DYNEX DFM300MXS18-A000

DFM300MXS18-A000
DFM300MXS18-A000
Fast Recovery Diode Module
Preliminary Information
DS5458-1.1 May 2001
FEATURES
■ Low Reverse Recovery Charge
■ High Switching Speed
■ Low Forward Voltage Drop
KEY PARAMETERS
VRRM
VF
(typ)
(max)
IF
(max)
IFM
1800V
2.0V
300A
600A
■ Isolated Base
APPLICATIONS
■ Brake Chopper Diode
■ Boost and Buck Converters
■ Free-wheel Circuits
1
2
3
■ Motor Drives
■ Resonant Converters
■ Induction Heating
■ Multi-level Switch Inverters
Fig. 1 Circuit diagram
The DFM300MXS18-A000 is a dual 1800 volt, fast
recovery diode (FRD) module. Designed for low power
loss, the module is suitable for a variety of high voltage
applications in motor drives and power conversion.
Fast switching times and low reverse recovery losses
allow high frequency operation making the device suitable
for the latest drive designs employing pwm and high
frequency switching.
1
2
3
The module incorporates an electrically isolated base
plate. Low inductance construction enables circuit
designers to optimise circuit layouts and utilise grounded
heat sinks for safety.
ORDERING INFORMATION
Order As:
DFM300MXS18-A000
Note: When ordering, please use the complete part number.
Outline type code: M
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
1/7
www.dynexsemi.com
DFM300MXS18-A000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise
Symbol
Test Conditions
Parameter
Max.
Units
Repetitive peak reverse voltage
Tvj = 125˚C
1800
V
IF
Forward current (per arm)
DC, Tcase = 65˚C
300
A
IFM
Max. forward current
Tcase = 110˚C, tp = 1ms
600
A
I2t
I2t value fuse current rating
VR = 0, tp = 10ms, Tvj = 125˚C
30
A2s
Pmax
Maximum power dissipation
Tcase = 25˚C, Tvj = 125˚C
1040
W
Visol
Isolation voltage
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
4.0
kV
Qpd
Partial discharge
IEC1287. V1 = 1500V, V2 = 1100V, 50Hz RMS
10
pC
VRRM
THERMAL AND MECHANICAL RATINGS
Internal insulation:
Baseplate material:
Creepage distance:
Clearance:
CTI (Critical Tracking Index):
Parameter
Symbol
Rth(j-c)
Al2O3
Cu
22mm
12mm
175
Thermal resistance - diode (per arm)
Test Conditions
Continuous dissipation -
Min.
Typ.
Max.
Units
-
-
96
˚C/kW
-
-
15
˚C/kW
junction to case
Rth(c-h)
Tj
Tstg
-
Thermal resistance - case to heatsink
Mounting torque 5Nm
(per module)
(with mounting grease)
Junction temperature
-
-
-
125
˚C
Storage temperature range
-
–40
-
125
˚C
Mounting - M6
-
-
5
Nm
Electrical connections - M6
-
-
5
Nm
Screw torque
2/7
www.dynexsemi.com
DFM300MXS18-A000
STATIC ELECTRICAL CHARACTERISTICS - PER ARM
Tvj = 25˚C unless stated otherwise.
Test Conditions
Parameter
Symbol
Min.
Typ.
Max.
Units
IRM
Peak reverse current
VR = 1800V, Tvj = 125˚C
-
-
5
mA
VF
Forward voltage
IF = 300A
-
2.0
2.3
V
IF = 300A, Tvj = 125˚C
-
2.0
2.3
V
-
30
-
nH
Test Conditions
Min.
Typ.
Max.
Units
IF = 300A,
-
220
-
A
L
Inductance
-
DYNAMIC ELECTRICAL CHARACTERISTICS
Tvj = 25˚C unless stated otherwise.
Parameter
Symbol
Irr
Peak reverse recovery current
Qrr
Reverse recovery charge
dIF/dt = 2000A/µs,
-
80
-
µC
Erec
Reverse recovery energy
VR = 900V
-
60
-
mJ
Test Conditions
Min.
Typ.
Max.
Units
IF = 300A,
-
255
-
A
Tvj = 125˚C unless stated otherwise.
Symbol
Parameter
Irr
Peak reverse recovery current
Qrr
Reverse recovery charge
dIF/dt = 2000A/µs,
-
135
-
µC
Erec
Reverse recovery energy
VR = 900V
-
90
-
mJ
3/7
www.dynexsemi.com
DFM300MXS18-A000
TYPICAL CHARACTERISTICS
800
Transient thermal impedance, Zth (j-c) - (°C/kW )
100
700
Tj = 25˚C
Foward current, IF - (A)
600
500
Tj = 125˚C
400
300
100
100
0
0
0.5
2.0
1.0
1.5
2.5
Foward voltage, VF - (V)
3.0
10
1
2
3
4
Ri (˚C/KW) 2.8086 10.5142 16.6906 66.004
τi (ms)
0.006863 1.8477 14.6244 76.68
1
0.001
3.5
0.01
0.1
Pulse width, tp - (s)
10
1
Fig. 4 Transient thermal impedance
Fig. 2 Diode typical forward characteristics
1500
600
DC forward current, IF - (A)
Power dissipation, Ptot - (W)
500
1000
500
400
300
200
100
0
0
20
40
60
80
100
120
Case temperature, Tcase - (˚C)
Fig. 5 Power dissipation
140
160
0
0
20
40
60
80
100
120
Case temperature, Tcase - (˚C)
140
160
Fig. 6DC current rating vs case temperature
4/7
www.dynexsemi.com
DFM300MXS18-A000
400
Reverse recovery current, IRR - (A)
350
300
250
200
150
200
50
Tj = 125˚C
0
0
400
1200
800
Reverse voltage, VR - (V)
1600
2000
Fig. 7 RBSOA
5/7
www.dynexsemi.com
DFM300MXS18-A000
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
28 ± 0.5
2
3
62 ± 0.8
48 ± 0.3
1
28 ± 0.5
93 ± 0.3
23
31 ± 0.8
3x M6
106 ± 0.8
108 ± 0.8
Nominal weight: 270g
Recommeded fixings for mounting: M6
Recommended mounting torque: 5Nm (44lbs.ins)
Recommended torque for electrical connections (M6): 5Nm (44lbs.ins)
Module outline type code: M
6/7
www.dynexsemi.com
DFM300MXS18-A000
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5458-1 Issue No. 1.1 May 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
7/7
www.dynexsemi.com