LMA417 MEDIUM POWER PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ ♦ • 18 GHz to 24 GHz Frequency Band 19 dB Gain 23 dBm Output Power at Saturation 14 dB Input/Output Return Loss +4 V Dual Bias Supply DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA417 is a 3-stage medium power PHEMT amplifier that provides 19dB linear power gain with 1-dB gain compression power output of greater than +21dBm for commercial mm-W (millimeter-wave) 18 & 23GHz PCN/PCS and 20GHz SatCom application. Ground is provided to the circuitry through vias to the backside metallization. • ELECTRICAL SPECIFICATIONS @ TAmbient = 25°°C (VDD = +4.0V, ZIN = ZOUT = 50Ω) Parameter Symbol Small Signal Gain S21 Test Conditions 60% IDSS Operating Frequency Min Typ 18±0.5 GHz 18 19 dB 20±0.5 GHz 17 18 dB 23±0.5 GHz 17 18 dB 18 dB 24.5-26.5 GHz Saturated Drain Current IDSS Small Signal Gain Flatness ∆S21 165 495 Units mA 18-24 GHz ±1 dB 24-26.5 GHz ±1.5 dB 21 dBm Power at 1-dB Compression P-1dB Power at Saturation PSAT 23 dBm Input Return Loss S11 -14 dB Output Return Loss S22 -14 dB Reverse Isolation S12 -48 dB Phone: (408) 988-1845 Fax: (408) 970-9950 60% IDSS 360 Max http:// www.filss.com Revised: 03/23/01 Email: [email protected] LMA417 MEDIUM POWER PHEMT MMIC • ABSOLUTE MAXIMUM RATINGS Parameter Notes: • • • • Symbol Test Conditions Drain Voltage VD Gate Voltage Min Max Units TAmbient = 22 ± 3 °C 7 V VG TAmbient = 22 ± 3 °C -1 V Operating Current IOP TAmbient = 22 ± 3 °C 495 mA RF Input Power PIN TAmbient = 22 ± 3 °C 15 dBm Total Power Dissipation PTOT TAmbient = 22 ± 3 °C 3.5 W Channel Operating Temperature TCH TAmbient = 22 ± 3 °C 150 ºC Storage Temperature Maximum Assembly Temperature (1 min. max.) TSTG — 165 ºC TMAX — 300 ºC -65 Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Recommended Continuous Operating Limits should be observed for reliable device operation. Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 03/23/01 Email: [email protected] LMA417 MEDIUM POWER PHEMT MMIC • ASSEMBLY DRAWING Notes: • • • • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. The recommended die attach is a eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Bond on bond or stitch bond acceptable. Conductor over conductor acceptable. Conductors must not short. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 03/23/01 Email: [email protected] LMA417 MEDIUM POWER PHEMT MMIC • MECHANICAL OUTLINE Notes: • • • • • All units are in microns (µm). All bond pads are 100 X 100 µm 2 . Bias pad (VDD ) size is 100 X 121.5 µm 2 . Unless otherwise specified. HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 03/23/01 Email: [email protected]