HITACHI M61006FP

M61006FP
DISTANCE DETECTION SIGNAL PROCESSING
FOR 3 V SUPPLY VOLTAGE
REJ03F0039-0100Z
Rev.1.0
Sep.16.2003
Description
M61006FP is a semiconductor integrated circuit including distance detection signal processing circuit for 3 V supply
voltage. This device transforms each optical inflow current I1 and I2 from PSD SENSOR into the voltage, and
integrates the output after doing calculation corresponds to I1 / (I1+I2), and outputs it as the voltage data.
Features
• Wide supply voltage range: Vcc = 2.2 to 5.5 V
• Including clamp level switching circuit
(It is possible to set a clamp level to 15 points with outside control.)
• Including infinity discrimination function
(clamp on detection function)
• Including POWER ON RESET function
• Including simple temperature detection function
(It is possible to correct temperature with transmitting this output to the microcomputer. )
Application
• Auto focus control for a camera, short distance sensor, etc.
Recommended Operating Condition
• Supply voltage range …… 2.2 V to 5.5 V
• Rated supply voltage …… 3.0 V
Block Diagram
Vcc1
CV
Vcc2
12
5
1 µF
AFOUT
1
16
CHN
Capacitance for
stationary lihgt
hold
0.032 µF
NC
DIELECTRIC DIVIDEPOLE
MEASURES CIRCUIT
TESTN
15
TEMPERATURE
DETECTION
CIRCUIT
I1
14
I/V
TRANSFORM
AMP
STATIONARY
LIGHT
REMOVE
RECKON
PSDN
I1
HOLD
HOLD
PSD
I2
PSDF
11
CHF
OUTPUT
CIRCUIT
STATIONARY
LIGHT
REMOVE
I1 + I2
INFINITY
JUDGE
CIRCUIT
I/V
TRANSFORM
AMP
9 NC
CLAMP
CIRCUIT
TESTF
HOLD
10
1 µF
POWER
ON
RESET
Capacitance for
stationary lihgt
hold
2
GND1
3
GND2
SEQUENTIAL CONTROL LOGIC
6
CONT
8
CLALV
Input control signal Input control signal
Note: Pin9, 16 is avail only for engineering sample.
Rev.1.0, Sep.16.2003, page 1 of 15
INFINITY JUDGE
OUTPUT CIRCUIT
7
CMOUT
M61006FP
Pin Configuration (Top View)
AFOUT
1
NC
16 (TESTN)
GND1
2
15 CHN
GND2
3
14 PSDN
NC
4
13
NC
VCC2
5
12
VCC1
CONT
6
11
PSDF
CMOUT
7
10
CHF
CLALV
8
9
NC
(TESTF)
OUTLINE 16P2E
Note:
Pin9,16 is available only for engineeing sample.
Vcc, GND1: small signalanalog line
Vcc, GND2: analog line or control line
Rev.1.00, Sep.16.2003, page 2 of 15
M61006FP
Absolute Maximum Ratings
(Ta = 25°C unless otherwise noted)
Parameter
Symbol
Rating
Unit
Remark
Supply voltage
VCC
Power dissipation
Thermal derating
Pin supply voltage
Another terminal
Output inflow current
Operating temperature
Storage temperature
Pd
Kθ
VIF
VI / O
Icmout
Topr
Tstg
7.0
320
–3.2
7.0
0 to VCC+0.3
0.5
−10 to 50
−40 to 125
V
mW
mW / °C
V
V
mA
°C
°C
Note1
Ta = 25°C
Ta ≥ 25°C
Pin 6, 7, 8
Note2
NPN open collector
Notes: 1. As a principle, do not provide a supply voltage reversely.
2. As a principle, do not provide the terminals with the voltage over supply voltage or under ground voltage.
Thermal Derating Curve
400
300
- 3.2mW/˚C
200
10
0
0
20
40
60
80
100
OPERATING TEMPERATURE
Rev.1.00, Sep.16.2003, page 3 of 15
120
Ta[˚C]
140
M61006FP
Electrical Characteristics - 1
(Ta = 25°C)
Classificatin
Parameter
Symbol
Operating supply voltage
VCC
Test conditions
Limits
Unit
VCC
(V)
3.0
No
te
Min
Typ
Max
2.2
3.0
5.5
V
—
3.9
5.1
mA
*6
—
9.5
12.5
mA
*1
range
Consum-
Usual consuming current
ICC1
ing
Rapid charge consuming
ICC2
Current
current 1
AFOUT rapid charge
consuming current
*6
VAFOUT = 0 V
Rapid charge consuming
ICC3
current 2
CH rapid charge
—
10.5
13.7
mA
consuming current
*6
CONT
CONT ”H” input voltage
VCOH
1.1
—
7.0
V
pin
CONT ”L” input voltage
VCOL
0
—
0.3
V
CONT ”H” input current
ICOH
VIH = 5.5 V
—
—
1.0
µA
CONT ”L” input current
ICOL
VIL = 0 V
–84
–64
–44
µA
CLALV
CLALV ”H” input voltage
VCLH
1.1
—
7.0
V
pin
CLALV ”L” input voltage
VCLL
0
—
0.3
V
CLALV ”H” input current
ICLH
VIH = 5.5 V
—
—
1.0
µA
CLALV ”L” input current
ICLL
VIL = 0 V
–84
–64
–44
µA
CH rapid charge current
ICHQC
IPSD = 5 µA
–2000
–1000
–500
µA
HOLD C
*1
*6
*6
VCH = 0 V
CH stationary charge
ICHC
VCH = 0 V
–33
–22
–11
µA
ICHD
VCH = 1.5 V
11
22
33
µA
current
CH stationary discharge
current
Integra-
AFOUT reset current
IRAFOUT
VAFOUT = 0.5 V
600
1200
2400
µA
tion
AFOUT integrating
IOFFAFOUT
VAFOUT = 0.5 V
—
—
1.0
µA
circuit
off current
IINTAFOUT
VAFOUT = 0.5 V
–13.0
–10.0
–7.0
µA
—
3.0
6.0
%
–6.5
–5.0
–3.5
µA
AFOUT integrating current
(maximum integration
VCHF = 2.0 V,
current)
Distance measurement
VCHN = 0 V
∆IINT
integration current stability
*2
*6
AFOUT temperature
revision integration current
ItAFOUT
The stability of temperature
integration current
∆It
—
3.0
6.0
%
Dynamic rage of AFOUT pin
DAFOUT
—
—
2.7
V
VAFOUT = 0.5 V
*2
*6
(VCC0.3)
Rev.1.00, Sep.16.2003, page 4 of 15
*6
*7
M61006FP
Electrical Characteristics - 2
(Ta = 25°C)
Classification
Parameter
AF Input
AF output voltage
Condition1
(9:1) -1
AF output voltage
Symbol
D (9:1) - 1
Near side 9: far side 1
Limits
Unit
VCC
(V)
Note
3.0
*3
Min
Typ
Max
1.26
1.81
2.36
V
0.83
1.19
1.55
V
*3
0.41
0.59
0.77
V
*3
IP = 100 nA
D (6:4) - 1
(6:4) -1
AF output voltage
Test conditions
Near side 6: far side 4
IP = 100 nA
D (3:7) - 1
(3:7) -1
Near side 3: far side 7
IP = 100 nA
AF slope - 1
∆AF - 1
0.85
1.22
1.59
V
*3
AF linearity - 1
LAF - 1
0.875
0.975
1.075
—
*3
AF input
AFoutput time
D (9:1) - 2
1.26
1.81
2.36
V
*3
condition2
(9:1) - 2
0.83
1.19
1.55
V
*3
0.41
0.59
0.77
V
*3
0.85
1.22
1.59
V
*3
AFoutput time
D (6:4) - 2
(6:4) - 2
AFoutput time
Near side 6: Far side4
IP = 50 nA
D (3:7) - 2
(3:7) - 2
AF input
condition3
Near side 9: Far side1
IP = 50 nA
Near side 3: Far side7
IP = 50 nA
AF slope - 2
∆AF - 2
AF linearity - 2
LAF - 2
0.875
0.975
1.075
—
*3
AFoutput time
(9:1) - 3
D (9:1) - 3
Near side 9: Far side1
IP = 50 nA
1.26
1.81
2.36
V
*3
AFoutput time
(6:4) - 3
D (6:4) - 3
Near side 6: Far side4
IP = 50 nA
0.83
1.19
1.55
V
*3
AFoutput time
(3:7) - 3
D (3:7) - 3
Near side 3: Far side7
IP = 50 nA
0.41
0.59
0.77
V
*3
AF slope - 3
∆AF - 3
0.85
1.22
1.59
µA
*3
0.875
0.975
1.075
V
*3
–0.022
—
0.022
—
*3
–0.022
—
0.022
—
*3
–0.022
—
0.022
—
*3
AF linearity - 3
LAF - 3
AF input
condition
AFoutput time
(9:1) - 3
D (9:1) - 3
1 to 2
AFoutput time
D (6:4) - 3
(condition 1 to 3)
(6:4) - 3
AFoutput time
Near side 9: Far side1
Near side 6: Far side4
(condition 1 to 3)
D (3:7) - 3
(3:7) - 3
Rev.1.00, Sep.16.2003, page 5 of 15
Near side 3: Far side7
(condition 1 to 3)
M61006FP
Electrical Characteristics - 3
(Ta = 25°C)
Classification
Parameter
Symbol
Test conditions
Limits
Min
Typ
Max
Unit
VCC
(V)
3.0
Note
Clamp
CMOUT leak current
ICMOUTH
VCMOUT = 5.5 V
—
—
1.0
µA
determin
CMOUT saturation current
VCMOUTL
ICMOUT = 500 µA
—
—
0.3
V
*6
Signal ray maximum current
∆INF
—
—
3.0
µA
*4
Capacity of the current to extract
IPSD
—
—
30
µA
*6
ation
SENSOR
*8
stationary rays
Clamp level
*4
*8
ICLAM
The change values
–50
—
50
%
—
—
26
µsec
about TYP current
(Design target value)
Clout for
measure
ment rays
Nch Response speed of Circuit for
measurement rays
∆TTESTN
Fch Response speed of Circuit for
∆TTESTF
measurement rays
Rev.1.00, Sep.16.2003, page 6 of 15
*5
*6
—
—
26
µsec
*5
*6
M61006FP
*1
Rapid charge consuming current 1 and 2 are measured with the following conditions:
VCC
1
2
3
CONT
Rapid Charge
Consuming Current 1
•
•
Rapid Charge
Consuming Current 2
Rapid charge consuming current 1
= (Rapid charge current for integration capacitance AFOUT dielectric absorption) + (Usual consuming current)
Rapid charge consuming current 2
= (mainly Rapid charge current for hold capacitance CHN, CHF) + (Usual consuming current)
Shorten hold capacitance CHN, CHF pin, integration capacitance AFOUT pin and GND at measurement rapid charge
consuming current 1 and hold capacitance CHN, CHF pin and GND at measurement rapid charge consuming current 2
to leave rapid charge current on stationary. But in practical uses it runs as the follows:
•
•
*2
Rapid charge current for hold capacitance CHN, CHF:
Use in a constant current charge. The current remain consuming in IC after completing charge.
Rapid charge current for integration capacitance AFOUT dielectric absourption:
Transition current. It flows until completing charge.
Charging rate of distance measurement integration current and temperature integration current when the voltage
of AFOUT changes.
distance measurement current ( at AFOUT = 0.5V )
∆ IAFOUT1
=(1-
∆ IAFOUT2
=(1-
distance measurement current ( at AFOUT = VCC-0.3V )
distance measurement current ( at AFOUT = 0V )
distance measurement current ( at AFOUT = VCC-0.3V )
Rev.1.00, Sep.16.2003, page 7 of 15
/
(VCC-0.3V-0.5V) × 100%
/
(VCC-0.3V-0.5V) × 100%
M61006FP
*3
Set a current output from PHOTOCUPPLER to following input conditions, and input the varied resistance ratio. AF
slope, linearity is calculated with following equations by measuring AFOUT output voltage.
I1:I2 = 100 nA
Input condition1: IPSD (Stationary light current) = 0
I1:I2 = 50 nA
Input condition2: IPSD (Stationary light current) = 0
Input condition3: IPSD (Stationary light current) = 10 µΑ
I1:I2 = 100 nA
D (9:1)·····The AFOUT output voltage at input with I1:I2 = 9:1
D (6:4)·····The AFOUT output voltage at input with I1:I2 = 6:4
D (3:7)·····The AFOUT output voltage at input with I1:I2 = 3:7
AF slope: ∆AF = D (9:1) – D (3:7)
AF linearity: L (AF) = (D (9:1) - (6:4) ) / (D (6:4) - (3:7) )
PSD quite resistance: 120 kΩ
*4
*5
*6
*7
*8
Input current of one side channel without saturating stationary light remove circuit and I / V transform amplifier
circuit.
Confirm not to change the output data at measuring AF input condition (1 to 4), when you shorten intervals
between stationary ray hold and distance measurement integration beginning to MIN 26 µS.
The value in this item is less than “max” value at any cases.
Set AFOUT capacity, distance measurement integration time, and the number of integration under max
value, because the “max” value in this item indicates a maximum of IC dynamic range.
Establish optional system to be input current to IC less than standard value, because this item’s value indicates
maximum input current to IC.
Rev.1.00, Sep.16.2003, page 8 of 15
M61006FP
Interface Table
(Vcc = 3.0 V, Ta = 25°C)
AF – IC side
Limits
Pin name
Circuit diagram
CONT
CLALV
Parameter
Min
Typ
Max
Unit
”H” input voltage
—
—
—
–64
7.0
0.3
1.0
–44
V
”L” input voltage
1.1
0
—
–84
”H” input voltage
—
—
V
”L” input voltage
0
—
—
—
Vcc
–0.3
0.3
1.0
Integration
ON current
(Ratio10:0)
–13
–10
–7
”L” output voltage
—
—
0.3
V
IOL = 500 µA
”H” leak current
—
—
1.0
µA
VIN = 5.5 V
”L” input voltage
”H” input voltage
AFOUT
Integration
OFF current
CMOUT
Rev.1.00, Sep.16.2003, page 9 of 15
Test
conditions and
note
µA
µA
VH = 5.5 V
VF = 0 V
VF = 0.5 V
VF = 0.5 V
M61006FP
Controls
(1) VCC (Vcc1+Vcc2)
The power on reset circuit with a built in IC work by this pin turned on, and the whole IC including a part of
logic circuit is done reset. Also the workings of power on reset circuit complete by less than 100 µS from rise
edge of VCC1, 2 (VCC1, VCC2 greater than 2.2 V).
Vcc1
Vcc2
H
L
H
Power
on reset
L
undifinition
reset
reset cancel
max 100 µs
Note:
Regard as rising supply voltage in establishing the timing if uses of this IC is in connecting large capacitance
with supply pin.
(2) CLALV:
Do reset the whole IC including the clamp level set and the part of logic. This IC include D / A converter for 4
bits, and it is possible to establish clamp level to 15 points by clock input after cancel of reset (including none
clamp). And also, the whole IC including parts of logic is reset by 15th clump level setting pulse (at intervals of
16 click after this clamp)
Values of each bit current are
established as the right side.
The number of input clock and
clamp level are as follows.
Clock value Clamp level(Typ.)
0
None clamp
1
0.130 nA
2
0.260 nA
3
0.390 nA
4
0.520 nA
5
0.650 nA
6
0.780 nA
7
0.910 nA
8
1.040 nA
9
1.170 nA
10
1.300 nA
11
1.430 nA
bit
1
2
3
4
Set up current (Typ.)
0.130nA
0.260nA
0.520nA
1.040nA
Clock value
Clamp level(Typ.)
12
1.560 nA
13
1.690 nA
14
1.820 nA
15
None clamp,Logic reset
16
0.130 nA
17
0.260 nA
18
0.390 nA
19
0.520 nA
20
0.650 nA
Clamp level is established with fall edge of input clock. It repeats the same value after 15 clock.
Rev.1.00, Sep.16.2003, page 10 of 15
M61006FP
(3) CONT:
By the clock input of the this terminal after canceling the IC reset, it begin to control the whole IC as
following function without establishing clamp level. And it repeat to switch over stationary hold and distance
measurement integration current after 7th clock
a) ON / OFF of dielectric polarity countermeasure circuit integration capacitance
b) ON / OFF of CH rapid charge
c) ON / OFF of AFOUT pin reset
d) ON / OFF of temperature correct integration
e) ON / OFF of stationary light hold
f) ON / OFF of distance measurement integration
H
1
2
3
4
5
6
7
8
9
10
cont
L
H
reset
L
reset cancel
dielectric polarity
countermeasure circuit ON
temperature
correct integration
AFOUT pin reset
stationary light hold
distance measurement
integration
AFOUT pin reset
a. The dielectric polarty contermeasure of integlation capacitance:
The dielectric polarity contermeasure circuit of integration capacitance run between reset and rise edge of
first CONT pin.
b. CH rapid charge:
After reset cancel, CH capacitance is charged rapidy between the fall edge of first clock and second ones.
c. AFOUT pin reset:
After reset cannel, accumulated chage at capacitance added to AFOUT pin is removed
between the fall clock edges of 1 to 2 and 5 to 6.
d. Temperrature correct integlation:
After reset cannel, temperature correct integration is carried out betweeen the fall edge of 3rd clock and
4th clock. This voltage of temperature corrent integration mentioned above is maintained at AFOUT pin.
This voltage is currected temperature (including time charge correct of AFOUT pin added capacotance)
as compared with base voltage estabilished previously.
e. Stationaly light hold:
After 7th clock from reset cuncel (from 7th clock rise to 8th clock rise), stationary light hold is carried out over
and over.
f. Distance measurement integration:
After 7th clock from reset cancel (from 7th clock fall to 8th clock rise ), distance measurement integration is
carried out over and over.
Rev.1.00, Sep.16.2003, page 11 of 15
M61006FP
(4) AFOUT:
After reset cancel, the voltage is outputted at intervals of temperature correct integration and distance
measurement integration from about 0 V to above a D range of this pin. The output is carried out linearly by
integration current or integration time.
(5) CMOUT:
After the CONT pin input 7th clock fall from reset cancel, the signal current at PSDF side is distinguished from
the clamp level in terms of the values. The result is outputted at each discrimination as the follows.
And after the CONT pin input 7th clock fall, the discrimination is carried out with the beginning of distance
measurement start. After reset cancel, until CONT pin input 8th clock “H” is further outputted.
1
H
CONT
L
H
6
•
•
•
•
7
9
8
10
•
discriminating point
RESET
•
•
•
•
•
•
•
•
•
discriminating point
L
H
CMOUT
L
reset cancel
Notes:
PSDF side signal current
CMOUT output
Greater than clamp level
H
Less than clamp level
L
1. It is necessary to contact a control signal for IRED with the control signal mentioned above.
2. Connect NC terminals (4, 9, 12, 16 pin) to Vcc1 terminal or GND.
Rev.1.00, Sep.16.2003, page 12 of 15
•
M61006FP
Sequential Time Chart Example
Rev.1.00, Sep.16.2003, page 13 of 15
M61006FP
Mask Option
1) Control terminal variation
1
Full spec (typical)
C
O
N
T
C
L
A
L
V
A
F
O
U
T
C
M
O
U
T
6
8
1
7
This type uses CONT,CLALV,AFOUT ,CMOUT terminal
as I/F terminal to the microcomputer.
This is the typical type at M61006FP.
MICROCOMPUTER
2
Most simplified type
C
O
N
T
A
F
O
U
T
6
1
This type does not connect CLALV,CMOUT terminals to the
microcomputer.
When above mentioned terminals are not connected to the
microcomputer without changing mask,connect each
terminal to the ground. In this case,clamp level becomes 0
And Power on reset in IC is used as reset.
MICROCOMPUTER
3
Explanation of the terminal that can be simplified.
(a) CLALV
•
•
In the typical type,15 ways clamp levels can be set by the outside control,but
also the terminal can be simplified by mask option as follows.
•
•
•
(I) Clamp level fixation
•
•
•
•
•
(II) Clamp level 2 step changeover
0.125nA
0.25nA
(b) CMOUT
•
•
0.5nA
•
•
•
1.0nA
Selects 1 point from 15 steps of clamp level and fixes it.
•
•
•
•
•
Selects 2 points from clamp level and switches it by
changing CLALV terminal HIGH/LOW. However,as
selecting 2 points, there is a following constraint.
Fixes 3 parts of 4 switches corresponds to each bit in figure to
ON or OFF,controls another part by CLALV terminal .
When an infinity decision function shouldn't be necessary, it is possible that
a CMOUT terminal is removed.
Rev.1.00, Sep.16.2003, page 14 of 15
Rev.1.00, Sep.16.2003, page 15 of 15
G
e
Z1
E
HE
1
16
z
D
b
8
9
Detail G
y
JEDEC Code
−
x
M
Weight(g)
0.06
Detail F
A2
A
Lead Material
Alloy 42
L1
EIAJ Package Code
SSOP16-P-225-0.65
c
A1
F
L
A
A1
A2
b
c
D
E
e
HE
L
L1
z
Z1
x
y
Symbol
e1
b2
e1
I2
b2
Dimension in Millimeters
Min
Nom
Max
−
−
1.45
0
0.1
0.2
−
−
1.15
0.17
0.22
0.32
0.13
0.15
0.2
4.9
5.0
5.1
4.3
4.4
4.5
−
−
0.65
6.2
6.4
6.6
0.3
0.5
0.7
−
−
1.0
−
0.225
−
−
−
0.375
−
−
0.13
−
−
0.1
−
0°
10°
−
−
0.35
−
−
5.8
−
−
1.0
Recommended Mount Pad
e
Plastic 16pin 225mil SSOP
I2
16P2E-A
M61006FP
Package Dimensions
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501
Renesas Technology Europe Limited.
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom
Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900
Renesas Technology Europe GmbH
Dornacher Str. 3, D-85622 Feldkirchen, Germany
Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11
Renesas Technology Hong Kong Ltd.
7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2375-6836
Renesas Technology Taiwan Co., Ltd.
FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0