HITACHI HD74HCT534

HD74HCT374/HD74HCT534
Octal D-type Flip-Flops (with 3-state outputs)/
Octal D-type Flip-Flops (with inverted 3-state outputs)
Description
These device are positive edge triggered flip-flops. The difference between HD74HCT374 and
HD74HCT534 is only that the former is a true outputs and the latter is a false outputs. Data at the D inputs,
meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions
of the clock (CK) input. When a high logic level is applied to the output control (OC) input, all outputs go
to a high impedance state, regardless of what signals are present at the other inputs and the state of the
storage elements.
Features
•
•
•
•
•
•
LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility
High Speed Operation: tpd (Clock to Q) = 15 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 4.5 to 5.5 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
D
HD74HCT374
Q
HD74HCT534
Q
L
H
H
L
L
L
L
H
Output Control
Clock
L
L
X
No change
No change
H
X
X
Z
Z
X :
Z :
Irrelevant
Off (high-impedance) state of a 3-state output.
HD74HCT374/HD74HCT534
Pin Arrangement
HD74HCT374
Output
Control 1
20 VCC
1Q
2
19 8Q
1D
3
18 8D
2D
4
17 7D
2Q
5
16 7Q
3Q
6
15 6Q
3D
7
14 6D
4D
8
13 5D
4Q
9
12 5Q
GND 10
11 Clock
(Top view)
HD74HCT534
Output
Control 1
20 VCC
1Q
2
19 8Q
1D
3
18 8D
2D
4
17 7D
2Q
5
16 7Q
3Q
6
15 6Q
3D
7
14 6D
4D
8
13 5D
4Q
9
12 5Q
GND 10
11 Clock
(Top view)
2
HD74HCT374/HD74HCT534
Block Diagram
HD74HCT374
1D
2D
3D
4D
5D
6D
7D
8D
D Q
D Q
D Q
D Q
D Q
D Q
D Q
D Q
C Q
C Q
C Q
C Q
C Q
C Q
C Q
C Q
Clock
Output
Control
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
HD74HCT534
1D
2D
3D
4D
5D
6D
7D
8D
D Q
D Q
D Q
D Q
D Q
D Q
D Q
D Q
C Q
C Q
C Q
C Q
C Q
C Q
C Q
C Q
Clock
Output
Control
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
3
HD74HCT374/HD74HCT534
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage range
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC + 0.5
V
Output voltage
VOUT
–0.5 to VCC + 0.5
V
DC current drain per pin
I OUT
±35
mA
DC current drain per VCC, GND
I CC, I GND
±75
mA
DC input diode current
I IK
±20
mA
DC output diode current
I OK
±20
mA
Power dissipation per package
PT
500
mW
Storage temperature
Tstg
–65 to +150
°C
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Test Conditions
Item
Symbol
Min Typ Max Min
Max
Unit
VCC (V)
Input voltage
VIH
2.0
—
—
—
V
4.5 to
5.5
VIL
—
—
0.8 —
0.8
V
4.5 to
5.5
VOH
4.4
—
—
4.4
—
V
4.5
Vin = VIH or VIL I OH = –20 µA
4.18 —
—
4.13
—
4.5
I OH = –6 mA
—
—
0.1 —
0.1
—
—
0.26 —
0.33
Output voltage
VOL
2.0
V
4.5
Vin = VIH or VIL I OL = 20 µA
4.5
I OL = 6 mA
Off-state output
current
I OZ
—
—
±0.5 —
±5.0
µA
5.5
Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
—
—
±0.1 —
±1.0
µA
5.5
Vin = VCC or GND
Quiescent current I CC
—
—
4.0 —
40
µA
5.5
Vin = VCC or GND, Iout = 0 µA
4
HD74HCT374/HD74HCT534
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Test Conditions
Item
Symbol
Min Typ Max Min
Max
Unit
VCC (V)
Maximum clock
frequency
f max
—
—
30
—
24
MHz
4.5
Propagation delay t PLH
—
12
28
—
35
ns
4.5
time
t PHL
—
15
28
—
35
Output enable
t ZL
—
16
30
—
38
time
t ZH
—
15
30
—
38
Output disable
t LZ
—
13
30
—
38
time
t HZ
—
16
30
—
38
Setup time
t su
20
2
—
25
—
ns
4.5
Data to clock
Hold time
th
5
0
—
6
—
ns
4.5
Clock to data
Pulse width
tw
16
5
—
20
—
ns
4.5
Clock, output control
Output rise/fall
time
t TLH
t THL
—
4
12
—
15
ns
4.5
Input capacitance
Cin
—
5
10
—
10
pF
—
4.5
ns
4.5
4.5
ns
4.5
4.5
5
Unit: mm
24.50
25.40 Max
6.30
11
1
7.00 Max
20
10
1.30
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
1
10
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
20
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
12.8
13.2 Max
11
1
10
0.20 ± 0.10
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.27 ± 0.05
0.25 ± 0.04
2.65 Max
7.50
20
0.25
10.40 +– 0.40
1.45
0° – 8°
0.57
0.70 +– 0.30
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DB
Conforms
—
0.52 g
Unit: mm
6.50
6.80 Max
11
1
10
4.40
20
0.65
*0.22+0.08
–0.07
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
*Dimension including the plating thickness
Base material dimension
0.07 +0.03
–0.04
0.10
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.65 Max
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-20DA
—
—
0.07 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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