SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 FEATURES • • • • • • Member of the Texas Instruments Widebus+™ Family Pinout Optimizes DDR2 DIMM PCB Layout Configurable as 25-Bit 1:1 or 14-Bit 1:2 Registered Buffer Chip-Select Inputs Gate Data Outputs From Changing State and Minimize System Power Consumption Output Edge-Control Circuitry Minimizes Switching Noise in Unterminated Line Supports SSTL_18 Data Inputs • • • • • Differential Clock (CLK and CLK) Inputs Supports LVCMOS Switching Levels on Control and RESET Inputs RESET Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) DESCRIPTION/ORDERING INFORMATION This 25-bit 1:1 or 14-bit 1:2 configurable registered buffer is designed for 1.7-V to 1.9-V VCC operation. In the 1:1 pinout configuration, only one device per DIMM is required to drive nine SDRAM loads. In the 1:2 pinout configuration, two devices per DIMM are required to drive 18 SDRAM loads. All inputs are SSTL_18, except the LVCMOS reset (RESET) and LVCMOS control (Cn) inputs. All outputs are edge-controlled circuits optimized for unterminated DIMM loads and meet SSTL_18 specifications. The SN74SSTU32864C operates from a differential clock (CLK and CLK). Data are registered at the crossing of CLK going high and CLK going low. The C0 input controls the pinout configuration of the 1:2 pinout from register-A configuration (when low) to register-B configuration (when high). The C1 input controls the pinout configuration from 25-bit 1:1 (when low) to 14-bit 1:2 (when high). C0 and C1 should not be switched during normal operation. They should be hard-wired to a valid low or high level to configure the register in the desired mode. In the 25-bit 1:1 pinout configuration, the A6, D6, and H6 terminals are driven low and should not be used. In the DDR2 RDIMM application, RESET is specified to be completely asynchronous with respect to CLK and CLK. Therefore, no timing relationship can be ensured between the two. When entering reset, the register is cleared and the data outputs are driven low quickly, relative to the time to disable the differential input receivers. However, when coming out of reset, the register becomes active quickly, relative to the time required to enable the differential input receivers. As long as the data inputs are low, and the clock is stable during the time from the low-to-high transition of RESET until the input receivers are fully enabled, the design of the SN74SSTU32864C must ensure that the outputs remain low, thus ensuring no glitches on the output. To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up. ORDERING INFORMATION PACKAGE (1) TA 0°C to 70°C (1) ORDERABLE PART NUMBER TOP-SIDE MARKING LFBGA – GKE Tape and reel SN74SSTU32864CGKER S864C LFBGA – ZKE Tape and reel SN74SSTU32864CZKER S864C Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus+ is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) The device supports low-power standby operation. When RESET is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when RESET is low, all registers are reset and all outputs are forced low. The LVCMOS RESET and Cn inputs always must be held at a valid logic high or logic low level. The device also supports low-power active operation by monitoring both system chip select (DCS and CSR) inputs and will gate the Qn outputs from changing states when both DCS and CSR inputs are high. If either DCS or CSR input is low, the Qn outputs function normally. The RESET input has priority over the DCS and CSR control and forces the output low. If the DCS control functionality is not desired, the CSR input can be hard-wired to ground, in which case the setup-time requirement for DCS is the same as for the other D data inputs. The two VREF pins (A3 and T3) are connected together internally by approximately 150 Ω. However, it is necessary to connect only one of the two VREF pins to the external VREF power supply. An unused VREF pin should be terminated with a VREF coupling capacitor. 2 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 GKE PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K L M N P R T TERMINAL ASSIGNMENTS FOR 1:1 REGISTER (C0 = 0, C1 = 0) (1) (2) (3) 1 (1) (2) (3) 2 3 4 5 6 A D1 (DCKE) NC VREF VCC Q1 (QCKE) DNU B D2 D15 GND GND Q2 Q15 C D3 D16 VCC VCC Q3 Q16 D D4 (DODT) NC GND GND Q4 (QODT) DNU E D5 D17 VCC VCC Q5 Q17 F D6 D18 GND GND Q6 Q18 G NC RESET VCC VCC C1 C0 H CLK D7 (DCS) GND GND Q7 (QCS) DNU J CLK CSR VCC VCC NC NC K D8 D19 GND GND Q8 Q19 L D9 D20 VCC VCC Q9 Q20 M D10 D21 GND GND Q10 Q21 N D11 D22 VCC VCC Q11 Q22 P D12 D23 GND GND Q12 Q23 R D13 D24 VCC VCC Q13 Q24 T D14 D25 VREF VCC Q14 Q25 Each pin name in parentheses indicates the DDR2 DIMM signal name. NC - No internal connection DNU - Do not use 3 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 LOGIC DIAGRAM FOR 1:1 REGISTER CONFIGURATION (POSITIVE LOGIC) RESET CLK CLK VREF D1 (DCKE) G2 H1 J1 A3, T3 A1 D CLK Q CLK Q CLK Q A5 Q1 (QCKE) R D4 (DODT) D1 D D5 Q4 (QODT) R D7 (DCS) H2 D H5 Q7 (QCS) R CSR J2 One of 22 Channels D2 B1 D CE CLK R To 21 Other Channels (D3, D5, D6, D8−D25) 4 Q B5 Q2 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 GKE PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K L M N P R T TERMINAL ASSIGNMENTS FOR 1:2 REGISTER A (C0 = 0, C1 = 1) (1) (2) (3) 1 (1) (2) (3) 2 3 4 5 6 A D1 (DCKE) NC VREF VCC Q1A (QCKEA) Q1B (QCKEB) B D2 DNU GND GND Q2A Q2B C D3 DNU VCC VCC Q3A Q3B D D4 (DODT) NC GND GND Q4A (QODTA) Q4B (QODTB) E D5 DNU VCC VCC Q5A Q5B F D6 DNU GND GND Q6A Q6B G NC RESET VCC VCC C1 C0 H CLK D7 (DCS) GND GND Q7A (QCSA) Q7B (QCSB) J CLK CSR VCC VCC NC NC K D8 DNU GND GND Q8A Q8B L D9 DNU VCC VCC Q9A Q9B M D10 DNU GND GND Q10A Q10B N D11 DNU VCC VCC Q11A Q11B P D12 DNU GND GND Q12A Q12B R D13 DNU VCC VCC Q13A Q13B T D14 DNU VREF VCC Q14A Q14B Each pin name in parentheses indicates the DDR2 DIMM signal name. NC - No internal connection DNU - Do not use 5 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 LOGIC DIAGRAM 1:2 REGISTER-A CONFIGURATION (POSITIVE LOGIC) RESET CLK CLK VREF D1 (DCKE) G2 H1 J1 A3, T3 A1 A5 D CLK Q A6 R D4 (DODT) D1 D5 D CLK D6 H2 H5 D CLK Q4A (QODTA) Q4B (QODTB) Q7A (QCSA) Q H6 R CSR Q1B (QCKEB) Q R D7 (DCS) Q1A (QCKEA) Q7B (QCSB) J2 One of Eleven Channels D2 B1 B5 D CE CLK Q B6 R To 10 Other Channels (D3, D5, D6, D8−D14) 6 Q2A Q2B SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 GKE PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K L M N P R T TERMINAL ASSIGNMENTS FOR 1:2 REGISTER B (C0 = 1, C1 = 1) (1) (2) (3) 1 (1) (2) (3) 2 3 4 5 6 A D1 NC VREF VCC Q1A Q1B B D2 DNU GND GND Q2A Q2B C D3 DNU VCC VCC Q3A Q3B D D4 NC GND GND Q4A Q4B E D5 DNU VCC VCC Q5A Q5B F D6 DNU GND GND Q6A Q6B G NC RESET VCC VCC C1 C0 H CLK D7 (DCS) GND GND Q7A (QCSA) Q7B (QCSB) J CLK CSR VCC VCC NC NC K D8 DNU GND GND Q8A Q8B L D9 DNU VCC VCC Q9A Q9B M D10 DNU GND GND Q10A Q10B N D11 (DODT) DNU VCC VCC Q11A (QODTA) Q11B (QODTB) Q12B P D12 DNU GND GND Q12A R D13 DNU VCC VCC Q13A Q13B T D14 (DCKE) DNU VREF VCC Q14A (QCKEA) Q14B (QCKEB) Each pin name in parentheses indicates the DDR2 DIMM signal name. NC - No internal connection DNU - Do not use 7 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 LOGIC DIAGRAM 1:2 REGISTER-B CONFIGURATION (POSITIVE LOGIC) RESET CLK CLK VREF D14 (DCKE) G2 H1 J1 A3, T3 T1 T5 D CLK Q T6 R D11 (DODT) N1 N5 D CLK N6 H2 H5 D CLK Q11A (QODTA) Q11B (QODTB) Q7A (QCSA) Q H6 R CSR Q14B (QCKEB) Q R D7 (DCS) Q14A (QCKEA) Q7B (QCSB) J2 One of Eleven Channels D1 A1 A5 D CE CLK Q A6 R To 10 Other Channels (D2−D6, D8−D10, D12−D13) 8 Q1A Q1B SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 TERMINAL FUNCTIONS TERMINAL NAME GND Ground Ground input VCC Power-supply voltage 1.8 V nominal VREF Input reference voltage 0.9 V nominal CLK Positive master clock input Differential input CLK Negative master clock input Differential input C0, C1 Configuration control inputs – Register A, Register B, 1:1, 1:2 select LVCMOS inputs RESET Asynchronous reset input – resets registers and disables VREF data and clock differential-input receivers. When RESET is low, all Q outputs are forced low. LVCMOS input D1–D25 Data inputs – clocked in on the crossing of the rising edge of CLK and the falling edge of CLK SSTL_18 inputs Chip select inputs – disables register clocking (1) when both inputs are high SSTL_18 inputs DODT The outputs of this register bit will not be suspended by the DCS and CSR control. SSTL_18 input DCKE The outputs of this register bit will not be suspended by the DCS and CSR control. SSTL_18 input CSR, DCS Q1–Q25 (2) Data outputs that are suspended by the DCS and CSR control 1.8-V CMOS outputs QCS Data output that will not be suspended by the DCS and CSR control 1.8-V CMOS output QODT Data output that will not be suspended by the DCS and CSR control 1.8-V CMOS output QCKE Data output that will not be suspended by the DCS and CSR control 1.8-V CMOS output NC DNU (1) (2) ELECTRICAL CHARACTERISTICS DESCRIPTION No internal connection Do not use – inputs are in standby-equivalent mode, and outputs are driven low. Data inputs = D2, D3, D5, D6, D8–D25 when C0 = 0 and C1 = 0 Data inputs = D2, D3 D5, D6, D8-D14 when C0 = 0 and C1 = 1 Data inputs = D1–D6, D8–D12, D13 when C0 = 1 and C1 = 1 Data outputs = Q2, Q3, Q5, Q6, Q8–when C0 = 0 and C1 = 0 Data outputs = Q2, Q3 Q5, Q6, Q8–Q14 when C0 = 0 and C1 = 1 Data outputs = Q1–Q6, Q8–Q10, Q12, Q13 when C0 = 1 and C1 = 1 FUNCTION TABLES INPUTS RESET DCS CSR CLK CLK Dn OUTPUT Qn H L X ↑ ↓ L L H L X ↑ ↓ H H H X L ↑ ↓ L L H X L ↑ ↓ H H H H H ↑ ↓ X Q0 H X X L or H L or H X Q0 L X or floating X or floating X or floating X or floating X or floating L INPUTS OUTPUTS RESET CLK CLK DCKE, DCS, DODT H ↑ ↓ H QCKE, QCS, QODT H H ↑ ↓ L L H L or H L or H X Q0 L X or floating X or floating X or floating L 9 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 2.5 V VI Input voltage range (2) (3) –0.5 2.5 V –0.5 VCC + 0.5 range (2) (3) UNIT VO Output voltage IIK Input clamp current VI < 0 or VI > VCC ±50 mA IOK Output clamp current VO < 0 or VO > VCC ±50 mA IO Continuous output current VO = 0 to VCC ±50 mA ±100 Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) –65 V mA 36 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. This value is limited to 2.5 V maximum. The package thermal impendance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN NOM UNIT Supply voltage VREF Reference voltage VI Input voltage VIH AC high-level input voltage Data inputs, CSR VIL AC low-level input voltage Data inputs, CSR VIH DC high-level input voltage Data inputs, CSR VIL DC low-level input voltage Data inputs, CSR VIH High-level input voltage RESET, Cn VIL Low-level input voltage RESET, Cn VICR Common-mode input voltage range CLK, CLK 0.675 VI(PP) Peak-to-peak input voltage CLK, CLK 600 IOH High-level output current –8 mA IOL Low-level output current 8 mA TA Operating free-air temperature 70 °C (1) 10 1.7 MAX VCC 0.49 × VCC 0 0.5 × VCC 1.9 V 0.51 × VCC V VCC V VREF + 250 mV V VREF – 250 mV VREF + 125 mV V VREF – 125 mV 0.65 × VCC V V 0.35 × VCC 0 V 1.125 V V mV The RESET and Cn inputs of the device must be held at valid logic voltage levels (not floating) to ensure proper device operation. The differential inputs must not be floating, unless RESET is low. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH ICC ICCD IOL = 100 µA V 0.4 All inputs (2) VI = VCC or GND 1.9 V ±5 Static standby RESET = GND Static operating RESET = VCC, VI = VIH(AC) or VIL(AC) Dynamic operating – clock only RESET = VCC, VI = VIH(AC) or VIL(AC), CLK and CLK switching 50% duty cycle Dynamic operating – per each data input, 1:1 configuration Chip-select-enabled low-power active mode, 1:1 configuration IO = 0 RESET = VCC, VI = VIH(AC) or VIL(AC), IO = 0 CLK and CLK switching 50% duty cycle, One data input switching at one-half clock frequency, 50% duty cycle 1.9 V 1.8 V RESET = VCC, VI = VIH(AC) or VIL(AC), CLK and CLK switching 50% duty cycle IO = 0 RESET = VCC, VI = VIH(AC) or VIL(AC), CLK and CLK switching 50% duty cycle, One data input switching at one-half clock frequency, 50% duty cycle Data inputs, CSR VI = VREF ± 250 mV CLK, CLK VICR = 0.9 V, VI(PP) = 600 mV RESET VI = VCC or GND UNIT 1.3 0.2 Chip-select-enabled low-power active mode, 1:2 configuration (1) (2) 1.7 V 1.7 V Chip-select-enabled low-power active mode, clock only Ci IOH = –6 mA MAX VCC – 0.2 1.7 V to 1.9 V Dynamic operating – per each data input, 1:2 configuration ICCDLP 1.7 V to 1.9 V IOL = 6 mA VOL II MIN TYP (1) VCC V µA 100 µA 40 mA 33 µA/MHz 19 35 µA/ clock MHz/ D input 34 µA/MHz 2 1.8 V µA/ clock MHz/ D input 2 2.5 1.8 V 3 3.5 2 3 pF 2.5 All typical values are at VCC = 1.8 V, TA = 25°C. Each VREF pin (A3 or T3) should be tested independently, with the other (untested) pin open. Timing Requirements (1) over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) MIN MAX UNIT 500 MHz fclock Clock frequency tw Pulse duration, CLK, CLK high or low tact Differential inputs active time (2) 10 ns tinact Differential inputs inactive time (3) 15 ns tsu Setup time th (1) (2) (3) Hold time 1 DCS before CLK↑, CLK↓, CSR high; CSR before CLK↑, CLK↓, DCS high 0.6 DCS before CLK↑, CLK↓, CSR low 0.5 DODT, DCKE, and Data before CLK↑, CLK↓ 0.5 DCS, DODT, DCKE, and Data after CLK↑, CLK↓ 0.5 ns ns ns All input slew rates are 1 V/ns ±20%. VREF must be held at a valid input level, and data inputs must be held low for a minimum time of tact max after RESET is taken high. VREF data and clock inputs must be held at valid voltage levels (not floating) for a minimum time of tinact max after RESET is taken low. 11 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpdm (1) CLK and CLK Q tpdmss (1) CLK and CLK RESET PARAMETER fmax tRPHL (1) (1) VCC = 1.8 V ± 0.1 V MIN UNIT MAX 500 MHz 1.4 2.4 ns Q 2.6 ns Q 3 ns Includes 350-ps test-load transmission-line delay Output Slew Rates over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) PARAMETER (1) 12 FROM TO VCC = 1.8 V ± 0.1 V UNIT MIN MAX dV/dt_r 20% 80% 1.9 4.9 V/ns dV/dt_f 80% 20% 1.9 4.9 V/ns dV/dt_∆ (1) 20% or 80% 80% or 20% 1.5 V/ns Difference between dV/dt_r (rising edge rate) and dV/dt_f (falling edge rate) SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 PARAMETER MEASUREMENT INFORMATION VCC ZO = 50 Ω, tD = 350 ps Test Point DUT RL = 1 kΩ CLK RL = 100 Ω Clock Inputs CL = 30 pF (see Note A) ZO = 50 Ω, tD = 350 ps CLK ZO = 50 Ω, tD = 350 ps Output Test Point Out Test Point RL = 1 kΩ LOAD CIRCUIT tw VIH VREF Input VREF VIL VCC LVCMOS RESET Input VCC/2 VCC/2 VOLTAGE WAVEFORMS PULSE DURATION 0V VI(PP) tinact tact ICC 90% ICC (operating) Timing Inputs VICR VICR (see Note B) 10% ICC (standby) VOLTAGE AND CURRENT WAVEFORMS INPUTS ACTIVE AND INACTIVE TIMES tPLH tPHL VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VI(PP) Timing Inputs tsu VIH LVCMOS RESET Input VICR VCC/2 VIL tPHL th VOH VIH Input VREF Output VREF VCC/2 VOL VIL VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. ICC tested with clock and data inputs held at VCC or GND, and IO = 0 mA. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, input slew rate = 1 V/ns ±20% (unless otherwise noted). D. The outputs are measured one at a time, with one transition per measurement. E. VREF = VCC/2 F. VIH = VREF + 250 mV (ac voltage levels) for differential inputs. VIH = VCC for LVCMOS input. G. VIL = VREF − 250 mV (ac voltage levels) for differential inputs. VIL = GND for LVCMOS input. H. VI(PP) = 600 mV I. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 13 SN74SSTU32864C 25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS www.ti.com SCES542A – JANUARY 2004 – REVISED FEBRUARY 2005 PARAMETER MEASUREMENT INFORMATION VCC DUT RL = 50 Ω VOH Test Point Out 80% CL = 5 pF (see Note A) Output 20% VOL dV_f dt_f LOAD CIRCUIT HIGH-TO-LOW SLEW-RATE MEASUREMENT VOLTAGE WAVEFORMS HIGH-TO-LOW SLEW-RATE MEASUREMENT DUT dt_r dV_r Out Test Point CL = 5 pF (see Note A) RL = 50 Ω LOAD CIRCUIT LOW-TO-HIGH SLEW-RATE MEASUREMENT VOH Output 20% VOL VOLTAGE WAVEFORMS LOW-TO-HIGH SLEW-RATE MEASUREMENT NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, input slew rate = 1 V/ns ± 20% (unless otherwise specified). Figure 2. Output Slew-Rate Measurement Information 14 80% PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-2005 PACKAGING INFORMATION Status (1) Package Type Package Drawing SN74SSTU32864CGKER ACTIVE LFBGA GKE 96 SN74SSTU32864CZKER PREVIEW LFBGA ZKE 96 Orderable Device Pins Package Eco Plan (2) Qty 1000 Lead/Ball Finish None Call TI Green (RoHS & no Sb/Br) / MSL Peak Temp (3) Call TI Level-3-250C-1WEEK (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. 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