STPS2L25 Low drop power Schottky rectifier Main product characteristics A IF(AV) 2A VRRM 25 V Tj (max) 150° C VF(max) 0.375 V K SMB STPS2L25U Features and benefits ■ Very low forward voltage drop for less power dissipation ■ Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications ■ Avalanche capability specified A K Description SMB flat STPS2L25UF Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMB, SMB flat for thermal resistance characteristic improvement, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. Table 1. Absolute ratings (limiting values) Symbol Value Unit 25 V 2 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1500 W -65 to + 150 °C 150 °C Tstg dPtot --------------dTj < SMB TL = 125° C δ = 0.5 SMB flat TL = 135° C δ = 0.5 Storage temperature range Operating junction Tj 1. Parameter 1 -------------------------Rth ( j – a ) February 2007 temperature(1) condition to avoid thermal runaway for a diode on its own heatsink Rev 5 1/9 www.st.com 9 Characteristics STPS2L25 1 Characteristics Table 2. Thermal resistance Symbol Rth(j-l) Table 3. Symbol IR(1) Parameter SMB 25 SMB flat 15 °C/W Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM Min. Typ. 15 0.325 Unit 90 µA 30 mA 0.375 V 0.53 IF = 4 A 0.43 To evaluate the maximum conduction losses, use the following equation: P = 0.24 x IF(AV) + 0.068 IF2(RMS) Max. 0.45 IF = 2 A 1. Pulse test: tp = 380 µs, δ < 2% 2/9 Unit Junction to lead Tj = 25° C VF(1) Value 0.51 STPS2L25 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) SMB IF(AV)(A) PF(AV)(W) 2.2 1.2 1.1 δ = 0.05 δ = 0.1 δ = 0.2 Rth(j-a)=Rth(j-l) δ = 0.5 SMB 2.0 1.0 1.8 0.9 1.6 0.8 Rth(j-a)=100°C/W δ=1 1.4 0.7 1.2 0.6 1.0 0.5 0.8 0.4 0.6 0.3 T T 0.4 0.2 IF(AV)(A) 0.1 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 1.2 1.4 0.2 δ=tp/T 0.0 1.6 1.8 2.0 δ=tp/T tp 0.0 2.2 2.4 2.6 Average forward current versus ambient temperature (δ = 0.5) SMB flat 0 Tamb(°C) tp 25 Figure 4. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMB IM(A) IF(AV)(A) 10 2.2 Rth(j-a)=Rth(j-l) SMB 2.0 9 SMB flat 1.8 8 1.6 7 Rth(j-a)=100°C/W 1.4 6 Ta=25°C 1.2 5 1.0 Ta=75°C 4 0.8 3 0.6 Ta=125°C T 2 0.4 0.2 δ=tp/T 0.0 0 1 Tamb(°C) tp IM t t(s) δ=0.5 0 25 Figure 5. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat 1.E-03 Figure 6. IM(A) 1.E-02 1.E-01 1.E+00 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1µs) 30 SMB flat 1 25 20 0.1 TL=25°C 15 TL=75°C 10 0.01 TL=125°C 5 IM t t(s) δ=0.5 1.E-03 1.E-02 tp(µs) 0.001 0 1.E-01 1.E+00 0.01 0.1 1 10 100 1000 3/9 Characteristics Figure 7. STPS2L25 Normalized avalanche power derating versus junction temperature Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - SMB Zth(j-a)/Rth(j-a) PARM(tp) PARM(25°C) 1.0 SMB 0.9 1.2 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 0.2 Tj(°C) 0.1 0 25 50 75 100 125 150 Single pulse 1.E-02 Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat tp(s) δ=tp/T 0.0 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-l)/Rth(j-l) 1.E+02 1.0 SMB flat Tj=150°C 0.9 Tj=125°C 1.E+01 0.8 0.7 Tj=100°C 1.E+00 0.6 0.5 0.4 1.E-01 0.3 0.2 0.1 Tj=25°C 1.E-02 Single pulse tp(s) VR(V) 0.0 1.E-03 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 Figure 12. Forward voltage drop versus forward current (typical values) IFM(A) C(pF) 10.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C Tj=150°C Tj=25°C 100 1.0 VFM(V) VR(V) 10 0.1 1 4/9 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 STPS2L25 Characteristics Figure 13. Forward voltage drop versus forward current (maximum values, high level) 10.0 IFM(A) Figure 14. Forward voltage drop versus forward current (maximum values, low level) 3.0 IFM(A) 2.5 Tj=125 °C (maximum values) Tj=125 °C (maximum values) 2.0 1.0 1.5 Tj=125 °C (typical values) Tj=25 °C (maximum values) Tj=125 °C (typical values) 1.0 Tj=25 °C (maximum values) 0.5 VFM(V) VFM(V) 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) Rth(j-a)(°C/W) 110 100 90 80 SMB 70 60 SMB flat 50 40 30 20 10 SCU(Cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/9 Package information 2 STPS2L25 Package information ● Epoxy meets UL94, V0 Table 4. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 16. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/9 STPS2L25 Package information Table 5. SMB Flat dimensions Dimensions Ref. D L L2 E E1 L L1 b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 A c Millimeters c Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 17. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 3 4 8/9 STPS2L25 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS2L25U G23 SMB 0.107 g 2500 Tape and reel STPS2L25UF FG23 SMB flat 0.50 g 5000 Tape and reel Revision history Date Revision July 2003 4A 08-Feb-2007 5 Changes Last update Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. STPS2L25 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9