FREESCALE MC56F8013

56F8013/56F8011
Data Sheet
Preliminary Technical Data
56F8000
16-bit Digital Signal Controllers
MC56F8013
Rev. 10
01/2007
freescale.com
Document Revision History
Version History
Description of Change
Rev. 0
Initial release.
Rev. 1
Updates to Part 10, Specifications,
Table 10-1, added maximum clamp current, per pin
Table 10-12, clarified variation over temperature table and graph
Table 10-16, added LIN slave timing
Rev. 2
Added alternate pins to Figure 11-1 and Table 11-1.
Rev. 3
Corrected ADC offering on page 3, clarified Section 1.4.1, corrected bit selects in Timer
Channel 3 Input (TC3_INP) bit 9, Section 6.3.1.7, and simplified notes in Table 10-9.
Rev. 4
Added clarification on sync inputs in Section 1.4.1, added voltage difference specification to
Table 10-1 and Table 10-4, deleted formula for Ambient Operating Temperature in
Table 10-4, also a note for pin group 3 to Table 10-1, corrected Table 8-1, error in Port C
peripheral function configuration, removed text from notes in Table 10-9 that referred to
multiple flash blocks - this family has one flash block. Added RoHs and “pb-free” language to
back cover.
Rev. 5
Updates to Section 10
Table 10-5, corrected max values for ADC Input Current High and Low; corrected typ value
for pull-up disabled Digital Input Current Low (a)
Table 10-6, corrected typ and added max values for Standby > Stop and Powerdown modes
Table 10-7, corrected min value for Low-Voltage Interrupt for 3.3V
Table 10-11, corrected typ and max values and units for PLL lock time
Table 10-12, corrected typ values for Relaxation Oscillator output frequency and variation
over temperature (also increased temp range to 150 degreesC) and added variation over
temperature from 0—105 degreesC
Updated Figure 10-5
Table 10-19, updated max values for Integral Non-Linearity full input signal range, Negative
Differential Non-Linearity, ADC internal clock, Offset Voltage Internal Ref, Gain Error and
Offset Voltage External Ref; updated typ values for Negative Differential Non-Linearity, Offset
Voltage Internal Ref, Gain Error and Offset Voltage External Ref; added new min values and
corrected typ values for Signal-to-noise ratio, Total Harmonic Distortion, Spurious Free
Dynamic Range, Signal-to-noise plus distortion, Effective Number of Bits
Rev. 6
Added details to Section 1. Clarified language in State During Reset column in Table 2-3;
corrected flash data retention temperature in Table 10-4; moved input current high/low
toTable 10-19 and location of footnotes in Table 10-5; reorganized Table 10-19; clarified title
of Figure 10-1.
Rev. 7
Added information on automotive device for 56F8013.
Added information on 56F8011device; edited to indicate differences in 56F8013 and 56F8011
devices.
Updated values for VEI3.3 and VEI2.5 in Table 10-7.
Deleted values for input and output voltage in Table 10-8.
Added row for MC56F8013MFAE in Table 10-12.
56F8013/56F8011 Data Sheet, Rev. 10
2
Freescale Semiconductor
Preliminary
Document Revision History (Continued)
Version History
Rev. 8
Description of Change
• In Table 10-4, added an entry for flash data retention with less than 100 program/erase
cycles (minimum 20 years).
• In Table 10-6, changed the device clock speed in STOP mode from 8MHz to 4MHz.
• In Table 10-12, changed the typical relaxation oscillator output frequency in Standby mode
from 400kHz to 200kHz.
Rev. 9
In Table 10-19, changed the maximum ADC internal clock frequency from 8MHz to 5.33MHz.
Rev. 10
Added the following note to the description of the TMS signal in Table 2-3:
Note: Always tie the TMS pin to VDD through a 2.2K resistor.
Please see http://www.freescale.com for the most current data sheet revision.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
3
56F8013/56F8011 General Description
Note: Features in italics describe the 56F8011 device.
• Up to 32 MIPS at 32MHz core frequency
• One Serial Peripheral Interface (SPI)
• DSP and MCU functionality in a unified,
C-efficient architecture
• One 16-bit Quad Timer
• One Inter-Integrated Circuit (I2C) Port
• 56F8013 device offers 16KB Program Flash
56F8011 device offers 12KB Program Flash
• Computer Operating Properly (COP)/Watchdog
• 56F8013 device offers 4KB Unified Data/Program
RAM
56F8011 device offers 2KB Unified Data/Program
RAM
• Integrated Power-On Reset and Low-Voltage Interrupt
Module
• On-Chip Relaxation Oscillator
• One 6-channel PWM module
• JTAG/Enhanced On-Chip Emulation (OnCE™) for
unobtrusive, real-time debugging
• Two 3-channel 12-bit ADCs
• Up to 26 GPIO lines
• One Serial Communication Interface (SCI) with LIN
slave functionality
• 32-pin LQFP Package
VCAP
RESET
7
PWM Outputs
JTAG/EOnCE
Port or
GPIOD
PWM
or Timer Port
or GPIOA
AD0
3
AD1
VSS
VDDA
VSSA
2
Digital Reg
Analog Reg
Low-Voltage
Supervisor
16-Bit
56800E Core
Address
Generation Unit
Program Controller
and Hardware
Looping Unit
3
VDD
4
Data ALU
16 x 16 + 36 -> 36-Bit MAC
Three 16-bit Input Registers
Four 36-bit Accumulators
Bit
Manipulation
Unit
PAB
PDB
CDBR
CDBW
ADC
or
GPIOC
Memory
Program Memory
8K x 16 Flash
6K x 16 Flash
Unified Data /
Program RAM
4KB
2KB
R/W Control
XDB2
XAB1
XAB2
System Bus
Control
PAB
PDB
CDBR
CDBW
IPBus Bridge (IPBB)
2
Timer or
GPIOB
SPI or I2C
or Timer
or GPIOB
4
SCI
or I2C
or GPIOB
COP/
Watchdog
Interrupt
Controller
System
Integration
Module
2
P
O
R
O
Clock
S
Generator* C
*Includes On-Chip
Relaxation Oscillator
56F8013/56F8011 Block Diagram
56F8013/56F8011 Data Sheet, Rev. 10
4
Freescale Semiconductor
Preliminary
56F8013/56F8011 Data Sheet Table of Contents
Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . 6
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
56F8013/56F8011 Features . . . . . . . . . . . . . . 6
56F8013/56F8011 Description . . . . . . . . . . . 8
Award-Winning Development Environment . 9
Architecture Block Diagram . . . . . . . . . . . . . 9
Product Documentation . . . . . . . . . . . . . . . 13
Data Sheet Conventions . . . . . . . . . . . . . . . 13
Part 2: Signal/Connection Descriptions . . 14
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2. 56F8013/56F8011 Signal Pins . . . . . . . . . . 18
Part 3: OCCS . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1.
3.2.
3.3.
3.4.
3.5.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Operating Modes . . . . . . . . . . . . . . . . . . . . . 26
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 28
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . 29
Part 4: Memory Map . . . . . . . . . . . . . . . . . . 29
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 29
Interrupt Vector Table . . . . . . . . . . . . . . . . . 29
Program Map . . . . . . . . . . . . . . . . . . . . . . . 31
Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
EOnCE Memory Map . . . . . . . . . . . . . . . . . . 34
Peripheral Memory Mapped Registers . . . . 35
Part 5: Interrupt Controller (ITCN) . . . . . . . 44
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 44
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Functional Description . . . . . . . . . . . . . . . . 44
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 46
Operating Modes . . . . . . . . . . . . . . . . . . . . . 46
Register Descriptions . . . . . . . . . . . . . . . . . . 47
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Part 6: System Integration Module (SIM). . 63
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . .
Register Descriptions . . . . . . . . . . . . . . . . .
Clock Generation Overview . . . . . . . . . . . .
Power-Down Modes . . . . . . . . . . . . . . . . . .
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . .
63
64
65
78
78
80
82
83
Part 8: General Purpose Input/Output
(GPIO) . . . . . . . . . . . . . . . . . . . . . . . . .85
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 85
8.2. Configuration . . . . . . . . . . . . . . . . . . . . . . . . 85
8.3. Reset Values . . . . . . . . . . . . . . . . . . . . . . . . 87
Part 9: Joint Test Action Group (JTAG) . . . 92
9.1. 56F8013/56F8011 Information . . . . . . . . . . 92
Part 10: Specifications. . . . . . . . . . . . . . . . . 92
10.1. General Characteristics . . . . . . . . . . . . . . . 92
10.2. DC Electrical Characteristics . . . . . . . . . . . 96
10.3. AC Electrical Characteristics . . . . . . . . . . . 98
10.4. Flash Memory Characteristics . . . . . . . . . . 99
10.5. External Clock Operation Timing . . . . . . . 100
10.6. Phase Locked Loop Timing . . . . . . . . . . . 100
10.7. Relaxation Oscillator Timing. . . . . . . . . . . 101
10.8. Reset, Stop, Wait, Mode Select, and
Interrupt Timing . . . . . . . . . . . . . . 102
10.9. Serial Peripheral Interface
(SPI) Timing . . . . . . . . . . . . . . . . 104
10.10. Quad Timer Timing. . . . . . . . . . . . . . . . . 107
10.11. Serial Communication Interface
(SCI) Timing. . . . . . . . . . . . . . . . . 109
10.12. Inter-Integrated Circuit Interface
(I2C) Timing . . . . . . . . . . . . . . . . . 110
10.13. JTAG Timing. . . . . . . . . . . . . . . . . . . . . . 111
10.14. Analog-to-Digital Converter
(ADC) Parameters . . . . . . . . . . . 113
10.15. Equivalent Circuit for ADC Inputs . . . . . . 114
10.16. Power Consumption . . . . . . . . . . . . . . . . 114
Part 11: Packaging . . . . . . . . . . . . . . . . . . .117
11.1. 56F8013/56F8011 Package and
Pin-Out Information . . . . . . . . . . . 117
Part 12: Design Considerations . . . . . . . . .120
12.1. Thermal Design Considerations . . . . . . . . 120
12.2. Electrical Design Considerations . . . . . . . 122
Part 13: Ordering Information . . . . . . . . . . 124
Part 14: Appendix. . . . . . . . . . . . . . . . . . . . 124
Part 7: Security Features . . . . . . . . . . . . . . . 83
7.1. Operation with Security Enabled . . . . . . . . 84
7.2. Flash Access Lock and
Unlock Mechanisms . . . . . . . . . . . 84
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
5
Part 1 Overview
1.1 56F8013/56F8011 Features
1.1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.1.2
Digital Signal Controller Core
Efficient 16-bit 56800E family Digital Signal Controller (DSC) engine with dual Harvard architecture
As many as 32 Million Instructions Per Second (MIPS) at 32MHz core frequency
Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
Four 36-bit accumulators, including extension bits
32-bit arithmetic and logic multi-bit shifter
Parallel instruction set with unique DSP addressing modes
Hardware DO and REP loops
Three internal address buses
Four internal data buses
Instruction set supports both DSP and controller functions
Controller-style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent, real-time
debugging
Differences Between Devices
Table 1-1 outlines the key differences between the 56F8013 and 56F8011 devices.
Table 1-1 Device Differences
1.1.3
•
•
•
Feature
56F8013
56F8011
Program Flash
16KB
12KB
Unified Data/Program RAM
4KB
2KB
Memory
Dual Harvard architecture permits as many as three simultaneous accesses to program and data
memory
Flash security and protection that prevent unauthorized users from gaining access to the internal
Flash
On-chip memory:
— 16KB of Program Flash (56F8013 device)
12KB of Program Flash (56F8011 device)
— 4KB of Unified Data/Program RAM (56F8013 device)
2KB of Unified Data/Program RAM (56F8011 device)
•
EEPROM emulation capability using Flash
56F8013/56F8011 Data Sheet, Rev. 10
6
Freescale Semiconductor
Preliminary
56F8013/56F8011 Features
1.1.4
•
•
•
•
•
•
•
•
•
Peripheral Circuits for 56F8013/56F8011
One multi-function six-output Pulse Width Modulator (PWM) module
— Up to 96MHz PWM operating clock
— 15 bits of resolution
— Center-aligned and Edge-aligned PWM signal mode
— Four programmable fault inputs with programmable digital filter
— Double-buffered PWM registers
— Taking into account values setting ADC high- and low-limit registers, each complementary
PWM signal pair allows selection of a PWM supply source from:
– PWM generator
– External GPIO
– Internal timers
– ADC conversion result
Two independent 12-bit Analog-to-Digital Converters (ADCs)
— 2 x 3 channel inputs
— Supports both simultaneous and sequential conversions
— ADC conversions can be synchronized by both PWM and timer modules
— Sampling rate up to 2.67MSPS
— 8-word result buffer registers
— ADC Smart Power Management (Auto-standby, auto-powerdown)
One 16-bit multi-purpose Quad Timer module (TMR)
— Up to 96MHz operating clock
— Four independent 16-bit counter/timers with cascading capability
— Each timer has capture and compare capability
— Up to 12 operating modes
One Serial Communication Interface (SCI) with LIN Slave functionality
— Full-duplex or single-wire operation
— Two receiver wake-up methods:
– Idle line
– Address mark
One Serial Peripheral Interface (SPI)
— Full-duplex operation
— Master and slave modes
— Programmable Length Transactions (2 to 16 bits)
One Inter-Integrated Circuit (I2C) port
— Operates up to 400kbps
— Supports both master and slave operation
Computer Operating Properly (COP)/Watchdog timer capable of selecting different clock sources
Up to 26 General-Purpose I/O (GPIO) pins with 5V tolerance
Integrated Power-On Reset and Low-Voltage Interrupt Module
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
7
•
•
•
•
1.1.5
•
•
•
•
•
Phase Lock Loop (PLL) provides a high-speed clock to the core and peripherals
Clock Sources:
— On-chip relaxation oscillator
— External clock source
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
JTAG/EOnCE debug programming interface for real-time debugging
Energy Information
Fabricated in high-density CMOS with 5V tolerance
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
Wait and Stop modes available
ADC smart power management
Each peripheral can be individually disabled to save power
1.2 56F8013/56F8011 Description
The 56F8013/56F8011 is a member of the 56800E core-based family of Digital Signal Controllers (DSCs).
It combines, on a single chip, the processing power of a DSP and the functionality of a microcontroller
with a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost,
configuration flexibility, and compact program code, the 56F8013/56F8011 is well-suited for many
applications. The 56F8013/56F8011 includes many peripherals that are especially useful for industrial
control, motion control, home appliances, general purpose inverters, smart sensors, fire and security
systems, power management, and medical monitoring applications.
The 56800E core is based on a dual Harvard-style architecture consisting of three execution units
operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style
programming model and optimized instruction set allow straightforward generation of efficient, compact
DSP and control code. The instruction set is also highly efficient for C compilers to enable rapid
development of optimized control applications.
The 56F8013/56F8011 supports program execution from internal memories. Two data operands can be
accessed from the on-chip data RAM per instruction cycle. The 56F8013/56F8011 also offers up to 26
General Purpose Input/Output (GPIO) lines, depending on peripheral configuration.
The 56F8013 Digital Signal Controller includes 16KB of Program Flash and 4KB of Unified
Data/Program RAM. The 56F8011 Digital Signal Controller includes 12KB of Program Flash and 2KB
of Unified Data/Program RAM. Program Flash memory can be independently bulk erased or erased in
pages. Program Flash page erase size is 512 Bytes (256 Words).
A full set of programmable peripherals—PWM, ADCs, SCI, SPI, I2C, Quad Timer—supports various
applications. Each peripheral can be independently shut down to save power. Any pin in these peripherals
can also be used as General Purpose Input/Outputs (GPIOs).
56F8013/56F8011 Data Sheet, Rev. 10
8
Freescale Semiconductor
Preliminary
Award-Winning Development Environment
1.3 Award-Winning Development Environment
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs), demonstration board kit and
development system cards will support concurrent engineering. Together, PE, CodeWarrior and EVMs
create a complete, scalable tools solution for easy, fast, and efficient development.
1.4 Architecture Block Diagram
The 56F8013/56F8011’s architecture is shown in Figure 1-1, Figure 1-2, and Figure 1-3. Figure 1-1
illustrates how the 56800E system buses communicate with internal memories and the IPBus Bridge.
Table 1-2 lists the internal buses in the 56800E architecture and provides a brief description of their
function. Figure 1-2 and Figure 1-3 show the peripherals and control blocks connected to the IPBus
Bridge. The figures do not show the on-board regulator and power and ground signals. They also do not
show the multiplexing between peripherals or the dedicated GPIOs. Please see Part 2, Signal/Connection
Descriptions, to see which signals are multiplexed with those of other peripherals.
1.4.1
PWM, TMR and ADC Connections
Figure 1-3 shows the over/under voltage connections from the ADC to the PWM and the connections to
the PWM from the TMR and GPIO. These signals can control the PWM outputs in a similar manner to the
over/under voltage control signals. See the 56F801X Peripheral Reference Manual for additional
information.
The PWM_reload_sync output can be connected to the TMR channel 3 input and the TMR channels 2 and
3 outputs are connected to the ADC sync inputs. TMR channel 3 output is connected to SYNC0 and TMR
channel 2 is connected to SYNC1. SYNC0 is the master ADC sync input that is used to trigger ADCA and
ADCB in sequence and parallel mode. SYNC1 is used to trigger ABCB in parallel independent mode.
These are controlled by bits in the SIM Control Register; see Section 6.3.1.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
9
DSP56800E Core
Program Control Unit
PC
LA
LA2
HWS0
HWS1
FIRA
OMR
SR
LC
LC2
FISR
Address
Generation
Unit
(AGU)
Instruction
Decoder
Interrupt
Unit
ALU1
ALU2
R0
R1
R2
R3
R4
R5
N
M01
N3
Looping
Unit
Program
Memory
SP
XAB1
XAB2
PAB
PDB
Data /
Program
RAM
CDBW
CDBR
XDB2
A2
B2
C2
D2
BitManipulation
Unit
Enhanced
OnCE™
JTAG TAP
Y
A1
B1
C1
D1
Y1
Y0
X0
MAC and ALU
A0
B0
C0
D0
IPBUS
Interface
Data
Arithmetic
Logic Unit
(ALU)
Multi-Bit Shifter
Figure 1-1 56800E Core Block Diagram
56F8013/56F8011 Data Sheet, Rev. 10
10
Freescale Semiconductor
Preliminary
Architecture Block Diagram
To/From IPBus Bridge
CLKGEN
(ROSC / PLL /
CLKIN)
GPIOAn
8
GPIOBn
8
GPIOCn
6
GPIODn
4
Interrupt
Controller
Low-Voltage Interrupt
GPIO A
POR & LVI
GPIO B
System POR
GPIO C
SIM
RESET / GPIOA7
GPIO D
COP Reset
COP
IPBus
(Continues on Figure 1-3)
Figure 1-2 Peripheral Subsystem
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
11
(Continued from Figure 1-2)
To/From IPBus Bridge
2
PWM4, 5
PWM
PWM0 - 3
4
PWM0 - 3
GPIOA0 - 3
2
Fault1, 2
PWM4, 5
Fault0
Output Controls
Reload
Pulse
3
Fault1, 2
Fault3
T2, 3
2
2
Fault0
from ADC
T3i
Fault3
T2/3
Timer
T2o, T3o
2
GPIOB5
T1
T0
I2C is muxed with both SPI and SCI.
T2 and T3 are muxed with SPI and PWM.
SPI
3
Sync0,
Sync1
CLKO
GPIOB4
2
2
I2C
Over/Under
Limits
ADC
GPIOA6
T1
T0
SCI
GPIOA4 - 5
TXD, RXD
2
SDA, SCL
2
SCLK, SS
2
MISO, MOSI
2
GPIOB6 - 7
GPIOB0 - 1
T2, 3
to PWM
ANA0, 1, 3
ANA0, 1, 3
ANA2
ANA2
VREFH, VREFL
GPIOC0, 1, 3
ANB2
ANB2
ANB0, 1, 3
GPIOB2 - 3
3
2
VREFH, VREFL
GPIOC2, 6
3
ANB0, 1, 3
GPIOC4, 5, 7
IPBus
Figure 1-3 56F8013/56F8011 Peripheral I/O Pin-Out
56F8013/56F8011 Data Sheet, Rev. 10
12
Freescale Semiconductor
Preliminary
Product Documentation
1.5 Product Documentation
The documents listed in Table 1-2 are required for a complete description and proper design with the 56F8013
or 56F8011. Documentation is available from local Freescale distributors, Freescale Semiconductor sales
offices, Freescale Literature Distribution Centers, or online at:
http://www.freescale.com
Table 1-2 56F8013/56F8011 Chip Documentation
Topic
Description
Order Number
DSP56800E
Reference Manual
Detailed description of the 56800E family architecture,
16-bit Digital Signal Controller core processor, and the
instruction set
DSP56800ERM
56F801X Peripheral
Reference Manual
Detailed description of peripherals of the 56F801X
family of devices
MC56F8000RM
56F801X Serial
Bootloader User Guide
Detailed description of the Serial Bootloader in the
56F801x family of devices
56F801XBLUG
56F8013/56F8011
Technical Data Sheet
Electrical and timing specifications, pin descriptions,
and package descriptions (this document)
MC56F8013
Errata
Details any chip issues that might be present
MC56F8013E
MC56F8011E
1.6 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
“asserted”
A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”
A high true (active high) signal is low or a low true (active low) signal is high.
Examples:
Signal/Symbol
Logic State
Signal State
Voltage1
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
13
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F8013/56F8011 are organized into functional groups, as detailed in
Table 2-1. Table 2-2 summarizes all device pins. In Table 2-2, each table row describes the signal or
signals present on a pin, sorted by pin number.
Table 2-1 Functional Group Pin Allocations
Functional Group
Number of Pins
Power (VDD or VDDA)
2
Ground (VSS or VSSA)
3
Supply Capacitors
1
Reset
1
Pulse Width Modulator (PWM) Ports1
7
Serial Peripheral Interface (SPI) Ports2
4
Analog-to-Digital Converter (ADC) Ports
6
Timer Module Ports3
2
Serial Communications Interface (SCI) Ports4
2
JTAG/Enhanced On-Chip Emulation (EOnCE)
4
1. Pins in this section can function as TMR and GPIO.
2. Pins in this section can function as TMR, I2C, and GPIO.
3. Pins can function as PWM and GPIO.
4. Pins in this section can function as I2C and GPIO.
56F8013/56F8011 Data Sheet, Rev. 10
14
Freescale Semiconductor
Preliminary
Introduction
Table 2-2 56F8013/56F8011 Pins
Peripherals:
LQFP
Pin #
Pin
Name
Signal Name
GPIO I2C
SCI
SPI
ADC
PWM
Quad Power &
Timer Ground
1
GPIOB6 GPIOB6, RXD,
SDA, CLKIN
B6
SDA
2
GPIOB1 GPIOB1, SS,
SDA
B1
SDA
3
GPIOB7 GPIOB7, TXD,
SCL
B7
SCL
4
GPIOB5 GPIOB5, T1,
FAULT3
B5
5
ANB0
ANB0, GPIOC4
C4
ANB0
6
ANB1
ANB1, GPIOC5
C5
ANB1
7
ANB2
ANB2, VREFL,
GPIOC6
C6
ANB2,
VREFL
8
VDDA
VDDA
VDDA
9
VSSA
VSSA
VSSA
10
ANA2
ANA2, VREFH,
GPIOC2
C2
ANA2,
VREFH
11
ANA1
ANA1, GPIOC1
C1
ANA1
12
ANA0
ANA0, GPIOC0
C0
ANA0
13
VSS_IO
VSS
14
TCK
TCK, GPIOD2
D2
15
RESET
RESET, GPIOA7
A7
16
GPIOB3 GPIOB3, MOSI,
T3
B3
MOSI
T3
17
GPIOB2 GPIOB2, MISO,
T2
B2
MISO
T2
18
GPIOA6 GPIOA6, FAULT0
A6
19
GPIOB4 GPIOB4, T0,
CLKO
B4
20
GPIOA5 GPIOA5, PWM5,
FAULT2, T3
A5
21
GPIOB0 GPIOB0, SCLK,
SCL
B0
22
GPIOA4 GPIOA4, PWM4,
FAULT1, T2
23
24
JTAG
RXD
Misc.
CLKIN
SS
TXD
FAULT3
T1
VSS
TCK
RESET
FAULT0
T0
PWM5,
FAULT2
T3
A4
PWM4,
FAULT1
T2
GPIOA2 GPIOA2, PWM2
A2
PWM2
GPIOA3 GPIOA3, PWM3
A3
PWM3
SCL
CLKO
SCLK
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
15
Table 2-2 56F8013/56F8011 Pins (Continued)
Peripherals:
LQFP
Pin #
Pin
Name
Signal Name
GPIO I2C
SCI
SPI
ADC
PWM
Quad Power &
Timer Ground
JTAG
25
VCAP
VCAP
VCAP
26
VDD
VDD
VDD
27
VSS_IO
VSS
VSS
28
GPIOA1 GPIOA1, PWM1
A1
PWM1
29
GPIOA0 GPIOA0, PWM0
A0
PWM0
30
TDI
TDI, GPIOD0
D0
TDI
31
TMS
TMS, GPIOD3
D3
TMS
32
TDO
TDO, GPIOD1
D1
TDO
Misc.
56F8013/56F8011 Data Sheet, Rev. 10
16
Freescale Semiconductor
Preliminary
Introduction
VDD
Power
VSS
Ground
VDDA
Power
VSSA
Ground
Other
Supply
Ports
VCAP
1
2
1
1
1
56F8013 /
56F8011
1
1
1
1
SCI Port or
I2C Port or
GPIO
GPIOB6 (RXD, SDA, CLKIN)
GPIOB7 (TXD, SCL)
1
1
3
1
1
RESET
RESET (GPIOA7)
1
1
1
2
Timer Port
or GPIO
GPIOB4 (T0, CLKO)
GPIOB5 (T1, FAULT3)
1
1
1
2
1
TCK (GPIOD2)
JTAG/
EOnCE Port
or GPIO
TMS (GPIOD3)
TDI (GPIOD0)
TDO (GPIOD1)
GPIOB0 (SCLK, SCL)
GPIOB1 (SS, SDA)
GPIOB2 (MISO, T2)
SPI Port or
I2C Port or
Timer Port
or GPIO
GPIOB3 (MOSI, T3)
GPIOA0 - 2 (PWM0 - 2)
GPIOA3 (PWM3)
GPIOA4 (PWM4, FAULT1, T2)
GPIOA5 (PWM5, FAULT2, T3)
PWM Port or
Timer Port or
GPIO
GPIOA6 (FAULT0)
ANA0 - 1 (GPIOC0 - 1)
ANA2 (VREFH, GPIOC2)
ADC Port or
GPIO
ANB0 - 1 (GPIOC4 - 5)
ANB2 (VREFL, GPIOC6)
1
1
1
1
Figure 2-1 56F8013/56F8011 Signals Identified by Functional Group
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
17
2.2 56F8013/56F8011 Signal Pins
After reset, each pin is configured for its primary function (listed first). Any alternate functionality must
be programmed.
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
Type
State During
Reset
Signal Description
VDD
26
Supply
Supply
I/O Power — This pin supplies 3.3V power to the chip I/O interface.
VSS
13
Supply
Supply
VSS — These pins provide ground for chip logic and I/O drivers.
VSS
27
VDDA
8
Supply
Supply
ADC Power — This pin supplies 3.3V power to the ADC modules. It
must be connected to a clean analog power supply.
VSSA
9
Supply
Supply
ADC Analog Ground — This pin supplies an analog ground to the
ADC modules.
VCAP
25
Supply
Supply
VCAP — Connect this pin to a 4.4μF or greater bypass capacitor in
order to bypass the core voltage regulator, required for proper chip
operation. See Section 10.2.1.
GPIOB6
1
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(RXD)
Input
(SDA1)
Input/
Output
(CLKIN)
Input
Receive Data — SCI receive data input.
Serial Data — This pin serves as the I2C serial data line.
Clock Input — This pin serves as an optional external clock input.
After reset, the default state is GPIOB6. The peripheral functionality
is controlled via the SIM (See Section 6.3.8) and the CLKMODE bit
of the OCCS Oscillator Control Register.
1. This signal is also brought out on the GPIOB1 pin.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
18
Freescale Semiconductor
Preliminary
56F8013/56F8011 Signal Pins
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
GPIOB7
3
Type
Input/
Output
(TXD)
Input/
Output
(SCL2)
Input/
Output
State During
Reset
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Signal Description
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Transmit Data — SCI transmit data output or transmit / receive in
single wire operation.
Serial Clock — This pin serves as the I2C serial clock.
After reset, the default state is GPIOB7. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
2. This signal is also brought out on the GPIOB0 pin.
RESET
15
(GPIOA7)
Input
Output
disabled,
internal
pull-up
enabled,
pin is in input
Input/Open
mode
Drain
Output
Reset — This input is a direct hardware reset on the processor.
When RESET is asserted low, the chip is initialized and placed in the
reset state. A Schmitt trigger input is used for noise immunity. The
internal reset signal will be deasserted synchronous with the internal
clocks after a fixed number of internal clocks.
Port A GPIO — This GPIO pin can be individually programmed as
an input or open drain output pin. Note that RESET functionality is
disabled in this mode and the chip can only be reset via POR, COP
reset, or software reset.
After reset, the default state is RESET.
GPIOB4
19
Input/
Output
(T0)
Input/
Output
(CLKO)
Output
Output
Port B GPIO — This GPIO pin can be individually programmed as
disabled, an input or output pin.
internal
pull-up
enabled,
T0 — Timer, Channel 0
pin is in input
mode
Clock Output — This is a buffered clock signal. Using the
SIM_CLKO Select Register (SIM_CLKOSR), this pin can be
programmed as any of the following: disabled (logic 0), CLK_MSTR
(system clock), IPBus clock, or oscillator output. See Section 6.3.7.
After reset, the default state is GPIOB4. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
19
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
GPIOB5
4
Type
Input/
Output
(T1)
Input/
Output
(FAULT3)
Output
State During
Reset
Signal Description
Output
Port B GPIO — This GPIO pin can be individually programmed as
disabled, an input or output pin.
internal
pull-up
enabled,
T1 — Timer, Channel 1
pin is in input
mode
FAULT3 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
After reset, the default state is GPIOB5. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
TCK
14
(GPIOD2)
Input
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Test Clock Input — This input pin provides a gated clock to
synchronize the test logic and shift serial data to the JTAG/EOnCE
port. The pin is connected internally to a pull-up resistor. A Schmitt
trigger input is used for noise immunity.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TCK.
TMS
31
(GPIOD3)
Input
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Test Mode Select Input — This input pin is used to sequence the
JTAG TAP controller’s state machine. It is sampled on the rising
edge of TCK and has an on-chip pull-up resistor.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TMS.
Note:
TDI
30
(GPIOD0)
Input
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Always tie the TMS pin to VDD through a 2.2K resistor.
Test Data Input — This input pin provides a serial input data stream
to the JTAG/EOnCE port. It is sampled on the rising edge of TCK
and has an on-chip pull-up resistor.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TDI.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
20
Freescale Semiconductor
Preliminary
56F8013/56F8011 Signal Pins
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
Type
TDO
32
Output
(GPIOD1)
State During
Reset
Output
disabled,
internal
pull-up
enabled
Input/
Output
Signal Description
Test Data Output — This tri-stateable output pin provides a serial
output data stream from the JTAG/EOnCE port. It is driven in the
shift-IR and shift-DR controller states, and changes on the falling
edge of TCK.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TDO.
GPIOB0
21
Input/
Output
(SCLK)
Input/
Output
(SCL3)
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
SPI Serial Clock — In the master mode, this pin serves as an
output, clocking slaved listeners. In slave mode, this pin serves as
the data clock input. A Schmitt trigger input is used for noise
immunity.
Serial Data — This pin serves as the I2C serial clock.
After reset, the default state is GPIOB0. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
3. This signal is also brought out on the GPIOB7 pin.
GPIOB1
2
Input/
Output
(SS)
Input
(SDA4)
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
SPI Slave Select — SS is used in slave mode to indicate to the SPI
module that the current transfer is to be received.
Serial Clock — This pin serves as the I2C serial data line.
After reset, the default state is GPIOB1. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
4. This signal is also brought out on the GPIOB6 pin.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
21
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
GPIOB2
17
Type
Input/
Output
(MISO)
Input/
Output
(T25)
Input/
Output
State During
Reset
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Signal Description
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
SPI Master In/Slave Out — This serial data pin is an input to a
master device and an output from a slave device. The MISO line of a
slave device is placed in the high-impedance state if the slave device
is not selected. The slave device places data on the MISO line a
half-cycle before the clock edge the master device uses to latch the
data.
T2 — Timer, Channel 2
After reset, the default state is GPIOB2. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
5. This signal is also brought out on the GPIOA4 pin.
GPIOB3
16
Input/
Output
(MOSI)
Input/
Output
(T36)
Input/
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
SPI Master Out/Slave In— This serial data pin is an output from a
master device and an input to a slave device. The master device
places data on the MOSI line a half-cycle before the clock edge the
slave device uses to latch the data.
T3 — Timer, Channel 3
After reset, the default state is GPIOB3. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
6. This signal is also brought out on the GPIOA5 pin.
GPIOA0
29
(PWM0)
Input/
Output
Output
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM0 — This is one of the six PWM output pins.
After reset, the default state is GPIOA0.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
22
Freescale Semiconductor
Preliminary
56F8013/56F8011 Signal Pins
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
GPIOA1
28
(PWM1)
GPIOA2
23
Input/
Output
Output
24
(PWM3)
GPIOA4
Input/
Output
Output
(PWM2)
GPIOA3
Type
Input/
Output
Output
22
Input/
Output
(PWM4)
Output
(FAULT1)
Input
(T27)
Input/
Output
State During
Reset
Signal Description
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM1 — This is one of the six PWM output pins.
After reset, the default state is GPIOA1.
PWM2 — This is one of the six PWM output pins.
After reset, the default state is GPIOA2.
PWM3 — This is one of the six PWM output pins.
After reset, the default state is GPIOA3.
PWM4 — This is one of the six PWM output pins.
Fault1 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
T2 — Timer, Channel 2
After reset, the default state is GPIOA4. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
7. This signal is also brought out on the GPIOB2 pin.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
23
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
GPIOA5
20
Type
Input/
Output
(PWM5)
Output
(FAULT2)
Input/
Output
(T38)
Input/
Output
State During
Reset
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Signal Description
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM5 — This is one of the six PWM output pins.
Fault2 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
T3 — Timer, Channel 3
After reset, the default state is GPIOA5. The peripheral functionality
is controlled via the SIM. See Section 6.3.8.
8. This signal is also brought out on the GPIOB3 pin.
GPIOA6
18
(FAULT0)
Input/
Output
Input
Output
disabled,
internal
pull-up
enabled,
pin is in input
mode
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Fault0 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
After reset, the default state is GPIOA6.
ANA0
12
(GPIOC0)
Input
Analog
Input
Input/
Output
ANA0 — Analog input to ADC A, channel 0
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is ANA0.
ANA1
11
(GPIOC1)
Input
Input/
Output
Analog
Input
ANA1 — Analog input to ADC A, channel 1
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is ANA1.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
24
Freescale Semiconductor
Preliminary
56F8013/56F8011 Signal Pins
Table 2-3 56F8013/56F8011 Signal and Package Information for the 32-Pin LQFP
Signal
Name
LQFP
Pin No.
Type
ANA2
10
Input
(VREFH)
Input
(GPIOC2)
Input/
Output
State During
Reset
Analog
Input
Signal Description
ANA2 — Analog input to ADC A, channel 2
VREFH — Analog reference voltage high
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is ANA2.
ANB0
5
(GPIOC4)
Input
Analog
Input
Input/
Output
ANB0 — Analog input to ADC B, channel 0
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is ANB0.
ANB1
6
(GPIOC5)
Input
Analog
Input
ANB1 — Analog input to ADC B, channel 1
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Input/
Output
After reset, the default state is ANB1.
ANB2
7
Input
(VREFL)
Input
(GPIOC6)
Input/
Output
Analog
Input
ANB2 — Analog input to ADC B, channel 2
VREFL — Analog reference voltage low. This should normally be
connected to a low-noise VSS.
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is ANB2.
Return to Table 2-2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
25
Part 3 OCCS
3.1 Overview
This module provides the 2X system clock frequency to the System Integration Module (SIM), which uses
it to generate the various chip clocks. This module also produces the OSC_CLK signals plus the ADC
clock and high-speed peripheral clock.
The on-chip clock synthesis module allows product design using an internal relaxation oscillator to run
56F801X family parts at user-selectable frequencies up to 32MHz.
3.2 Features
The On-Chip Clock Synthesis (OCCS) module interfaces to the oscillator and PLL. The OCCS module
features:
•
•
•
•
•
Internal relaxation oscillator
Ability to power down the internal relaxation oscillator
Ability to put the internal relaxation oscillator into a standby mode
3-bit postscaler provides control for the PLL output
Ability to power down the internal PLL
•
•
•
•
Provides 2X master clock frequency and OSC_CLK signals
Provides 3X fast peripheral clock to PWM and Timer
Safety shutdown feature is available in the event that the PLL reference clock disappears
Can be driven from an external clock source
The clock generation module provides the programming interface for both the PLL and internal relaxation
oscillator.
3.3 Operating Modes
In 56F801X family parts, either an internal oscillator or an external frequency source can be used to
provide a reference clock (SYS_CLK2) to the SIM.
The 2X system clock source output from the OCCS can be described by one of the following equations:
2X system frequency = oscillator frequency
2X system frequency = (oscillator frequency X 8) / (postscaler)
where:
postscaler = 1, 2, 4, 8, 16, or 32 PLL output divider
The SIM is responsible for further dividing these frequencies by two, which will insure a 50% duty cycle
in the system clock output.
56F8013/56F8011 Data Sheet, Rev. 10
26
Freescale Semiconductor
Preliminary
Operating Modes
The 56F801X family parts’ on-chip clock synthesis module has the following registers:
•
•
•
•
•
Control Register (OCCS_CR)
Divide-by Register (OCCS_DB)
Status Register (OCCS_SR)
Shutdown Register (OCCS_SHUTDN)
Oscillator Control Register (OCCS_OCTRL)
For more information on these registers, please refer to the 56F801X Peripheral Reference Manual.
3.3.1
External Clock Source
The recommended method of connecting an external clock is illustrated in Figure 3-1. The external clock
source is connected to GPIOB6 / RXD.
56F8013/56F8011
GPIOB6 / RXD
External Clock
Figure 3-1 Connecting an External Clock Signal using GPIOB6 / RXD
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
27
3.4 Block Diagram
Figure 3-2 provides a block diagram which shows how the 56F8013/56F8011 creates its internal clock,
using the relaxation oscillator as an 8MHz clock reference for the PLL.
TRIM[9:0]
Relaxation
OSC
ROSB
ROPD
Bus Interface and
Control
GPIOB6 / RXD
MUX
Bus
Interface
PRECS
PLL
FOUT
Postscaler
(÷ 1, 2, 4, 8, 16, 32)
÷3
X 24
MUX
MSTR_OSC
SYS_CLK_x2
source to the SIM
(64MHz max)
ZSRC
PLLCOD
Lock
Detector
FOUT/2
Postscaler
(÷ 1, 2, 4, 8, 16, 32)
Loss of
Reference
Clock
Detector
MUX
FEEDBACK
÷2
HS PERF CLK
(96MHz max)
LCK
Loss of Reference Clock Interrupt
Figure 3-2 OCCS Block Diagram with Relaxation Oscillator
56F8013/56F8011 Data Sheet, Rev. 10
28
Freescale Semiconductor
Preliminary
Pin Descriptions
3.5 Pin Descriptions
3.5.1
External Reference (GPIOB6 / RXD)
The relaxation oscillator is included on chip and the reset mode is to use this as the clock source for the
chip. The user then has the option of switching to an external clock reference if desired.
Part 4 Memory Map
4.1 Introduction
The 56F8013/56F8011 device is a 16-bit motor-control chip based on the 56800E core. It uses a
Harvard-style architecture with two independent memory spaces for Data and Program. On-chip RAM is
used in both spaces and Flash memory is used only in Program space.
This section provides memory maps for:
•
•
Program Address Space, including the Interrupt Vector Table
Data Address Space, including the EOnCE Memory and Peripheral Memory Maps
On-chip memory sizes for the device are summarized in Table 4-1. Flash memories’ restrictions are
identified in the “Use Restrictions” column of Table 4-1.
Table 4-1 Chip Memory Configurations
On-Chip Memory
56F8013
56F8011
Use Restrictions
Program Flash
(PFLASH)
8k x 16
6k x 16
Erase / Program via Flash interface unit and word writes to CDBW
Unified RAM (ram)
2k x 16
1k x 16
Usable by both the Program and Data memory spaces
4.2 Interrupt Vector Table
Table 4-2 provides the 56F8013/56F8011’s reset and interrupt priority structure, including on-chip
peripherals. The table is organized with higher-priority vectors at the top and lower-priority interrupts
lower in the table. As indicated, the priority of an interrupt can be assigned to different levels, allowing
some control over interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For
a selected priority level, the lowest vector number has the highest priority.
The location of the vector table is determined by the Vector Base Address (VBA). Please see Section
5.6.11 for the reset value of the VBA.
By default, VBA = 0, and the reset address and COP reset address will correspond to vector 0 and 1 of the
interrupt vector table. In these instances, the first two locations in the vector table must contain branch or
JMP instructions. All other entries must contain JSR instructions.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
29
Table 4-2 Interrupt Vector Table Contents1
Peripheral
Vector
Number
Priority
Level
Vector Base
Address +
Interrupt Function
core
P:$00
Reserved for Reset Overlay2
core
P:$02
Reserved for COP Reset Overlay
core
2
3
P:$04
Illegal Instruction
core
3
3
P:$06
SW Interrupt 3
core
4
3
P:$08
HW Stack Overflow
core
5
3
P:$0A
Misaligned Long Word Access
core
6
1-3
P:$0C
EOnCE Step Counter
core
7
1-3
P:$0E
EOnCE Breakpoint Unit 0
core
8
1-3
P:$10
EOnCE Trace Buffer
core
9
1-3
P:$12
EOnCE Transmit Register Empty
core
10
1-3
P:$14
EOnCE Receive Register Full
core
11
2
P:$16
SW Interrupt 2
core
12
1
P:$18
SW Interrupt 1
core
13
0
P:$1A
SW Interrupt 0
14
Reserved
15
Reserved
PS
16
0-2
P:$20
Power Sense
OCCS
17
0-2
P:$22
PLL Lock, Loss of Clock Reference Interrupt
FM
18
0-2
P:$24
FM Access Error Interrupt
FM
19
0-2
P:$26
FM Command Complete
FM
20
0-2
P:$28
FM Command, data and address Buffers Empty
21
Reserved
GPIOD
22
0-2
P:$2C
GPIOD
GPIOC
23
0-2
P:$2E
GPIOC
GPIOB
24
0-2
P:$30
GPIOB
GPIOA
25
0-2
P:$32
GPIOA
SPI
26
0-2
P:$34
SPI Receiver Full / Error
SPI
27
0-2
P:$36
SPI Transmitter Empty
SCI
28
0-2
P:$38
SCI Transmitter Empty
SCI
29
0-2
P:$3A
SCI Transmitter Idle
SCI
30
0-2
P:$3C
SCI Reserved
SCI
31
0-2
P:$3E
SCI Receiver Error
SCI
32
0-2
P:$40
SCI Receiver Full
I2C
35
0-2
P:$46
I2C
Timer
36
0-2
P:$48
Timer Channel 0
Timer
37
0-2
P:$4A
Timer Channel 1
33, 34
Reserved
(Continues next page)
56F8013/56F8011 Data Sheet, Rev. 10
30
Freescale Semiconductor
Preliminary
Program Map
Table 4-2 Interrupt Vector Table Contents1 (Continued)
Peripheral
Vector
Number
Priority
Level
Vector Base
Address +
Interrupt Function
Timer
38
0-2
P:$4C
Timer Channel 2
Timer
39
0-2
P:$4E
Timer Channel 3
ADC
40
0-2
P:$50
ADCA Conversion Complete
ADC
41
0-2
P:$52
ADCB Conversion Complete
ADC
42
0-2
P:$54
ADC Zero Crossing or Limit Error
PWM
43
0-2
P:$56
Reload PWM
PWM
44
0-2
P:$58
PWM Fault
SWILP
45
-1
P:$5A
SW Interrupt Low Priority
1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced
from the vector table, providing only 19 bits of address.
2. If the VBA is set to $0000, the first two locations of the vector table will overlay the chip reset addresses.
4.3 Program Map
The Program Memory map is shown in Table 4-3.
Table 4-3 Program Memory Map for 56F80131
Begin/End Address
Memory Allocation
P: $FF FFFF
P: $00 8800
RESERVED
P: $00 87FF
P: $00 8000
On-Chip RAM2
4KB
P: $00 7FFF
P: $00 2000
RESERVED
P: $00 1FFF
P: $00 0000
Internal Program Flash
16KB
Cop Reset Address = $00 0002
Boot Location = $00 0000
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Data space starting at address X: $00 0000;
see Figure 4-1.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
31
Table 4-4 Program Memory Map for 56F80111
Begin/End Address
Memory Allocation
P: $1F FFFF
P: $00 8400
RESERVED
P: $00 83FF
P: $00 8000
On-Chip RAM2
2KB
P: $00 7FFF
P: $00 2000
RESERVED
P: $00 1FFF
P: $00 0800
Internal Program Flash
12KB
Cop Reset Address = $00 0802
Boot Location = $00 0800
P: $00 07FF
P: $00 0000
RESERVED
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Data space starting at address X: $00 0000;
see Figure 4-1.
4.4 Data Map
Table 4-5 Data Memory Map for 56F80131
Begin/End Address
Memory Allocation
X:$FF FFFF
X:$FF FF00
EOnCE
256 locations allocated
X:$FF FEFF
X:$01 0000
RESERVED
X:$00 FFFF
X:$00 F000
On-Chip Peripherals
4096 locations allocated
X:$00 EFFF
X:$00 8800
RESERVED
X:$00 EFFF
X:$00 0800
RESERVED
X:$00 7FFF
X:$00 0040
RESERVED
X:$00 07FF
X:$00 0000
On-Chip Data RAM2
4KB
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Program space starting at P: $00 8000; see
Figure 4-1.
56F8013/56F8011 Data Sheet, Rev. 10
32
Freescale Semiconductor
Preliminary
Data Map
Table 4-6 Data Memory Map for 56F80111
Begin/End Address
Memory Allocation
X:$FF FFFF
X:$FF FF00
EOnCE
256 locations allocated
X:$FF FEFF
X:$01 0000
RESERVED
X:$00 FFFF
X:$00 F000
On-Chip Peripherals
4096 locations allocated
X:$00 EFFF
X:$00 0400
RESERVED
X:$00 03FF
X:$00 0000
On-Chip Data RAM2
2KB
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Program space starting at P: $00 8000; see
Figure 4-1.
Program
Data
EOnCE
Reserved
Reserved
RAM
Reserved
Peripherals
Dual Port RAM
Reserved
Flash
RAM
Figure 4-1 Dual Port RAM
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
33
4.5 EOnCE Memory Map
Figure 4-7 lists all EOnCE registers necessary to access or control the EOnCE.
Table 4-7 EOnCE Memory Map
Address
Register Acronym
Register Name
X:$FF FFFF
OTX1 / ORX1
Transmit Register Upper Word
Receive Register Upper Word
X:$FF FFFE
OTX / ORX (32 bits)
Transmit Register
Receive Register
X:$FF FFFD
OTXRXSR
Transmit and Receive Status and Control Register
X:$FF FFFC
OCLSR
Core Lock / Unlock Status Register
X:$FF FFFB - X:$FF FFA1
X:$FF FFA0
Reserved
OCR
Control Register
X:$FF FF9F
Instruction Step Counter
X:$FF FF9E
OSCNTR (24 bits)
Instruction Step Counter
X:$FF FF9D
OSR
Status Register
X:$FF FF9C
OBASE
Peripheral Base Address Register
X:$FF FF9B
OTBCR
Trace Buffer Control Register
X:$FF FF9A
OTBPR
Trace Buffer Pointer Register
X:$FF FF99
Trace Buffer Register Stages
X:$FF FF98
OTB (21 - 24 bits/stage) Trace Buffer Register Stages
X:$FF FF97
X:$FF FF96
Breakpoint Unit Control Register
OBCR (24 bits)
X:$FF FF95
X:$FF FF94
Breakpoint Unit Address Register 1
OBAR1 (24 bits)
X:$FF FF93
X:$FF FF92
OBAR2 (32 bits)
Breakpoint Unit Address Register 2
Breakpoint Unit Mask Register 2
OBMSK (32 bits)
X:$FF FF8F
X:$FF FF8E
Breakpoint Unit Address Register 1
Breakpoint Unit Address Register 2
X:$FF FF91
X:$FF FF90
Breakpoint Unit Control Register
Breakpoint Unit Mask Register 2
Reserved
OBCNTR
EOnCE Breakpoint Unit Counter
X:$FF FF8D
Reserved
X:$FF FF8C
Reserved
X:$FF FF8B
Reserved
X:$FF FF8A
X:$FF FF89 - X:$FF FF00
OESCR
External Signal Control Register
Reserved
56F8013/56F8011 Data Sheet, Rev. 10
34
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
4.6 Peripheral Memory Mapped Registers
On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may
be accessed with the same addressing modes used for ordinary Data memory, except all peripheral
registers should be read/written using word accesses only.
Table 4-8 summarizes base addresses for the set of peripherals on the 56F8013/56F8011 device.
Peripherals are listed in order of the base address.
The following tables list all of the peripheral registers required to control or access the peripherals.
Table 4-8 Data Memory Peripheral Base Address Map Summary
Peripheral
Timer
Prefix
Base Address
Table Number
X:$00 F000
4-9
TMRn
PWM
PWM
X:$00 F040
4-10
ITCN
ITCN
X:$00 F060
4-11
ADC
ADC
X:$00 F080
4-12
SCI
SCI
X:$00 F0B0
4-13
SPI
SPI
X:$00 F0C0
4-14
2C
I2C
X:$00 F0D0
4-15
COP
COP
X:$00 F0E0
4-16
CLK, PLL, OSC, TEST
OCCS
X:$00 F0F0
4-17
GPIO Port A
GPIOA
X:$00 F100
4-18
GPIO Port B
GPIOB
X:$00 F110
4-19
GPIO Port C
GPIOC
X:$00 F120
4-20
GPIO Port D
GPIOD
X:$00 F130
4-21
SIM
SIM
X:$00 F140
4-22
Power Supervisor
PS
X:$00 F160
4-23
FM
FM
X:$00 F400
4-24
I
Table 4-9 Quad Timer Registers Address Map
(TMR_BASE = $00 F000)
Register Acronym
Address Offset
Register Description
TMR0_COMP1
$0
Compare Register 1
TMR0_COMP2
$1
Compare Register 2
TMR0_CAPT
$2
Capture Register
TMR0_LOAD
$3
Load Register
TMR0_HOLD
$4
Hold Register
TMR0_CNTR
$5
Counter Register
TMR0_CTRL
$6
Control Register
TMR0_SCTRL
$7
Status and Control Register
TMR0_CMPLD1
$8
Comparator Load Register 1
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
35
Table 4-9 Quad Timer Registers Address Map (Continued)
(TMR_BASE = $00 F000)
Register Acronym
Address Offset
Register Description
TMR0_CMPLD2
$9
Comparator Load Register 2
TMR0_CSCTRL
$A
Comparator Status and Control Register
Reserved
TMR1_COMP1
$10
Compare Register 1
TMR1_COMP2
$11
Compare Register 2
TMR1_CAPT
$12
Capture Register
TMR1_LOAD
$13
Load Register
TMR1_HOLD
$14
Hold Register
TMR1_CNTR
$15
Counter Register
TMR1_CTRL
$16
Control Register
TMR1_SCTRL
$17
Status and Control Register
TMR1_CMPLD1
$18
Comparator Load Register 1
TMR1_CMPLD2
$19
Comparator Load Register 2
TMR1_CSCTRL
$1A
Comparator Status and Control Register
Reserved
TMR2_COMP1
$20
Compare Register 1
TMR2_COMP2
$21
Compare Register 2
TMR2_CAPT
$22
Capture Register
TMR2_LOAD
$23
Load Register
TMR2_HOLD
$24
Hold Register
TMR2_CNTR
$25
Counter Register
TMR2_CTRL
$26
Control Register
TMR2_SCTRL
$27
Status and Control Register
TMR2_CMPLD1
$28
Comparator Load Register 1
TMR2_CMPLD2
$29
Comparator Load Register 2
TMR2_CSCTRL
$2A
Comparator Status and Control Register
Reserved
TMR3_COMP1
$30
Compare Register 1
TMR3_COMP2
$31
Compare Register 2
TMR3_CAPT
$32
Capture Register
TMR3_LOAD
$33
Load Register
TMR3_HOLD
$34
Hold Register
TMR3_CNTR
$35
Counter Register
TMR3_CTRL
$36
Control Register
TMR3_SCTRL
$37
Status and Control Register
TMR3_CMPLD1
$38
Comparator Load Register 1
TMR3_CMPLD2
$39
Comparator Load Register 2
TMR3_CSCTRL
$3A
Comparator Status and Control Register
56F8013/56F8011 Data Sheet, Rev. 10
36
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-10 Pulse Width Modulator Registers Address Map
(PWM_BASE = $00 F040)
Register Acronym
Address Offset
Register Description
PWM_CTRL
$0
Control Register
PWM_FCTRL
$1
Fault Control Register
PWM_FLTACK
$2
Fault Status Acknowledge Register
PWM_OUT
$3
Output Control Register
PWM_CNTR
$4
Counter Register
PWM_CMOD
$5
Counter Modulo Register
PWM_VAL0
$6
Value Register 0
PWM_VAL1
$7
Value Register 1
PWM_VAL2
$8
Value Register 2
PWM_VAL3
$9
Value Register 3
PWM_VAL4
$A
Value Register 4
PWM_VAL5
$B
Value Register 5
PWM_DTIM0
$C
Dead Time Register 0
PWM_DTIM1
$D
Dead Time Register 1
PWM_DMAP1
$E
Disable Mapping Register 1
PWM_DMAP2
$F
Disable Mapping Register 2
PWM_CNFG
$10
Configure Register
PWM_CCTRL
$11
Channel Control Register
PWM_PORT
$12
Port Register
PWM_ICCTRL
$13
Internal Correction Control Register
PWM_SCTRL
$14
Source Control Register
Table 4-11 Interrupt Control Registers Address Map
(ITCN_BASE = $00 F060)
Register Acronym
Address Offset
Register Description
ITCN_IPR0
$0
Interrupt Priority Register 0
ITCN_IPR1
$1
Interrupt Priority Register 1
ITCN_IPR2
$2
Interrupt Priority Register 2
ITCN_IPR3
$3
Interrupt Priority Register 3
ITCN_IPR4
$4
Interrupt Priority Register 4
ITCN_VBA
$5
Vector Base Address Register
ITCN_FIM0
$6
Fast Interrupt Match 0 Register
ITCN_FIVAL0
$7
Fast Interrupt Vector Address Low 0 Register
ITCN_FIVAH0
$8
Fast Interrupt Vector Address High 0 Register
ITCN_FIM1
$9
Fast Interrupt Match 1 Register
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
37
Table 4-11 Interrupt Control Registers Address Map (Continued)
(ITCN_BASE = $00 F060)
Register Acronym
Address Offset
Register Description
ITCN_FIVAL1
$A
Fast Interrupt Vector Address Low 1 Register
ITCN_FIVAH1
$B
Fast Interrupt Vector Address High 1 Register
ITCN_IRQP0
$C
IRQ Pending Register 0
ITCN_IRQP1
$D
IRQ Pending Register 1
ITCN_IRQP2
$E
IRQ Pending Register 2
Reserved
ITCN_ICTRL
$12
Interrupt Control Register
Reserved
Table 4-12 Analog-to-Digital Converter Registers Address Map
(ADC_BASE = $00 F080)
Register Acronym
Address Offset
Register Description
ADC_CTRL1
$0
Control Register 1
ADC_CTRL2
$1
Control Register 2
ADC_ZXCTRL
$2
Zero Crossing Control Register
ADC_CLIST 1
$3
Channel List Register 1
ADC_CLIST 2
$4
Channel List Register 2
ADC_SDIS
$5
Sample Disable Register
ADC_STAT
$6
Status Register
ADC_LIMSTAT
$7
Limit Status Register
ADC_ZXSTAT
$8
Zero Crossing Status Register
ADC_RSLT0
$9
Result Register 0
ADC_RSLT1
$A
Result Register 1
ADC_RSLT2
$B
Result Register 2
ADC_RSLT3
$C
Result Register 3
ADC_RSLT4
$D
Result Register 4
ADC_RSLT5
$E
Result Register 5
ADC_RSLT6
$F
Result Register 6
ADC_RSLT7
$10
Result Register 7
ADC_LOLIM0
$11
Low Limit Register 0
ADC_LOLIM1
$12
Low Limit Register 1
ADC_LOLIM2
$13
Low Limit Register 2
ADC_LOLIM3
$14
Low Limit Register 3
ADC_LOLIM4
$15
Low Limit Register 4
ADC_LOLIM5
$16
Low Limit Register 5
ADC_LOLIM6
$17
Low Limit Register 6
ADC_LOLIM7
$18
Low Limit Register 7
56F8013/56F8011 Data Sheet, Rev. 10
38
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-12 Analog-to-Digital Converter Registers Address Map (Continued)
(ADC_BASE = $00 F080)
Register Acronym
Address Offset
Register Description
ADC_HILIM0
$19
High Limit Register 0
ADC_HILIM1
$1A
High Limit Register 1
ADC_HILIM2
$1B
High Limit Register 2
ADC_HILIM3
$1C
High Limit Register 3
ADC_HILIM4
$1D
High Limit Register 4
ADC_HILIM5
$1E
High Limit Register 5
ADC_HILIM6
$1F
High Limit Register 6
ADC_HILIM7
$20
High Limit Register 7
ADC_OFFST0
$21
Offset Register 0
ADC_OFFST1
$22
Offset Register 1
ADC_OFFST2
$23
Offset Register 2
ADC_OFFST3
$24
Offset Register 3
ADC_OFFST4
$25
Offset Register 4
ADC_OFFST5
$26
Offset Register 5
ADC_OFFST6
$27
Offset Register 6
ADC_OFFST7
$28
Offset Register 7
ADC_PWR
$29
Power Control Register
ADC_VREF
$2A
Voltage Reference Register
Reserved
Table 4-13 Serial Communication Interface Registers Address Map
(SCI_BASE = $00 F0B0)
Register Acronym
Address Offset
Register Description
SCI_RATE
$0
Baud Rate Register
SCI_CTRL1
$1
Control Register 1
SCI_CTRL2
$2
Control Register 2
SCI_STAT
$3
Status Register
SCI_DATA
$4
Data Register
Table 4-14 Serial Peripheral Interface Registers Address Map
(SPI_BASE = $00 F0C0)
Register Acronym
Address Offset
Register Description
SPI_SCTRL
$0
Status and Control Register
SPI_DSCTRL
$1
Data Size and ControlRegister
SPI_DRCV
$2
Data Receive Register
SPI_DXMIT
$3
Data Transmit Register
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
39
Table 4-15 I2C Registers Address Map
(I2C_BASE = $00 F0D0)
Register Acronym
Address Offset
Register Description
I2C_ADDR
$0
Address Register
I2C_FDIV
$1
Frequency Divider Register
I2C_CTRL
$2
Control Register
I2C_STAT
$3
Status Register
I2C_DATA
$4
Data I/O Register
I2C_NFILT
$5
Noise Filter Register
Table 4-16 Computer Operating Properly Registers Address Map
(COP_BASE = $00 F0E0)
Register Acronym
Address Offset
Register Description
COP_CTRL
$0
Control Register
COP_TOUT
$1
Time-Out Register
COP_CNTR
$2
Counter Register
Table 4-17 Clock Generation Module Registers Address Map
(OCCS_BASE = $00 F0F0)
Register Acronym
Address Offset
Register Description
OCCS_CTRL
$0
Control Register
OCCS_DIVBY
$1
Divide-By Register
OCCS_STAT
$2
Status Register
OCCS_SHUTDN
$4
Shutdown Register
OCCS_OCTRL
$5
Oscillator Control Register
Reserved
56F8013/56F8011 Data Sheet, Rev. 10
40
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-18 GPIOA Registers Address Map
(GPIOA_BASE = $00 F100)
Register Acronym
GPIOA_PUPEN
Address Offset
$0
Register Description
Pull-up Enable Register
GPIOA_DATA
$1
Data Register
GPIOA_DDIR
$2
Data Direction Register
GPIOA_PEREN
$3
Peripheral Enable Register
GPIOA_IASSRT
$4
Interrupt Assert Register
GPIOA_IEN
$5
Interrupt Enable Register
GPIOA_IEPOL
$6
Interrupt Edge Polarity Register
GPIOA_IPEND
$7
Interrupt Pending Register
GPIOA_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOA_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOA_RDATA
$A
Raw Data Register
GPIOA_DRIVE
$B
Drive Strength Control Register
Table 4-19 GPIOB Registers Address Map
(GPIOB_BASE = $00 F110)
Register Acronym
Address Offset
Register Description
GPIOB_PUPEN
$0
Pull-up Enable Register
GPIOB_DATA
$1
Data Register
GPIOB_DDIR
$2
Data Direction Register
GPIOB_PEREN
$3
Peripheral Enable Register
GPIOB_IASSRT
$4
Interrupt Assert Register
GPIOB_IEN
$5
Interrupt Enable Register
GPIOB_IEPOL
$6
Interrupt Edge Polarity Register
GPIOB_IPEND
$7
Interrupt Pending Register
GPIOB_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOB_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOB_RDATA
$A
Raw Data Register
GPIOB_DRIVE
$B
Drive Strength Control Register
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
41
Table 4-20 GPIOC Registers Address Map
(GPIOC_BASE = $00 F120)
Register Acronym
Address Offset
Register Description
GPIOC_PUPEN
$0
Pull-up Enable Register
GPIOC_DATA
$1
Data Register
GPIOC_DDIR
$2
Data Direction Register
GPIOC_PEREN
$3
Peripheral Enable Register
GPIOC_IASSRT
$4
Interrupt Assert Register
GPIOC_IEN
$5
Interrupt Enable Register
GPIOC_IEPOL
$6
Interrupt Edge Polarity Register
GPIOC_IPEND
$7
Interrupt Pending Register
GPIOC_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOC_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOC_RDATA
$A
Raw Data Register
GPIOC_DRIVE
$B
Drive Strength Control Register
Table 4-21 GPIOD Registers Address Map
(GPIOD_BASE = $00 F130)
Register Acronym
GPIOD_PUPEN
Address Offset
$0
Register Description
Pull-up Enable Register
GPIOD_DATA
$1
Data Register
GPIOD_DDIR
$2
Data Direction Register
GPIOD_PEREN
$3
Peripheral Enable Register
GPIOD_IASSRT
$4
Interrupt Assert Register
GPIOD_IEN
$5
Interrupt Enable Register
GPIOD_IEPOL
$6
Interrupt Edge Polarity Register
GPIOD_IPEND
$7
Interrupt Pending Register
GPIOD_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOD_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOD_RDATA
$A
Raw Data Register
GPIOD_DRIVE
$B
Drive Strength Control Register
56F8013/56F8011 Data Sheet, Rev. 10
42
Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-22 System Integration Module Registers Address Map
(SIM_BASE = $00 F140)
Register Acronym
Address Offset
Register Description
SIM_CTRL
$0
Control Register
SIM_RSTAT
$1
Reset Status Register
SIM_SWC0
$2
Software Control Register 0
SIM_SWC1
$3
Software Control Register 1
SIM_SWC2
$4
Software Control Register 2
SIM_SWC3
$5
Software Control Register 3
SIM_MSHID
$6
Most Significant Half JTAG ID
SIM_LSHID
$7
Least Significant Half JTAG ID
SIM_PWR
$8
Power Control Register
Reserved
SIM_CLKOUT
$A
Clock Out Select Register
SIM_GPS
$B
GPIO Peripheral Select Register
SIM_PCE
$C
Peripheral Clock Enable Register
SIM_IOSAHI
$D
I/O Short Address Location High Register
SIM_IOSALO
$E
I/O Short Address Location Low Register
Table 4-23 Power Supervisor Registers Address Map
(PS_BASE = $00 F160)
Register Acronym
Address Offset
Register Description
PS_CTRL
$0
Control Register
PS_STAT
$1
Status Register
Table 4-24 Flash Module Registers Address Map
(FM_BASE = $00 F400)
Register Acronym
FM_CLKDIV
FM_CNFG
Address Offset
$0
Register Description
Clock Divider Register
$1
Configuration Register
$2
Reserved
FM_SECHI
$3
Security High Half Register
FM_SECLO
$4
Security Low Half Register
$5 - $9
FM_PROT
$10
$11 - $12
FM_USTAT
$13
Reserved
Protection Register
Reserved
User Status Register
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
43
Table 4-24 Flash Module Registers Address Map (Continued)
(FM_BASE = $00 F400)
Register Acronym
FM_CMD
FM_DATA
FM_OPT1
Address Offset
Register Description
$14
Command Register
$15
Reserved
$16
Reserved
$17
Reserved
$18
Data Buffer Register
$19
Reserved
$1A
Reserved
$1B
Optional Data 1 Register
Reserved
FM_TSTSIG
$1D
Test Array Signature Register
Part 5 Interrupt Controller (ITCN)
5.1 Introduction
The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to
signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in
order to service this interrupt.
5.2 Features
The ITCN module design includes these distinctive features:
•
•
•
•
Programmable priority levels for each IRQ
Two programmable Fast Interrupts
Notification to SIM module to restart clocks out of Wait and Stop modes
Ability to drive initial address on the address bus after reset
For further information, see Table 4-2, Interrupt Vector Table Contents.
5.3 Functional Description
The Interrupt Controller is a slave on the IPBus. It contains registers that allow each of the 46 interrupt
sources to be set to one of four priority levels (excluding certain interrupts that are of fixed priority). Next,
all of the interrupt requests of a given level are priority encoded to determine the lowest numerical value
of the active interrupt requests for that level. Within a given priority level, number 0 is the highest priority
and number 45 is the lowest.
56F8013/56F8011 Data Sheet, Rev. 10
44
Freescale Semiconductor
Preliminary
Functional Description
5.3.1
Normal Interrupt Handling
Once the INTC has determined that an interrupt is to be serviced and which interrupt has the highest
priority, an interrupt vector address is generated. Normal interrupt handling concatenates the Vector Base
Address (VBA) and the vector number to determine the vector address, generating an offset into the vector
table for each interrupt.
5.3.2
Interrupt Nesting
Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be
serviced. The following table defines the nesting requirements for each priority level.
Table 5-1 Interrupt Mask Bit Definition
5.3.3
SR[9]
SR[8]
Exceptions Permitted
Exceptions Masked
0
0
Priorities 0, 1, 2, 3
None
0
1
Priorities 1, 2, 3
Priority 0
1
0
Priorities 2, 3
Priorities 0, 1
1
1
Priority 3
Priorities 0, 1, 2
Fast Interrupt Handling
Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes
Fast Interrupts before the core does.
A Fast Interrupt is defined (to the ITCN) by:
1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers
2. Setting the FIMn register to the appropriate vector number
3. Setting the FIVALn and FIVAHn registers with the address of the code for the Fast Interrupt
When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a
match occurs, and it is a level 2 interrupt, the ITCN handles it as a Fast Interrupt. The ITCN takes the vector
address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an
offset from the VBA.
The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts
its Fast Interrupt handling.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
45
5.4 Block Diagram
any0
Priority
Level
INT0
Level 0
46 -> 6
Priority
Encoder
2 -> 4
Decode
6
INT
VAB
CONTROL
any3
Level 3
IACK
SR[9:8]
Priority
Level
INT45
IPIC
46 -> 6
Priority
Encoder
6
PIC_EN
2 -> 4
Decode
Figure 5-1 Interrupt Controller Block Diagram
5.5 Operating Modes
The ITCN module design contains two major modes of operation:
•
•
Functional Mode
The ITCN is in this mode by default.
Wait and Stop Modes
During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal
a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ
can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode.
56F8013/56F8011 Data Sheet, Rev. 10
46
Freescale Semiconductor
Preliminary
Register Descriptions
5.6 Register Descriptions
A register address is the sum of a base address and an address offset. The base address is defined at the
system level and the address offset is defined at the module level. The ITCN module has 16 registers.
Table 5-2 ITCN Register Summary
(ITCN_BASE = $00 F060)
Register
Acronym
Base Address +
Register Name
Section Location
IPR0
$0
Interrupt Priority Register 0
5.6.1
IPR1
$1
Interrupt Priority Register 1
5.6.2
IPR2
$2
Interrupt Priority Register 2
5.6.3
IPR3
$3
Interrupt Priority Register 3
5.6.4
IPR4
$4
Interrupt Priority Register 4
5.6.5
VBA
$5
Vector Base Address Register
5.6.6
FIM0
$6
Fast Interrupt Match 0 Register
5.6.7
FIVAL0
$7
Fast Interrupt 0 Vector Address Low Register
5.6.8
FIVAH0
$8
Fast Interrupt 0 Vector Address High 0 Register
5.6.9
FIM1
$9
Fast Interrupt Match 1 Register
5.6.10
FIVAL1
$A
Fast Interrupt 1 Vector Address Low Register
5.6.11
FIVAH1
$B
Fast Interrupt 1 Vector Address High Register
5.6.12
IRQP0
$C
IRQ Pending Register 0
5.6.13
IRQP1
$D
IRQ Pending Register 1
5.6.14
IRQP2
$E
IRQ Pending Register 2
5.6.15
Reserved
ICTRL
$12
Interrupt Control Register
5.6.16
Reserved
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
47
Add.
Offset
Register
Name
$0
IPR0
$1
IPR1
$2
IPR2
$3
IPR3
$4
IPR4
$5
VBA
$6
FIM0
$7
FIVAL0
$8
FIVAH0
$9
FIM1
$A
FIVAL1
$B
FIVAH1
$C
IRQP0
$D
IRQP1
$E
IRQP2
15
R
14
LVI IPL
W
R
W
11
10
0
0
0
0
GPIOC IPL
SCI_RCV
IPL
SCI_RERR
IPL
ADCA_CC
IPL
TMR_3 IPL
R
R
12
GPIOB IPL
W
W
13
R
0
0
0
0
0
0
0
9
RX_REG IPL
0
0
4
3
2
1
0
STPCNT IPL
FM_CBE IPL
FM_CC IPL
FM_ERR IPL
PLL IPL
SCI_TIDL IPL
SCI_XMIT
IPL
SPI_XMIT
IPL
SPI_RCV IPL
GPIOA IPL
TMR_1 IPL
TMR_0 IPL
I2C_ADDR
IPL
PWM_F IPL
PWM_RL IPL
0
0
0
0
0
0
0
ADC_ZC_LE
IPL
0
0
ADCB_CC IPL
VECTOR_BASE_ADDRESS
W
R
5
BKPT_U IPL
W
R
6
TRBUF IPL
TMR_2 IPL
0
7
TX_REG IPL
GPIOD IPL
0
8
0
0
0
0
0
0
0
0
FAST INTERRUPT 0
W
R
FAST INTERRUPT 0 VECTOR ADDRESS LOW
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 0 VECTOR
ADDRESS HIGH
W
R
FAST INTERRUPT 1
W
R
FAST INTERRUPT 1 VECTOR ADDRESS LOW
W
R
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 1 VECTOR
ADDRESS HIGH
W
R
1
PENDING[16:2]
W
R
PENDING[32:17]
W
1
R
1
1
PENDING[45:33]
W
Reserved
$12
R
ICTRL
IPIC
INT
VAB
INT_
DIS
W
1
1
1
0
0
1
0
Reserved
= Reserved
Figure 5-2 ITCN Register Map Summary
5.6.1
Interrupt Priority Register 0 (IPR0)
Base + $0
Read
Write
RESET
15
14
LVI IPL
0
0
13
12
11
10
0
0
0
0
0
0
0
0
9
8
RX_REG IPL
0
0
7
6
TX_REG IPL
0
0
5
4
TRBUF IPL
0
0
3
2
BKPT_U IPL
0
0
STPCNT IPL
0
0
Figure 5-3 Interrupt Priority Register 0 (IPR0)
56F8013/56F8011 Data Sheet, Rev. 10
48
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.1.1
LVI IPL—Bits 15–14
This field is used to set the interrupt priority levels for a peripheral IRQ. This IRQ is limited to priorities
0 through 2 and is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.1.2
Reserved—Bits 13–10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.1.3
EOnCE Receive Register Full Interrupt Priority Level
(RX_REG IPL)— Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.4
EOnCE Transmit Register Empty Interrupt Priority Level
(TX_REG IPL)— Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.5
EOnCE Trace Buffer Interrupt Priority Level
(TRBUF IPL)— Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
49
5.6.1.6
EOnCE Breakpoint Unit Interrupt Priority Level
(BKPT_U IPL)— Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.7
EOnCE Step Counter Interrupt Priority Level
(STPCNT IPL)— Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.2
Interrupt Priority Register 1 (IPR1)
Base + $1
Read
15
14
GPIOB IPL
Write
RESET
0
0
13
12
GPIOC IPL
0
0
11
10
GPIOD IPL
0
0
9
8
0
0
0
0
7
6
FM_CBE IPL
0
0
5
4
FM_CC IPL
0
0
3
2
FM_ERR IPL
0
0
1
0
PLL IPL
0
0
Figure 5-4 Interrupt Priority Register 1 (IPR1)
5.6.2.1
GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.2
GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8013/56F8011 Data Sheet, Rev. 10
50
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.2.3
GPIOD Interrupt Priority Level (GPIOD IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.4
Reserved—Bits 9–8
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.2.5
FM Command, Data, Address Buffers Empty Interrupt Priority Level
(FM_CBE IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.6
FM Command Complete Priority Level (FM_CC IPL)—Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.7
FM Error Interrupt Priority Level (FM_ERR IPL)—Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
51
5.6.2.8
PLL Loss of Reference or Change in Lock Status Interrupt Priority Level
(PLL IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3
Interrupt Priority Register 2 (IPR2)
Base + $2
Read
15
14
13
SCI_RCV IPL
Write
RESET
0
0
12
SCI_RERR
IPL
0
0
11
10
0
0
0
0
9
8
SCI_TIDL IPL
0
0
7
6
5
4
SCI_XMIT IPL SPI_XMIT IPL
0
0
0
0
3
2
SPI_RCV IPL
0
0
1
0
GPIOA IPL
0
0
Figure 5-5 Interrupt Priority Register 2 (IPR2)
5.6.3.1
SCI Receiver Full Interrupt Priority Level (SCI_RCV IPL)—
Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.2
SCI Receiver Error Interrupt Priority Level (SCI_RERR IPL)—
Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.3
Reserved—Bits 11–10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
56F8013/56F8011 Data Sheet, Rev. 10
52
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.3.4
SCI Transmitter Idle Interrupt Priority Level (SCI_TIDL IPL)—
Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.5
SCI Transmitter Empty Interrupt Priority Level (SCI_XMIT IPL)—
Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.6
SPI Transmitter Empty Interrupt Priority Level (SPI_XMIT IPL)—
Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.7
SPI Receiver Full Interrupt Priority Level (SPI_RCV IPL)—
Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
53
5.6.3.8
GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4
Interrupt Priority Register 3 (IPR3)
Base + $3
Read
Write
RESET
15
14
ADCA_CC IPL
0
0
13
12
TMR_3 IPL
0
0
11
10
TMR_2 IPL
0
0
9
8
TMR_1 IPL
0
0
7
6
TMR_0 IPL
0
0
5
4
I2C_ADDR
IPL
0
0
3
2
1
0
0
0
0
0
0
0
0
0
Figure 5-6 Interrupt Priority Register 3 (IPR3)
5.6.4.1
ADCA Conversion Complete Interrupt Priority Level
(ADCA_CC IPL)—Bits 15–14
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.2
Timer Channel 3 Interrupt Priority Level (TMR_3 IPL)—Bits 13–12
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.3
Timer Channel 2 Interrupt Priority Level (TMR_2 IPL)—Bits 11–10
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8013/56F8011 Data Sheet, Rev. 10
54
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.4.4
Timer Channel 1 Interrupt Priority Level (TMR_1 IPL)—Bits 9–8
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.5
Timer Channel 0 Interrupt Priority Level (TMR_0 IPL)—Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
I2C Address Detect Interrupt Priority Level (I2C_ADDR IPL)—Bits 5–4
5.6.4.6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.7
Reserved—Bits 3–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.5
Interrupt Priority Register 4 (IPR4)
Base + $4
15
14
13
12
11
10
9
8
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
7
6
PWM_F IPL
0
0
5
4
PWM_RL IPL
0
0
3
2
ADC_ZC_LE
IPL
0
0
1
0
ADCB_CC
IPL
0
0
Figure 5-7 Interrupt Priority Register 4 (IPR4)
5.6.5.1
Reserved—Bits 15–8
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
55
5.6.5.2
PWM Fault Interrupt Priority Level (PWM_F IPL)—
Bits 7–6
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.3
Reload PWM Interrupt Priority Level (PWM_RL IPL)—
Bits 5–4
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.4
ADC Zero Crossing or Limit Error Interrupt Priority Level
(ADC_ZC_LE IPL)— Bits 3–2
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.5
ADCB Conversion Complete Interrupt Priority Level
(ADCB_CC IPL)—Bits 1–0
This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.
They are disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8013/56F8011 Data Sheet, Rev. 10
56
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.6
Vector Base Address Register (VBA)
Base + $5
15
14
Read
0
0
0
0
13
12
11
10
9
7
6
5
4
3
2
1
0
0
0
0
0
0
VECTOR_BASE_ADDRESS
Write
RESET
8
0
0
0
0
0
0
0
0
0
Figure 5-8 Vector Base Address Register (VBA)
5.6.6.1
Reserved—Bits 15–14
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.6.2
Vector Address Bus (VAB) Bits 13—0
The value in this register is used as the upper 14 bits of the interrupt vector VAB[20:0]. The lower 7 bits
are determined based on the highest priority interrupt and are then appended onto VBA before presenting
the full VAB to the Core.
5.6.7
Fast Interrupt Match 0 Register (FIM0)
Base + $6
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
2
1
0
0
0
FAST INTERRUPT 0
Write
RESET
3
0
0
0
0
Figure 5-9 Fast Interrupt Match 0 Register (FIM0)
5.6.7.1
Reserved—Bits 15–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.7.2
Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 5–0
These values determine which IRQ will be Fast Interrupt 0. Fast Interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast
Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest-priority
level 2 interrupt regardless of its location in the interrupt table prior to being declared as Fast Interrupt.
Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to
the vector table.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
57
5.6.8
Fast Interrupt 0 Vector Address Low Register (FIVAL0)
Base + $7
15
14
13
12
11
Read
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
FAST INTERRUPT 0 VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
0
Figure 5-10 Fast Interrupt 0 Vector Address Low Register (FIVAL0)
5.6.8.1
Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15—0
The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.9
Fast Interrupt 0 Vector Address High Register (FIVAH0)
Base + $8
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 0 VECTOR
ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-11 Fast Interrupt 0 Vector Address High Register (FIVAH0)
5.6.9.1
Reserved—Bits 15–5
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.9.2
Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0
The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.10
Fast Interrupt 1 Match Register (FIM1)
Base + $9
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
2
1
0
0
0
FAST INTERRUPT 1
Write
RESET
3
0
0
0
0
Figure 5-12 Fast Interrupt 1 Match Register (FIM1)
5.6.10.1
Reserved—Bits 15–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.10.2
Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 5–0
These values determine which IRQ will be Fast Interrupt 1. Fast Interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast
56F8013/56F8011 Data Sheet, Rev. 10
58
Freescale Semiconductor
Preliminary
Register Descriptions
Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest priority
level 2 interrupt, regardless of its location in the interrupt table prior to being declared as Fast Interrupt.
Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to
the vector table.
5.6.11
Fast Interrupt 1 Vector Address Low Register (FIVAL1)
Base + $A
15
14
13
12
11
Read
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
FAST INTERRUPT 1 VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
0
Figure 5-13 Fast Interrupt 1 Vector Address Low Register (FIVAL1)
5.6.11.1
Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0
The lower 16 bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAH1
to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.12
Fast Interrupt 1 Vector Address High (FIVAH1)
Base + $B
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 1 VECTOR
ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-14 Fast Interrupt 1 Vector Address High Register (FIVAH1)
5.6.12.1
Reserved—Bits 15–5
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.6.12.2
Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0
The upper five bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAL1
to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.13
IRQ Pending Register 0 (IRQP0)
Base + $C
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
PENDING[16:2]
0
1
Write
RESET
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Figure 5-15 IRQ Pending Register 0 (IRQP0)
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
59
5.6.13.1
IRQ Pending (PENDING)—Bits 15–1
This register combines with IRQP1 and IRQP2 to represent the pending IRQs for interrupt vector numbers
2 through 45.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.13.2
Reserved—Bit 0
This bit is reserved or not implemented. It is read as 1 and cannot be modified by writing.
5.6.14
IRQ Pending Register 1 (IRQP1)
Base + $D
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING[32:17]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-16 IRQ Pending Register 1 (IRQP1)
5.6.14.1
IRQ Pending (PENDING)—Bits 32–17
This register combines with IRQP0 and IRQP2 to represent the pending IRQs for interrupt vector numbers
2 through 45.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.15
IRQ Pending Register 2 (IRQP2)
Base + $E
15
14
13
Read
1
1
1
1
1
1
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
PENDING[45:33]
Write
RESET
1
1
1
1
1
1
1
1
Figure 5-17 IRQ Pending Register 2 (IRQP2)
5.6.15.1
IRQ Pending (PENDING)—Bits 45–33
This register combines with IRQP0 and IRQP1 to represent the pending IRQs for interrupt vector numbers
2 through 45.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
56F8013/56F8011 Data Sheet, Rev. 10
60
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.16
Interrupt Control Register (ICTRL)
$Base + $12
15
Read
INT
14
13
12
11
10
IPIC
9
8
7
6
VAB
Write
RESET
0
0
0
0
0
0
0
0
0
0
5
4
3
2
1
0
INT_
DIS
1
1
1
0
0
0
1
1
1
0
0
Figure 5-18 Interrupt Control Register (ICTRL)
5.6.16.1
Interrupt (INT)—Bit 15
This read-only bit reflects the state of the interrupt to the 56800E core.
•
•
0 = No interrupt is being sent to the 56800E core
1 = An interrupt is being sent to the 56800E core
5.6.16.2
Interrupt Priority Level (IPIC)—Bits 14–13
These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E
core. These bits indicate the priority level needed for a new IRQ to interrupt the current interrupt being
sent to the 56800E core. This field is only updated when the 56800E core jumps to a new interrupt service
routine.
Note:
•
•
•
•
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
00 = Required nested exception priority levels are 0, 1, 2, or 3
01 = Required nested exception priority levels are 1, 2, or 3
10 = Required nested exception priority levels are 2 or 3
11 = Required nested exception priority level is 3
Table 5-3 Interrupt Priority Encoding
5.6.16.3
IPIC_VALUE[1:0]
Current Interrupt
Priority Level
Required Nested
Exception Priority
00
No interrupt or SWILP
Priorities 0, 1, 2, 3
01
Priority 0
Priorities 1, 2, 3
10
Priority 1
Priorities 2, 3
11
Priority 2 or 3
Priority 3
Vector Number - Vector Address Bus (VAB)—Bits 12–6
This read-only field shows the vector number (VAB[6:0]) used at the time the last IRQ was taken. In the
case of a Fast Interrupt, it shows the lower address bits of the jump address. This field is only updated when
the 56800E core jumps to a new interrupt service routine.
Note:
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
61
5.6.16.4
Interrupt Disable (INT_DIS)—Bit 5
This bit allows all interrupts to be disabled.
•
•
0 = Normal operation (default)
1 = All interrupts disabled
5.6.16.5
Reserved—Bits 4–2
This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing.
5.6.16.6
Reserved—Bits 1–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
5.7 Resets
5.7.1
General
Table 5-4 Reset Summary
Reset
Priority
Core Reset
5.7.2
5.7.2.1
Source
Characteristics
RST
Core reset from the SIM
Description of Reset Operation
Reset Handshake Timing
The ITCN provides the 56800E core with a reset vector address on the VAB pins whenever RESET is
asserted from the SIM. The reset vector will be presented until the second rising clock edge after RESET
is released. The general timing is shown in Figure 5-19.
RES
CLK
VAB
RESET_VECTOR_ADR
PAB
READ_ADR
Figure 5-19 Reset Interface
56F8013/56F8011 Data Sheet, Rev. 10
62
Freescale Semiconductor
Preliminary
Introduction
5.7.3
ITCN After Reset
After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled,
except the core IRQs with fixed priorities:
•
•
•
•
•
•
•
•
Illegal Instruction
SW Interrupt 3
HW Stack Overflow
Misaligned Long Word Access
SW Interrupt 2
SW Interrupt 1
SW Interrupt 0
SW Interrupt LP
These interrupts are enabled at their fixed priority levels.
Part 6 System Integration Module (SIM)
6.1 Introduction
The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls
distribution of resets and clocks and provides a number of control features. The System Integration Module
is responsible for the following functions:
•
•
•
•
•
•
•
•
Reset sequencing
Clock control & distribution
Stop/Wait control
System status registers
Registers for software access to the JTAG ID of the chip
Test registers
Power control
I/O pad multiplexing
These are discussed in more detail in the sections that follow.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
63
6.2 Features
The SIM has the following features:
•
•
System bus clocks with pipeline hold-off support
System clocks for non-pipelined interfaces
•
Peripheral clocks for TMR and PWM with high-speed (3X) option
•
•
•
•
•
•
•
•
•
•
•
•
Power-saving clock gating for peripherals
ITCK clock to the 56800E core TAP interface
Three power modes (Run, Wait, Stop) to control power utilization
— Stop mode shuts down the 56800E core, system clock, and peripheral clock
— Wait mode shuts down the 56800E core and unnecessary system clock operation
— Run mode supports full part operation
Controls, with write protection, the enable/disable of 56800E core WAIT and STOP instructions
Controls, with write protection, the enable/disable of Large Regulator Standby mode
Controls to route functional signals to selected peripherals and I/O pads
Controls deassertion sequence of internal resets
Software-initiated reset
Four 16-bit registers reset only by a Power-On Reset usable for general-purpose software control
Timer channel Stop mode clocking controls
SCI Stop mode clocking control to support LIN Sleep mode stop recovery
Short addressing location control
•
•
Registers for software access to the JTAG ID of the chip
Controls output to CLKO pin
56F8013/56F8011 Data Sheet, Rev. 10
64
Freescale Semiconductor
Preliminary
Register Descriptions
6.3 Register Descriptions
Table 6-1 SIM Registers (SIM_BASE = $00 F140)
Address Offset
Address Acronym
Register Name
Section Location
Base + $0
SIM_CTRL
Control Register
6.3.1
Base + $1
SIM_RSTAT
Reset Status Register
6.3.2
Base + $2
SIM_SWC0
Software Control Register 0
6.3.3
Base + $3
SIM_SWC1
Software Control Register 1
6.3.3
Base + $4
SIM_SWC2
Software Control Register 2
6.3.3
Base + $5
SIM_SWC3
Software Control Register 3
6.3.3
Base + $6
SIM_MSHID
Most Significant Half of JTAG ID
6.3.4
Base + $7
SIM_LSHID
Least Significant Half of JTAG ID
6.3.5
Base + $8
SIM_PWR
Power Control Register
6.3.6
Reserved
Base + $A
SIM_CLKOUT
CLKO Select Register
6.3.7
Base + $B
SIM_GPS
GPIO Peripheral Select Register
6.3.8
Base + $C
SIM_PCE
Peripheral Clock Enable Register
6.3.9
Base + $D
SIM_IOSAHI
I/O Short Address Location High Register
6.3.10
Base + $E
SIM_IOSALO
I/O Short Address Location Low Register
6.3.10
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
65
Add.
Offset
Address
Acronym
$0
SIM_
CTRL
$1
SIM_
RSTAT
W
$2
SIM_SWC0
$3
SIM_SWC1
$4
SIM_SWC2
$5
SIM_SWC3
$6
SIM_MSHID
$7
SIM_LSHID
$8
SIM_PWR
15
14
13
12
11
10
9
8
7
6
5
4
TC2_
SD
TC1_
SD
TC0_
SD
SCI_
SD
0
TC3_
INP
0
0
0
W
TC3_
SD
ONCE
EBL0
SW
RST
R
0
0
0
0
0
0
0
0
0
0
R
R
2
STOP_
DISABLE
COPR EXTR
POR
1
0
WAIT_
DISABLE
0
0
Software Control Data 0
W
R
Software Control Data 1
W
R
Software Control Data 2
W
R
Software Control Data 3
W
R
SWR
3
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TCR
PCR
0
0
CFG_
B7
0
0
0
0
0
0
0
0
0
0
0
0
W
R
W
R
W
LRSTDBY
Reserved
$A
SIM_
CLKOUT
$B
SIM_GPS
$C
SIM_PCE
$D
SIM_IOSAHI
$E
SIM_IOSALO
R
W
R
W
R
W
R
0
I2C
0
ADC
0
0
CLK
DIS
PWM3 PWM2 PWM1 PWM0
CFG_ CFG_ CFG_
B6
B5
B4
CFG_
B3
CFG_
B2
CFG_
B1
CLKOSEL
CFG_
B0
0
TMR
0
SCI
0
0
CFG_A5
CFG_A4
0
0
SPI
0
0
W
R
PWM
ISAL[23:22]
ISAL[21:6]
W
0
= Read as 0
1
= Reserved
= Read as 1
= Reserved
Figure 6-1 SIM Register Map Summary
6.3.1
SIM Control Register (SIM_CTRL)
Base + $0
Read
15
14
13
12
11
10
9
8
7
6
5
4
TC3_
INP
0
0
0
ONCE
EBL
SW
RST
0
0
0
0
0
0
Write
TC3_
SD
TC2_
SD
TC1_
SD
TC0_
SD
SCI_
SD
0
RESET
0
0
0
0
0
0
3
2
1
0
STOP_
DISABLE
WAIT_
DISABLE
0
0
0
0
Figure 6-2 SIM Control Register (SIM_CTRL)
6.3.1.1
Timer Channel 3 Stop Disable (TC3_SD)—Bit 15
This bit enables the operation of the Timer Channel 3 peripheral clock in Stop mode.
•
•
0 = Timer Channel 3 disabled in Stop mode
1 = Timer Channel 3 enabled in Stop mode
56F8013/56F8011 Data Sheet, Rev. 10
66
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.1.2
Timer Channel 2 Stop Disable (TC2_SD)—Bit 14
This bit enables the operation of the Timer Channel 2 peripheral clock in Stop mode.
•
•
0 = Timer Channel 2 disabled in Stop mode
1 = Timer Channel 2 enabled in Stop mode
6.3.1.3
Timer Channel 1 Stop Disable (TC1_SD)—Bit 13
This bit enables the operation of the Timer Channel 1 peripheral clock in Stop mode.
•
•
0 = Timer Channel 1 disabled in Stop mode
1 = Timer Channel 1 enabled in Stop mode
6.3.1.4
Timer Channel 0 Stop Disable (TC0_SD)—Bit 12
This bit enables the operation of the Timer Channel 0 peripheral clock in Stop mode.
•
•
0 = Timer Channel 0 disabled in Stop mode
1 = Timer Channel 0 enabled in Stop mode
6.3.1.5
SCI Stop Disable (SCI_SD)—Bit 11
This bit enables the operation of the SCI peripheral clock in Stop mode. This is recommended for use in
LIN mode so that the SCI can generate interrupts and recover from Stop mode while the LIN interface is
in Sleep mode and using Stop mode to reduce power consumption.
•
•
0 = SCI disabled in Stop mode
1 = SCI enabled in Stop mode
6.3.1.6
Reserved—Bit 10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.1.7
Timer Channel 3 Input (TC3_INP)—Bit 9
This bit selects the input of Timer Channel 3 to be from the PWM or GPIO.
•
•
1 = Timer Channel 3 Input from PWM reload_sync signal
0 = Timer Channel 3 Input controlled by SIM_GPS register CFG_B3 and CFG_A5 fields
6.3.1.8
Reserved—Bits 8–6
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.1.9
•
•
OnCE Enable (ONCEEBL)—Bit 5
0 = OnCE clock to 56800E core enabled when core TAP is enabled
1 = OnCE clock to 56800E core is always enabled
6.3.1.10
Software Reset (SWRST)—Bit 4
Writing 1 to this field will cause the part to reset.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
67
6.3.1.11
•
•
•
Stop Disable (STOP_DISABLE[1:0])—Bits 3–2
00 = Stop mode will be entered when the 56800E core executes a STOP instruction
01 = The 56800E STOP instruction will not cause entry into Stop mode
10 = Stop mode will be entered when the 56800E core executes a STOP instruction and the
STOP_DISABLE field is write-protected until the next reset
11 = The 56800E STOP instruction will not cause entry into Stop mode and the STOP_DISABLE field is
write-protected until the next reset
•
6.3.1.12
•
•
•
Wait Disable (WAIT_DISABLE[1:0])—Bits 1–0
00 = Wait mode will be entered when the 56800E core executes a WAIT instruction
01 = The 56800E WAIT instruction will not cause entry into Wait mode
10 = Wait mode will be entered when the 56800E core executes a WAIT instruction and the
WAIT_DISABLE field is write-protected until the next reset
11 = The 56800E WAIT instruction will not cause entry into Wait mode and the WAIT_DISABLE field is
write-protected until the next reset
•
6.3.2
SIM Reset Status Register (SIM_RSTAT)
This register is updated upon any system reset and indicates the cause of the most recent reset. It also
controls whether the COP reset vector or regular reset vector in the vector table is used. This register is
asynchronously reset during Power-On Reset (see power supervisor module) and subsequently is
synchronously updated based on the level of the external reset, software reset, or cop reset inputs. Only
one source will ever be indicated. In the event that multiple reset sources assert simultaneously, the
highest-precedence source will be indicated. The precedence from highest to lowest is POR, EXTR,
COPR, and SWR. While POR is always set during a Power-On Reset, EXTR will become set if the
external reset pin is asserted or remains asserted after the Power-On Reset (POR) has deasserted.
Base + $1
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
5
SWR
4
COPR
3
EXTR
2
POR
1
0
0
0
0
0
Figure 6-3 SIM Reset Status Register (SIM_RSTAT)
6.3.2.1
Reserved—Bits 15–6
This bit field is reserved or not implemented. It is read as zero and cannot be modified by writing.
6.3.2.2
Software Reset (SWR)—Bit 5
When set, this bit indicates that the previous system reset occurred as a result of a software reset (written
1 to SWRST bit in the SIM_CTRL register). It will not be set if a COP, external, or POR reset also
occurred.
6.3.2.3
COP Reset (COPR)—Bit 4
When set, this bit indicates that the previous system reset was caused by the Computer Operating Properly
(COP) timer. It will not be set if an external or POR reset also occurred. If COPR is set as code starts
executing, the COP reset vector in the vector table will be used. Otherwise, the normal reset vector is used.
56F8013/56F8011 Data Sheet, Rev. 10
68
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.2.4
External Reset (EXTR)—Bit 3
When set, this bit indicates that the previous system reset was caused by an external reset. It will only be
set if the external reset pin was asserted or remained asserted after the Power-On Reset deasserted.
6.3.2.5
Power-On Reset (POR)—Bit 2
This bit is set during a Power-On Reset.
6.3.2.6
Reserved—Bits 1–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.3
SIM Software Control Registers (SIM_SWC0, SIM_SWC1,
SIM_SWC2, and SIM_SWC3)
Only SIM_SWC0 is shown in this section. SIM_SWC1, SIM_SWC2, and SIM_SWC3 are identical in
functionality.
Base + $2
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
Software Control Data 0
Write
RESET
0
0
0
0
0
0
0
0
0
Figure 6-4 SIM Software Control Register 0 (SIM_SWC0)
6.3.3.1
Software Control Data 0 (FIELD)—Bits 15–0
This register is reset only by the Power-On Reset (POR). It has no part-specific functionality and is
intended for use by a software developer to contain data that will be unaffected by the other reset sources
(RESET pin, software reset, and COP reset).
6.3.4
Most Significant Half of JTAG ID (SIM_MSHID)
This read-only register displays the most significant half of the JTAG ID for the chip. This register reads
$01F2.
Base + $6
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
Write
RESET
Figure 6-5 Most Significant Half of JTAG ID (SIM_MSHID)
6.3.5
Least Significant Half of JTAG ID (SIM_LSHID)
This read-only register displays the least significant half of the JTAG ID for the chip. This register reads
$401D.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
69
Base + $7
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
1
1
1
0
1
Write
RESET
Figure 6-6 Least Significant Half of JTAG ID (SIM_LSHID)
6.3.6
SIM Power Control Register (SIM_PWR)
This register controls the Standby mode of the large regulator. The large regulator derives the core digital
logic power supply from the IO power supply. In some circumstances, the large regulator may be put in a
reduced-power Standby mode without interfering with part operation. Refer to the overview of
power-down modes and the overview of clock generation for more information on the use of large
regulator standby.
Base + $8
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
1
0
LRSTDBY
0
0
Figure 6-7 SIM Power Control Register (SIM_PWR)
6.3.6.1
Reserved—Bits 15–2
6.3.6.2
Large Regulator Standby Mode[1:0] (LRSTDBY)—Bits 1–0
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
This bit controls the pull-up resistors on the IRQA pin.
•
•
•
•
6.3.7
00 = Large regulator is in Normal mode
01 = Large regulator is in Standby (reduced-power) mode
10 = Large regulator is in Normal mode and the LRSTDBY field is write-protected until the next reset
11 = Large regulator is in Standby mode and the LRSTDBY field is write-protected until the next reset
CLKO Select Register (SIM_CLKOUT)
The CLKO select register can be used to multiplex out selected clocks generated inside the clock
generation and SIM modules. All functionality is for test purposes only and is subject to
unspecified latencies. Glitches may be produced when the clock is enabled or switched.
The lower four bits of the GPIO A register can function as GPIO, PWM, or as additional clock output
signals. GPIO has priority and is enabled/disabled via the GPIOA_PEREN. If GPIOA[3:0] are
programmed to operate as peripheral outputs, then the choice between PWM and additional clock outputs
is done here in the CLKOUT. The default state is for the peripheral function of GPIOA[3:0] to be
programmed as PWM. This can be changed by altering PWM3 through PWM0.
56F8013/56F8011 Data Sheet, Rev. 10
70
Freescale Semiconductor
Preliminary
Register Descriptions
Base + $A
15
14
13
12
11
10
Read
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
9
8
PWM3
PWM2
0
0
7
6
PWM1 PWM0
0
0
5
4
3
CLK
DIS
1
2
1
0
0
0
CLKOSEL
0
0
0
Figure 6-8 CLKO Select Register (SIM_CLKOUT)
6.3.7.1
Reserved—Bits 15–10
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.7.2
•
•
0 = Peripheral output function of GPIOA[3] is defined to be PWM3
1 = Peripheral output function of GPIOA[3] is defined to be the Relaxation Oscillator Clock
6.3.7.3
•
•
PWM0—Bit 6
0 = Peripheral output function of GPIOA[0] is defined to be PWM0
1 = Peripheral output function of GPIOA[0] is defined to be three times the rate of the system clock
6.3.7.6
•
•
PWM1—Bit 7
0 = Peripheral output function of GPIOA[1] is defined to be PWM1
1 = Peripheral output function of GPIOA[1] is defined to be two times the rate of the system clock
6.3.7.5
•
•
PWM2—Bit 8
0 = Peripheral output function of GPIOA[2] is defined to be PWM2
1 = Peripheral output function of GPIOA[2] is defined to be the system clock
6.3.7.4
•
•
PWM3—Bit 9
Clockout Disable (CLKDIS)—Bit 5
0 = CLKOUT output is enabled and will output the signal indicated by CLKOSEL
1 = CLKOUT is 0
6.3.7.7
Clockout Select (CLKOSEL)—Bits 4–0
Selects clock to be muxed out on the CLKO pin.
•
•
•
•
•
•
•
00000 = Reserved for factory test—Continuous system clock
01001 = Reserved for factory test—OCCS MSTR OSC clock
01011 = Reserved for factory test—ADC clock
01100 = Reserved for factory test—JTAG TCLK
01101 = Reserved for factory test—Continuous peripheral clock
01110 = Reserved for factory test—Continuous inverted peripheral clock
01111 = Reserved for factory test—Continuous high-speed peripheral clock
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
71
6.3.8
SIM GPIO Peripheral Select Register (SIM_GPS)
All of the peripheral pins on the 56F8013/56F8011 share their Input/Output (I/O) with GPIO ports. In
order to select peripheral or GPIO control, program the GPIOx_PEREN register. In some cases, there are
two possible peripherals as well as the GPIO functionality available for control of the I/O. In these cases,
the SIM_GPS register is used to determine which peripheral has control.
As shown in Figure 6-9, the GPIO Peripheral Enable Register (PEREN) has the final control over which
pin controls the I/O. SIM_GPS simply decides which peripheral will be routed to the I/O when
PEREN = 1.
GPIOB_PEREN Register
0
GPIO Controlled
I/O Pad Control
1
SIM_GPS Register
0
Quad Timer Controlled
1
SCI Controlled
Figure 6-9 Overall Control of Pads Using SIM_GPS Control
Base + $B
Read
Write
RESET
15
14
TCR
PCR
0
0
13
12
11
10
9
8
7
6
5
4
0
0
CFG_
B7
CFG_
B6
CFG_
B5
CFG_
B4
CFG_
B3
CFG_
B2
CFG_
B1
CFG_
B0
0
0
0
0
0
0
0
0
0
0
3
2
1
0
CFG_A5
CFG_A4
0
0
0
0
Figure 6-10 GPIO Peripheral Select Register (SIM_GPS)
6.3.8.1
TMR Clock Rate (TCR)—Bit 15
This bit selects the clock speed for the TMR module.
•
•
0 = TMR module clock rate equals core clock rate, typically 32MHz (default)
1 = TMR module clock rate equals three times core clock rate
Note: This bit should only be changed while the TMR module’s clock is disabled. See Section 6.3.9.
Note: High-speed clocking is only available when the PLL is being used.
Note: If the PWM reload pulse is used as input to Timer 3 (See SIM_CTRL: TC3_INP, Section 6.3.1.7),
then the clocks of the Quad Timer and PWM must be related, as shown in Table 6-2.
56F8013/56F8011 Data Sheet, Rev. 10
72
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.8.2
PWM Clock Rate (PCR)—Bit 14
This bit selects the clock speed for the PWM module.
•
•
0 = PWM module clock rate equals core clock rate, typically 32MHz (default)
1 = PWM module clock rate equals three times core clock rate
Note: This bit should only be changed while the PWM module’s clock is disabled. See Section 6.3.9.
Note: High-speed clocking is only available when the PLL is being used.
Note: If the PWM reload pulse is used as input to Timer 3 (See SIM_CTRL: TC3_INP, Section 6.3.1.7),
then the clocks of the Quad Timer and PWM must be related, as shown in Table 6-2.
Table 6-2 Allowable Quad Timer and PWM Clock Rates
when Using PWM Reload Pulse
Quad Timer
Clock Speed
1X
3X
1X
OK
OK
3X
NO
OK
PWM
6.3.8.3
Reserved—Bits 13–12
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
Note: Take care when programming the following CFG_* signals so as not to connect two
different I/O pads to the same peripheral input. For example, do not set CFG_B7 to select
SCL and also set CFG_B0 to select SCL. If this occurs for an output signal, then the signal
will be routed to two I/O pads. For input signals, the values on the two I/O pads will be
ORed together before reaching the peripheral.
6.3.8.4
Configure GPIOB7 (CFG_B7)—Bit 11
This bit selects the alternate function for GPIOB7.
•
•
0 = TXD (default)
1 = SCL
6.3.8.5
Configure GPIOB6 (CFG_B6)—Bit 10
This bit selects the alternate function for GPIOB6.
•
•
0 = RXD (default)
1 = SDA
Note: The CLKMODE bit in the OCCS Oscillator Control register can enable this pin as the
source clock to the chip. In this mode, make sure that no on-chip peripheral (including the
GPIO) is driving this pin.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
73
6.3.8.6
Configure GPIOB5 (CFG_B5)—Bit 9
This bit selects the alternate function for GPIOB5.
•
•
0 = T1 (default)
1 = FAULT3
6.3.8.7
Configure GPIOB4 (CFG_B4)—Bit 8
This bit selects the alternate function for GPIOB4.
•
•
0 = T0 (default)
1 = CLKO
6.3.8.8
Configure GPIOB3 (CFG_B3)—Bit 7
This bit selects the alternate function for GPIOB3.
•
•
0 = MOSI (default)
1 = T3
6.3.8.9
Configure GPIOB2 (CFG_B2)—Bit 6
This bit selects the alternate function for GPIOB2.
•
•
0 = MISO (default)
1 = T2
6.3.8.10
Configure GPIOB1 (CFG_B1)—Bit 5
This bit selects the alternate function for GPIOB1.
•
•
0 = SS (default)
1 = SDA
6.3.8.11
Configure GPIOB0 (CFG_B0)—Bit 4
This bit selects the alternate function for GPIOB0.
•
•
0 = SCLK (default)
1 = SCL
6.3.8.12
Configure GPIOA5[1:0] (CFG_A5)—Bits 3–2
These bits select the alternate function for GPIOA5.
•
•
•
•
00 = Select PWM5 when peripheral mode is enabled in GPIOA5 (default)
01 = Select PWM5 when peripheral mode is enabled in GPIOA5
10 = Select FAULT2 when peripheral mode is enabled in GPIOA5
11 = Select T3 when peripheral mode is enabled in GPIOA5
56F8013/56F8011 Data Sheet, Rev. 10
74
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.8.13
Configure GPIOA4[1:0] (CFG_A4)—Bits 1–0
These bits select the alternate function for GPIOA4.
•
•
•
•
00 = Select PWM4 when peripheral mode is enabled in GPIOA4 (default)
01 = Select PWM4 when peripheral mode is enabled in GPIOA4
10 = Select FAULT1 when peripheral mode is enabled in GPIOA4
11 = Select T2 when peripheral mode is enabled in GPIOA4
6.3.9
Peripheral Clock Enable Register (SIM_PCE)
The Peripheral Clock Enable register is used to enable or disable clocks to the peripherals as a power
savings feature. The clocks can be individually controlled for each peripheral on the chip. The
corresponding peripheral should itself be disabled while its clock is shut off. IPBus writes cannot be made
to a module that has its clock disabled.
Base + $C
Read
Write
RESET
15
14
I2C
0
0
0
13
ADC
0
12
11
10
9
8
7
0
0
0
0
0
0
0
0
0
0
0
0
6
TMR
0
5
0
0
4
SCI
0
3
0
0
2
SPI
0
1
0
0
0
PWM
0
Figure 6-11 Peripheral Clock Enable Register (SIM_PCE)
6.3.9.1
I2C IPBus Clock Enable (I2C)—Bit 15
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
6.3.9.2
Reserved—Bit 14
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.9.3
Analog-to-Digital Converter IPBus Clock Enable (ADC)—Bit 13
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
6.3.9.4
Reserved—Bits 12–7
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.9.5
Timer IPBus Clock Enable (TMR)—Bit 6
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
75
6.3.9.6
Reserved—Bit 5
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.9.7
SCI IPBus Clock Enable (SCI)—Bit 4
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
6.3.9.8
Reserved—Bit 3
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.9.9
SPI IPBus Clock Enable (SPI)—Bit 2
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
6.3.9.10
Reserved—Bit 1
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.9.11
PWM IPBus Clock Enable (PWM)—Bit 0
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is not provided to the peripheral (the peripheral is disabled)
1 = Clocks are enabled
6.3.10
I/O Short Address Location Register (SIM_IOSAHI and
SIM_IOSALO)
The I/O Short Address Location registers are used to specify the memory referenced via the I/O short
address mode. The I/O short address mode allows the instruction to specify the lower six bits of address;
the upper address bits are not directly controllable. This register set allows limited control of the full
address, as shown in Figure 6-12.
56F8013/56F8011 Data Sheet, Rev. 10
76
Freescale Semiconductor
Preliminary
Register Descriptions
“Hard Coded” Address Portion
Instruction Portion
6 Bits from I/O Short Address Mode Instruction
16 Bits from SIM_IOSALO Register
2 bits from SIM_IOSAHI Register
Full 24-Bit for Short I/O Address
Figure 6-12 I/O Short Address Determination
With this register set, an interrupt driver can set the SIM_IOSALO register pair to point to its peripheral
registers and then use the I/O Short addressing mode to reference them. The ISR should restore this register
to its previous contents prior to returning from interrupt.
Note:
The default value of this register set points to the EOnCE registers.
Note:
The pipeline delay between setting this register set and using short I/O addressing with the new value
is five instruction cycles.
Base + $D
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
1
0
ISAL[23:22]
1
1
Figure 6-13 I/O Short Address Location High Register (SIM_IOSAHI)
6.3.10.1
Reserved—Bits 15—2
This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.
6.3.10.2
Input/Output Short Address Location (ISAL[23:22])—Bits 1–0
This field represents the upper two address bits of the “hard coded” I/O short address.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
77
Base + $E
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
ISAL[21:6]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 6-14 I/O Short Address Location Low Register (SIM_IOSALO)
6.3.10.3
Input/Output Short Address Location (ISAL[21:6])—Bits 15–0
This field represents the lower 16 address bits of the “hard coded” I/O short address.
6.4 Clock Generation Overview
The SIM uses master clocks from the OCCS module to produce the peripheral and system (core and
memory) clocks. The HS_PERF clock input from OCCS operates at three times the system and peripheral
bus rate, or a maximum of 96MHz. The SYS_CLK_x2 clock input from OCCS operates at two times the
system and peripheral bus rate, or a maximum of 64MHz. Peripheral and system clocks are generated at a
maximum of 32MHz by dividing the SYS_CLK_x2 clock by two and gating it with appropriate power
mode and clock gating controls. The PWM and TIMER peripheral clocks can optionally be generated at
three times the normal rate at a maximum of 96MHz. These clocks are generated by gating the HS_PERF
clock with appropriate power mode and clock gating controls.
The OCCS configuration controls the operating frequency of the SIM’s master clocks. In the OCCS, either
an external clock or the relaxation oscillator can be selected as the master clock source (MSTR_OSC).
When selected, the relaxation oscillator can be operated at full speed (8MHz), standby speed (400kHz
using ROSB), or powered down (using ROPD). An 8MHz MSTR_OSC can be multiplied to 196MHz
using the PLL and postscaled to provide a variety of high speed clock rates. Either the postscaled PLL
output or MSTR_OSC signal can be selected to produce the master clocks to the SIM. When the PLL is
not selected, the HS_PERF clock is disabled and the SYS_CLK_x2 clock is MSTR_OSC.
In combination with the OCCS module, the SIM provides power modes (see Section 6.5), clock enables
(SIM_PCE register, CLK_DIS, ONCE_EBL), and clock rate controls (TCR, PCR) to provide flexible
control of clocking and power utilization. The SIM’s clock enable controls can be used to disable
individual clocks when not needed. The clock rate controls enable the high speed clocking option for the
Timer channels and PWM but require the PLL to be on and selected. Refer to the 56F801X Peripheral
User Manual for further details.
6.5 Power-Down Modes
The 56F8013/56F8011 operates in one of five Power-Down modes, as shown in Table 6-3.
56F8013/56F8011 Data Sheet, Rev. 10
78
Freescale Semiconductor
Preliminary
Power-Down Modes
Table 6-3 Clock Operation in Power-Down Modes
Mode
Core Clocks
Peripheral Clocks
Description
Run
Core and memory
clocks disabled
Peripheral clocks
enabled
Device is fully functional
Wait
Core and memory
clocks disabled
Peripheral clocks
enabled
Core executes WAIT instruction to enter this
mode.
Typically used for power-conscious applications.
Possible recoveries from Wait mode to Run
mode are:
1. Any interrupt
2. Executing a Debug mode entry command
during the 56800E core JTAG interface
2. Any reset (POR, external, software, COP)
Stop
Master clock generation in the OCCS
remains operational, but the SIM disables
the generation of system and peripheral
clocks.
Core executes STOP instruction to enter this
mode. Possible recoveries from Stop mode to
Run mode are:
1. Interrupt from TMR channels that have been
configured to operate in Stop mode (TCx_SD)
2. Interrupt for SCI configured to operate in Stop
mode (SCI_SD)
3. Low-voltage interrupt
4. Executing a Debug mode entry command
using the 56800E core JTAG interface
5. Any reset (POR, external, software, COP)
Standby
The OCCS generates the SYS_CLK_x2
clock at a reduced frequency (400kHz). The
PLL and HS_PERF clocks are disabled and
the high-speed peripheral option is not
available. System and peripheral clocks
operate at 200kHz.
The user configures the OCCS and SIM to select
the relaxation oscillator clock source (PRECS),
shut down the PLL (PLLPD), put the relaxation
oscillator in Standby mode (ROSB), and put the
large regulator in Standby (LRSTDBY). The part
is fully operational, but operating at a minimum
frequency and power configuration. Recovery
requires reversing the sequence used to enter
this mode (allowing for PLL lock time).
Power-Down
Master clock generation in the OCCS is
completely shut down. All system and
peripheral clocks are disabled.
The user configures the OCCS and SIM to enter
Standby mode as shown in the previous
description, followed by powering down the
oscillator (ROPD). The only possible recoveries
from this mode are:
1. External Reset
2. Power-On Reset
The power modes provide additional means to disable clock domains, configure the voltage regulator, and
configure clock generation to manage power utilization, as shown in Table 6-3. Run, Wait, and Stop
modes provide means of enabling/disabling the peripheral and/or core clocking as a group. Stop disable
controls are provided for selected peripherals in the control register (SCI and TMR channels) so that these
peripheral clocks can optionally continue to operate in Stop mode and generate interrupts which will return
the part from Stop to Run mode. Standby mode provides normal operation but at very low speed and power
utilization. It is possible to invoke Stop or Wait mode while in Standby mode for even greater levels of
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
79
power reduction. A 400kHz clock external clock can optionally be used in Standby mode to produce the
required Standby 200kHz system bus rate. Power-down mode, which selects the ROSC clock source but
shuts it off, fully disables the part and minimizes its power utilization but is only recoverable via reset.
When the PLL is not selected and the system bus is operating at 200kHz or less, the large regulator can be
put into its Standby mode (LRSTDBY) to reduce the power utilization of that regulator.
All peripherals, except the COP/watchdog timer, run at the IPBus clock (peripheral bus) frequency1, which
is the same as the main processor frequency in this architecture. The COP timer runs at
MSTR_OSC / 1024. The maximum frequency of operation is SYS_CLK = 32MHz. The only exception is
the TMR and PWM, which can be configured to operate at three times the system bus rate using TCR and
PCR controls, provided the PLL is active and selected.
6.6 Resets
The SIM supports four sources of reset, as shown in Figure 6-15. The two asynchronous sources are the
external reset pin and the Power-On Reset (POR). The two synchronous sources are the software reset,
which is generated within the SIM itself by writing the SIM_CTRL register in Section 6.3.1, and the COP
reset. The SIM uses these to generate resets for the internal logic. These are outlined in Table 6-4. The
first column lists the four primary resets which are calculated. The JTAG circuitry is reset by the Power-On
Reset. Columns two through five indicate which reset sources trigger these reset signals. The last column
provides additional detail.
Table 6-4 Primary System Resets
Reset Sources
Reset Signal
POR
External
Software
COP
Comments
EXTENDED_POR
X
CLKGEN_RST
X
X
X
X
Released 32 Relaxation Oscillator Clock
cycles after all reset sources have
released.
PERIP_RST
X
X
X
X
Releases 32 Relaxation Oscillator Clock
cycles after the CLKGEN_RST is
released.
CORE_RST
X
X
X
X
Releases 32 SYS_CLK periods after
PERIP_RST is released.
Stretched version of POR. Relevant 64
Relaxation Oscillator Clock cycles after
POR deasserts.
Figure 6-15 provides a graphic illustration of the details in Table 6-4. Note that the POR_Delay blocks
use the Relaxation Oscillator Clock as their time base since other system clocks are inactive during this
phase of reset.
1. The TMR ans PWM modules can be operated at three times the IPBus clock frequency.
56F8013/56F8011 Data Sheet, Rev. 10
80
Freescale Semiconductor
Preliminary
Resets
EXTENDED_POR
Power-On
Reset
(active
low)
JTAG
POR
pulse shaper
Delay 64
MSTR_OSC
Clocks
External
RESET IN RESET
(active
low)
CLKGEN_RST
OCCS
COMBINED_RST
PERIP_RST
Delay 32
MSTR_OSC
Clocks
pulse shaper
COP
(active
low)
Memory
Subsystem
SW Reset
Delay 32
sys clocks
pulse shaper
Delay blocks assert immediately and
deassert only after the programmed
number of clock cycles.
Peripherals
56800E
Delay 32
sys clocks
pulse shaper
CORE_RST
Figure 6-15 Sources of RESET Functional Diagram (Test modes not included)
POR resets are extended 64 MSTR_OSC clocks to stabilize the power supply. All resets are subsequently
extended for an additional 32 MSTR_OSC clocks and 64 system clocks as the various internal reset
controls are released. Given the normal relaxation oscillator rate of 8MHz, the duration of a POR reset
from when power comes on to when code is running is 28μS. An external reset generation chip may also
be used. Resets may be asserted asynchronously, but they are always released internally on a rising edge
of the system clock.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
81
6.7 Clocks
The memory, peripheral and core clocks all operate at the same frequency (32MHz max) with the
exception of the TMR and PWM peripheral clocks, which have the option (using TCR and PCR) to operate
three times faster. The SIM is responsible for stalling individual clocks as a response to various hold-off
requests, low power modes, and other configuration parameters. The SIM has access to the following
signals from the OCCS module:
MSTR_OSC
HS_PERF
SYS_CLK_x2
This comes from the input clock source mux of the OCCS. It is the output of the
relaxation oscillator or the external clock source, depending on PRECS. It is not
guaranteed to be at 50% duty cycle (+ or - 10% can probably be assumed for design
purposes). This clock runs continuously, even during resetm and is used for reset
generation.
The PLL multiplies the MSTR_OSC by 24, to a maximum of 192MHz. The ZSRC
field in OCCS selects the active source to be the PLL. This is divided by 2 and
postscaled to produce this maximum 96MHz clock. It is used without further division
to produce the high-speed (3x system bus rate) variants of the TMR and PWM
peripheral clocks. This clock is disabled when ZSRC is selecting MSTR_OSC.
The PLL can multiply the MSTR_OSC by 24, to a maximum of 192MHz. When the
PLL is selected by the OCCS ZSRC field, the PLL is divided by three and postscaled
to produce this maximum 64MHz clock. When MSTR_OSC is selected by the OCCS
ZSRC field, MSTR_OSC feeds SYS_CLK_x2 directly. The SIM takes this clock and
divides it by two to generate all the normal (1x system bus rate) peripheral and system
clocks.
While the SIM generates the ADC peripheral clock in the same way it generates all other peripheral clocks,
the ADC standby and conversion clocks are generated by a direct interface between the ADC and the
OCCS module.
Figure 6-16 illustrates clock relationships to one another and to the various resets as the device comes out
of reset. RST is assumed to be the logical AND of all active-low system resets (for example, POR, external
reset, COP and Software reset). In the 56F8013/56F8011 architecture, this signal will be stretched by the
SIM for a period of time (up to 96 MSTR_OSC clock cycles, depending upon the status of the POR) to
create the clock generation reset signal (CLKGEN_RST). The SIM should deassert CLKGEN_RST
synchronously with the negative edge of OSC_CLK in order to avoid skew problems. CLKGEN_RST is
delayed 32 SYS_CLK cycles to create the peripheral reset signal (PERIP_RST). PERIP_RST is then
delayed by 32 SYS_CLK cycles to create CORE_RST. Both PERIP_RST and CORE_RST should be
released on the negative edge of SYS_CLK_D as shown. This phased releasing of system resets is
necessary to give some peripherals (for example, the Flash interface unit) set-up time prior to the 56800E
core becoming active.
56F8013/56F8011 Data Sheet, Rev. 10
82
Freescale Semiconductor
Preliminary
Interrupts
Maximum Delay = 64 MSTR_OSC cycles for POR reset extension and 32 MSTR_OSC cycles
for combined reset extension
RST
MSTR_OSC
Switch on falling OSC_CLK
96 MSTR_OSC cycles
CKGEN_RST
SYS_CLK_x2
SYS_CLK
SYS_CLK_D
SYS_CLK_DIV2
32 SYS_CLK cycles delay
Switch on falling SYS_CLK
PERIP_RST
Switch on falling SYS_CLK
32 SYS_CLK cycles delay
CORE_RST
Figure 6-16 Timing Relationships of Reset Signal to Clocks
6.8 Interrupts
The SIM generates no interrupts.
Part 7 Security Features
The 56F8013/56F8011 offer security features intended to prevent unauthorized users from reading the
contents of the Flash Memory (FM) array. The 56F8013/56F8011’s Flash security consists of several
hardware interlocks that prevent unauthorized users from gaining access to the Flash array.
Note, however, that part of the security must lie with the user’s code. An extreme example would be user’s
code that includes a subroutine to read and transfer the contents of the internal program to SCI, SPI or
another peripheral, as this code would defeat the purpose of security. At the same time, the user may also
wish to put a “backdoor” in his program. As an example, the user downloads a security key through the
SCI, allowing access to a programming routine that updates parameters stored in another section of the
Flash.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
83
7.1 Operation with Security Enabled
Once the user has programmed the Flash with his application code, the 56F8013/56F8011 can be secured
by programming the security bytes located in the FM configuration field, which are located at the last nine
words of Program Flash. These non-volatile bytes will keep the part secured through reset and through
power-down of the device. Only two bytes within this field are used to enable or disable security. Refer to
the Flash Memory chapter in the 56F801X Peripheral User Manual for the state of the security bytes and
the resulting state of security. When Flash security mode is enabled in accordance with the method
described in the Flash Memory module chapter, the 56F8013/56F8011 will disable the core EOnCE debug
capabilities. Normal program execution is otherwise unaffected.
7.2 Flash Access Lock and Unlock Mechanisms
The 56F8013/56F8011 have several operating functional and debug modes. Effective Flash security must
address operating mode selection and anticipate modes in which the on-chip Flash can be read without
explicit user permission.
7.2.1
Disabling EOnCE Access
On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for
the 56800E CPU. The TCLK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the
EOnCE port functionality is mapped. When the 56F8013/56F8011 boot, the chip-level JTAG TAP (Test
Access Port) is active and provides the chip’s boundary scan capability and access to the ID register, but
proper implementation of Flash security will block any attempt to access the internal Flash memory via
the EOnCE port when security is enabled.
7.2.2
Flash Lockout Recovery Using JTAG
If a user inadvertently enables security on the 56F8013/56F8011, the only lockout recovery mechanism is
the complete erasure of the internal Flash contents, including the configuration field, and thus disables
security (the protection register is cleared). This does not compromise security, as the entire contents of
the user’s secured code stored in Flash are erased before security is disabled on the 56F8013/56F8011 on
the next reset or power-up sequence.
To start the lockout recovery sequence, the JTAG public instruction (LOCKOUT_RECOVERY) must
first be shifted into the chip-level TAP controller’s instruction register. Once the
LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock divider value
must be shifted into the corresponding 7-bit data register. After the data register has been updated, the user
must transition the TAP controller into the RUN-TEST/IDLE state for the lockout sequence to commence.
The controller must remain in this state until the erase sequence has completed. Refer to the 56F801X
Peripheral User Manual for more details, or contact Freescale.
Note:
Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller
(by advancing the TAP state machine to the reset state) and the 56F8013/56F8011 (by asserting
external chip reset) to return to normal unsecured operation.
56F8013/56F8011 Data Sheet, Rev. 10
84
Freescale Semiconductor
Preliminary
Introduction
7.2.3
Flash Lockout Recovery using CodeWarrior
CodeWarrior can unlock a device using the command sequence described in Section 7.2.2 by selecting the
Debug menu, then selecting DSP56800E, followed by Unlock Flash.
Another mechanism is also built into CodeWarrior using the device’s memory configuration file. The
command “Unlock_Flash_on_Connect1” in the .cfg file accomplishes the same task as using the Debug
menu.
7.2.4
Product Analysis
The recommended method of unsecuring a programmed 56F8013/56F8011 for product analysis of field
failures is via the backdoor key access. The customer would need to supply Technical Support with the
backdoor key and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit
that allows backdoor key access must be set.
An alternative method for performing analysis on a secured microcontroller would be to mass-erase and
reprogram the Flash with the original code, but modify the security bytes.
To insure that a customer does not inadvertently lock himself out of the 56F8013/56F8011 during
programming, it is recommended that the user program the backdoor access key first, the application code
second and the security bytes within the FM configuration field last.
Part 8 General Purpose Input/Output (GPIO)
8.1 Introduction
This section is intended to supplement the GPIO information found in the 56F801X Peripheral User
Manual and contains only chip-specific information. This information supercedes the generic information
in the 56F801X Peripheral User Manual.
8.2 Configuration
There are four GPIO ports defined on the 56F8013/56F8011. The width of each port, the associated
peripheral and reset functions are shown in Table 8-1. The specific mapping of GPIO port pins is shown
in Table 8-2.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
85
Table 8-1 GPIO Ports Configuration
GPIO Port
Available Pins in
56F8013/56F8011
A
8
PWM, Reset
GPIO, except GPIOA7
B
8
SPI, SCI, Timer
GPIO
C
6
ADC (GPIOC3 and GPIOC7 are not
bonded out on the 56F8013/56F8011)
Analog
D
4
JTAG
JTAG
Peripheral Function
Reset Function
Table 8-2 GPIO External Signals Map
Pins in shaded rows are not available in 56F8013/56F8011
LQFP
Package Pin
GPIO Function
Peripheral Function
GPIOA0
PWM0
29
Defaults to A0
GPIOA1
PWM1
28
Defaults toA1
GPIOA2
PWM2
23
Defaults to A2
GPIOA3
PWM3
24
Defaults to A3
GPIOA4
PWM4 / FAULT1 / T2
22
SIM register SIM_GPS is used to select
between PWM4, FAULT1, and T2
Defaults to A4
GPIOA5
PWM5 / FAULT2 / T3
20
SIM register SIM_GPS is used to select
between PWM5, FAULT2, and T3
Defaults to A5
GPIOA6
FAULT0
18
Defaults to A6
GPIOA7
RESET
15
Defaults to RESET
GPIOB0
SCLK / SCL
21
SIM register SIM_GPS is used to select
between SCLK and SCL
Defaults to B0
GPIOB1
SS / SDA
2
SIM register SIM_GPS is used to select
between SS and SDA
Defaults to B1
GPIOB2
MISO / T2
17
SIM register SIM_GPS is used to select
between MISO and T2
Defaults to B2
GPIOB3
MOSI / T3
16
SIM register SIM_GPS is used to select
between MOSI and T3
Defaults to B3
Notes
56F8013/56F8011 Data Sheet, Rev. 10
86
Freescale Semiconductor
Preliminary
Reset Values
Table 8-2 GPIO External Signals Map (Continued)
Pins in shaded rows are not available in 56F8013/56F8011
LQFP
Package Pin
GPIO Function
Peripheral Function
GPIOB4
T0 / CLKO
19
SIM register SIM_GPS is used to select
between T0 and CLKO
Defaults to B4
GPIOB5
T1 / FAULT3
4
SIM register SIM_GPS is used to select
between T1 and FAULT3
Defaults to B5
GPIOB6
RXD / SDA / CLKIN
1
SIM register SIM_GPS is used to select
between RXD and SDA. CLKIN
functionality is enabled using the PLL
Control Register within the OCCS block.
Defaults to B6
GPIOB7
TXD / SCL
3
SIM register SIM_GPS is used to select
between TXD and SCL
Defaults to B7
GPIOC0
ANA0
12
Defaults to ANA0
GPIOC1
ANA1
11
Defaults to ANA1
GPIOC2
ANA2 / VREFH
10
Defaults to ANA2
GPIOC3
ANA3
GPIOC4
ANB0
5
Defaults to ANB0
GPIOC5
ANB1
6
Defaults to ANB1
GPIOC6
ANB2 / VREFL
7
Defaults to ANB2
GPIOC7
ANB3
GPIOD0
TDI
30
Defaults to TDI
GPIOD1
TDO
32
Defaults to TDO
GPIOD2
TCK
14
Defaults to TCK
GPIOD3
TMS
31
Defaults to TMS
Notes
Not bonded out in 56F8013/56F8011
Defaults to ANA3
Not bonded out in 56F8013/56F8011
Defaults to ANB3
8.3 Reset Values
Tables 4-18 through 4-21 detail registers for the 56F8013/56F8011; Figures 8-1 through 8-4 summarize
register maps and reset values.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
87
Add.
Offset
Register Acronym
$0
GPIOA_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOA_DATA
GPIOA_DDIR
GPIOA_PEREN
GPIOA_IASSRT
GPIOA_IEN
GPIOA_IEPOL
GPIOA_IPEND
GPIOA_IEDGE
GPIOA_PPOUTM
GPIOA_RDATA
GPIOA_DRIVE
15
14
13
12
11
10
9
8
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
0
RS
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
X
X
X
0
0
0
PU
1
1
1
1
D
0
1
1
1
DD
0
0
0
0
PE
1
0
0
0
IA
0
0
0
0
IEN
0
0
0
0
IEPOL
0
0
0
0
IPR
0
0
0
0
IES
0
0
0
0
OEN
1
1
1
1
1
RAW DATA
X
X
X
X
X
DRIVE
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-1 GPIOA Register Map Summary
56F8013/56F8011 Data Sheet, Rev. 10
88
Freescale Semiconductor
Preliminary
Reset Values
Add.
Offset
Register Acronym
$0
GPIOB_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOB_DATA
GPIOB_DDIR
GPIOB_PEREN
GPIOB_IASSRT
GPIOB_IEN
GPIOB_IEPOL
GPIOB_IPEND
GPIOB_IEDGE
GPIOB_PPOUTM
GPIOB_RDATA
GPIOB_DRIVE
15
14
13
12
11
10
9
8
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
0
RS
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
X
X
X
0
0
0
PU
1
1
1
1
D
1
1
1
1
DD
0
0
0
0
PE
0
0
0
0
IA
0
0
0
0
IEN
0
0
0
0
IEPOL
0
0
0
0
IPR
0
0
0
0
IES
0
0
0
0
OEN
1
1
1
1
1
RAW DATA
X
X
X
X
X
DRIVE
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-2 GPIOB Register Map Summary
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
89
Add.
Offset
Register Acronym
$0
GPIOC_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOC_DATA
GPIOC_DDIR
GPIOC_PEREN
GPIOC_IASSRT
GPIOC_IEN
GPIOC_IEPOL
GPIOC_IPEND
GPIOC_IEDGE
GPIOC_PPOUTM
GPIOC_RDATA
GPIOC_DRIVE
15
14
13
12
11
10
9
8
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
0
RS
7
6
5
4
3
2
1
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
X
X
X
0
0
0
PU
1
1
1
1
D
0
0
0
0
DD
0
0
0
0
PE
1
1
1
1
IA
0
0
0
0
IEN
0
0
0
0
IEPOL
0
0
0
0
IPR
0
0
0
0
IES
0
0
0
0
OEN
1
1
1
1
1
RAW DATA
X
X
X
X
X
DRIVE
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-3 GPIOC Register Map Summary
56F8013/56F8011 Data Sheet, Rev. 10
90
Freescale Semiconductor
Preliminary
Reset Values
Add.
Offset
Register Acronym
$0
GPIOD_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOD_DATA
GPIOD_DDIR
GPIOD_PEREN
GPIOD_IASSRT
GPIOD_IEN
GPIOD_IEPOL
GPIOD_IPEND
GPIOD_IEDGE
GPIOD_PPOUTM
GPIOD_RDATA
GPIOD_DRIVE
15
14
13
12
11
10
9
8
7
6
5
4
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
0
0
0
0
RS
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
0
0
0
0
RS
0
0
0
0
0
0
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
0
0
0
0
RS
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
0
3
2
1
0
1
1
0
0
0
0
1
1
0
0
0
0
PU
1
1
D
W
0
0
DD
0
0
PE
1
1
IA
0
0
IEN
W
0
0
IEPOL
W
RS
0
0
0
0
0
0
0
0
IPR
0
0
IES
0
0
OEN
1
1
1
1
RAW DATA
X
X
X
X
DRIVE
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-4 GPIOD Register Map Summary
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
91
Part 9 Joint Test Action Group (JTAG)
9.1 56F8013/56F8011 Information
Please contact your Freescale sales representative or authorized distributor for device/package-specific
BSDL information.
The TRST pin is not available in this package. The pin is tied to VDD in the package.
The JTAG state machine is reset during POR and can also be reset via a soft reset by holding TMS high
for five rising edges of TCK, as described in the 56F801X Peripheral User Manual.
Part 10 Specifications
10.1 General Characteristics
The 56F8013/56F8011 are fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital
inputs. The term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process
technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture
of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and
5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V
± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the
power savings of 3.3V I/O levels, combined with the ability to receive 5V levels without damage.
Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum
is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to
the device.
Unless otherwise stated, all specifications within this chapter apply over the temperature range of -40ºC to
125ºC ambient temperature over the following supply ranges:
VSS = VSSA = 0V, VDD = VDDA = 3.0–3.6V, CL < 50pF, fOP = 32MHz
Note: The 56F8011 device is specified to meet Industrial requirements only.
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
56F8013/56F8011 Data Sheet, Rev. 10
92
Freescale Semiconductor
Preliminary
General Characteristics
Table 10-1 Absolute Maximum Ratings
(VSS = 0V, VSSA = 0V)
Characteristic
Symbol
Notes
Min
Max
Unit
Supply Voltage Range
VDD
-0.3
4.0
V
Analog Supply Voltage Range
VDDA
- 0.3
4.0
V
ADC High Voltage Reference
VREFH
- 0.3
4.0
V
Voltage difference VDD to VDDA
ΔVDD
- 0.3
0.3
V
Voltage difference VSS to VSSA
ΔVSS
- 0.3
0.3
V
Input Voltage Range (Digital inputs)
VIN
Pin Groups 1, 2
- 0.3
6.0
V
Input Voltage Range (ADC inputs)1
VINA
Pin Group 3
- 0.3
4.0
V
Input clamp current, per pin (VIN < 0)2
VIC
-
-20
mA
Output clamp current, per pin (VO < 0)2
VOC
-
-20
mA
Output Voltage Range
(Normal Push-Pull mode)
VOUT
Pin Group 1
-0.3
4.0
V
Output Voltage Range
(Open Drain mode)
VOUTOD
Pin Groups 1, 2
-0.3
6.0
V
Ambient Temperature
TA
-40
105
°C
Storage Temperature
TSTG
-55
150
°C
1. Pin Group 3 can tolerate 6V for less than 5 seconds when they are configured as ADC inputs or during reset. Pin Group 3 can
tolerate 6V if they are configured as GPIO.
2. Continuous input current per pin is -2 mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC Analog Inputs
10.1.1
ElectroStatic Discharge (ESD) Model
Table 10-2 56F8013/56F8011 ESD Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
750
—
—
V
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
93
Table 10-3 LQFP Package Thermal Characteristics6
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Notes
RθJA
74
°C/W
1,2
Junction to ambient
Natural convection
Single layer board
(1s)
Junction to ambient
Natural convection
Four layer board
(2s2p)
RθJMA
50
°C/W
1,3
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
RθJMA
67
°C/W
1,3
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
RθJMA
46
°C/W
1,3
Junction to board
RθJB
23
°C/W
4
Junction to case
RθJC
20
°C/W
5
ΨJT
4
°C/W
6
Junction to package top
Natural Convection
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the
top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
7. See Section 12.1 for more details on thermal design considerations.
56F8013/56F8011 Data Sheet, Rev. 10
94
Freescale Semiconductor
Preliminary
General Characteristics
Table 10-4 Recommended Operating Conditions
(VREFL = 0V, VSSA = 0V, VSS = 0V )
Characteristic
Symbol
Notes
Min
Typ
Max
Unit
Supply voltage
VDD
3
3.3
3.6
V
ADC Supply voltage
VDDA
3
3.3
3.6
V
ADC High Voltage Reference
VREFH
3
—
VDDA
V
Voltage difference VDD to VDDA
ΔVDD
-0.1
0
0.1
V
Voltage difference VSS to VSSA
ΔVSS
-0.1
0
0.1
V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
FSYSCLK
—
8
0
MHz
32
32
Input Voltage High (digital inputs)
VIH
Pin Groups 1, 2
2
—
5.5
V
Input Voltage Low (digital inputs)
VIL
Pin Groups 1, 2
-0.3
—
0.8
V
Output Source Current High (at VOH min.)
When programmed for low drive strength
When programmed for high drive strength
IOH
Pin Group 1
Pin Group 1
—
—
—
—
-4
-8
Output Source Current Low (at VOL max.)
When programmed for low drive strength
When programmed for high drive strength
IOL
Pin Groups 1, 2
Pin Groups 1, 2
—
—
—
—
4
8
Ambient Operating Temperature
TA
-40
—
105
°C
Flash Endurance
(Program Erase Cycles)
NF
TA = -40°C to
105°C
10,000
—
—
Cycles
Flash Data Retention
TR
TJ <= 85°C avg
15
—
—
Years
tFLRET
TJ <= 85°C avg
20
—
—
Years
Flash Data Retention with <100
Program/Erase Cycles
mA
mA
Note: Total chip source or sink current cannot exceed 50mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
95
10.2 DC Electrical Characteristics
Table 10-5 DC Electrical Characteristics
At Recommended Operating Conditions
Symbol
Notes
Min
Typ
Max
Unit
Test
Conditions
Output Voltage High
VOH
Pin Group 1
2.4
—
—
V
IOH = IOHmax
Output Voltage Low
VOL
Pin Groups 1, 2
—
—
0.4
V
IOL = IOLmax
Digital Input Current High
pull-up enabled or disabled1
IIH
Pin Groups 1, 2
—
0
+/- 2.5
μA
VIN = 2.4V to
5.5V
Digital Input Current Low
pull-up enabled
pull-up disabled1
IIL
Pin Groups 1, 2
μA
-15
—
-30
0
-60
+/- 2.5
VIN = 0V
Output Current
High Impedance State1
IOZ
Pin Groups 1, 2
—
0
+/- 2.5
μA
VOUT = 2.4V to
5.5V or 0V
VHYS
Pin Groups 1, 2
—
0.35
—
V
—
CIN
—
10
—
pF
—
COUT
—
10
—
pF
—
3.5
4.0
4.5
5.0
Characteristic
Schmitt Trigger Input Hysteresis
Input Capacitance
Output Capacitance
1. See Figure 10-1
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC Analog Inputs
2.0
0.0
µA
- 2.0
- 4.0
- 6.0
- 8.0
- 10.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
5.5
6.0
Volt
Figure 10-1 IIN/IOZ vs. VIN (Typical; Pull-Up Disabled)
56F8013/56F8011 Data Sheet, Rev. 10
96
Freescale Semiconductor
Preliminary
DC Electrical Characteristics
Table 10-6 Current Consumption per Power Supply Pin (Typical)
Typical @ 3.3V, 25°C
Mode
Conditions
[email protected] 3.6V, 25°C
IDD1
IDDA
IDD1
IDDA
RUN
32MHz Device Clock
Relaxation Oscillator on
PLL powered on
Continuous MAC instructions with fetches from
Program Flash
All peripheral modules enabled. TMR and PWM using
1x Clock
ADC powered on and clocked
42mA
13.5mA
—
—
WAIT
32MHz Device Clock
Relaxation Oscillator on
PLL powered on
Processor Core in WAIT state
All Peripheral modules enabled. TMR and PWM using
1x Clock
ADC powered off
17mA
0μA
—
—
STOP
4MHz Device Clock
Relaxation Oscillator on
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC powered off
5mA
0μA
—
—
STANDBY >
STOP
100KHz Device Clock
Relaxation Oscillator in Standby mode
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC powered off
Voltage regulator in Standby mode
430μA
0μA
550μA
1μA
POWERDOWN
Device Clock is off
Relaxation Oscillator powered off
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC powered off
Voltage Regulator in Standby mode
300μA
0μA
400μA
1μA
1. No Output Switching
All ports configured as inputs
All inputs Low
No DC Loads
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
97
Table 10-7 Power-On Reset Low-Voltage Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Low-Voltage Interrupt for 3.3V supply1
VEI3.3
2.58
2.7
—
V
Low-Voltage Interrupt for 2.5V supply2
VE12.5
—
2.15
—
V
Low-Voltage Interrupt Recovery Hysteresis
VEIH
—
50
—
mV
Power-On Reset3
POR
—
1.8
1.9
V
1. When VDD drops below VEI3.3, an interrupt is generated.
2. When VDD drops below VEI32.5, an interrupt is generated.
3. Power-On Reset occurs whenever the internally regulated 2.5V digital supply drops below 1.8V. While
power is ramping up, this signal remains active for as long as the internal 2.5V is below 2.15V or the 3.3V
1/O voltage is below 2.7V, no matter how long the ramp-up rate is. The internally regulated voltage is
typically 100mV less than VDD during ramp-up until 2.5V is reached, at which time it self-regulates.
10.2.1
Voltage Regulator Specifications
The 56F8013/56F8011 have two on-chip regulators. One supplies the PLL and relaxation oscillator. It has
no external pins and therefore has no external characteristics which must be guaranteed (other than proper
operation of the device). The second regulator supplies approximately 2.5V to the 56F8013/56F8011’s
core logic. This regulator requires an external 4.4μF, or greater, capacitor for proper operation. Ceramic
and tantalum capacitors tend to provide better performance tolerances. The output voltage can be
measured directly on the VCAP pin. The specifications for this regulator are shown in Table 10-8.
Table 10-8. Regulator Parameters
Characteristic
Short Circuit Current
Short Circuit Tolerance
(output shorted to ground)
Symbol
Min
Typical
Max
Unit
ISS
—
450
650
mA
TRSC
—
—
30
Minutes
10.3 AC Electrical Characteristics
Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified,
propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured
between the 10% and 90% points, as shown in Figure 10-2.
56F8013/56F8011 Data Sheet, Rev. 10
98
Freescale Semiconductor
Preliminary
Flash Memory Characteristics
Low
VIH
Input Signal
High
90%
50%
10%
Midpoint1
VIL
Fall Time
Rise Time
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-2 Input Signal Measurement References
Figure 10-3 shows the definitions of the following signal states:
•
•
•
Active state, when a bus or signal is driven, and enters a low impedance state
Tri-stated, when a bus or signal is placed in a high impedance state
Data Valid state, when a signal level has reached VOL or VOH
•
Data Invalid state, when a signal level is in transition between VOL and VOH
Data2 Valid
Data1 Valid
Data1
Data3 Valid
Data2
Data3
Data
Tri-stated
Data Invalid State
Data Active
Data Active
Figure 10-3 Signal States
10.4 Flash Memory Characteristics
Table 10-9 Flash Timing Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Program time1
Tprog
20
—
40
μs
Erase time 2
Terase
20
—
—
ms
Tme
100
—
—
ms
Mass erase time
1. There is additional overhead which is part of the programming sequence. See the 56F801X Peripheral User Manual
for details.
2. Specifies page erase time. There are 512 bytes per page in the Program Flash memory.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
99
10.5 External Clock Operation Timing
Table 10-10 External Clock Operation Timing Requirements1
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation (external clock driver)2
fosc
4
8
8
MHz
Clock Pulse Width3
tPW
6.25
—
—
ns
External Clock Input Rise Time4
trise
—
—
3
ns
External Clock Input Fall Time5
tfall
—
—
3
ns
1.
2.
3.
4.
5.
Parameters listed are guaranteed by design.
See Figure 10-4 for details on using the recommended connection of an external clock driver.
The high or low pulse width must be no smaller than 6.25ns or the chip may not function.
External clock input rise time is measured from 10% to 90%.
External clock input fall time is measured from 90% to 10%.
VIH
External
Clock
90%
50%
10%
90%
50%
10%
tfall
tPW
tPW
trise
VIL
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-4 External Clock Timing
10.6 Phase Locked Loop Timing
Table 10-11 PLL Timing
Characteristic
Symbol
Min
Typ
Max
Unit
Internal reference relaxation oscillator frequency for
the PLL
frosc
—
8
—
MHz
PLL output frequency1 (24 x reference frequency)
fop
—
192
—
MHz
PLL lock time2
tlock
—
40
100
µs
Cycle-to-cycle jitter
tjitterpll
350
ps
1. The core system clock will operate at 1/6 of the PLL output frequency.
2. This is the time required after the PLL is enabled to ensure reliable operation.
56F8013/56F8011 Data Sheet, Rev. 10
100
Freescale Semiconductor
Preliminary
Relaxation Oscillator Timing
10.7 Relaxation Oscillator Timing
Table 10-12 Relaxation Oscillator Timing
Characteristic
Symbol
Minimum
Relaxation Oscillator output frequency1
Normal Mode
Standby Mode
fop
—
Relaxation Oscillator stabilization time2
troscs
—
1
tjitterrosc
—
400
ps
Minimum tuning step size
.08
%
Maximum tuning step size
40
%
Cycle-to-cycle jitter. This is measured on the
CLKO signal (programmed prescaler_clock)
over 264 clocks3
Variation over temperature –40°C to 150°C4
Typical
Unit
—
8.05
200
MHz
kHz
3
µs
+1.0 to –1.5
+3.0 to –3.0
%
0 to +1
+2.0 to –2.0
%
+1.0 to -1.5
+3.0 to –4.5
%
Variation over temperature 0°C to 105°C4
Variation over temperature –40°C to 150°C4
(MC56F8013MFAE)
Maximum
1. Output frequency after application of 8MHz trim value, at 125°C.
2. This is the time required from standby to normal mode transition.
3. JA is required to meet SCI requirements.
4. See Figure 10-5.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
101
8.16
8.08
MHz
8
7.92
7.84
-50
-25
0
25
50
75
100
125
150
175
Degrees C (Junction)
Figure 10-5 Relaxation Oscillator Temperature Variation (Typical) After Trim at 125°C
10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing
Note: All the address and data buses described here are internal.
Table 10-13 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,2
Characteristic
Symbol
Typical Min
Typical Max
Unit
Minimum RESET Assertion Duration
tRA
4T
—
ns
Minimum GPIO pin Assertion for Interrupt
tIW
2T
—
ns
tRDA
96TOSC + 64T
97TOSC + 65T
ns
tIF
—
6T
ns
RESET deassertion to First Address Fetch3
Delay from Interrupt Assertion to Fetch of first
instruction (exiting Stop)
See Figure
10-6
1. In the formulas, T = clock cycle and Tosc = oscillator clock cycle. For an operating frequency of 32MHz, T = 31.25ns. At 8MHz
(used during Reset and Stop modes), T = 125ns.
2. Parameters listed are guaranteed by design.
3. During Power-On Reset, it is possible to use the 56F8013/56F8011 internal reset stretching circuitry to extend this period to
2^21T.
56F8013/56F8011 Data Sheet, Rev. 10
102
Freescale Semiconductor
Preliminary
Reset, Stop, Wait, Mode Select, and Interrupt Timing
GPIO pin
(Input)
TIW
Figure 10-6 GPIO Interrupt Timing (Negative Edge-Sensitive)
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
103
10.9 Serial Peripheral Interface (SPI) Timing
Table 10-14 SPI Timing1
Characteristic
Symbol
Cycle time
Master
Slave
tC
Enable lead time
Master
Slave
tELD
Enable lag time
Master
Slave
tELG
Clock (SCK) high time
Master
Slave
tCH
Clock (SCK) low time
Master
Slave
tCL
Data set-up time required for inputs
Master
Slave
tDS
Data hold time required for inputs
Master
Slave
tDH
Access time (time to data active from
high-impedance state)
Slave
tA
Disable time (hold time to high-impedance state)
Slave
tD
Data Valid for outputs
Master
Slave (after enable edge)
tDV
Data invalid
Master
Slave
tDI
Rise time
Master
Slave
tR
Fall time
Master
Slave
tF
Min
Max
Unit
125
62.5
—
—
ns
ns
—
31
—
—
ns
ns
—
125
—
—
ns
ns
50
31
—
—
ns
ns
50
31
—
—
ns
ns
20
0
—
—
ns
ns
0
2
—
—
ns
ns
4.8
15
ns
3.7
15.2
ns
—
—
4.5
20.4
ns
ns
0
0
—
—
ns
ns
—
—
11.5
10.0
ns
ns
—
—
9.7
9.0
ns
ns
See Figure
10-7, 10-8,
10-9, 10-10
10-10
10-10
10-7, 10-8,
10-9, 10-10
10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-10
10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
1. Parameters listed are guaranteed by design.
56F8013/56F8011 Data Sheet, Rev. 10
104
Freescale Semiconductor
Preliminary
Serial Peripheral Interface (SPI) Timing
1
SS
SS is held High on master
(Input)
tC
tR
tF
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tR
tCL
SCLK (CPOL = 1)
(Output)
tDH
tCH
tDS
MISO
(Input)
MSB in
tDI
MOSI
(Output)
Master MSB out
Bits 14–1
tDV
Bits 14–1
tF
LSB in
tDI(ref)
Master LSB out
tR
Figure 10-7 SPI Master Timing (CPHA = 0)
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
105
SS
(Input)
SS is held High on master
tC
tF
tR
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tCL
SCLK (CPOL = 1)
(Output)
tCH
tDS
tR
MISO
(Input)
MSB in
tDH
Bits 14–1
tDI
tDV(ref)
MOSI
(Output)
LSB in
tDV
Master MSB out
tDI(ref)
Bits 14– 1
Master LSB out
tF
tR
Figure 10-8 SPI Master Timing (CPHA = 1)
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELD
tCL
SCLK (CPOL = 1)
(Input)
tA
MISO
(Output)
tCH
Slave MSB out
tDV
tDH
MSB in
tF
tR
Bits 14–1
tDS
MOSI
(Input)
tELG
tR
Bits 14–1
tD
Slave LSB out
tDI
tDI
LSB in
Figure 10-9 SPI Slave Timing (CPHA = 0)
56F8013/56F8011 Data Sheet, Rev. 10
106
Freescale Semiconductor
Preliminary
Quad Timer Timing
SS
(Input)
tF
tC
tR
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELG
tELD
tCL
SCLK (CPOL = 1)
(Input)
tDV
tCH
tR
tA
MISO
(Output)
tD
tF
Slave MSB out
Bits 14–1
tDS
tDV
tDI
tDH
MOSI
(Input)
MSB in
Slave LSB out
Bits 14–1
LSB in
Figure 10-10 SPI Slave Timing (CPHA = 1)
10.10 Quad Timer Timing
Table 10-15 Timer Timing1, 2
Characteristic
Symbol
Min
Max
Unit
See Figure
PIN
2T + 6
—
ns
10-11
Timer input high / low period
PINHL
1T + 3
—
ns
10-11
Timer output period
POUT
125
—
ns
10-11
POUTHL
50
—
ns
10-11
Timer input period
Timer output high / low period
1. In the formulas listed, T = the clock cycle. For 32MHz operation, T = 31.25ns.
2. Parameters listed are guaranteed by design.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
107
Timer Inputs
PIN
PINHL
PINHL
POUT
POUTHL
POUTHL
Timer Outputs
Figure 10-11 Timer Timing
56F8013/56F8011 Data Sheet, Rev. 10
108
Freescale Semiconductor
Preliminary
Serial Communication Interface (SCI) Timing
10.11 Serial Communication Interface (SCI) Timing
Table 10-16 SCI Timing1
Characteristic
Symbol
Min
Max
Unit
See Figure
BR
—
(fMAX/16)
Mbps
—
RXD3 Pulse Width
RXDPW
0.965/BR
1.04/BR
ns
10-12
TXD4 Pulse Width
TXDPW
0.965/BR
1.04/BR
ns
10-13
Baud Rate2
LIN Slave Mode
Deviation of slave node clock from
nominal clock rate before
synchronization
Deviation of slave node clock relative
to the master node clock after
synchronization
Minimum break character length
1.
2.
3.
4.
FTOL_UNSYNCH
-14
14
%
FTOL_SYNCH
-2
2
%
TBREAK
13
Master
node bit
periods
11
Slave node
bit periods
Parameters listed are guaranteed by design.
fMAX is the frequency of operation of the system clock in MHz, which is 32MHz for the 56F8013/56F8011 devices.
The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1.
The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1.
RXD
Receive
data pin
(Input)
RXDPW
Figure 10-12 RXD Pulse Width
TXD
Receive
data pin
(Input)
TXDPW
Figure 10-13 TXD Pulse Width
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
109
10.12 Inter-Integrated Circuit Interface (I2C) Timing
Table 10-17 I2C Timing
Characteristic
Symbol
Standard Mode
Fast Mode
Unit
Minimum
Maximum
Minimum
Maximum
fSCL
0
100
0
400
tHD; STA
4.0
0.6
μs
LOW period of the SCL
clock
tLOW
4.7
1.25
μs
HIGH period of the SCL
clock
tHIGH
4.0
0.6
μs
Set-up time for a repeated
START condition
tSU; STA
4.7
0.6
μs
Data hold time for I2C bus
devices
tHD; DAT
01
Data set-up time
tSU; DAT
250
SCL Clock Frequency
Hold time (repeated )
START condition. After
this period, the first clock
pulse is generated.
3.452
01
kHz
0.92
μs
ns
1003
Rise time of both SDA and
SCL signals
tr
1000
2 +0.1Cb4
300
ns
Fall time of both SDA and
SCL signals
tf
300
2 +0.1Cb4
300
ns
Set-up time for STOP
condition
tSU; STO
4.0
0.6
μs
Bus free time between
STOP and START
condition
tBUF
4.7
1.3
μs
Pulse width of spikes that
must be suppressed by
the input filter
tSP
N/A
N/A
0.0
50
ns
1. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH min of the SCL
signal) to bridge the undefined region of the falling edge of SCL.
2. The maximum tHD; DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal.
3. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT > = 250ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal.
If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
trmax + tSU; DAT = 1000 + 250 = 1250ns (according to the Standard mode I2C bus specification) before the SCL line is
released.
4. Cb = total capacitance of the one bus line in pF.
56F8013/56F8011 Data Sheet, Rev. 10
110
Freescale Semiconductor
Preliminary
JTAG Timing
SDA
tSU; DAT
tLOW
tHD; STA
tBUF
tSP
SCL
S
tHD; STA
tHD; DAT
tHIGH
tSU; STA
tSU; STO
BR
P
S
Figure 10-14 Timing Definition for Fast and Standard Mode Devices on the I2C Bus
10.13 JTAG Timing
Table 10-18 JTAG Timing
Characteristic
Symbol
Min
Max
Unit
See Figure
TCK frequency of operation1
fOP
DC
SYS_CLK/8
MHz
10-15
TCK clock pulse width
tPW
50
—
ns
10-15
TMS, TDI data set-up time
tDS
5
—
ns
10-16
TMS, TDI data hold time
tDH
5
—
ns
10-16
TCK low to TDO data valid
tDV
—
30
ns
10-16
TCK low to TDO tri-state
tTS
—
30
ns
10-16
1. TCK frequency of operation must be less than 1/8 the processor rate.
1/fOP
tPW
tPW
VM
VM
VIH
TCK
(Input)
VM = VIL + (VIH – VIL)/2
VIL
Figure 10-15 Test Clock Input Timing Diagram
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
111
TCK
(Input)
TDI
TMS
(Input)
tDS
tDH
Input Data Valid
tDV
TDO
(Output)
Output Data Valid
tTS
TDO
(Output)
Figure 10-16 Test Access Port Timing Diagram
56F8013/56F8011 Data Sheet, Rev. 10
112
Freescale Semiconductor
Preliminary
Analog-to-Digital Converter (ADC) Parameters
10.14 Analog-to-Digital Converter (ADC) Parameters
Table 10-19 ADC Parameters1
Parameter
Symbol
Min
Typ
Max
Unit
Resolution
RES
12
—
12
Bits
ADC internal clock
fADIC
0.1
—
5.33
MHz
Conversion range
RAD
VREFL
—
VREFH
V
ADC power-up time2
tADPU
—
6
13
tAIC cycles3
Recovery from auto standby
tREC
—
0
1
tAIC cycles3
Conversion time
tADC
—
6
—
tAIC cycles3
Sample time
tADS
—
1
—
tAIC cycles3
Integral non-linearity4
(Full input signal range)
INL
—
+/- 3
+/- 5
LSB5
Differential non-linearity
DNL
—
+/- .6
+/- 1
LSB5
DC Specifications
Accuracy
Monotonicity
GUARANTEED
Offset Voltage Internal Ref
VOFFSET
—
+/- 4
+/- 9
mV
Offset Voltage External Ref
VOFFSET
—
+/- 6
+/- 12
mV
EGAIN
—
.998 to 1.002
1.01 to .99
—
Input voltage (external reference)
VADIN
VREFL
—
VREFH
V
Input voltage (internal reference)
VADIN
VSSA
—
VDDA
V
Input leakage
IIA
—
0
+/- 2
μA
VREFH current
IVREFH
—
0
—
μA
Input injection current7, per pin
IADI
—
—
3
mA
Input capacitance
CADI
—
See Figure 10-17
—
pF
Input impedance
XIN
—
See Figure 10-17
—
Ohms
Signal-to-noise ratio
SNR
60
65
dB
Total Harmonic Distortion
Gain Error (transfer gain)
ADC Inputs6 (Pin Group 3)
AC Specifications
THD
60
64
dB
Spurious Free Dynamic Range
SFDR
61
66
dB
Signal-to-noise plus distortion
SINAD
58
62
dB
Effective Number Of Bits
ENOB
—
10.0
Bits
1. All measurements were made at VDD = 3.3V, VREFH = 3.3V, and VREFL = ground
2. Includes power-up of ADC and VREF
3. ADC clock cycles
4. INL measured from VIN = VREFL to VIN = VREFH
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
113
5. LSB = Least Significant Bit = 0.806mV
6. Pin groups are detailed following Table 10-1.
7. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the
ADC.
10.15 Equivalent Circuit for ADC Inputs
Figure 10-17 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and
hold circuit moves to (VREFH-VREFL)/2, while the other charges to the analog input voltage. When the
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about (VREFH-VREFL)/2. The switches switch
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, VREF and the ADC clock frequency.
125Ω ESD Resistor
8pF noise damping capacitor
3
Analog Input
4
S1
C1
S/H
S3
1
1.
2.
3.
4.
5.
2
(VREFH- VREFL )/ 2
S2
C2
C1 = C2 = 1pF
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pF
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pF
Equivalent resistance for the channel select mux; 100 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1.4pF
1
Equivalent input impedance, when the the input is selected =
(ADC Clock Rate) x 1.4 x 10-12
Figure 10-17 Equivalent Circuit for A/D Loading
10.16 Power Consumption
See Section 10.1 for a list of IDD requirements for the 56F8013/56F8011. This section provides additional
detail which can be used to optimize power consumption for a given application.
56F8013/56F8011 Data Sheet, Rev. 10
114
Freescale Semiconductor
Preliminary
Power Consumption
Power consumption is given by the following equation:
Total power =
A: internal [static component]
+B: internal [state-dependent component]
+C: internal [dynamic component]
+D: external [dynamic component]
+E: external [static]
A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage currents,
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two
of the I/O cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Table 10-20 I/O Loading Coefficients at 10MHz
Intercept
Slope
8mA drive
1.3
0.11mW / pF
4mA drive
1.15mW
0.11mW / pF
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change. Table 10-20 provides coefficients for calculating power dissipated
in the I/O cells as a function of capacitive load. In these cases:
TotalPower = Σ((Intercept + Slope*Cload)*frequency/10MHz)
where:
•
•
•
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
115
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5
for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs driving
10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
Please see http://www.freescale.com for the most current mechanical drawing.
56F8013/56F8011 Data Sheet, Rev. 10
116
Freescale Semiconductor
Preliminary
56F8013/56F8011 Package and Pin-Out Information
Part 11 Packaging
11.1 56F8013/56F8011 Package and Pin-Out Information
GPIOB7/TXD/SCL
VCAP
VDD
VSS
GPIOA1/PWM1
GPIOA0/PWM0
ORIENTATION
MARK
GPIOB6/RXD/SDA/CLKIN
GPIOB1/SS/SDA
TDI/GPIOD0
TMS/GPIOD3
TDO/GPIOD1
This section contains package and pin-out information for the 56F8013/56F8011. These devices come in
a 32-pin Low-profile Quad Flat Pack (LQFP). Figure 11-1 shows the package outline for the 32-pin
LQFP, Figure 11-2 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out
for the 32-pin LQFP.
GPIOA3/PWM3
PIN 25
GPIOA2/PWM2
PIN 1
GPIOA4/PWM4/FAULT1/T2
GPIOB5/T1/FAULT3
GPIOB0/SCLK/SCL
ANB0/GPIOC4
GPIOA5/PWM5/FAULT2/T3
ANB1/GPIOC5
GPIOB4/T0/CLKO
ANB2/VREFL/GPIOC6
VDDA
GPIOA6/FAULT0
GPIOB3/MOSI/T3
RESET/GPIOA7
TCK/GPIOD2
VSS
ANA0/GPIOC0
ANA1/GPIOC1
ANA2/VREFH/GPIOC2
GPIOB2/MISO/T2
VSSA
Note: Alternate signals are in italic
PIN 17
PIN 9
Figure 11-1 Top View, 56F8013/56F8011 32-Pin LQFP Package
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
117
Table 11-1 56F8013/56F8011 32-Pin LQFP Package Identification by Pin Number1
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
Pin
No.
Signal Name
1
GPIOB6
RXD,SDA,CLKIN
9
VSSA
17
GPIOB2
MISO,T2
25
VCAP
2
GPIOB1
SS,SDA
10
ANA2
VREFH,GPIOC2
18
GPIOA6
FAULT0
26
VDD
3
GPIOB7
TXD,SCL
11
ANA1
GPIOC1
19
GPIOB4
T0,CLKO
27
VSS
4
GPIOB5
T1,FAULT3
12
ANA0
GPIOC0
20
GPIOA5
PWM5,FAULT2,T3
28
GPIOA1
PWM1
5
ANB0
GPIOC4
13
VSS
21
GPIOB0
SCLK,SCL
28
GPIOA0
PWM0
6
ANB1
GPIOC5
14
TCK
GPIOD2
22
GPIOA4
PWM4,FAULT1,T2
30
TDI
GPIOD0
7
ANB2
VREFL,GPIOC6
15
RESET
GPIOA7
23
GPIOA2
PWM2
31
TMS
GPIOD3
8
VDDA
16
GPIOB3
MOSI,T3
24
GPIOA3
PWM3
32
TDO
GPIOD1
1.Alternate signals are in iltalic
56F8013/56F8011 Data Sheet, Rev. 10
118
Freescale Semiconductor
Preliminary
A
–T–, –U–, –Z–
56F8013/56F8011 Package and Pin-Out Information
4X
A1
32
0.20 (0.008) AB T–U Z
25
1
–U–
–T–
B
V
AE
P
B1
DETAIL Y
17
8
V1
AE
DETAIL Y
9
4X
–Z–
9
0.20 (0.008) AC T–U Z
S1
S
DETAIL AD
G
–AB–
0.10 (0.004) AC
AC T–U Z
–AC–
BASE
METAL
ÉÉ
ÉÉ
ÉÉ
ÉÉ
F
8X
M
R
J
M
N
D
0.20 (0.008)
SEATING
PLANE
SECTION AE–AE
W
K
X
DETAIL AD
Q
GAUGE PLANE
H
0.250 (0.010)
C E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12 REF
0.090
0.160
0.400 BSC
1
5
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 REF
0.004
0.006
0.016 BSC
1
5
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Figure 11-2 56F8013/56F8011 32-Pin LQFP Mechanical Information
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
119
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
TA = Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (oC/W)
= Power dissipation in the package (W)
PD
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA =
RθJC =
RθCA =
Package junction-to-ambient thermal resistance (°C/W)
Package junction-to-case thermal resistance (°C/W)
Package case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TT
ΨJT
= Thermocouple temperature on top of package (oC)
= Thermal characterization parameter (oC/W)
56F8013/56F8011 Data Sheet, Rev. 10
120
Freescale Semiconductor
Preliminary
Thermal Design Considerations
PD
= Power dissipation in package (W)
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
121
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
Use the following list of considerations to assure correct operation of the 56F8013/56F8011:
•
Provide a low-impedance path from the board power supply to each VDD pin on the 56F8013/56F8011 and
from the board ground to each VSS (GND) pin
•
The minimum bypass requirement is to place 0.01–0.1μF capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are as short as possible
•
56F8013/56F8011 Data Sheet, Rev. 10
122
Freescale Semiconductor
Preliminary
Electrical Design Considerations
•
Bypass the VDD and VSS with approximately 100μF, plus the number of 0.1μF ceramic capacitors
•
•
PCB trace lengths should be minimal for high-frequency signals
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the VDD and VSS circuits.
•
Take special care to minimize noise levels on the VREF, VDDA and VSSA pins
•
Using separate power planes for VDD and VDDA and separate ground planes for VSS and VSSA is
recommended. Connect the separate analog and digital power and ground planes as close as possible to
power supply outputs. If both analog circuit and digital circuit are powered by the same power supply, it is
advisable to connect a small inductor or ferrite bead in serial with both VDDA and VSSA traces.
•
It is highly desirable to physically separate analog components from noisy digital components by ground
planes. Do not place an analog trace in parallel with digital traces. It is also desirable to place an analog
ground trace around an analog signal trace to isolate it from digital traces.
•
Because the Flash memory is programmed through the JTAG/EOnCE port, SPI, SCI or I2C, the designer
should provide an interface to this port if in-circuit Flash programming is desired.
56F8013/56F8011 Data Sheet, Rev. 10
Freescale Semiconductor
Preliminary
123
Part 13 Ordering Information
Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor
sales office or authorized distributor to determine availability and to order parts.
Table 13-1 56F8013/56F8011 Ordering Information
Part
Supply
Voltage
Package Type
Pin
Count
Frequency
(MHz)
Ambient
Temperature
Range
Order Number
MC56F8013
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
32
32
-40° to + 105°C
MC56F8013VFAE*
MC56F8011
3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
32
32
-40° to + 105°C
MC56F8011VFAE*
*This package is RoHS compliant.
Part 14 Appendix
Register acronyms are revised from previous device data sheets to provide a cleaner register description.
A cross reference to legacy and revised acronyms are provided in the following table.
Peripheral Reference Manual
Module
ADC
ADCR1
ADC_CTRL1
ADC_ADCR1
ADC_ADCR1
0xF080
ADCR2
ADC_CTRL2
ADC_ADCR2
ADC_ADCR2
0xF081
CTRL1
Control Register 2
CTRL2
Start
End
Zero Crossing Control Register
ZXCTRL
ADZCC
ADC_ZXCTRL
ADC_ADZCC
ADC_ADZCC
0xF082
Channel List Register 1
CLIST1
ADLST1
ADC_CLIST1
ADC_ADLST1
ADC_ADLST1
0xF083
Channel List Register 2
0xF084
CLIST2
ADLST2
ADC_CLIST2
ADC_ADLST2
ADC_ADLST2
Sample Disable Register
SDIS
ADSDIS
ADC_SDIS
ADC_ADSDIS
ADC_ADSDIS
0xF085
Status Register
STAT
ADSTAT
ADC_STAT
ADC_ADSTAT
ADC_ADSTAT
0xF086
0xF087
Limit Status Register
LIMSTAT
ADLSTAT
ADC_LIMSTAT
ADC_ADLSTAT
ADC_ADLSTAT
Zero Crossing Status Register
ZXSTAT
ADZCSTAT
ADC_ZXSTAT
ADC_ADZCSTAT
ADC_ADZCSTAT
Result Registers 0-7
RSLT0-7
ADRSLT0-7
ADC_RSLT0-7
ADC_ADRSLT0-7
ADC_ADRSLT0-7
0xF089
Low Limit Registers 0-7
LOLIM0-7
ADLLMT0-7
ADC_LOLIM0-7
ADC_ADLLMT0-7
ADC_ADLLMT0-7
0XF091 0XF098
High Limit Registers 0-7
I2C
Legacy Acronym
Control Register 1
0xF088
0XF090
HILIM0-7
ADHLMT0-7
ADC_HILIM0-7
ADC_ADHLMT0-7
ADC_ADHLMT0-7
0XF099 0XF0A0
OFFST0-7
ADOFS0-7
ADC_OFFST0-7
ADC_ADOFS0-7
ADC_ADOFS0-7
0XF0A1 0XF0A8
Power Control Register
PWR
ADPOWER
ADC_PWR
ADC_ADPOWER
ADC_ADPOWER
0XF0A9
Voltage Reference Register
CAL
ADCAL
ADC_VREF
ADC_ADCAL
ADC_CAL
0XF0AA
Offset Registers 0-7
COP
Memory Address
New Acronym
Legacy
Acronym
Register Name
Data Sheet
Processor
Expert
Acronym
New
Acronym
Control Register
CTRL
COPCTL
COP_CTRL
COPCTL
COPCTL
0XF0E0
Time-Out Register
TOUT
COPTO
COP_TOUT
COPTO
COPTO
0XF0E1
Counter Register
CNTR
COPCTR
COP_CNTR
COPCTR
COPCTR
0XF0E2
Address Register
ADDR
IBAD
I2C_ADDR
I2C_IBAD
IBAD
0xF0D0
Frequency Divider Register
FDIV
IBFD
I2C_FDIV
I2C_IBFD
IBFD
0xF0D1
Control Register
CTRL
IBCR
I2C_CTRL
I2C_IBCR
IBCR
0xF0D2
Status Register
STAT
IBSR
I2C_STAT
I2C_IBSR
IBSR
0xF0D3
Data I./O Register
DATA
IBDR
I2C_DATA
I2C_IBDR
IBDR
0xF0D4
Noise Filter Register
NFILT
IBNR
I2C_NFILT
I2C_IBNR
IBNR
0xF0D5
56F8013/56F8011 Data Sheet, Rev. 10
124
Freescale Semiconductor
Preliminary
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© Freescale Semiconductor, Inc. 2005, 2006. All rights reserved.
MC56F8013
Rev. 10
01/2007