STPS2H100-Y Automotive power Schottky rectifier Features ■ Negligible switching losses ■ High junction temperature capability ■ Low leakage current ■ Good trade-off between leakage current and forward voltage drop ■ Avalanche capability specified ■ ECOPACK®2 compliant component ■ AEC-Q101 qualified A Description K Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. Available in SMA and SMB. December 2010 K SMA STPS2H100AY Table 1. Doc ID 17944 Rev 1 A SMB STPS2H100UY Device summary Symbol Value IF(AV) 2A VRRM 100 V Tj (max) 175 °C VF (max) 0.65 V 1/9 www.st.com 9 Characteristics 1 STPS2H100-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit 100 V 2 A Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W -65 to +175 °C -40 to +175 °C Tj SMA / SMB TL = 130 °C δ = 0.5 Storage temperature range Operating junction temperature range (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Symbol IR(1) Parameter VF(2) Value SMA 30 SMB 25 Unit Junction to lead °C/W Static electrical characteristics Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.56 x IF(AV) + 0.045 IF2(RMS) Doc ID 17944 Rev 1 Min. Typ. Max. Unit - - 1 µA - 0.4 1 mA - - 0.79 - 0.6 0.65 - - 0.88 - 0.69 0.74 V 1. Pulse test: tp = 5 ms, δ < 2% 2/9 Value VRRM Tstg 1. Parameter STPS2H100-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5) (SMA / SMB) IF(AV)(A) 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 δ = 0.2 δ = 0.1 δ = 0.05 2.2 δ = 0.5 Rth(j-a)=Rth(j-I) 2.0 SMB 1.8 SMA 1.6 δ=1 SMA Rth(j-a)=100°C/W S(CU)=1.5cm2 1.4 1.2 SMB Rth(j-a)=80°C/W S(CU)=1.5cm2 1.0 0.8 0.6 T T 0.4 IF(AV)(A) 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 1.2 0.2 δ=tp/T 1.4 1.6 1.8 δ=tp/T tp 0.0 2.0 2.2 Normalized avalanche power derating versus pulse duration 0 Figure 4. PARM(tp) PARM(1 µs) Tamb(°C) tp 25 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) 25 50 Figure 6. IM(A) 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) IM(A) 10 10 SMA 9 SMB 9 8 8 7 7 6 Ta=25°C 5 Ta=25°C 6 5 Ta=75°C Ta=75°C 4 4 3 2 1 Ta=125°C t 0 1.E-03 IM 1 t(s) δ=0.5 Ta=125°C 3 2 IM t t(s) δ=0.5 0 1.E-02 1.E-01 1.E+00 1.E-03 Doc ID 17944 Rev 1 1.E-02 1.E-01 1.E+00 3/9 Characteristics Figure 7. STPS2H100-Y Relative variation of thermal Figure 8. impedance junction to ambient versus pulse duration (SMA / SMB) Zth(j-a)/Rth(j-a) 1.E+04 1.0 0.9 SMA 0.8 Reverse leakage current versus reverse voltage applied (typical values) IR(µA) 1.E+03 Tj=150°C SMB Tj=125°C 0.7 1.E+02 Tj=100°C 0.6 1.E+01 0.5 Tj=75°C 0.4 Tj=50°C 1.E+00 0.3 T Tj=25°C 0.2 1.E-01 Single pulse 0.1 δ=tp/T tp(s) VR(V) tp 1.E-02 0.0 1.E-02 Figure 9. 1.E-01 1.E+00 1.E+01 1.E+02 0 1.E+03 Junction capacitance versus reverse voltage applied (typical values) 20 40 60 80 100 Figure 10. Forward voltage drop versus forward current (low level) C(pF) 2.0 100 IFM(A) 1.8 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (Maximum values) 1.6 1.4 1.2 Tj=125°C (Typical values) 1.0 0.8 Tj=25°C (Maximum values) 0.6 0.4 0.2 VR(V) 1 4/9 VFM(V) 0.0 10 10 100 0.0 0.1 Doc ID 17944 Rev 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 STPS2H100-Y Characteristics Figure 11. Forward voltage drop versus forward current (high level) 100 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) IFM(A) 130 Epoxy printed circuit board FR4, Copper thickness = 35 µm 120 SMA 110 Tj=125°C (Maximum values) 100 90 80 Tj=125°C (Typical values) 70 10 60 50 40 30 Tj=25°C (Maximum values) 20 VFM(V) 10 1 SCU(cm²) 0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Rth(j-a)(°C/W) 110 Epoxy printed circuit board FR4, Copper thickness = 35 µm 100 SMB 90 80 70 60 50 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 17944 Rev 1 4.0 4.5 5.0 5/9 Package information 2 STPS2H100-Y Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 14. SMA footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 6/9 Doc ID 17944 Rev 1 STPS2H100-Y Package information Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 15. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID 17944 Rev 1 7/9 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2H100AY S21Y SMA 0.068 g 5000 Tape and reel STPS2H100UY G21Y SMB 0.107 g 2500 Tape and reel Revision history Table 8. 8/9 STPS2H100-Y Document revision history Date Revision 03-Dec-2010 1 Changes Initial release. Doc ID 17944 Rev 1 STPS2H100-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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