TI SN74AHC245PWR

SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
D
D
SN54AHC245 . . . J OR W PACKAGE
SN74AHC245 . . . DB, DGV, DW, N, OR PW PACKAGE
(TOP VIEW)
Operating Range 2-V to 5.5-V VCC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
description/ordering information
The ’AHC245 octal bus transceivers are designed
for asynchronous two-way communication
between data buses. The control-function
implementation minimizes external timing
requirements.
These devices allow data transmission from the
A bus to the B bus or from the B bus to the A bus,
depending on the logic level at the
direction-control (DIR) input. The output-enable
(OE) input can be used to disable the device so
that the buses are effectively isolated.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
A2
A1
DIR
VCC
OE
SN54AHC245 . . . FK PACKAGE
(TOP VIEW)
To ensure the high-impedance state during power
up or power down, OE should be tied to VCC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
B1
B2
B3
B4
B5
A8
GND
B8
B7
B6
A3
A4
A5
A6
A7
ORDERING INFORMATION
PDIP – N
SN74AHC245N
Tube
SN74AHC245DW
Tape and reel
SN74AHC245DWR
Tape and reel
SN74AHC245DBR
Tube
SN74AHC245PW
Tape and reel
SN74AHC245PWR
TVSOP – DGV
Tape and reel
SN74AHC245DGVR
HA245
CDIP – J
Tube
SNJ54AHC245J
SNJ54AHC245J
CFP – W
Tube
SNJ54AHC245W
SNJ54AHC245W
LCCC – FK
Tube
SNJ54AHC245FK
SNJ54AHC245FK
SSOP – DB
TSSOP – PW
–55°C to 125°C
TOP-SIDE
MARKING
Tube
SOIC – DW
–40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AHC245N
AHC245
HA245
HA245
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
FUNCTION TABLE
(each transceiver)
INPUTS
OE
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic diagram (positive logic)
DIR
1
19
A1
OE
2
18
B1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I/O, Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
I/O, Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 3)
SN54AHC245
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 3 V
High-level input voltage
VI
VO
IOH
Low-level input voltage
MAX
2
5.5
1.5
VCC = 5.5 V
VCC = 2 V
VIL
MIN
∆t/∆v
MIN
MAX
2
5.5
2.1
2.1
3.85
0.5
VCC = 3 V
VCC = 5.5 V
UNIT
V
1.5
3.85
V
0.5
0.9
0.9
1.65
1.65
V
Input voltage
OE or DIR
0
5.5
0
5.5
V
Output voltage
A or B
0
VCC
–50
0
VCC
–50
mA
High-level output current
VCC = 2 V
VCC = 3.3 V ± 0.3 V
–4
–4
–8
–8
50
50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
4
4
8
8
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
100
100
20
20
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
SN74AHC245
Low-level output current
Input transition rise or fall rate
V
mA
mA
mA
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –50 mA
VOH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
VOL
IOL = 4 mA
IOL = 8 mA
A or B inputs
II
OE or DIR
VI = VCC or GND
IOZ†
VO = VCC or GND,
VI (OE) = VIL or VIH
ICC
VI = VCC or GND,
Ci
OE or DIR
Cio
A or B inputs
VI = VCC or GND
IO = 0
MIN
TA = 25°C
TYP
MAX
2V
1.9
2
1.9
1.9
3V
2.9
3
2.9
2.9
4.5 V
4.4
4.5
4.4
4.4
3V
2.58
2.48
2.48
4.5 V
3.94
3.8
VCC
SN54AHC245
MIN
MAX
SN74AHC245
MIN
MAX
UNIT
V
3.8
2V
0.1
0.1
0.1
3V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
V
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
5.5 V
±0.1
±1
±1
0 V to 5.5 V
±0.1
±1*
±1
5.5 V
±0.25
±2.5
±2.5
mA
5.5 V
4
40
40
mA
10
pF
5V
2.5
10
VI = VCC or GND
5V
4
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
† The parameter IOZ includes the input leakage current.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
mA
pF
3
SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
B or A
CL = 15 pF
tPZH
tPZL
OE
A or B
CL = 15 pF
tPHZ
tPLZ
OE
A or B
CL = 15 pF
tPLH
tPHL
A or B
B or A
CL = 50 pF
tPZH
tPZL
OE
A or B
CL = 50 pF
tPHZ
tPLZ
OE
A or B
CL = 50 pF
tsk(o)
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54AHC245
range,
SN74AHC245
MIN
MAX
MIN
MAX
5.8**
8.4**
1**
10**
1
10
5.8**
8.4**
1**
10**
1
10
8.5**
13.2**
1**
15.5**
1
15.5
8.5**
13.2**
1**
15.5**
1
15.5
8.9**
12.5**
1**
15.5**
1
15.5
8.9**
12.5**
1**
15.5**
1
15.5
8.3
11.9
1
13.5
1
13.5
8.3
11.9
1
13.5
1
13.5
11
16.7
1
19
1
19
11
16.7
1
19
1
19
11.5
15.8
1
18
1
18
11.5
15.8
1
18
1
18
CL = 50 pF
1.5***
1.5
UNIT
ns
ns
ns
ns
ns
ns
ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
*** On products compliant to MIL-PRF-38535, this parameter does not apply.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
B or A
CL = 15 pF
tPZH
tPZL
OE
A or B
CL = 15 pF
tPHZ
tPLZ
OE
A or B
CL = 15 pF
tPLH
tPHL
A or B
B or A
CL = 50 pF
tPZH
tPZL
OE
A or B
CL = 50 pF
tPHZ
tPLZ
OE
A or B
CL = 50 pF
tsk(o)
MIN
TA = 25°C
TYP
MAX
SN54AHC245
range,
SN74AHC245
MIN
MAX
MIN
MAX
5.5*
1*
6.5*
1
6.5
4*
5.5*
1*
6.5*
1
6.5
5.8*
8.5*
1*
10*
1
10
5.8*
8.5*
1*
10*
1
10
5.6*
7.8*
1*
9.2*
1
9.2
5.6*
7.8*
1*
9.2*
1
9.2
5.5
7.5
1
8.5
1
8.5
5.5
7.5
1
8.5
1
8.5
7.3
10.6
1
12
1
12
7.3
10.6
1
12
1
12
7
9.7
1
11
1
11
7
9.7
1
11
1
11
CL = 50 pF
POST OFFICE BOX 655303
temperature
4*
1**
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
** On products compliant to MIL-PRF-38535, this parameter does not apply.
4
free-air
• DALLAS, TEXAS 75265
1
UNIT
ns
ns
ns
ns
ns
ns
ns
SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4)
SN74AHC245
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.9
V
Quiet output, minimum dynamic VOL
–0.9
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
4.3
V
High-level dynamic input voltage
3.5
VIL(D)
Low-level dynamic input voltage
NOTE 4: Characteristics are for surface-mount packages only.
V
1.5
V
TYP
UNIT
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
14
pF
5
SN54AHC245, SN74AHC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS230I – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
Input
50% VCC
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
VCC
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
0V
tPZL
VOH
50% VCC
VOL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9681801Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9681801QRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
5962-9681801QSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
5962-9681801VRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
5962-9681801VSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
SN74AHC245DBLE
OBSOLETE
SSOP
DB
20
Call TI
Call TI
SN74AHC245DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC245NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC245NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245PWLE
OBSOLETE
TSSOP
PW
20
SN74AHC245PWR
ACTIVE
TSSOP
PW
20
TBD
TBD
2000 Green (RoHS &
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AHC245PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC245PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54AHC245FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54AHC245J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
SNJ54AHC245W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AHC245, SN54AHC245-SP, SN74AHC245 :
SN74AHC245-Q1
• Automotive:
• Enhanced Product: SN74AHC245-EP
NOTE: Qualified Version Definitions:
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.2
7.5
2.5
12.0
16.0
Q1
SN74AHC245DBR
SSOP
DB
20
2000
330.0
16.4
SN74AHC245DGVR
TVSOP
DGV
20
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
SN74AHC245DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74AHC245NSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74AHC245PWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHC245DBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74AHC245DGVR
TVSOP
DGV
20
2000
346.0
346.0
29.0
SN74AHC245DWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74AHC245NSR
SO
NS
20
2000
346.0
346.0
41.0
SN74AHC245PWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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