-only bit reflects the state of the interrupt to the 56800E core.
•
•
0 = No interrupt is being sent to the 56800E core
1 = An interrupt is being sent to the 56800E core
56F8347 Technical Data, Rev.11
100
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.30.2
Interrupt Priority Level (IPIC)—Bits 14–13
These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E
core at the time the last IRQ was taken. This field is only updated when the 56800E core jumps to a new
interrupt service routine.
Note:
•
•
•
•
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
00 = Required nested exception priority levels are 0, 1, 2, or 3
01 = Required nested exception priority levels are 1, 2, or 3
10 = Required nested exception priority levels are 2 or 3
11 = Required nested exception priority level is 3
5.6.30.3
Vector Number - Vector Address Bus (VAB)—Bits 12–6
This read-only field shows the vector number (VAB[7:1]) used at the time the last IRQ was taken. This
field is only updated when the 56800E core jumps to a new interrupt service routine.
Note:
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
5.6.30.4
Interrupt Disable (INT_DIS)—Bit 5
This bit allows all interrupts to be disabled.
•
•
0 = Normal operation (default)
1 = All interrupts disabled
5.6.30.5
Reserved—Bit 4
This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing.
5.6.30.6
IRQB State Pin (IRQB STATE)—Bit 3
This read-only bit reflects the state of the external IRQB pin.
5.6.30.7
IRQA State Pin (IRQA STATE)—Bit 2
This read-only bit reflects the state of the external IRQA pin.
5.6.30.8
IRQB Edge Pin (IRQB Edg)—Bit 1
This bit controls whether the external IRQB interrupt is edge- or level-sensitive. During Stop and Wait
modes, it is automatically level-sensitive.
•
•
0 = IRQB interrupt is a low-level sensitive (default)
1 = IRQB interrupt is falling-edge sensitive
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
101
5.6.30.9
IRQA Edge Pin (IRQA Edg)—Bit 0
This bit controls whether the external IRQA interrupt is edge- or level-sensitive. During Stop and Wait
modes, it is automatically level-sensitive.
•
•
0 = IRQA interrupt is a low-level sensitive (default)
1 = IRQA interrupt is falling-edge sensitive
5.7 Resets
5.7.1
Reset Handshake Timing
The ITCN provides the 56800E core with a reset vector address whenever RESET is asserted. The reset
vector will be presented until the second rising clock edge after RESET is released.
5.7.2
ITCN After Reset
After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled,
except the core IRQs with fixed priorities:
•
•
•
•
•
•
•
•
Illegal Instruction
SW Interrupt 3
HW Stack Overflow
Misaligned Long Word Access
SW Interrupt 2
SW Interrupt 1
SW Interrupt 0
SW Interrupt LP
These interrupts are enabled at their fixed priority levels.
56F8347 Technical Data, Rev.11
102
Freescale Semiconductor
Preliminary
Overview
Part 6 System Integration Module (SIM)
6.1 Overview
The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls
distribution of resets and clocks and provides a number of control features. The system integration module
is responsible for the following functions:
•
•
•
•
•
•
•
Reset sequencing
Clock generation & distribution
Stop/Wait control
Pull-up enables for selected peripherals
System status registers
Registers for software access to the JTAG ID of the chip
Enforcing Flash security
These are discussed in more detail in the sections that follow.
6.2 Features
The SIM has the following features:
•
•
•
Flash security feature prevents unauthorized access to code/data contained in on-chip Flash memory
Power-saving clock gating for peripheral
Three power modes (Run, Wait, Stop) to control power utilization
— Stop mode shuts down the 56800E core, system clock, peripheral clock, and PLL operation
— Stop mode entry can optionally disable PLL and Oscillator (low power vs. fast restart); must be
explicitly done
— Wait mode shuts down the 56800E core and unnecessary system clock operation
— Run mode supports full part operation
•
•
•
•
•
•
•
Controls to enable/disable the 56800E core WAIT and STOP instructions
Calculates base delay for reset extension based upon POR or RESET operations. Reset delay will be either
3 x 32 clocks for reset, except for POR, which is 2^21 clock cycles.
Controls reset sequencing after reset
Software-initiated reset
Four 16-bit registers reset only by a Power-On Reset usable for general-purpose software control
System Control Register
Registers for software access to the JTAG ID of the chip
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
103
6.3 Operating Modes
Since the SIM is responsible for distributing clocks and resets across the chip, it must understand the
various chip operating modes and take appropriate action. These are:
•
Reset Mode, which has two submodes:
— POR and RESET operation
The 56800E core and all peripherals are reset. This occurs when the internal POR is asserted or the
RESET pin is asserted.
— COP reset and software reset operation
The 56800E core and all peripherals are reset. The MA bit within the OMR is not changed. This allows
the software to determine the boot mode (internal or external boot) to be used on the next reset.
•
•
•
•
Run Mode
This is the primary mode of operation for this device. In this mode, the 56800E controls chip operation.
Debug Mode
The 56800E is controlled via JTAG/EOnCE when in debug mode. All peripherals, except the COP and
PWMs, continue to run. COP is disabled and PWM outputs are optionally switched off to disable any motor
from being driven; see the PWM chapter in the 56F8300 Peripheral User Manual for details.
Wait Mode
In Wait mode, the core clock and memory clocks are disabled. Optionally, the COP can be stopped.
Similarly, it is an option to switch off PWM outputs to disable any motor from being driven. All other
peripherals continue to run.
Stop Mode
When in Stop mode, the 56800E core, memory, and most peripheral clocks are shut down. Optionally, the
COP and CAN can be stopped. For lowest power consumption in Stop mode, the PLL can be shut down.
This must be done explicitly before entering Stop mode, since there is no automatic mechanism for this. The
CAN (along with any non-gated interrupt) is capable of waking the chip up from Stop mode, but is not fully
functional in Stop mode.
6.4 Operating Mode Register
Bit
15
NL
CM
XP
SD
R
Type
R/W
R/W
R/W
R/W
R/W
RESET
0
0
0
0
0
0
0
14
0
13
0
12
0
11
0
10
0
9
0
8
7
6
5
4
3
2
SA
EX
0
R/W
R/W
0
1
0
MB
MA
R/W
R/W
X
X
Figure 6-1 OMR
The reset state for MB and MA will depend on the Flash secured state. See Part 4.2 and Part 7 for detailed
information on how the Operating Mode Register (OMR) MA and MB bits operate in this device. For all
other bits, see the DSP56800E Reference Manual.
Note:
The OMR is not a Memory Map register; it is directly accessible in code through the acronym OMR.
56F8347 Technical Data, Rev.11
104
Freescale Semiconductor
Preliminary
Register Descriptions
6.5 Register Descriptions
Table 6-1 SIM Registers
(SIM_BASE = $00 F350)
Address Offset
Address Acronym
Register Name
Section Location
Base + $0
SIM_CONTROL
Control Register
6.5.1
Base + $1
SIM_RSTSTS
Reset Status Register
6.5.2
Base + $2
SIM_SCR0
Software Control Register 0
6.5.3
Base + $3
SIM_SCR1
Software Control Register 1
6.5.3
Base + $4
SIM_SCR2
Software Control Register 2
6.5.3
Base + $5
SIM_SCR3
Software Control Register 3
6.5.3
Base + $6
SIM_MSH_ID
Most Significant Half of JTAG ID
6.5.4
Base + $7
SIM_LSH_ID
Least Significant Half of JTAG ID
6.5.5
Base + $8
SIM_PUDR
Pull-up Disable Register
6.5.6
Reserved
Base + $A
SIM_CLKOSR
CLKO Select Register
6.5.7
Base + $B
SIM_GPS
GPIO Peripheral Select Register
6.5.7
Base + $C
SIM_PCE
Peripheral Clock Enable Register
6.5.8
Base + $D
SIM_ISALH
I/O Short Address Location High Register
6.5.9
Base + $E
SIM_ISALL
I/O Short Address Location Low Register
6.5.10
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
105
Add.
Offset
Register
Name
$0
SIM_
CONTROL
$1
SIM_
RSTSTS
$2
SIM_SCR0
$3
SIM_SCR1
R
W
R
W
R
W
R
W
R
SIM_SCR2
W
R
SIM_SCR3
W
SIM_MSH_ R
ID
W
R
SIM_LSH_ID
W
R
SIM_PUDR
W
Reserved
R
SIM_
CLKOSR
W
$4
$5
$6
$7
$8
$A
$B
SIM_GPS
$C
SIM_PCE
$D
SIM_ISALH
$E
SIM_ISALL
R
W
R
W
R
W
R
W
15
14
13
12
11
10
9
8
7
6
5
4
0
0
0
0
0
0
0
0
0
EMI_
MODE
ONCE
EBL0
SW
RST
0
0
0
0
0
0
0
0
0
0
SWR
3
2
STOP_
DISABLE
COPR EXTR
POR
1
0
WAIT_
DISABLE
0
0
FIELD
FIELD
FIELD
FIELD
0
0
0
0
0
0
0
1
1
1
1
1
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
PWMA
1
CAN
CTRL
ADR
JTAG
0
0
0
0
0
0
0
0
0
0
0
0
CAN
DEC1
DEC0
1
1
1
EMI
1
ADCB ADCA
1
1
EMI_
RESET
MODE
IRQ
XBOOT PWMB
PWMA
DATA
0
A23
A22
A21
A20
CLKDIS
0
0
0
0
0
0
SCI1
1
TMRD TMRC TMRB TMRA
1
1
1
1
TMRD TMRC TMRA
CLKOSEL
C3
C2
C1
C0
SCI0
SPI1
SPI0
PWM
B
PWM
A
1
1
1
ISAL[23:22]
ISAL[21:6]
= Reserved
Figure 6-2 SIM Register Map Summary
6.5.1
SIM Control Register (SIM_CONTROL)
Base + $0
15
14
13
12
11
10
9
8
7
6
5
4
Read
0
0
0
0
0
0
0
0
0
EMI_
MODE
ONCE
EBL
SW
RST
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
3
2
1
0
STOP_
DISABLE
WAIT_
DISABLE
0
0
0
0
Figure 6-3 SIM Control Register (SIM_CONTROL)
6.5.1.1
Reserved—Bits 15–7
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
56F8347 Technical Data, Rev.11
106
Freescale Semiconductor
Preliminary
Register Descriptions
6.5.1.2
EMI_MODE (EMI_MODE)—Bit 6
This bit reflects the current (non-clocked) state of the EMI_MODE pin. During reset, this bit, coupled with
the EXTBOOT signal, is used to initialize address bits [19:16] either as GPIO or as address. These settings
can be explicitly overwritten using the appropriate GPIO peripheral enable register at any time after reset.
In addition, this pin can be used as a general purpose input pin after reset.
•
•
0 = External address bits [19:16] are initially programmed as GPIO
1 = When booted with EXTBOOT = 1, A[19:16] are initially programmed as address. If EXTBOOT is 0,
they are initialized as GPIO.
6.5.1.3
•
•
OnCE Enable (OnCE EBL)—Bit 5
0 = OnCE clock to 56800E core enabled when core TAP is enabled
1 = OnCE clock to 56800E core is always enabled
6.5.1.4
Software Reset (SW RST)—Bit 4
This bit is always read as 0. Writing a 1 to this bit will cause the part to reset.
6.5.1.5
•
•
Stop Disable (STOP_DISABLE)—Bits 3–2
00 - Stop mode will be entered when the 56800E core executes a STOP instruction
01 - The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can be
reprogrammed in the future
10 - The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can then only be
changed by resetting the device
11 - Same operation as 10
•
•
6.5.1.6
•
•
Wait Disable (WAIT_DISABLE)—Bits 1–0
00 - Wait mode will be entered when the 56800E core executes a WAIT instruction
01 - The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can be
reprogrammed in the future
10 - The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can then only be
changed by resetting the device
11 - Same operation as 10
•
•
6.5.2
SIM Reset Status Register (SIM_RSTSTS)
Bits in this register are set upon any system reset and are initialized only by a Power-On Reset (POR). A
reset (other than POR) will only set bits in the register; bits are not cleared. Only software should only clear
this register.
Base + $1
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
5
SWR
4
COPR
3
EXTR
2
POR
1
0
0
0
0
0
Figure 6-4 SIM Reset Status Register (SIM_RSTSTS)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
107
6.5.2.1
Reserved—Bits 15–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.2.2
Software Reset (SWR)—Bit 5
When 1, this bit indicates that the previous reset occurred as a result of a software reset (write to SW RST
bit in the SIM_CONTROL register). This bit will be cleared by any hardware reset or by software. Writing
a 0 to this bit position will set the bit, while writing a 1 to the bit will clear it.
6.5.2.3
COP Reset (COPR)—Bit 4
When 1, the COPR bit indicates the Computer Operating Properly (COP) timer-generated reset has
occurred. This bit will be cleared by a Power-On Reset or by software. Writing a 0 to this bit position will
set the bit, while writing a 1 to the bit will clear it.
6.5.2.4
External Reset (EXTR)—Bit 3
If 1, the EXTR bit indicates an external system reset has occurred. This bit will be cleared by a Power-On
Reset or by software. Writing a 0 to this bit position will set the bit, while writing a 1 to the bit position
will clear it. Basically, when the EXTR bit is 1, the previous system reset was caused by the external
RESET pin being asserted low.
6.5.2.5
Power-On Reset (POR)—Bit 2
When 1, the POR bit indicates a Power-On Reset occurred some time in the past. This bit can be cleared
only by software or by another type of reset. Writing a 0 to this bit will set the bit, while writing a 1 to the
bit position will clear the bit. In summary, if the bit is 1, the previous system reset was due to a Power-On
Reset.
6.5.2.6
Reserved—Bits 1–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.3
SIM Software Control Registers (SIM_SCR0, SIM_SCR1, SIM_SCR2,
and SIM_SCR3)
Only SIM_SCR0 is shown below. SIM_SCR1, SIM_SCR2, and SIM_SCR3 are identical in functionality.
Base + $2
15
14
13
12
11
10
9
Read
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
FIELD
Write
RESET
8
0
0
0
0
0
0
0
0
Figure 6-5 SIM Software Control Register 0 (SIM_SCR0)
56F8347 Technical Data, Rev.11
108
Freescale Semiconductor
Preliminary
Register Descriptions
6.5.3.1
Software Control Data 1 (FIELD)—Bits 15–0
This register is reset only by the Power-On Reset (POR). It has no part-specific functionality and is
intended for use by a software developer to contain data that will be unaffected by the other reset sources
(RESET pin, software reset, and COP reset).
6.5.4
Most Significant Half of JTAG ID (SIM_MSH_ID)
This read-only register displays the most significant half of the JTAG ID for the chip. This register reads
$11F4.
Base + $6
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
0
0
0
0
1
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
1
0
0
Write
RESET
Figure 6-6 Most Significant Half of JTAG ID (SIM_MSH_ID)
6.5.5
Least Significant Half of JTAG ID (SIM_LSH_ID)
This read-only register displays the least significant half of the JTAG ID for the chip. This register reads
$401D.
Base + $7
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
Write
RESET
Figure 6-7 Least Significant Half of JTAG ID (SIM_LSH_ID)
6.5.6
SIM Pull-up Disable Register (SIM_PUDR)
Most of the pins on the chip have on-chip pull-up resistors. Pins which can operate as GPIO can have these
resistors disabled via the GPIO function. Non-GPIO pins can have their pull-ups disabled by setting the
appropriate bit in this register. Disabling pull-ups is done on a peripheral-by-peripheral basis (for pins not
muxed with GPIO). Each bit in the register (see Figure 6-8) corresponds to a functional group of pins. See
Table 2-2 to identify which pins can deactivate the internal pull-up resistor.
Base + $8
15
Read
0
Write
RESET
0
14
13
12
11
10
9
PWMA1
CAN
EMI_
MODE
RESET
IRQ
XBOOT
0
0
0
0
0
0
8
7
PWMB PWMA0
0
0
6
0
0
5
CTRL
0
4
0
0
3
JTAG
0
2
1
0
0
0
0
0
0
0
Figure 6-8 SIM Pull-up Disable Register (SIM_PUDR)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
109
6.5.6.1
Reserved—Bit 15
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.6.2
PWMA1—Bit 14
This bit controls the pull-up resistors on the FAULTA3 pin.
6.5.6.3
CAN—Bit 13
This bit controls the pull-up resistors on the CAN_RX pin.
6.5.6.4
EMI_MODE—Bit 12
This bit controls the pull-up resistors on the EMI_MODE pin.
6.5.6.5
RESET—Bit 11
This bit controls the pull-up resistors on the RESET pin.
6.5.6.6
IRQ—Bit 10
This bit controls the pull-up resistors on the IRQA and IRQB pins.
6.5.6.7
XBOOT—Bit 9
This bit controls the pull-up resistors on the EXTBOOT pin.
6.5.6.8
PWMB—Bit 8
This bit controls the pull-up resistors on the FAULTB0, FAULTB1, FAULTB2, and FAULTB3 pins.
6.5.6.9
PWMA0—Bit 7
This bit controls the pull-up resistors on the FAULTA0, FAULTA1, and FAULTA2 pins.
6.5.6.10
Reserved—Bit 6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.6.11
CTRL—Bit 5
This bit controls the pull-up resistors on the WR and RD pins.
6.5.6.12
Reserved—Bit 4
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.6.13
JTAG—Bit 3
This bit controls the pull-up resistors on the TRST, TMS and TDI pins.
6.5.6.14
Reserved—Bits 2 - 0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
56F8347 Technical Data, Rev.11
110
Freescale Semiconductor
Preliminary
Register Descriptions
6.5.7
CLKO Select Register (SIM_CLKOSR)
The CLKO select register can be used to multiplex out any one of the clocks generated inside the clock
generation and SIM modules. The default value is SYS_CLK. All other clocks primarily muxed out are
for test purposes only, and are subject to significant unspecified latencies at high frequencies.
The upper four bits of the GPIOB register can function as GPIO, [A23:20], or as additional clock output
signals. GPIO has priority and is enabled/disabled via the GPIOB_PER. If GPIOB[7:4] are programmed
to operate as peripheral outputs, then the choice between [A23:20] and additional clock outputs is done
here in the CLKOSR. The default state is for the peripheral function of GPIOB[7:4] to be programmed as
[A23:20]. This can be changed by altering [A23:20] as shown in Figure 6-9.
Base + $A
15
14
13
12
11
10
Read
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
9
8
7
6
5
A23
A22
A21
A20
CLK
DIS
0
0
0
0
1
4
3
2
1
0
0
0
CLKOSEL
0
0
0
Figure 6-9 CLKO Select Register (SIM_CLKOSR)
6.5.7.1
Reserved—Bits 15–10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.7.2
•
•
0 = Peripheral output function of GPIOB7 is defined to be A23
1 = Peripheral output function of GPIOB7 is defined to be the oscillator_clock (MSTR_OSC, see
Figure 3-4)
6.5.7.3
•
•
Alternate GPIOB Peripheral Function for A20 (A20)—Bit 6
0 = Peripheral output function of GPIOB4 is defined to be A20
1 = Peripheral output function of GPIOB4 is defined to be the prescaler_clock (FREF in Figure 3-4)
6.5.7.6
•
•
Alternate GPIOB Peripheral Function for A21 (A21)—Bit 7
0 = Peripheral output function of GPIOB5 is defined to be A21
1 = Peripheral output function of GPIOB5 is defined to be SYS_CLK
6.5.7.5
•
•
Alternate GPIOB Peripheral Function for A22 (A22)—Bit 8
0 = Peripheral output function of GPIOB6 is defined to be A22
1 = Peripheral output function of GPIOB6 is defined to be SYS_CLK2
6.5.7.4
•
•
Alternate GPIOB Peripheral Function for A23 (A23)—Bit 9
Clockout Disable (CLKDIS)—Bit 5
0 = CLKOUT output is enabled and will output the signal indicated by CLKOSEL
1 = CLKOUT is tri-stated
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
111
6.5.7.7
CLockout Select (CLKOSEL)—Bits 4–0
Selects clock to be muxed out on the CLKO pin.
•
•
•
•
•
•
•
•
•
00000 = SYS_CLK (from OCCS - DEFAULT)
00001 = Reserved for factory test—56800E clock
00010 = Reserved for factory test—XRAM clock
00011 = Reserved for factory test—PFLASH odd clock
00100 = Reserved for factory test—PFLASH even clock
00101 = Reserved for factory test—BFLASH clock
00110 = Reserved for factory test—DFLASH clock
00111 = Oscillator output
01000 = Fout (from OCCS)
•
•
•
•
•
•
•
•
•
01001 = Reserved for factory test—IPB clock
01010 = Reserved for factory test—Feedback (from OCCS, this is path to PLL)
01011 = Reserved for factory test—Prescaler clock (from OCCS)
01100 = Reserved for factory test—Postscaler clock (from OCCS)
01101 = Reserved for factory test—SYS_CLK2 (from OCCS)
01110 = Reserved for factory test—SYS_CLK_DIV2
01111 = Reserved for factory test—SYS_CLK_D
10000 = ADCA clock
10001 = ADCB clock
6.5.8
GPIO Peripheral Select Register (SIM_GPS)
The GPIO Peripheral Select register can be used to multiplex out any one of the three alternate peripherals
for GPIOC. The default peripheral is Quad Decoder 1 and Quad Timer B (NOT available in the 56F8147
device); these peripherals work together.
The four I/O pins associated with GPIOC can function as GPIO, Quad Decoder 1/Quad Timer B, or as
SPI 1 signals. GPIO is not the default and is enabled/disabled via the GPIOC_PER, as shown in
Figure 6-10 and Table 6-2. When GPIOC[3:0] are programmed to operate as peripheral I/O, then the
choice between decoder/timer and SPI inputs/outputs is made in the SIM_GPS register and in conjunction
with the Quad Timer Status and Control Registers (SCR). The default state is for the peripheral function
of GPIOC[3:0] to be programmed as decoder functions. This can be changed by altering the appropriate
controls in the indicated registers.
56F8347 Technical Data, Rev.11
112
Freescale Semiconductor
Preliminary
Register Descriptions
GPIOC_PER Register
GPIO Controlled
0
I/O Pad Control
1
SIM_ GPS Register
0
Quad Timer Controlled
1
SPI Controlled
Figure 6-10 Overall Control of Pads Using SIM_GPS Control
Table 6-2 Control of Pads Using SIM_GPS Control 1
GPIOC_PER
GPIOC_DTR
SIM_GPS
Quad Timer
SCR Register
OEN bits
Control Registers
GPIO Input
0
0
—
—
GPIO Output
0
1
—
—
Quad Timer Input /
Quad Decoder Input 2
1
—
0
0
Quad Timer Output /
Quad Decoder Input 3
1
—
0
1
SPI input
1
—
1
—
SPI output
1
—
1
—
Pin Function
Comments
See the “Switch Matrix for Inputs to the Timer”
table in the 56F8300 Peripheral User’s
Manual for the definition of the timer inputs
based on the Quad Decoder Mode
configuration.
See SPI controls for determining the direction
of each of the SPI pins.
1. This applies to the four pins that serve as Quad Decoder / Quad Timer / SPI / GPIOC functions. A separate set of control bits
is used for each pin.
2. Reset configuration
3. Quad Decoder pins are always inputs and function in conjunction with the Quad Timer pins.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
113
Base + $B
15
14
13
12
11
10
9
8
7
6
5
4
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
3
2
1
0
C3
C2
C1
C0
0
0
0
0
Figure 6-11 GPIO Peripheral Select Register (SIM_GPS)
6.5.8.1
Reserved—Bits 15–4
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.5.8.2
GPIOC3 (C3)—Bit 3
This bit selects the alternate function for GPIOC3.
•
0 = HOME1/TB3 (default - see “Switch Matrix Mode” bits of the Quad Decoder DECCR register in the
56F8300 Peripheral User’s Manual)
1 = SS1
•
6.5.8.3
GPIOC2 (C2)—Bit 2
This bit selects the alternate function for GPIOC2.
•
•
0 = INDEX1/TB2 (default)
1 = MISO1
6.5.8.4
GPIOC1 (C1)—Bit 1
This bit selects the alternate function for GPIOC1.
•
•
0 = PHASEB1/TB1 (default)
1 = MOSI1
6.5.8.5
GPIOC0 (C0)—Bit 0
This bit selects the alternate function for GPIOC0.
•
•
0 = PHASEA1/TB0 (default)
1 = SCLK1
6.5.9
Peripheral Clock Enable Register (SIM_PCE)
The Peripheral Clock Enable register is used to enable or disable clocks to the peripherals as a power
savings feature. The clocks can be individually controlled for each peripheral on the chip.
Base + $C
Read
Write
RESET
15
EMI
1
14
13
12
ADCB ADCA CAN
1
1
1
11
10
9
8
7
DEC1 DEC0 TMRD TMRC TMRB
1
1
1
1
1
6
TMRA
1
5
4
SCI 1 SCI 0
1
1
3
2
1
0
SPI 1
SPI 0
PWMB
PWMA
1
1
1
1
Figure 6-12 Peripheral Clock Enable Register (SIM_PCE)
56F8347 Technical Data, Rev.11
114
Freescale Semiconductor
Preliminary
Register Descriptions
6.5.9.1
External Memory Interface Enable (EMI)—Bit 15
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.2
Analog-to-Digital Converter B Enable (ADCB)—Bit 14
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.3
Analog-to-Digital Converter A Enable (ADCA)—Bit 13
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.4
FlexCAN Enable (CAN)—Bit 12
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.5
Decoder 1 Enable (DEC1)—Bit 11
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.6
Decoder 0 Enable (DEC0)—Bit 10
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.7
Quad Timer D Enable (TMRD)—Bit 9
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.8
Quad Timer C Enable (TMRC)—Bit 8
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
115
6.5.9.9
Quad Timer B Enable (TMRB)—Bit 7
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.10
Quad Timer A Enable (TMRA)—Bit 6
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.11
Serial Communications Interface 1 Enable (SCI1)—Bit 5
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.12
Serial Communications Interface 0 Enable (SCI0)—Bit 4
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.13
Serial Peripheral Interface 1 Enable (SPI1)—Bit 3
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.14
Serial Peripheral Interface 0 Enable (SPI0)—Bit 2
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.15
Pulse Width Modulator B Enable (PWMB)—1
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
6.5.9.16
Pulse Width Modulator A Enable (PWMA)—0
Each bit controls clocks to the indicated peripheral.
•
•
1 = Clocks are enabled
0 = The clock is not provided to the peripheral (the peripheral is disabled)
56F8347 Technical Data, Rev.11
116
Freescale Semiconductor
Preliminary
Register Descriptions
6.5.10
I/O Short Address Location Register (SIM_ISALH and SIM_ISALL)
The I/O Short Address Location registers are used to specify the memory referenced via the I/O short
address mode. The I/O short address mode allows the instruction to specify the lower six bits of address;
the upper address bits are not directly controllable. This register set allows limited control of the full
address, as shown in Figure 6-13.
Note:
If this register is set to something other than the top of memory (EOnCE register space) and the EX bit
in the OMR is set to 1, the JTAG port cannot access the on-chip EOnCE registers, and debug functions
will be affected.
“Hard Coded” Address Portion
Instruction Portion
6 Bits from I/O Short Address Mode Instruction
16 Bits from SIM_ISALL Register
2 bits from SIM_ISALH Register
Full 24-Bit for Short I/O Address
Figure 6-13 I/O Short Address Determination
With this register set, an interrupt driver can set the SIM_ISALL register pair to point to its peripheral
registers and then use the I/O Short addressing mode to reference them. The ISR should restore this register
to its previous contents prior to returning from interrupt.
Note:
The default value of this register set points to the EOnCE registers.
Note:
The pipeline delay between setting this register set and using short I/O addressing with the new value
is three cycles.
Base + $D
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Read
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Write
RESET
1
0
ISAL[23:22]
1
1
Figure 6-14 I/O Short Address Location High Register (SIM_ISALH)
6.5.10.1
Input/Output Short Address Low (ISAL[23:22])—Bit 1–0
This field represents the upper two address bits of the “hard coded” I/O short address.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
117
Base + $E
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
ISAL[21:6]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 6-15 I/O Short Address Location Low Register (SIM_ISAL)
6.5.10.2
Input/Output Short Address Low (ISAL[21:6])—Bit 15–0
This field represents the lower 16 address bits of the “hard coded” I/O short address.
6.6 Clock Generation Overview
The SIM uses an internal master clock from the OCCS (CLKGEN) module to produce the peripheral and
system (core and memory) clocks. The maximum master clock frequency is 120MHz. Peripheral and
system clocks are generated at half the master clock frequency and therefore at a maximum 60MHz. The
SIM provides power modes (Stop, Wait) and clock enables (SIM_PCE register, CLK_DIS, ONCE_EBL)
to control which clocks are in operation. The OCCS, power modes, and clock enables provide a flexible
means to manage power consumption.
Power utilization can be minimized in several ways. In the OCCS, crystal oscillator, and PLL may be shut
down when not in use. When the PLL is in use, its prescaler and postscaler can be used to limit PLL and
master clock frequency. Power modes permit system and/or peripheral clocks to be disabled when unused.
Clock enables provide the means to disable individual clocks. Some peripherals provide further controls
to disable unused subfunctions. Refer to Part 3 On-Chip Clock Synthesis (OCCS), and the 56F8300
Peripheral User Manual for further details.
6.7 Power-Down Modes Overview
The 56F8347/56F8147 operate in one of three power-down modes, as shown in Table 6-3.
Table 6-3 Clock Operation in Power-Down Modes
Mode
Core Clocks
Peripheral Clocks
Description
Run
Active
Active
Device is fully functional
Wait
Core and memory
clocks disabled
Active
Peripherals are active and can produce interrupts if
they have not been masked off.
Interrupts will cause the core to come out of its
suspended state and resume normal operation.
Typically used for power-conscious applications.
Stop
System clocks continue to be generated in
the SIM, but most are gated prior to
reaching memory, core and peripherals.
The only possible recoveries from Stop mode are:
1. CAN traffic (1st message will be lost)
2. Non-clocked interrupts
3. COP reset
4. External reset
5. Power-on reset
56F8347 Technical Data, Rev.11
118
Freescale Semiconductor
Preliminary
Stop and Wait Mode Disable Function
All peripherals, except the COP/watchdog timer, run off the IPBus clock frequency, which is the same as
the main processor frequency in this architecture. The maximum frequency of operation is
SYS_CLK = 60MHz.
6.8 Stop and Wait Mode Disable Function
Permanent
Disable
D
Q
D-FLOP
C
Reprogrammable
Disable
56800E
D
STOP_DIS
Q
D-FLOP
Clock
Select
C
R
Note: Wait disable circuit is similar
Reset
Figure 6-16 Internal Stop Disable Circuit
The 56800E core contains both STOP and WAIT instructions. Both put the CPU to sleep. For lowest
power consumption in Stop mode, the PLL can be shut down. This must be done explicitly before entering
Stop mode, since there is no automatic mechanism for this. When the PLL is shut down, the 56800E
system clock must be set equal to the oscillator output.
Some applications require the 56800E STOP and WAIT instructions be disabled. To disable those
instructions, write to the SIM control register (SIM_CONTROL), described in Part 6.5.1. This procedure
can be on either a permanent or temporary basis. Permanently assigned applications last only until their
next reset.
6.9 Resets
The SIM supports four sources of reset. The two asynchronous sources are the external RESET pin and
the Power-On Reset (POR). The two synchronous sources are the software reset, which is generated within
the SIM itself by writing to the SIM_CONTROL register and the COP reset.
Reset begins with the assertion of any of the reset sources. Release of reset to various blocks is sequenced
to permit proper operation of the device. A POR reset is first extended for 221 clock cycles to permit
stabilization of the clock source, followed by a 32 clock window in which SIM clocking is initiated. It is
then followed by a 32 clock window in which peripherals are released to implement Flash security, and,
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
119
finally, followed by a 32 clock window in which the core is initialized. After completion of the described
reset sequence, application code will begin execution.
Resets may be asserted asynchronously, but are always released internally on a rising edge of the system
clock.
Part 7 Security Features
The 56F8347/56F8147 offer security features intended to prevent unauthorized users from reading the
contents of the Flash Memory (FM) array. The Flash security consists of several hardware interlocks that
block the means by which an unauthorized user could gain access to the Flash array.
However, part of the security must lie with the user’s code. An extreme example would be user’s code that
dumps the contents of the internal program, as this code would defeat the purpose of security. At the same
time, the user may also wish to put a “backdoor” in his program. As an example, the user downloads a
security key through the SCI, allowing access to a programming routine that updates parameters stored in
another section of the Flash.
7.1 Operation with Security Enabled
Once the user has programmed the Flash with his application code, the device can be secured by
programming the security bytes located in the FM configuration field, which occupies a portion of the FM
array. These non-volatile bytes will keep the part secured through reset and through power-down of the
device. Only two bytes within this field are used to enable or disable security. Refer to the Flash Memory
section in the 56F8300 Peripheral User Manual for the state of the security bytes and the resulting state
of security. When Flash security mode is enabled in accordance with the method described in the Flash
Memory module specification, the device will disable external P-space accesses (disabling EXTBOOT =
1 mode), restrict memory and disable the core EOnCE debug capabilities. Normal program execution is
otherwise unaffected.
7.2 Flash Access Blocking Mechanisms
The 56F8347/56F8147 have several operating functional and test modes. Effective Flash security must
address operating mode selection and anticipate modes in which the on-chip Flash can be compromised
and read without explicit user permission. Methods to block these are outlined in the next subsections.
7.2.1
Forced Operating Mode Selection
At boot time, the SIM determines in which functional modes the device will operate. These are:
•
•
•
Internal Boot Mode
External Boot Mode
Secure Mode
When Flash security is enabled as described in the Flash Memory module specification, the device will
boot in internal boot mode, disable all access to external P-space, and start executing code from the Boot
Flash at address 0x02_0000.
56F8347 Technical Data, Rev.11
120
Freescale Semiconductor
Preliminary
Flash Access Blocking Mechanisms
This security affords protection only to applications in which the device operates in internal Flash security
mode. Therefore, the security feature cannot be used unless all executing code resides on-chip.
When security is enabled, any attempt to override the default internal operating mode by asserting the
EXTBOOT pin in conjunction with reset will be ignored.
7.2.2
Disabling EOnCE Access
On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for
the 56800E core. The TRST, TCLK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the
EOnCE port functionality is mapped. When the device boots, the chip-level JTAG TAP (Test Access Port)
is active and provides the chip’s boundary scan capability and access to the ID register.
Proper implementation of Flash security requires that no access to the EOnCE port is provided when
security is enabled. The 56800E core has an input which disables reading of internal memory via the
JTAG/EOnCE. The FM sets this input at reset to a value determined by the contents of the FM security
bytes.
7.2.3
Flash Lockout Recovery
If a user inadvertently enables Flash security on the device, a built-in lockout recovery mechanism can be
used to reenable access to the device. This mechanism completely reases all on-chip Flash, thus disabling
Flash security. Access to this recovery mechanism is built into CodeWarrior via an instruction in memory
configuration (.cfg) files. Add, or uncomment the following configuration command:
unlock_flash_on_connect 1
For more information, please see CodeWarrior MC56F83xx/DSP5685x Family Targeting Manual.
The LOCKOUT_RECOVERY instruction will have an associated 7-bit Data Register (DR) that is used to
control the clock divider circuit within the FM module. This divider, FM_CLKDIV[6:0], is used to control
the period of the clock used for timed events in the FM erase algorithm. This register must be set with
appropriate values before the lockout sequence can begin. Refer to the JTAG section of the 56F8300
Peripheral User Manual for more details on setting this register value.
The value of the JTAG FM_CLKDIV[6:0] will replace the value of the FM register FMCLKD that divides
down the system clock for timed events, as illustrated in Figure 7-1. FM_CLKDIV[6] will map to the
PRDIV8 bit, and FM_CLKDIV[5:0] will map to the DIV[5:0] bits. The combination of PRDIV8 and DIV
must divide the FM input clock down to a frequency of 150kHz-200kHz. The “Writing the FMCLKD
Register” section in the Flash Memory chapter of the 56F8300 Peripheral User Manual gives specific
equations for calculating the correct values.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
121
Flash Memory
SYS_CLK
input
clock
2
DIVIDER
7
FMCLKD
7
FM_CLKDIV
JTAG
7
FM_ERASE
Figure 7-1 JTAG to FM Connection for Lockout Recovery
Two examples of FM_CLKDIV calculations follow.
EXAMPLE 1: If the system clock is the 8MHz crystal frequency because the PLL has not been set up,
the input clock will be below 12.8MHz, so PRDIV8 = FM_CLKDIV[6] = 0. Using the following equation
yields a DIV value of 19 for a clock of 200kHz, and a DIV value of 20 for a clock of 190kHz. This
translates into an FM_CLKDIV[6:0] value of $13 or $14, respectively.
150[kHz]
(
<
SYS_CLK
(2)
(DIV + 1)
)<
200[kHz]
EXAMPLE 2: In this example, the system clock has been set up with a value of 32MHz, making the FM
input clock 16MHz. Because that is greater than 12.8MHz, PRDIV8 = FM_CLKDIV[6] = 1. Using the
following equation yields a DIV value of 9 for a clock of 200kHz, and a DIV value of 10 for a clock of
181kHz. This translates to an FM_CLKDIV[6:0] value of $49 or $4A, respectively.
150[kHz]
(
<
SYS_CLK
(2)(8)
(DIV + 1)
)<
200[kHz]
Once the LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock
divider value must be shifted into the corresponding 7-bit data register. After the data register has been
updated, the user must transition the TAP controller into the RUN-TEST/IDLE state for the lockout
sequence to commence. The controller must remain in this state until the erase sequence has completed.
For details, see the JTAG Section in the 56F8300 Peripheral User Manual.
Note:
Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller
(by asserting TRST) and the device (by asserting external chip reset) to return to normal unsecured
operation.
56F8347 Technical Data, Rev.11
122
Freescale Semiconductor
Preliminary
Introduction
7.2.4
Product Analysis
The recommended method of unsecuring a programmed device for product analysis of field failures is via
the backdoor key access. The customer would need to supply Technical Support with the backdoor key
and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit that allows
backdoor key access must be set.
An alternative method for performing analysis on a secured microcontroller would be to mass-erase and
reprogram the Flash with the original code, but modify the security bytes.
To insure that a customer does not inadvertently lock himself out of the device during programming, it is
recommended that he program the backdoor access key first, his application code second, and the security
bytes within the FM configuration field last.
Part 8 General Purpose Input/Output (GPIO)
8.1 Introduction
This section is intended to supplement the GPIO information found in the 56F8300 Peripheral User
Manual and contains only chip-specific information. This information supercedes the generic information
in the 56F8300 Peripheral User Manual.
8.2 Memory Maps
The width of the GPIO port defines how many bits are implemented in each of the GPIO registers. Based
on this and the default function of each of the GPIO pins, the reset values of the GPIOx_PUR and
GPIOx_PER registers change from port to port. Tables 4-29 through 4-34 define the actual reset values of
these registers.
8.3 Configuration
There are six GPIO ports defined on the 56F8347/56F8147. The width of each port and the associated
peripheral function is shown in Table 8-1 and Table 8-2. The specific mapping of GPIO port pins is
shown in Table 8-3.
Table 8-1 56F8347 GPIO Ports Configuration
GPIO
Port
Port
Width
Available
Pins in
56F8347
A
14
14
14 pins - EMI Address pins
EMI Address
B
8
8
8 pins - EMI Address pins
EMI Address
C
11
11
4 pins -DEC1 / TMRB / SPI1
4 pins -DEC0 / TMRA
3 pins -PWMA current sense
DEC1 / TMRB
DEC0 / TMRA
PWMA current sense
Peripheral Function
Reset Function
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
123
Table 8-1 56F8347 GPIO Ports Configuration (Continued)
GPIO
Port
Port
Width
Available
Pins in
56F8347
D
13
13
6 pins - EMI CSn
2 pins - SCI1
2 pins - EMI CSn
3 pins -PWMB current sense
EMI Chip Selects
SCI1
EMI Chip Selects
PWMB current sense
E
14
14
2 pins - SCI0
2 pins - EMI Address pins
4 pins - SPI0
2 pins - TMRC
4 pins - TMRD
SCI0
EMI Address
SPI0
TMRC
TMRD
F
16
16
16 pins - EMI Data
EMI Data
Peripheral Function
Reset Function
Table 8-2 56F8147 GPIO Ports Configuration
GPIO
Port
Port
Width
Available
Pins in
56F8147
A
14
14
14 pins - EMI Address pins
EMI Address
B
8
8
8 pins - EMI Address pins
EMI Address
C
11
11
4 pins - SPI1
4 pins - DEC0 / TMRA
3 pins - Dedicated GPIO
SPI1
DEC0 / TMRA
GPIO
D
13
13
6 pins - EMI CSn
2 pins - SCI1
2 pins - EMI CSn
3 pins -PWMB current sense
EMI Chip Selects
SCI1
EMI Chip Selects
PWMB current sense
E
14
14
2 pins - SCI0
2 pins - EMI Address pins
4 pins - SPI0
2 pins - TMRC
4 pins - Dedicated GPIO
SCI0
EMI Address
SPI0
TMRC
GPIO
F
16
16
16 pins - EMI Data
EMI Data
Peripheral Function
Reset Function
56F8347 Technical Data, Rev.11
124
Freescale Semiconductor
Preliminary
Configuration
Table 8-3 GPIO External Signals Map
Pins in italics are NOT available in the 56F8147 device
GPIO Port
GPIOA
GPIOB
1This
GPIO Bit
Reset
Function
Functional Signal
Package Pin
0
Peripheral
A8
19
1
Peripheral
A9
20
2
Peripheral
A10
21
3
Peripheral
A11
22
4
Peripheral
A12
23
5
Peripheral
A13
24
6
Peripheral
A14
25
7
Peripheral
A15
26
8
Peripheral
A0
154
9
Peripheral
A1
10
10
Peripheral
A2
11
11
Peripheral
A3
12
12
Peripheral
A4
13
13
Peripheral
A5
14
0
GPIO1
A16
33
1
GPIO1
A17
34
2
GPIO1
A18
35
3
GPIO1
A19
36
4
GPIO
A20 / Prescaler_clock
37
5
GPIO
A21 / SYS_CLK
46
6
GPIO
A22 / SYS_CLK2
47
7
GPIO
A23 / Oscillator_Clock
48
is a function of the EMI_MODE, EXTBOOT, and Flash security settings at reset.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
125
Table 8-3 GPIO External Signals Map (Continued)
Pins in italics are NOT available in the 56F8147 device
GPIO Port
GPIOC
GPIOD
GPIO Bit
Reset
Function
Functional Signal
Package Pin
0
Peripheral
PhaseA1 / TB0 / SCLK11
6
1
Peripheral
PhaseB1 / TB1 / MOSI11
7
2
Peripheral
Index1 / TB2 / MISO11
8
3
Peripheral
Home1 / TB3 / SSI11
9
4
Peripheral
PHASEA0 / TA0
155
5
Peripheral
PHASEB0 / TA1
156
6
Peripheral
Index0 / TA2
157
7
Peripheral
Home0 / TA3
158
8
Peripheral
ISA0
126
9
Peripheral
ISA1
127
10
Peripheral
ISA2
128
0
GPIO
CS2
55
1
GPIO
CS3
56
2
GPIO
CS4
57
3
GPIO
CS5
58
4
GPIO
CS6
59
5
GPIO
CS7
60
6
Peripheral
TXD1
49
7
Peripheral
RXD1
50
8
Peripheral
PS / CS0
53
9
Peripheral
DS / CS1
54
10
Peripheral
ISB0
61
11
Peripheral
ISB1
63
12
Peripheral
ISB2
64
56F8347 Technical Data, Rev.11
126
Freescale Semiconductor
Preliminary
Configuration
Table 8-3 GPIO External Signals Map (Continued)
Pins in italics are NOT available in the 56F8147 device
GPIO Port
GPIOE
GPIOF
GPIO Bit
Reset
Function
Functional Signal
Package Pin
0
Peripheral
TXD0
4
1
Peripheral
RXD0
5
2
Peripheral
A6
17
3
Peripheral
A7
18
4
Peripheral
SCLK0
146
5
Peripheral
MOSI0
148
6
Peripheral
MISO0
147
7
Peripheral
SS0
145
8
Peripheral
TC0
133
9
Peripheral
TC1
135
10
Peripheral
TD0
129
11
Peripheral
TD1
130
12
Peripheral
TD2
131
13
Peripheral
TD3
132
0
Peripheral
D7
28
1
Peripheral
D8
29
2
Peripheral
D9
30
3
Peripheral
D10
32
4
Peripheral
D11
149
5
Peripheral
D12
150
6
Peripheral
D13
151
7
Peripheral
D14
152
8
Peripheral
D15
153
9
Peripheral
D0
70
10
Peripheral
D1
71
11
Peripheral
D2
83
12
Peripheral
D3
86
13
Peripheral
D4
88
14
Peripheral
D5
89
15
Peripheral
D6
90
1. See Part 6.5.8 to determine how to select peripherals from this set
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
127
Part 9 Joint Test Action Group (JTAG)
9.1 JTAG Information
Please contact your Freescale marketing
device/package-specific BSDL information.
representative
or
authorized
distributor
for
Part 10 Specifications
10.1 General Characteristics
The 56F8347/56F8147 are fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital
inputs. The term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process
technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture
of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and
5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V
± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the
power savings of 3.3V I/O levels combined with the ability to receive 5V levels without damage.
Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum
is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to
the device.
Note: All specifications meet both Automotive and Industrial requirements unless individual
specifications are listed.
Note: The 56F8147 device is guaranteed to 40MHz and specified to meet Industrial requirements only.
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
56F8347 Technical Data, Rev.11
128
Freescale Semiconductor
Preliminary
General Characteristics
Note: The 56F8147 device is specified to meet Industrial requirements only; CAN is NOT available on the
56F8147 device.
Table 10-1 Absolute Maximum Ratings
(VSS = VSSA_ADC = 0)
Characteristic
Supply Voltage
ADC Supply Voltage
Oscillator / PLL Supply Voltage
Symbol
Notes
VDD_IO
VDDA_ADC,
VREFH
VREFH must be less than or
equal to VDDA_ADC
VDDA_OSC_PLL
Min
Max
Unit
-0.3
4.0
V
-0.3
4.0
V
-0.3
4.0
V
VDD_CORE
OCR_DIS is High
-0.3
3.0
V
Input Voltage (digital)
VIN
Pin Groups 1, 2, 5, 6, 9, 10
-0.3
6.0
V
Input Voltage (analog)
VINA
Pin Groups 11, 12, 13
-0.3
4.0
V
Output Voltage
VOUT
Pin Groups 1, 2, 3, 5, 6, 7, 8
-0.3
4.0
6.01
V
Output Voltage (open drain)
VOD
Pin Group 4
-0.3
6.0
V
Internal Logic Core Supply Voltage
Ambient Temperature (Automotive)
TA
-40
125
°C
Ambient Temperature (Industrial)
TA
-40
105
°C
Junction Temperature (Automotive)
TJ
-40
150
°C
Junction Temperature (Industrial)
TJ
-40
125
°C
Storage Temperature (Automotive)
TSTG
-55
150
°C
Storage Temperature (Industrial)
TSTG
-55
150
°C
1. If corresponding GPIO pin is configured as open drain.
Note: Pins in italics are NOT available in the 56F8147 device.
Pin Group 1: TXD0-1, RXD0-1, SS0, MISO0, MOSI0
Pin Group 2: PHASEA0, PHASEA1, PHASEB0, PHASEB1, INDEX0, INDEX1, HOME0, HOME1, ISB0-2, ISA0-2, TD2-3, TC0-1, SCLK0
Pin Group 3: RSTO, TDO
Pin Group 4: CAN_TX
Pin Group 5: A0-5, D0-15, GPIOD0-5, PS, DS
Pin Group 6: A6-15, GPIOB0-7, TD0-1
Pin Group 7: CLKO, WR, RD
Pin Group 8: PWMA0-5, PWMB0-5
Pin Group 9: IRQA, IRQB, RESET, EXTBOOT, TRST, TMS, TDI, CAN_RX, EMI_MODE, FAULTA0-3, FAULTB0-3
Pin Group 10: TCK
Pin Group 11: XTAL, EXTAL
Pin Group 12: ANA0-7, ANB0-7
Pin Group 13: OCR_DIS, CLKMODE
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
129
Table 10-2 56F8347/56F8147 Electrostatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
500
—
—
V
Table 10-3 Thermal Characteristics6
Characteristic
Comments
Value
Value
160-pin LQFP
160MAPBGA
Symbol
Unit
Notes
Junction to ambient
Natural convection
RθJA
38.5
34.66
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
35.4
31.24
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
33
TBD
°C/W
1, 2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
(2s2p)
31.5
TBD
°C/W
1, 2
Junction to case
RθJC
8.6
TBD
°C/W
3
Junction to center of case
ΨJT
0.8
TBD
°C/W
4, 5
I/O pin power dissipation
P I/O
User-determined
W
Power dissipation
PD
P D = (IDD x VDD + P I/O)
W
PDMAX
(TJ - TA) / RθJA7
W
Maximum allowed PD
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (ΨJT), is the "resistance" from junction to reference point thermocouple on top center
of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction temperature in steady-state customer environments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
TA = Ambient temperature
TBD = numbers will be available late Q4 2005
56F8347 Technical Data, Rev.11
130
Freescale Semiconductor
Preliminary
General Characteristics
Note: The 56F8147 device is guaranteed to 40MHz and specified to meet Industrial requirements only.
Table 10-4 Recommended Operating Conditions
(VREFLO = 0V, VSS = VSSA_ADC = 0V, VDDA = VDDA_ADC = VDDA_OSC_PLL )
Characteristic
Supply voltage
ADC Supply Voltage
Oscillator / PLL Supply Voltage
Symbol
Notes
VDD_IO
VDDA_ADC,
VREFH
VREFH must be less than
Min
Typ
Max
Unit
3
3.3
3.6
V
3
3.3
3.6
V
3
3.3
3.6
V
2.25
2.5
2.75
V
0
—
60
MHz
or equal to VDDA_ADC
VDDA_OSC
_PLL
Internal Logic Core Supply Voltage
VDD_CORE
Device Clock Frequency
FSYSCLK
OCR_DIS is High
Input High Voltage (digital)
VIH
Pin Groups 1, 2, 5, 6, 9, 10
2
—
5.5
V
Input High Voltage (analog)
VIHA
Pin Group 13
2
—
VDDA+0.3
V
Input High Voltage (XTAL/EXTAL,
VIHC
Pin Group 11
VDDA-0.8
—
VDDA+0.3
V
VIHC
Pin Group 11
2
—
VDDA+0.3
V
Input Low Voltage
VIL
Pin Groups
1, 2, 5, 6, 9, 10, 11, 13
-0.3
—
0.8
V
Output High Source Current
VOH = 2.4V (VOH min.)
IOH
Pin Groups 1, 2, 3
—
—
-4
mA
Pin Groups 5, 6, 7
—
—
-8
Pin Group 8
—
—
-12
Pin Groups 1, 2, 3, 4
—
—
4
Pin Groups 5, 6, 7
—
—
8
Pin Group 8
—
—
12
XTAL is not driven by an external clock)
Input high voltage (XTAL/EXTAL,
XTAL is driven by an external clock)
Output Low Sink Current
VOL = 0.4V (VOL max)
IOL
mA
Ambient Operating Temperature
(Automotive)
TA
-40
—
125
°C
Ambient Operating Temperature
(Industrial)
TA
-40
—
105
°C
Flash Endurance (Automotive)
(Program Erase Cycles)
NF
TA = -40°C to 125°C
10,000
—
—
Cycles
Flash Endurance (Industrial)
(Program Erase Cycles)
NF
TA = -40°C to 105°C
10,000
—
—
Cycles
Flash Data Retention
TR
TJ <= 85°C avg
15
—
—
Years
Total chip source or sink current cannot exceed 200mA
See Pin Groups in Table 10-1
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
131
10.2 DC Electrical Characteristics
Note: The 56F8147 device is specified to meet Industrial requirements only; CAN is NOT available on the
56F8147 device.
Table 10-5 DC Electrical Characteristics
At Recommended Operating Conditions; see Table 10-4
Characteristic
Symbol
Notes
Min
Typ
Max
Unit
Test
Conditions
Output High Voltage
VOH
2.4
—
—
V
IOH = IOHmax
Output Low Voltage
VOL
—
—
0.4
V
IOL = IOLmax
IIH
Pin Groups
1, 2, 5, 6, 9
—
0
+/- 2.5
μA
VIN = 3.0V to 5.5V
IIH
Pin Group 10
40
80
160
μA
VIN = 3.0V to 5.5V
IIHA
Pin Group 13
—
0
+/- 2.5
μA
VIN = VDDA
ADC Input Current High
IIHADC
Pin Group 12
—
0
+/- 10
μA
VIN = VDDA
Digital Input Current Low
IIL
Pin Groups 1, 2, 5, 6, 9
-200
-100
-50
μA
VIN = 0V
IIL
Pin Groups 1, 2, 5, 6, 9
—
0
+/- 2.5
μA
VIN = 0V
IIL
Pin Group 10
—
0
+/- 2.5
μA
VIN = 0V
IILA
Pin Group 13
—
0
+/- 2.5
μA
VIN = 0V
ADC Input Current Low
IILADC
Pin Group 12
—
0
+/- 10
μA
VIN = 0V
EXTAL Input Current Low
IEXTAL
—
0
+/- 2.5
μA
VIN = VDDA or 0V
CLKMODE = High
—
0
+/- 2.5
μA
VIN = VDDA or 0V
CLKMODE = Low
—
—
200
μA
VIN = VDDA or 0V
IOZ
Pin Groups
1, 2, 3, 4, 5, 6, 7, 8
—
0
+/- 2.5
μA
VOUT = 3.0V to
5.5V or 0V
Schmitt Trigger Input
Hysteresis
VHYS
Pin Groups
2, 6, 9, 10
—
0.3
—
V
—
Input Capacitance
(EXTAL/XTAL)
CINC
—
4.5
—
pF
—
COUTC
—
5.5
—
pF
—
CIN
—
6
—
pF
—
COUT
—
6
—
pF
—
Digital Input Current High
pull-up enabled or disabled
Digital Input Current High
with pull-down
Analog Input Current High
pull-up enabled
Digital Input Current Low
pull-up disabled
Digital Input Current Low with
pull-down
Analog Input Current Low
clock input
XTAL Input Current Low
clock input
Output Current
High Impedance State
Output Capacitance
(EXTAL/XTAL)
Input Capacitance
Output Capacitance
IXTAL
See Pin Groups in Table 10-1
56F8347 Technical Data, Rev.11
132
Freescale Semiconductor
Preliminary
DC Electrical Characteristics
Table 10-6 Power-On Reset Low Voltage Parameters
Characteristic
Symbol
Min
Typ
Max
Units
POR Trip Point
POR
1.75
1.8
1.9
V
LVI, 2.5 volt Supply, trip point1
VEI2.5
—
2.14
—
V
LVI, 3.3 volt supply, trip point2
VEI3.3
—
2.7
—
V
Bias Current
I bias
110
130
μA
1. When VDD_CORE drops below VEI2.5, an interrupt is generated.
2. When VDD_CORE drops below VEI3.3, an interrupt is generated.
Table 10-7 Current Consumption per Power Supply Pin (Typical)
On-Chip Regulator Enabled (OCR_DIS = Low)
Mode
RUN1_MAC
IDD_IO1
IDD_ADC
IDD_OSC_PLL
155mA
50mA
2.5mA
Test Conditions
• 60MHz Device Clock
• All peripheral clocks are enabled
• All peripherals running
• Continuous MAC instructions with fetches from
Data RAM
• ADC powered on and clocked
Wait3
91mA
65μA
2.5mA
• 60MHz Device Clock
• All peripheral clocks are enabled
• ADC powered off
Stop1
5.8mA
0μA
155μA
• 8MHz Device Clock
• All peripheral clocks are off
• ADC powered off
• PLL powered off
Stop2
5.1mA
0μA
145μA
• External Clock is off
• All peripheral clocks are off
• ADC powered off
• PLL powered off
1. No Output Switching
2. Includes Processor Core current supplied by internal voltage regulator
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
133
Table 10-8 Current Consumption per Power Supply Pin (Typical)
On-Chip Regulator Disabled (OCR_DIS = High)
Mode
RUN1_MAC
IDD_Core
IDD_IO1
IDD_ADC
IDD_OSC_PLL
150mA
13μA
50mA
2.5mA
Test Conditions
• 60MHz Device Clock
• All peripheral clocks are enabled
• All peripherals running
• Continuous MAC instructions with
fetches from Data RAM
• ADC powered on and clocked
Wait3
86mA
13μA
65μA
2.5mA
• 60MHz Device Clock
• All peripheral clocks are enabled
• All peripherals running
• ADC powered off
Stop1
800μA
13μA
0μA
155μA
• 8MHz Device Clock
• All peripheral clocks are off
• ADC powered off
• PLL powered off
Stop2
100μA
13μA
0μA
145μA
• External Clock is off
• All peripheral clocks are off
• ADC powered off
• PLL powered off
1. No Output Switching
Table 10-9. Regulator Parameters
Characteristic
Symbol
Min
Typical
Max
Unit
Unloaded Output Voltage
(0mA Load)
VRNL
2.25
—
2.75
V
Loaded Output Voltage
(200 mA load)
VRL
2.25
—
2.75
V
Line Regulation @ 250 mA load
(VDD33 ranges from 3.0 to 3.6)
VR
2.25
—
2.75
V
Short Circuit Current
( output shorted to ground)
Iss
—
—
700
mA
I bias
—
5.8
7
mA
Ipd
—
0
2
μA
TRSC
—
—
30
minutes
Bias Current
Power-down Current
Short-Circuit Tolerance
(output shorted to ground)
56F8347 Technical Data, Rev.11
134
Freescale Semiconductor
Preliminary
DC Electrical Characteristics
Table 10-10. PLL Parameters
Characteristics
Symbol
Min
Typical
Max
Unit
PLL Start-up time
TPS
0.3
0.5
10
ms
Resonator Start-up time
TRS
0.1
0.18
1
ms
Min-Max Period Variation
TPV
120
—
200
ps
Peak-to-Peak Jitter
TPJ
—
—
175
ps
Bias Current
IBIAS
—
1.5
2
mA
IPD
—
100
150
μA
Quiescent Current, power-down mode
10.2.1
Temperature Sense
Note: Temperature Sensor is NOT available in the 56F8147 device.
Table 10-11 Temperature Sense Parametrics
Characteristics
Symbol
Min
Typical
Max
Unit
m
—
7.762
—
mV/°C
Room Trim Temp. 1, 2
TRT
24
26
28
°C
Hot Trim Temp. (Industrial)1,2
THT
122
125
128
°C
Hot Trim Temp. (Automotive)1,2
THT
147
150
153
°C
Output Voltage @
VDDA_ADC = 3.3V, TJ =0°C1
VTS0
—
1.370
—
V
VDDA_ADC
3.0
3.3
3.6
V
Supply Current - OFF
IDD-OFF
—
—
10
μA
Supply Current - ON
IDD-ON
—
—
250
μA
Accuracy3,1 from -40°C to 150°C
Using VTS = mT + VTS0
TACC
-6.7
0
6.7
°C
Resolution4, 5,1
RES
—
0.104
—
°C / bit
Slope (Gain)1
Supply Voltage
1. Includes the ADC conversion of the analog Temperature Sense voltage.
2. The ADC is not calibrated for the conversion of the Temperature Sensor trim value stored in the Flash Memory at
FMOPT0 and FMOPT1.
3. See Application Note, AN1980, for methods to increase accuracy.
4. Assuming a 12-bit range from 0V to 3.3V.
5. Typical resolution calculated using equation, RES = (VREFH - VREFLO) X 1
212
m
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
135
10.3 AC Electrical Characteristics
Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified,
propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured
between the 10% and 90% points, as shown in Figure 10-1.
Low
VIH
Input Signal
High
90%
50%
10%
Midpoint1
VIL
Fall Time
Rise Time
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-1 Input Signal Measurement References
Figure 10-2 shows the definitions of the following signal states:
•
•
•
Active state, when a bus or signal is driven, and enters a low impedance state
Tri-stated, when a bus or signal is placed in a high impedance state
Data Valid state, when a signal level has reached VOL or VOH
•
Data Invalid state, when a signal level is in transition between VOL and VOH
Data2 Valid
Data1 Valid
Data3 Valid
Data2
Data1
Data3
Data
Tri-stated
Data Invalid State
Data Active
Data Active
Figure 10-2 Signal States
10.4 Flash Memory Characteristics
Table 10-12 Flash Timing Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Program time1
Tprog
20
—
—
μs
Erase time2
Terase
20
—
—
ms
Tme
100
—
—
ms
Mass erase time
1. There is additional overhead which is part of the programming sequence. See the 56F8300 Peripheral User Manual
for details. Program time is per 16-bit word in Flash memory. Two words at a time can be programmed within the Program Flash module, as it contains two interleaved memories.
2. Specifies page erase time. There are 512 bytes per page in the Data and Boot Flash memories. The Program Flash
module uses two interleaved Flash memories, increasing the effective page size to 1024 bytes.
56F8347 Technical Data, Rev.11
136
Freescale Semiconductor
Preliminary
External Clock Operation Timing
10.5 External Clock Operation Timing
Table 10-13 External Clock Operation Timing Requirements1
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation (external clock driver)2
fosc
0
—
120
MHz
Clock Pulse Width3
tPW
3.0
—
—
ns
External clock input rise time4
trise
—
—
10
ns
External clock input fall time5
tfall
—
—
10
ns
1. Parameters listed are guaranteed by design.
2. See Figure 10-3 for details on using the recommended connection of an external clock driver.
3. The high or low pulse width must be no smaller than 8.0ns or the chip will not function.
4. External clock input rise time is measured from 10% to 90%.
5. External clock input fall time is measured from 90% to 10%.
VIH
External
Clock
90%
50%
10%
90%
50%
10%
tfall
tPW
tPW
trise
VIL
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-3 External Clock Timing
10.6 Phase Locked Loop Timing
Table 10-14 PLL Timing
Characteristic
Symbol
Min
Typ
Max
Unit
External reference crystal frequency for the PLL1
fosc
4
8
8.4
MHz
PLL output frequency2 (fOUT)
fop
160
—
260
MHz
PLL stabilization time3 -40° to +125°C
tplls
—
1
10
ms
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly.
The PLL is optimized for 8MHz input crystal.
2. ZCLK may not exceed 60MHz. For additional information on ZCLK and (fOUT/2), please refer to the OCCS chapter in
the 56F8300 Peripheral User Manual.
3. This is the minimum time required after the PLL set up is changed to ensure reliable operation.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
137
10.7 Crystal Oscillator Timing
Table 10-15 Crystal Oscillator Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Crystal Start-up time
TCS
4
5
10
ms
Resonator Start-up time
TRS
0.1
0.18
1
ms
RESR
—
—
120
ohms
Crystal Peak-to-Peak Jitter
TD
70
—
250
ps
Crystal Min-Max Period Variation
TPV
0.12
—
1.5
ns
Resonator Peak-to-Peak Jitter
TRJ
—
—
300
ps
Resonator Min-Max Period Variation
TRP
—
—
300
ps
Bias Current, high-drive mode
IBIASH
—
250
290
μA
Bias Current, low-drive mode
IBIASL
—
80
110
μA
IPD
—
0
1
μA
Crystal ESR
Quiescent Current, power-down mode
10.8 External Memory Interface Timing
The External Memory Interface is designed to access static memory and peripheral devices. Figure 10-4
shows sample timing and parameters that are detailed in Table 10-16.
The timing of each parameter consists of both a fixed delay portion and a clock related portion, as well as
user controlled wait states. The equation:
t = D + P * (M + W)
should be used to determine the actual time of each parameter. The terms in this equation are defined as:
t
= Parameter delay time
D
= Fixed portion of the delay, due to on-chip path delays
P
= Period of the system clock, which determines the execution rate of the part
(i.e., when the device is operating at 60MHz, P = 16.67 ns)
M = Fixed portion of a clock period inherent in the design; this number is adjusted to account
for possible derating of clock duty cycle
W = Sum of the applicable wait state controls. The “Wait State Controls” column of
Table 10-16 shows the applicable controls for each parameter and the EMI chapter of the
56F8300 Peripheral User Manual details what each wait state field controls.
When using the XTAL clock input directly as the chip clock without prescaling (ZSRC selects prescaler
clock and prescaler set to ÷ 1), the EMI quadrature clock is generated using both edges of the EXTAL
clock input. In this situation only, parameter values must be adjusted for the duty cycle at XTAL.
DCAOE and DCAEO are used to make this duty cycle adjustment where needed.
56F8347 Technical Data, Rev.11
138
Freescale Semiconductor
Preliminary
External Memory Interface Timing
DCAOE and DCAEO are calculated as follows:
DCAOE = 0.5 - MAX XTAL duty cycle, if ZSRC selects prescaler clock and the prescaler is set to ÷ 1
= 0.0 all other cases
DCAEO = MIN XTAL duty cycle - 0.5, if ZSRC selects prescaler clock and the prescaler is set to ÷ 1
= 0.0 all other cases
Example of DCAOE and DCAEO calculation:
Assuming prescaler is set for ÷ 1 and prescaler clock is selected by ZSRC, if XTAL duty cycle
ranges between 45% and 60% high;
DCAOE = .50 - .60 = - 0.1
DCAEO = .45 - .50 = - 0.05
The timing of write cycles is different when WWS = 0 than when WWS > 0. Therefore, some parameters
contain two sets of numbers to account for this difference. Use the “Wait States Configuration” column
of Table 10-16 to make the appropriate selection.
A0-Axx,CS
tARDD
tRDA
tARDA
tRDRD
tRD
RD
tWR
tAWR
tWAC
tWRWR
tWRRD
tRDWR
WR
tDWR
D0-D15
tDOS
tDOH
tRDD
tAD
Data Out
tDRD
Data In
Note: During read-modify-write instructions and internal instructions, the address lines do not change state.
Figure 10-4 External Memory Interface Timing
Note:
When multiple lines are given for the same wait state configuration, calculate each and then select the
smallest or most negative.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
139
Table 10-16 External Memory Interface Timing
Characteristic
Address Valid to WR Asserted
WR Width Asserted to WR
Deasserted
Symbol
Wait States
Configuration
D
M
WWS=0
-2.121
0.50
WWS>0
-1.805
0.75 + DCAOE
WWS=0
-0.063
0.25 + DCAOE
WWS>0
-0.253
0
WWS=0
-10.252
0.25 + DCAEO
WWS=0
-2.868
0.00
WWS>0
-9.505
0.50
WWS>0
-2.552
0.25 + DCAOE
-1.512
0.25 + DCAEO
-2.047
0.25 + DCAOE
-9.000
0.50
tAWR
tWR
Data Out Valid to WR Asserted
tDWR
Wait States
Controls
Unit
WWSS
ns
WWS
ns
WWSS
ns
WWSH
ns
WWS,WWSS
ns
Valid Data Out Hold Time after WR
Deasserted
tDOH
Valid Data Out Set-Up Time to WR
Deasserted
tDOS
Valid Address after WR Deasserted
tWAC
-3.888
0.25 + DCAEO
WWSH
ns
RD Deasserted to Address Invalid
tRDA
-2.922
0.00
RWSH
ns
Address Valid to RD Deasserted
tARDD
-1.645
1.00
RWSS,RWS
ns
Valid Input Data Hold after RD
Deasserted
tDRD
0.00
N/A1
—
ns
RD Assertion Width
tRD
0.257
1.00
RWS
ns
-14.414
1.00
-19.299
1.25 + DCAOE
RWSS,RWS
ns
-2.002
0.00
RWSS
ns
-12.411
1.00
-17.297
1.25 + DCAOE
RWSS,RWS
ns
Address Valid to Input Data Valid
Address Valid to RD Asserted
RD Asserted to Input Data Valid
tAD
tARDA
tRDD
WR Deasserted to RD Asserted
tWRRD
-1.323
0.25 + DCAEO
WWSH,RWSS
ns
RD Deasserted to RD Asserted
tRDRD
-0.3572
0.00
RWSS,RWSH
MDAR3, 4
ns
WWS=0
-1.442
0.75 + DCAEO
WWS>0
-0.695
1.00
WWSS, WWSH
ns
WWS=0
-0.476
0.50
WWS>0
-0.160
0.75 + DCAOE
RWSH, WWSS,
MDAR3
ns
WR Deasserted to WR Asserted
RD Deasserted to WR Asserted
tWRWR
tRDWR
1. N/A, since device captures data before it deasserts RD
2. If RWSS = RWSH = 0, and the chip select does not change, then RD does not deassert during back-to-back reads.
3. Substitute BMDAR for MDAR if there is no chip select
4. MDAR is active in this calculation only when the chip select changes.
56F8347 Technical Data, Rev.11
140
Freescale Semiconductor
Preliminary
Reset, Stop, Wait, Mode Select, and Interrupt Timing
10.9 Reset, Stop, Wait, Mode Select, and Interrupt Timing
Table 10-17 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,2
Symbol
Typical
Min
Typical
Max
Unit
See Figure
RESET Assertion to Address, Data and Control
Signals High Impedance
tRAZ
—
21
ns
10-5
Minimum RESET Assertion Duration
tRA
16T
—
ns
10-5
RESET Deassertion to First External Address
Output3
tRDA
63T
64T
ns
10-5
Edge-sensitive Interrupt Request Width
tIRW
1.5T
—
ns
10-6
IRQA, IRQB Assertion to External Data Memory
Access Out Valid, caused by first instruction
execution in the interrupt service routine
tIDM
18T
—
ns
10-7
tIDM - FAST
14T
—
tIG
18T
—
ns
10-7
tIG - FAST
14T
—
tIRI
22T
—
ns
10-8
tIRI -FAST
18T
—
tIF
22T
—
ns
10-9
tIF - FAST
18T
—
tIW
1.5T
—
ns
10-9
Characteristic
IRQA, IRQB Assertion to General Purpose Output
Valid, caused by first instruction execution in the
interrupt service routine
Delay from IRQA Assertion (exiting Wait) to
External Data Memory Access4
Delay from IRQA Assertion to External Data
Memory Access (exiting Stop)
IRQA Width Assertion to Recover from Stop
State5
1. In the formulas, T = clock cycle. For an operating frequency of 60MHz, T = 16.67ns. At 8MHz (used during Reset and
Stop modes), T = 125ns.
2. Parameters listed are guaranteed by design.
3. During Power-On Reset, it is possible to use the device’s internal reset stretching circuitry to extend this period to 221T.
4. The minimum is specified for the duration of an edge-sensitive IRQA interrupt required to recover from the Stop state.
This is not the minimum required so that the IRQA interrupt is accepted.
5. The interrupt instruction fetch is visible on the pins only in Mode 3.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
141
RESET
tRA
tRAZ
A0–A15,
D0–D15
tRDA
First Fetch
Figure 10-5 Asynchronous Reset Timing
IRQA,
IRQB
tIRW
Figure 10-6 External Interrupt Timing (Negative-Edge Sensitive)
A0–A15,
PS, DS,
RD, WR,
IRQA,
First Interrupt Instruction Execution
tIDM
IRQB
a) First Interrupt Instruction Execution
General
Purpose
I/O Pin
IRQA,
tIG
IRQB
b) General Purpose I/O
Figure 10-7 External Level-Sensitive Interrupt Timing
56F8347 Technical Data, Rev.11
142
Freescale Semiconductor
Preliminary
Serial Peripheral Interface (SPI) Timing
IRQA,
IRQB
tIRI
A0–A15,
PS, DS,
RD, WR,
First Interrupt Vector
Instruction Fetch
Figure 10-8 Interrupt from Wait State Timing
tIW
IRQA
tIF
A0–A15,
PS, DS,
RD, WR,
First Instruction Fetch
Not IRQA Interrupt Vector
Figure 10-9 Recovery from Stop State Using Asynchronous Interrupt Timing
10.10 Serial Peripheral Interface (SPI) Timing
Table 10-18 SPI Timing1
Characteristic
Cycle time
Master
Slave
Symbol
tC
Enable lead time
Master
Slave
tELD
Enable lag time
Master
Slave
tELG
Clock (SCK) high time
Master
Slave
tCH
Min
Max
Unit
50
50
—
—
ns
ns
—
25
—
—
ns
ns
—
100
—
—
ns
ns
17.6
25
—
—
ns
ns
See Figure
10-10, 10-11,
10-12, 10-13
10-13
10-13
10-10, 10-11,
10-12, 10-13
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
143
Table 10-18 SPI Timing1 (Continued)
Characteristic
Symbol
Clock (SCK) low time
Master
Slave
tCL
Data set-up time required for inputs
Master
Slave
tDS
Data hold time required for inputs
Master
Slave
tDH
Access time (time to data active from
high-impedance state)
Slave
tA
Disable time (hold time to high-impedance state)
Slave
tD
Data Valid for outputs
Master
Slave (after enable edge)
tDV
Data invalid
Master
Slave
tDI
Rise time
Master
Slave
tR
Fall time
Master
Slave
tF
Min
Max
Unit
24.1
25
—
—
ns
ns
20
0
—
—
ns
ns
0
2
—
—
ns
ns
4.8
15
ns
3.7
15.2
ns
—
—
4.5
20.4
ns
ns
0
0
—
—
ns
ns
—
—
11.5
10.0
ns
ns
—
—
9.7
9.0
ns
ns
See Figure
10-13
10-10, 10-11,
10-12, 10-13
10-10, 10-11,
10-12, 10-13
10-13
10-13
10-10, 10-11,
10-12, 10-13
10-10, 10-11,
10-12
10-10, 10-11,
10-12, 10-13
10-10, 10-11,
10-12, 10-13
1. Parameters listed are guaranteed by design.
56F8347 Technical Data, Rev.11
144
Freescale Semiconductor
Preliminary
Serial Peripheral Interface (SPI) Timing
SS
SS is held High on master
(Input)
tC
tR
tF
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tR
tCL
SCLK (CPOL = 1)
(Output)
tDH
tCH
tDS
MISO
(Input)
MSB in
Bits 14–1
tDI
MOSI
(Output)
LSB in
tDI(ref)
tDV
Master MSB out
Bits 14–1
Master LSB out
tR
tF
Figure 10-10 SPI Master Timing (CPHA = 0)
SS
(Input)
SS is held High on master
tC
tF
tR
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tCL
SCLK (CPOL = 1)
(Output)
tCH
tDS
tR
MISO
(Input)
MSB in
tDV(ref)
MOSI
(Output)
tDH
Bits 14–1
tDI
Master MSB out
tDV
Bits 14– 1
tF
LSB in
tDI(ref)
Master LSB out
tR
Figure 10-11 SPI Master Timing (CPHA = 1)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
145
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tELG
tR
tCH
tELD
tCL
SCLK (CPOL = 1)
(Input)
tCH
tA
MISO
(Output)
Slave MSB out
tF
tR
Bits 14–1
tDS
Slave LSB out
tDV
MSB in
tDI
tDI
tDH
MOSI
(Input)
tD
Bits 14–1
LSB in
Figure 10-12 SPI Slave Timing (CPHA = 0)
SS
(Input)
tF
tC
tR
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELG
tELD
SCLK (CPOL = 1)
(Input)
tCL
tDV
tCH
tR
tA
MISO
Slave MSB out
(Output)
Bits 14–1
tDS
tDV
tDH
MOSI
(Input)
tD
tF
MSB in
Bits 14–1
Slave LSB out
tDI
LSB in
Figure 10-13 SPI Slave Timing (CPHA = 1)
56F8347 Technical Data, Rev.11
146
Freescale Semiconductor
Preliminary
Quad Timer Timing
10.11 Quad Timer Timing
Table 10-19 Timer Timing1, 2
Characteristic
Symbol
Min
Max
Unit
See Figure
PIN
2T + 6
—
ns
10-14
Timer input high / low period
PINHL
1T + 3
—
ns
10-14
Timer output period
POUT
1T - 3
—
ns
10-14
POUTHL
0.5T - 3
—
ns
10-14
Timer input period
Timer output high / low period
1. In the formulas listed, T = the clock cycle. For 60MHz operation, T = 16.67ns.
2. Parameters listed are guaranteed by design.
Timer Inputs
PIN
PINHL
PINHL
POUT
POUTHL
POUTHL
Timer Outputs
Figure 10-14 Timer Timing
10.12 Quadrature Decoder Timing
Table 10-20 Quadrature Decoder Timing1, 2
Characteristic
Symbol
Min
Max
Unit
See Figure
Quadrature input period
PIN
4T + 12
—
ns
10-15
Quadrature input high / low period
PHL
2T + 6
—
ns
10-15
Quadrature phase period
PPH
1T + 3
—
ns
10-15
1. In the formulas listed, T = the clock cycle. For 60MHz operation, T=16.67ns.
2. Parameters listed are guaranteed by design.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
147
PPH
PPH
PPH
PPH
Phase A
(Input)
PHL
PIN
PHL
Phase B
PHL
(Input)
PIN
PHL
Figure 10-15 Quadrature Decoder Timing
10.13 Serial Communication Interface (SCI) Timing
Table 10-21 SCI Timing1
Characteristic
Symbol
Min
Max
Unit
See Figure
BR
—
(fMAX/16)
Mbps
—
RXD3 Pulse Width
RXDPW
0.965/BR
1.04/BR
ns
10-16
TXD4 Pulse Width
TXDPW
0.965/BR
1.04/BR
ns
10-17
Baud Rate2
1. Parameters listed are guaranteed by design.
2. fMAX is the frequency of operation of the system clock, ZCLK, in MHz, which is 60MHz for the 56F8347 device, and
40MHz for the 56F8147 device.
3. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1.
4. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1.
RXD
SCI receive
data pin
(Input)
RXDPW
Figure 10-16 RXD Pulse Width
TXD
SCI receive
data pin
(Input)
TXDPW
Figure 10-17 TXD Pulse Width
56F8347 Technical Data, Rev.11
148
Freescale Semiconductor
Preliminary
Controller Area Network (CAN) Timing
10.14 Controller Area Network (CAN) Timing
Note: CAN is not available in the 56F8147 device.
Table 10-22 CAN Timing1
Characteristic
Baud Rate
Bus Wake Up detection
Symbol
Min
Max
Unit
See Figure
BRCAN
—
1
Mbps
—
T WAKEUP
5
—
μs
10-18
1. Parameters listed are guaranteed by design
CAN_RX
CAN receive
data pin
(Input)
T WAKEUP
Figure 10-18 Bus Wake Up Detection
10.15 JTAG Timing
Table 10-23 JTAG Timing
Characteristic
Symbol
Min
Max
Unit
See Figure
TCK frequency of operation using EOnCE 1
fOP
DC
SYS_CLK/8
MHz
10-19
TCK frequency of operation not using EOnCE1
fOP
DC
SYS_CLK/4
MHz
10-19
TCK clock pulse width
tPW
50
—
ns
10-19
TMS, TDI data set-up time
tDS
5
—
ns
10-20
TMS, TDI data hold time
tDH
5
—
ns
10-20
TCK low to TDO data valid
tDV
—
30
ns
10-20
TCK low to TDO tri-state
tTS
—
30
ns
10-20
tTRST
2T2
—
ns
10-21
TRST assertion time
1. TCK frequency of operation must be less than 1/8 the processor rate.
2. T = processor clock period (nominally 1/60MHz)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
149
1/fOP
tPW
tPW
VM
VM
VIH
TCK
(Input)
VIL
VM = VIL + (VIH – VIL)/2
Figure 10-19 Test Clock Input Timing Diagram
TCK
(Input)
TDI
TMS
(Input)
tDS
tDH
Input Data Valid
tDV
TDO
(Output)
Output Data Valid
tTS
TDO
(Output)
tDV
TDO
(Output)
Output Data Valid
Figure 10-20 Test Access Port Timing Diagram
TRST
(Input)
tTRST
Figure 10-21 TRST Timing Diagram
56F8347 Technical Data, Rev.11
150
Freescale Semiconductor
Preliminary
Analog-to-Digital Converter (ADC) Parameters
10.16 Analog-to-Digital Converter (ADC) Parameters
Table 10-24 ADC Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
VADIN
VREFL
—
VREFH
V
Resolution
RES
12
—
12
Bits
Integral Non-Linearity1
INL
—
+/- 2.4
+/- 3.2
LSB2
Differential Non-Linearity
DNL
—
+/- 0.7
< +1
LSB2
Input voltages
Monotonicity
GUARANTEED
ADC internal clock
fADIC
0.5
—
5
MHz
Conversion range
RAD
VREFL
—
VREFH
V
ADC channel power-up time
tADPU
5
6
16
tAIC cycles3
ADC reference circuit power-up time4
tVREF
—
—
25
ms
Conversion time
tADC
—
6
—
tAIC cycles3
Sample time
tADS
—
1
—
tAIC cycles3
Input capacitance
CADI
—
5
—
pF
Input injection current5, per pin
IADI
—
—
3
mA
Input injection current, total
IADIT
—
—
20
mA
VREFH current
IVREFH
—
1.2
3
mA
ADC A current
IADCA
—
25
—
mA
ADC B current
IADCB
—
25
—
mA
Quiescent current
IADCQ
—
0
10
μA
Uncalibrated Gain Error (ideal = 1)
EGAIN
—
.+/- .004
+/- .015
—
Uncalibrated Offset Voltage
VOFFSET
—
+/- 18
+/- 46
mV
Calibrated Absolute Error6
AECAL
—
See Figure 10-22
—
LSBs
Calibration Factor 17
CF1
—
-0.003141
—
—
Calibration Factor 27
CF2
—
-17.6
—
—
—
—
-60
—
dB
Vcommon
—
(VREFH - VREFLO) / 2
—
V
SNR
—
64.6
—
db
SINAD
—
59.1
—
db
Crosstalk between channels
Common Mode Voltage
Signal-to-noise ratio
Signal-to-noise plus distortion ratio
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
151
Table 10-24 ADC Parameters (Continued)
Characteristic
Symbol
Min
Typ
Max
Unit
THD
—
60.6
—
db
Spurious Free Dynamic Range
SFDR
—
61.1
—
db
Effective Number Of Bits8
ENOB
—
9.6
—
Bits
Total Harmonic Distortion
1. INL measured from Vin = .1VREFH to Vin = .9VREFH
10% to 90% Input Signal Range
2. LSB = Least Significant Bit
3. ADC clock cycles
4. Assumes each voltage reference pin is bypassed with 0.1μF ceramic capacitors to ground
5. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of
the ADC. This allows the ADC to operate in noisy industrial environments where inductive flyback is possible.
6. Absolute error includes the effects of both gain error and offset error.
7. Please see the 56F8300 Peripheral User’s Manual for additional information on ADC calibration.
8. ENOB = (SINAD - 1.76)/6.02
56F8347 Technical Data, Rev.11
152
Freescale Semiconductor
Preliminary
Analog-to-Digital Converter (ADC) Parameters
Figure 10-22 ADC Absolute Error Over Processing and Temperature Extremes Before
and After Calibration for VDCin = 0.60V and 2.70V
Note: The absolute error data shown in the graphs above reflects the effects of both gain error and offset
error. The data was taken on 15 parts: five each from four processing corner lots as well as five from one
nominally processed lot, each at three temperatures: -40°C, 27°C, and 150°C (giving the 75 data points
shown above), for two input DC voltages: 0.60V and 2.70V. The data indicates that for the given
population of parts, calibration significantly reduced (by as much as 24%) the collective variation (spread)
of the absolute error of the population. It also significantly reduced (by as much as 38%) the mean
(average) of the absolute error and thereby brought it significantly closer to the ideal value of zero.
Although not guaranteed, it is believed that calibration will produce results similar to those shown above
for any population of parts including those which represent processing and temperature extremes.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
153
10.17 Equivalent Circuit for ADC Inputs
Figure 10-23 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and
hold circuit moves to VREFH - VREFH / 2, while the other charges to the analog input voltage. When the
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about VREFH - VREFH / 2. The switches switch
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, VREF and the ADC clock frequency.
Analog Input
3
S1
(VREFH - VREFLO) / 2
1
1.
2.
3.
4.
4
C1
S2
2
S/H
S3
C2
C1 = C2 = 1pF
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
Figure 10-23 Equivalent Circuit for A/D Loading
10.18 Power Consumption
This section provides additional detail which can be used to optimize power consumption for a given
application.
Power consumption is given by the following equation:
Total power =
A:
+B:
+C:
+D:
+E:
internal [static component]
internal [state-dependent component]
internal [dynamic component]
external [dynamic component]
external [static]
A, the internal [static component], is comprised of the DC bias currents for the oscillator, PLL, and voltage
references. These sources operate independently of processor state or operating frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
56F8347 Technical Data, Rev.11
154
Freescale Semiconductor
Preliminary
Power Consumption
C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two
of the IO cell types used on the device reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Table 10-25 I/O Loading Coefficients at 10MHz
Intercept
Slope
PDU08DGZ_ME
1.3
0.11mW / pF
PDU04DGZ_ME
1.15mW
0.11mW / pF
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change. Table 10-25 provides coefficients for calculating power dissipated
in the IO cells as a function of capacitive load. In these cases:
TotalPower = Σ((Intercept +Slope*Cload)*frequency/10MHz)
where:
•
•
•
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time. The one possible exception to this is if the chip is
using the external address and data buses at a rate approaching the maximum system rate. In this case,
power from these buses can be significant.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V =
0.5 for the purposes of these rough calculations. For instance, if there is a total of 8 PWM outputs driving
10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
155
Part 11 Packaging
Note: The 160 Map Ball Grid Array is not available in the 56F8147 device.
11.1 56F8347 Package and Pin-Out Information
ANB7
ANB6
ANB5
VSS
EMI_MODE
HOME0
INDEX0
PHASEB0
PHASEA0
A0
D15
D14
D13
D12
D11
MOSI0
MISO0
SCLK0
SS0
VCAP2*
CAN_RX
CAN_TX
VPP1
TDO
TDI
TMS
TCK
TRST
TC1
VDD_IO
TC0
TD3
TD2
TD1
TD0
ISA2
ISA1
ISA0
VSS
EXTBOOT
This section contains package and pin-out information for the 56F8347. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP) and 160 Map Ball Grid Array. Figure 11-1 shows the package
lay-out for the 160-pin LQFP, and Figure 11-2 for the160 Map Ball Grid Array. Figure 11-5 for the shows
the mechanical parameters for the LQFP package and Figure 11-3 for the MBGA. Table 11-1 lists the
pin-out for the 160-pin LQFP and Table 11-2 lists the pin-out for the 160 MBGA.
Orientation Mark
VPP2
CLKO
TXD0
RXD0
PHASEA1
PHASEB1
INDEX1
HOME1
A1
A2
A3
A4
A5
VCAP4*
VDD_IO
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
VSS
D7
D8
D9
VDD_IO
D10
GPIOB0
GPIOB1
GPIOB2
GPIOB3
GPIOB4
ANB4
121
Pin 1
PWMB0
PWMB1
PWMB2
81
GPIOD2
GPIOD3
GPIOD4
GPIOD5
ISB0
VCAP1*
ISB1
ISB2
IRQA
IRQB
FAULTB0
FAULTB1
FAULTB2
D0
D1
FAULTB3
PWMA0
VSS
PWMA1
PWMA2
VDD_IO
VSS
VDD_IO
PWMB3
PWMB4
PWMB5
GPIOB5
GPIOB6
GPIOB7
TXD1
RXD1
WR
RD
PS
DS
GPIOD0
GPIOD1
41
ANB3
ANB2
ANB1
ANB0
VSSA_ADC
VDDA_ADC
VREFH
VREFP
VREFMID
VREFN
VREFLO
TEMP_SENSE
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
CLKMODE
RESET
RSTO
VDD_IO
VCAP3*
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
D5
D4
FAULTA3
D3
FAULTA2
FAULTA1
D2
FAULTA0
PWMA5
PWMA3
PWMA4
VSS
VDD_IO
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE.
Figure 11-1 Top View, 56F8347 160-Pin LQFP Package
56F8347 Technical Data, Rev.11
156
Freescale Semiconductor
Preliminary
56F8347 Package and Pin-Out Information
Table 11-1 56F8347 160-Pin LQFP Package Identification by Pin Number
Pin No.
Signal
Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
1
VDD_IO
41
VSS
81
PWMA5
121
ANB5
2
VPP2
42
VDD_IO
82
FAULTA0
122
ANB6
3
CLKO
43
PWMB3
83
D2
123
ANB7
4
TXD0
44
PWMB4
84
FAULTA1
124
EXTBOOT
5
RXD0
45
PWMB5
85
FAULTA2
125
VSS
6
PHASEA1
46
GPIOB5
86
D3
126
ISA0
7
PHASEB1
47
GPIOB6
87
FAULTA3
127
ISA1
8
INDEX1
48
GPIOB7
88
D4
128
ISA2
9
HOME1
49
TXD1
89
D5
129
TD0
10
A1
50
RXD1
90
D6
130
TD1
11
A2
51
WR
91
OCR_DIS
131
TD2
12
A3
52
RD
92
VDDA_OSC_PLL
132
TD3
13
A4
53
PS
93
XTAL
133
TC0
14
A5
54
DS
94
EXTAL
134
VDD_IO
15
VCAP4*
55
GPIOD0
95
VCAP3*
135
TC1
16
VDD_IO
56
GPIOD1
96
VDD_IO
136
TRST
17
A6
57
GPIOD2
97
RSTO
137
TCK
18
A7
58
GPIOD3
98
RESET
138
TMS
19
A8
59
GPIOD4
99
CLKMODE
139
TDI
20
A9
60
GPIOD5
100
ANA0
140
TDO
21
A10
61
ISB0
101
ANA1
141
VPP1
22
A11
62
VCAP1*
102
ANA2
142
CAN_TX
23
A12
63
ISB1
103
ANA3
143
CAN_RX
24
A13
64
ISB2
104
ANA4
144
VCAP2*
25
A14
65
IRQA
105
ANA5
145
SS0
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE.
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
157
Table 11-1 56F8347 160-Pin LQFP Package Identification by Pin Number (Continued)
Pin No.
Signal
Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
26
A15
66
IRQB
106
ANA6
146
SCLK0
27
VSS
67
FAULTB0
107
ANA7
147
MISO0
28
D7
68
FAULTB1
108
TEMP_SENSE
148
MOSI0
29
D8
69
FAULTB2
109
VREFLO
149
D11
30
D9
70
D0
110
VREFN
150
D12
31
VDD_IO
71
D1
111
VREFMID
151
D13
32
D10
72
FAULTB3
112
VREFP
152
D14
33
GPIOB0
73
PWMA0
113
VREFH
153
D15
34
GPIOB1
74
VSS
114
VDDA_ADC
154
A0
35
GPIOB2
75
PWMA1
115
VSSA_ADC
155
PHASEA0
36
GPIOB3
76
PWMA2
116
ANB0
156
PHASEB0
37
GPIOB4
77
VDD_IO
117
ANB1
157
INDEX0
38
PWMB0
78
PWMA3
118
ANB2
158
HOME0
39
PWMB1
79
PWMA4
119
ANB3
159
EMI_MODE
40
PWMB2
80
VSS
120
ANB4
160
VSS
56F8347 Technical Data, Rev.11
158
Freescale Semiconductor
Preliminary
56F8347 Package and Pin-Out Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
D15
D12
D11
SCLK0
VPP1
TMS
TC0
TD1
ISA0
ANB7
ANB5
ANB4
D13
MOSI0 CAN_RX
TDI
TC1
TD0
EXTBOOT ANB6
ANB3
ANB1
A
INDEX0 PHASEA0
B
TXD0
EMI_ HOME0 PHASEB0
MODE
C
PHASEA1 VPP2
A0
D14
PHASEB1 RXD0
CLKO
MISO0
SS0
CAN_TX
TDO
TCK
TRST
TD2
A1
A2
VDD_IO
VSS
VSS
VCAP2
VDD_IO
TD3
ISA1
D
ANB2
ANB0 VDDA_ADC
ISA2 VSSA_ADC VREFP
VREFH
E
HOME1 INDEX1
TEMP_ VREFLO
SENSE
ANA7
VREFMID
F
A4
A3
A5
VDD_IO
VDD_IO
ANA4
ANA3
VREFN
A6
A8
A7
VCAP4
VSS
ANA2
ANA0
ANA6
A9
A10
A12
A11
VCAP3
CLK
MODE
ANA1
ANA5
A13
A14
A15
VSS
VSS
EXTAL
RSTO
RESET
D7
D9
D8
D10
VSS
XTAL
VDDA_
OSC_PLL
OCR_DIS
D6
D5
D3
D4
G
H
J
K
VDD_IO GPIOD2 VDD_IO
VCAP1
IRQA
VDD_IO
L
GPIOB0 GPIOB2 GPIOB1
WR
DS
GPIOD1 GPIOD5
ISB1 FAULTB1 FAULTB2
M
GPIOB3 GPIOB4 PWMB5 GPIOB7
PWMA0 PWMA3 FAULTA2 FAULTA3
N
PWMB0 PWMB2 PWMB3 GPIOB5
RXD1
PS
GPIOD3
ISB0 FAULTB0
D1
PWMA2 PWMA5 FAULTA0 FAULTA1
ISB2
D0
FAULTB3 PWMA1 PWMA4
P
PWMB1 PWMB4 GPIOB6
TXD1
RD
GPIOD0 GPIOD4
IRQB
D2
Figure 11-2 Top View, 56F8347 160-Pin MAPBGA Package
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
159
Table 11-2 56F8347 -160 MAPBGA Package Identification by Pin Number
Ball
No.
Signal Name
Ball
No.
Signal Name
Ball
No.
Signal Name
Ball
No.
Signal Name
F4
VDD_IO
K11
VSS
N12
PWMA5
A13
ANB5
C2
VPP2
K7
VDD_IO
N13
FAULTA0
B12
ANB6
D3
CLKO
N3
PWMB3
P14
D2
A12
ANB7
B1
TXD0
P2
PWMB4
N14
FAULTA1
B11
EXTBOOT
D2
RXD0
M3
PWMB5
M13
FAULTA2
J11
VSS
C1
PHASEA1
N4
GPIOB5
L13
D3
A11
ISA0
D1
PHASEB1
P3
GPIOB6
M14
FAULTA3
C11
ISA1
E2
INDEX1
M4
GPIOB7
L14
D4
D11
ISA2
E1
HOME1
P4
TXD1
L12
D5
B10
TD0
E3
A1
N5
RXD1
L11
D6
A10
TD1
E4
A2
L4
WR
K14
OCR_DIS
D10
TD2
F2
A3
P5
RD
K13
VDDA_OSC_PLL
E10
TD3
F1
A4
N6
PS
K12
XTAL
A9
TC0
F3
A5
L5
DS
J12
EXTAL
F11
VDD_IO
G4
VCAP4*
P6
GPIOD0
H11
VCAP3*
B9
TC1
K5
VDD_IO
L6
GPIOD1
K10
VDD_IO
D9
TRST
G1
A6
K6
GPIOD2
J13
RSTO
D8
TCK
G3
A7
N7
GPIOD3
J14
RESET
A8
TMS
G2
A8
P7
GPIOD4
H12
CLKMODE
B8
TDI
H1
A9
L7
GPIOD5
G13
ANA0
D7
TDO
H2
A10
N8
ISB0
H13
ANA1
A7
VPP1
H4
A11
K8
VCAP1*
G12
ANA2
D6
CAN_TX
H3
A12
L8
ISB1
F13
ANA3
B7
CAN_RX
J1
A13
P8
ISB2
F12
ANA4
E8
VCAP2*
J2
A14
K9
IRQA
H14
ANA5
D5
SS0
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE.
56F8347 Technical Data, Rev.11
160
Freescale Semiconductor
Preliminary
56F8347 Package and Pin-Out Information
Table 11-2 56F8347 -160 MAPBGA Package Identification by Pin Number (Continued)
Ball
No.
Signal Name
Ball
No.
Signal Name
Ball
No.
Signal Name
Ball
No.
Signal Name
J3
A15
P9
IRQB
G14
ANA6
A6
SCLK0
J4
VSS
N9
FAULTB0
E13
ANA7
D4
MISO0
K1
D7
L9
FAULTB1
E11
TEMP_SENSE
B6
MOSI0
K3
D8
L10
FAULTB2
E12
VREFLO
A5
D11
K2
D9
P10
D0
F14
VREFN
A4
D12
E5
VDD_IO
N10
D1
E14
VREFMID
B5
D13
K4
D10
P11
FAULTB3
D13
VREFP
C4
D14
L1
GPIOB0
M11
PWMA0
D14
VREFH
A3
D15
L3
GPIOB1
G11
VSS
C14
VDDA_ADC
C3
A0
L2
GPIOB2
P12
PWMA1
D12
VSSA_ADC
A2
PHASEA0
M1
GPIOB3
N11
PWMA2
C13
ANB0
B4
PHASEB0
M2
GPIOB4
E9
VDD_IO
B14
ANB1
A1
INDEX0
N1
PWMB0
M12
PWMA3
C12
ANB2
B3
HOME0
P1
PWMB1
P13
PWMA4
B13
ANB3
B2
EMI_MODE
N2
PWMB2
E7
VSS
A14
ANB4
E6
VSS
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
161
D
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
M
K
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
E
MILLIMETERS
DIM MIN MAX
A
1.32
1.75
A1
0.27
0.47
A2
1.18 REF
b
0.35
0.65
D
15.00 BSC
E
15.00 BSC
e
1.00 BSC
S
0.50 BSC
0.20
13X
e
S
14 13 12 11 10
9
6
5
4
3
2
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
1
A
B
C
13X
5
D
S
E
e
F
A
0.30 Z
A2
G
H
J
A1
K
L
M
160X
Z
0.15 Z
4
DETAIL K
ROTATED 90 ° CLOCKWISE
N
P
3
160X
b
0.30 Z X Y
VIEW M-M
0.10 Z
CASE 1268-01
ISSUE O
DATE 04/06/98
Figure 11-3 160 MAPBGA Mechanical Information
Please see http://www.freescale.com for the most current mechanical drawing.
56F8347 Technical Data, Rev.11
162
Freescale Semiconductor
Preliminary
56F8147 Package and Pin-Out Information
11.2 56F8147 Package and Pin-Out Information
ANB7
ANB6
ANB5
VSS
EMI_MODE
HOME0
INDEX0
PHASEB0
PHASEA0
A0
D15
D14
D13
D12
D11
MOSI0
MISO0
SCLK0
SS0
VCAP2*
NC
NC
VPP1
TDO
TDI
TMS
TCK
TRST
TC1
VDD_IO
TC0
GPIOE13
GPIOE12
GPIOE11
GPIOE10
GPIOC10
GPIOC9
GPIOC8
VSS
EXTBOOT
This section contains package and pin-out information for the 56F8147. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP). Figure 11-4 shows the package outline for the 160-pin LQFP,
Figure 11-5 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out for the
160-pin LQFP.
Orientation Mark
VDD_IO
VPP2
CLKO
TXD0
RXD0
SCLK1
MOSI1
MISO1
SS1
A1
A2
A3
A4
A5
VCAP4*
VDD_IO
ANB4
121
Pin 1
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
VSS
D7
D8
D9
VDD_IO
D10
GPIOB0
GPIOB1
GPIOB2
GPIOB3
GPIOB4
81
GPIOD2
GPIOD3
GPIOD4
GPIOD5
ISB0
VCAP1*
ISB1
ISB2
IRQA
IRQB
FAULTB0
FAULTB1
FAULTB2
D0
D1
FAULTB3
NC
VSS
NC
NC
VDD_IO
VSS
VDD_IO
PWMB3
PWMB4
PWMB5
GPIOB5
GPIOB6
GPIOB7
TXD1
RXD1
WR
RD
PS
DS
GPIOD0
GPIOD1
41
D2
NC
NC
NC
NC
VSS
PWMB0
PWMB1
PWMB2
ANB3
ANB2
ANB1
ANB0
VSSA_ADC
VDDA_ADC
VREFH
VREFP
VREFMID
VREFN
VREFLO
NC
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
CLKMODE
RESET
RSTO
VDD_IO
VCAP3*
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
D5
D4
NC
D3
NC
NC
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE.
Figure 11-4 Top View, 56F8147 160-Pin LQFP Package
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
163
Table 11-3 56F8147 160-Pin LQFP Package Identification by Pin Number
Pin No.
Signal
Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
1
VDD_IO
41
VSS
81
NC
121
ANB5
2
VPP2
42
VDD_IO
82
NC
122
ANB6
3
CLKO
43
PWMB3
83
D2
123
ANB7
4
TXD0
44
PWMB4
84
NC
124
EXTBOOT
5
RXD0
45
PWMB5
85
NC
125
VSS
6
SCLK1
46
GPIOB5
86
D3
126
GPIOC8
7
MOSI1
47
GPIOB6
87
NC
127
GPIOC9
8
MISO1
48
GPIOB7
88
D4
128
GPIOC10
9
SS1
49
TXD1
89
D5
129
GPIOE10
10
A1
50
RXD1
90
D6
130
GPIOE11
11
A2
51
WR
91
OCR_DIS
131
GPIOE12
12
A3
52
RD
92
VDDA_OSC_PLL
132
GPIOE13
13
A4
53
PS
93
XTAL
133
TC0
14
A5
54
DS
94
EXTAL
134
VDD_IO
15
VCAP4*
55
GPIOD0
95
VCAP3*
135
TC1
16
VDD_IO
56
GPIOD1
96
VDD_IO
136
TRST
17
A6
57
GPIOD2
97
RSTO
137
TCK
18
A7
58
GPIOD3
98
RESET
138
TMS
19
A8
59
GPIOD4
99
CLKMODE
139
TDI
20
A9
60
GPIOD5
100
ANA0
140
TDO
21
A10
61
ISB0
101
ANA1
141
VPP1
22
A11
62
VCAP1*
102
ANA2
142
NC
23
A12
63
ISB1
103
ANA3
143
NC
24
A13
64
ISB2
104
ANA4
144
VCAP2*
25
A14
65
IRQA
105
ANA5
145
SS0
* When the on-chip regulator is disabled, these four pins become 2.5V VDD_CORE
56F8347 Technical Data, Rev.11
164
Freescale Semiconductor
Preliminary
56F8147 Package and Pin-Out Information
Table 11-3 56F8147 160-Pin LQFP Package Identification by Pin Number (Continued)
Pin No.
Signal
Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
26
A15
66
IRQB
106
ANA6
146
SCLK0
27
VSS
67
FAULTB0
107
ANA7
147
MISO0
28
D7
68
FAULTB1
108
NC
148
MOSI0
29
D8
69
FAULTB2
109
VREFLO
149
D11
30
D9
70
D0
110
VREFN
150
D12
31
VDD_IO
71
D1
111
VREFMID
151
D13
32
D10
72
FAULTB3
112
VREFP
152
D14
33
GPIOB0
73
NC
113
VREFH
153
D15
34
GPIOB1
74
VSS
114
VDDA_ADC
154
A0
35
GPIOB2
75
NC
115
VSSA_ADC
155
PHASEA0
36
GPIOB3
76
NC
116
ANB0
156
PHASEB0
37
GPIOB4
77
VDD_IO
117
ANB1
157
INDEX0
38
PWMB0
78
NC
118
ANB2
158
HOME0
39
PWMB1
79
NC
119
ANB3
159
EMI_MODE
40
PWMB2
80
VSS
120
ANB4
160
VSS
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
165
160X
0.20 C A-B D
D
D
2
b
GG
c1
D
c
6
SECTION G-G
E
2
E1
2
E
E1
B
A
(b)
D1
2
D1
4X
0.20 H A-B D
DETAIL F
C
SEATING
PLANE
0.08 C
e
e/2
156X
4X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUMS A, B, AND D TO BE DETERMINED
WHERE THE LEADS EXIT THE PLASTIC BODY
AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25mm PER SIDE.
DIMENSIONS D1 AND E1 ARE MAXIMUM
PLASTIC BODY SIZE DIMENSIONS
INCLUDING MOLD MISMATCH.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM b
DIMENSION BY MORE THAN 0.08mm.
DAMBAR CAN NOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN A PROTRUSION AND AN
ADJACENT LEAD IS 0.07mm.
6. EXACT SHAPE OF CORNERS MAY VARY.
160X
e
0.08
M
C A-B D
θ1
R1
R2
A2
A
θ2
A1
θ3
H
θ
S
L
(L1)
0.25
GAGE
PLANE
DETAIL F
MILLIMETERS
DIM MIN MAX
A
--1.60
A1
0.05
0.15
A2
1.35
1.45
b
0.17
0.27
b1
0.17
0.23
c
0.09
0.20
c1
0.09
0.16
D
26.00 BSC
D1
24.00 BSC
e
0.50 BSC
E
26.00 BSC
E1
24.00 BSC
L
0.45
0.75
L1
1.00 REF
R1
0.08
--R2
0.08
0.20
S
0.20
--θ
0°
7°
θ1
0°
--θ2
11 °
13 °
θ3
11 °
13 °
CASE 1259 01
Figure 11-5 160-pin LQFP Mechanical Information
Please see http://www.freescale.com for the most current mechanical drawing.
56F8347 Technical Data, Rev.11
166
Freescale Semiconductor
Preliminary
Thermal Design Considerations
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
TA = Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (oC/W)
PD = Power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single-layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJΑ = RθJC + RθCΑ
where:
RθJA
RθJC
RθCA
= Package junction-to-ambient thermal resistance °C/W
= Package junction-to-case thermal resistance °C/W
= Package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA . For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TT = Thermocouple temperature on top of package (oC)
ΨJT = Thermal characterization parameter (oC)/W
PD = Power dissipation in package (W)
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
167
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
Use the following list of considerations to assure correct device operation:
•
Provide a low-impedance path from the board power supply to each VDD pin on the device, and from the
board ground to each VSS (GND) pin
•
The minimum bypass requirement is to place six 0.01–0.1μF capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
performance tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are less than 0.5 inch per capacitor lead
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and VSS
•
•
•
Bypass the VDD and VSS layers of the PCB with approximately 100μF, preferably with a high-grade
capacitor such as a tantalum capacitor
56F8347 Technical Data, Rev.11
168
Freescale Semiconductor
Preliminary
Power Distribution and I/O Ring Implementation
•
•
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the VDD and VSS circuits.
•
Take special care to minimize noise levels on the VREF, VDDA and VSSA pins
•
Designs that utilize the TRST pin for JTAG port or EOnCE module functionality (such as development or
debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means
to assert TRST independently of RESET. Designs that do not require debugging functionality, such as
consumer products, should tie these pins together.
Because the Flash memory is programmed through the JTAG/EOnCE port, the designer should provide an
interface to this port to allow in-circuit Flash programming
•
12.3 Power Distribution and I/O Ring Implementation
Figure 12-1 illustrates the general power control incorporated in the 56F8347/56F8147. This chip
contains two internal power regulators. One of them is powered from the VDDA_OSC_PLL pin and cannot
be turned off. This regulator controls power to the internal clock generation circuitry. The other regulator
is powered from the VDD_IO pins and provides power to all of the internal digital logic of the core, all
peripherals and the internal memories. This regulator can be turned off, if an external VDD_CORE voltage
is externally applied to the VCAP pins.
In summary, the entire chip can be supplied from a single 3.3 volt supply if the large core regulator is
enabled. If the regulator is not enabled, a dual supply 3.3V/2.5V configuration can also be used.
Notes:
•
•
Flash, RAM and internal logic are powered from the core regulator output
VPP1 and VPP2 are not connected in the customer system
•
All circuitry, analog and digital, shares a common VSS bus
VDDA_OSC_PLL
VDDA_ADC
VDD
REG
VCAP
REG
I/O
ADC
CORE
OSC
VSS
VREFH
VREFP
VREFMID
VREFN
VREFLO
VSSA_ADC
Figure 12-1 Power Management
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
169
Part 13 Ordering Information
Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor
sales office or authorized distributor to determine availability and to order parts.
Table 13-1 56F8347/56F8147 Ordering Information
Part
Supply
Voltage
Package Type
Pin
Count
Frequency
(MHz)
Ambient
Temperature
Range
Order Number
MC56F8347
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160
60
-40° to + 105°C
MC56F8347VPY60
MC56F8147
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160
40
-40° to + 105°C
MC56F8147VPY
MC56F8347
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160
60
-40° to + 105°C
MC56F8347VPYE*
MC56F8347
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160
60
-40° to + 125°C
MC56F8347MPYE*
MC56F8147
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160
40
-40° to + 105°C
MC56F8147VPYE*
MC56F8347
3.0–3.6 V
Mold Array Process Ball Grid Array
(MAPBGA)
160
60
-40° to + 105°C
MC56F8347VVF*
*This package is RoHS compliant.
56F8347 Technical Data, Rev.11
170
Freescale Semiconductor
Preliminary
Power Distribution and I/O Ring Implementation
56F8347 Technical Data, Rev.11
Freescale Semiconductor
Preliminary
171
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
[email protected]
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
[email protected]escale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
[email protected]
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064, Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
[email protected]
RoHS-compliant and/or Pb-free versions of Freescale products have the
functionality and electrical characteristics of their non-RoHS-compliant
and/or non-Pb-free counterparts. For further information, see
http://www.freescale.com or contact your Freescale sales representative.
For information on Freescale’s Environmental Products program, go to
http://www.freescale.com/epp.
Information in this document is provided solely to enable system and
software implementers to use Freescale Semiconductor products. There are
no express or implied copyright licenses granted hereunder to design or
fabricate any integrated circuits or integrated circuits based on the
information in this document.
Freescale Semiconductor reserves the right to make changes without further
notice to any products herein. Freescale Semiconductor makes no warranty,
representation or guarantee regarding the suitability of its products for any
particular purpose, nor does Freescale Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or
incidental damages. “Typical” parameters that may be provided in Freescale
Semiconductor data sheets and/or specifications can and do vary in different
applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer
application by customer’s technical experts. Freescale Semiconductor does
not convey any license under its patent rights nor the rights of others.
Freescale Semiconductor products are not designed, intended, or authorized
for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other
application in which the failure of the Freescale Semiconductor product could
create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold Freescale
Semiconductor and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized
use, even if such claim alleges that Freescale Semiconductor was negligent
regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor,
Inc. All other product or service names are the property of their respective owners.
This product incorporates SuperFlash® technology licensed from SST.
© Freescale Semiconductor, Inc. 2005, 2006. All rights reserved.
MC56F8347
Rev.11
01/2007