EE-SX1107/1108/1109/1131 Ultra-Compact Photomicrosensors with Surface-Mount Design Surface mount design, and tape and reel packaging facilitate automated PCB assembly ■ Compact size makes these sensors ideal for use in applications with restricted space ■ High-resolution sensing with phototransistor output ■ ■ Dual channel model that is ideal for encoder applications (EE-SX1131) Ordering Information Appearance Sensing method Slot width Slot depth Sensing object Weight Part number Transmissive 1 mm 2 mm Opaque 0.15 x 0.6 mm min. 0.05 g EE-SX1107 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1108 3 mm 3.5 mm Opaque 0.5 x 1.0 mm min. 0.1 g EE-SX1109 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1131 Dual channel transmissive EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Specifications ■ ABSOLUTE MAXIMUM RATING (TA=25°C) Item Emitter Detector Ambient temperature Symbol Rated value Forward current IF 25 mA (see note) Pulse forward current IFP 100 mA (duty: 1/100, pulse width: 0.1 ms) Reverse voltage VR 5V Collector-emitter voltage VCEO 20 V Emitter-collector voltage VECO 5V Collector current IC 20 mA Collector dissipation PC 75 mW (see note) Operating Topr -30° to 85°C Storage Tstg -40° to 90°C Soldering (manual) Tsol 300°C (3 second max.) Soldering (reflow) Tsol 240°C (10 second max) Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range. ■ CHARACTERISTICS (TA=25°C) Item Emitter Detector Combination Symbol Value Condition Forward voltage VF 1.1 V typ., 1.3 V max. IF = 5 mA Reverse current IR 10 µA max. VR = 5 V Peak emission wavelength λP(L) 940 nm typ. IF = 20 mA Dark current ID 100 nA max. VCE = 10 V, 0 lx Peak spectral sensitivity wavelength λP(P) 900 nm typ. — Light current (collector-current) IL 50 µA min., 150 µA typ., 500 µA max. IF = 5 mA, VCE = 5 V Collector-emitter saturation voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 µA Rising time tr tf 10 µs typ. (see note) VCC = 5 V, RL = 1KΩ 10 µs typ. (see note) IL = 100 µA Falling time Note: The following figures show the rising time (tr) and falling time (tf). Input Input IL VCC t 90% Output Output 10% RL tr 2 tf t EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Engineering Data Note: The operating conditions of the photomicrosensor must be within the absolute maximum rating ranges. ■ TEMPERATURE CHARACTERISTICS 100 80 60 40 20 0 -40 -20 0 20 40 60 80 50 Forward current IF (mA) 50 120 Forward current IF (mA) Collector dissipation PC (mW) 140 ■ INPUT CHARACTERISTICS (TYPICAL) 40 30 20 10 0 -40 100 -20 Ambient temperature Ta (°C) 0 20 40 60 80 40 Ta=25°C 30 20 10 0 1.0 100 1.1 Ambient temperature Ta (°C) 1.2 1.3 1.4 1.5 1.6 Forward voltage VF (V) ■ INPUT/OUTPUT CHARACTERISTICS (TYPICAL) EE-SX1108/1131 EE-SX1109 910 910 810 810 810 710 610 510 410 310 Ta=25°C 210 VCE=5 V 110 10 0 10 20 30 710 610 510 410 310 Ta=25°C 210 VCE=5 V 110 40 10 50 Light current IL (µA) 910 Light current IL (µA) Light current IL (µA) EE-SX1107 0 10 Forward current I F (mA) 20 30 40 710 610 510 410 310 Ta=25°C 210 VCE=5 V 110 10 50 0 20 10 Forward current I F (mA) 30 40 50 Forward current IF (mA) ■ OUTPUT CHARACTERISTICS (TYPICAL) EE-SX1107 EE-SX1108/1131 700 700 600 500 400 10 mA 300 5 mA 200 700 100 600 Ta=25°C 500 Light current IL (µA) Ta=25°C Light current IL (µA) Light current IL (µA) 600 0 EE-SX1109 10 mA 400 300 5 mA 200 2 4 6 8 10 12 0 14 0 Collector-emitter voltage VCE (V) 2 4 6 8 10 12 80 60 IF=5 mA VCE=10 V 100 10 1 V CE=2 V VCE=5 V 0 20 40 60 80 2 4 6 8 10 12 100 Input 0 t 90% 10% Output 0 10 tr Input IL RL 100 0.1 -40 14 1000 Response time tr, tf (µs) Dark current ID (nA) Llight current IL (%) 120 100 Ambient temperature Ta (°C) 0 ■ RESPONSE TIME CHARACTERISTICS (TYPICAL) 1000 -20 5 mA Collector-emitter voltage VCE (V) 140 0 -40 200 0 14 ■ DARK CURRENT TEMPERATURE DEPENDENCY(TYPICAL) 160 20 10 mA 300 Collector-emitter voltage VCE (V) ■ LIGHT CURRENT TEMPERATURE DEPENDENCY (TYPICAL) 40 400 100 100 0 Ta=25°C 500 -20 0 20 40 60 Ambient temperature Ta (°C) 80 100 1 1 10 Load resistance RL (KΩ) t tf VCC Output 100 3 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 ■ SENSING POSITION CHARACTERISTICS (TYPICAL) EE-SX1108/1109/1131 EE-SX1107 100 80 d 60 40 20 VCE=5 V IF=5 mA 0 -1.2 0 -0.6 0.6 120 100 d 80 60 40 VCE=5 V IF=5 mA 20 0 -0.6 1.2 Relative light current IL (%) 120 Relative light current IL (%) Relative light current IL (%) 120 -0.4 -0.2 Distance: d (mm) 0 0.2 0.4 100 80 d 60 40 VCE=5 V IF=5 mA 20 0 -1.2 0.6 -0.6 Distance: d (mm) 0 0.6 1.2 Distance: d (mm) ■ SENSING POSITION CHARACTERISTICS (TYPICAL) EE-SX1108 EE-SX1109 100 d 80 60 40 20 0 -0.6 VCE=5 V IF=5 mA -0.4 -0.2 0 0.2 0.4 0.6 120 100 Relative light current IL (%) 120 Relative light current IL (%) Relative light current IL (%) 120 EE-SX1131 d 80 60 40 IF=5 mA V CE=5 V 20 0 -0.6 -0.4 -0.2 Distance: d (mm) 0 0.2 0.4 0.6 100 80 d 60 40 IF=5 mA V CE=5 V 20 0 -0.6 -0.4 Distance: d (mm) -0.2 0 0.2 0.4 Distance: d (mm) Dimensions Unit: mm (inch) ■ EE-SX1107 C A 3.0 (0.12) White stripe E K 3.4 (0.13) A 0.15±0.05 (0.01) 1.0+0.2 0 (0.04) 1.2 (0.05) [0.5 (0.02)] 0.6 (0.02) 1.0 (0.04) Optical axis R 0.3 (0.01) 3.0 (0.12) 2.0 (0.08) 1.0 (0.04) [0.5 (0.02)] [0.5 (0.02)] A (Cross section AA view) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 4 1.6 (0.06) 1.2 (0.05) 0.6 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Recommended soldering pattern Pin assignment A C K E 1.2 (0.05) 0.4 (0.02) 1.2 (0.05) 1.8 (0.07) 1.8 (0.07) A Anode K Cathode C Collector E Emitter 1.8 (0.07) ■ EE-SX1108 A C 4.0 (0.16) White stripe E K 5.0 (0.20) 2.0+0.2 0 (0.08) 0.3±0.05 (0.01) [1.0 (0.04)] 1.5 (0.06) A 1.0 (0.04) 1.0 (0.04) 4.0 (0.16) Optical axis R 0.3 (0.01) 2.8 (0.11) E C 1.0 (0.04) [0.5 (0.02)] A [0.5 (0.02)] 2.2 (0.09) 1.6 (0.06) (Cross section AA view) Recommended soldering pattern Pin assignment A C K E 1.6 (0.06) 0.6 (0.02) 1.6 (0.06) 2.0 (0.08) 3.0 (0.12) A Anode K Cathode C Collector E Emitter 2.0 (0.08) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 5 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Unit: mm (inch) ■ EE-SX1109 A C 4.0 (0.16) White stripe K E 6.0 (0.24) 3.0+0.2 0 (0.12) 0.5±0.05 (0.02) A [1.5 (0.06)] 1.5 (0.06) 1.0 (0.04) 1.0 (0.04) Optical axis 5.0 (0.20) R 0.3 (0.01) 3.5 (0.14) 1.0 (0.04) A [0.5 (0.02)] 1.6 (0.06) [0.5 (0.02)] 2.2 (0.09) (Cross section AA view) Recommended soldering pattern Pin assignment A C K E 1.6 (0.06) 0.6 (0.02) 1.6 (0.06) 2.0 (0.08) 4.0 (0.16) 2.0 (0.08) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 6 A Anode K Cathode C Collector E Emitter EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 ■ EE-SX1131 A C 4.0 (0.16) White stripe NC E1 K E2 6.0 (0.24) 0.8±0.05 (0.03) 2.0+0.2 0 (0.08) [1.0 (0.04)] 0.3±0.05 (0.01) 1.5 (0.06) A 1.0 (0.04) 1.0 (0.04) 4.0 (0.16) Optical axis R 0.3 (0.01) 2.8 (0.11) 1.0 (0.04) 1.0 (0.04) A (Cross section AA view) [0.5 (0.02)] Recommended soldering pattern [0.5 (0.02)] 1.4 (0.06) 1.4 (0.06) Pin assignment 0.4 (0.02) C A 1.0 (0.04) E1 NC 1.0 (0.04) K E2 A 1.0 (0.04) 0.4 (0.02) 2.0 (0.08) 3.0 (0.12) 2.0 (0.08) NC Anode No connection K Cathode C Collector E1 Emitter 1 E2 Emitter 2 Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 7 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Unit: mm (inch) ■ TAPE AND REEL Reel dia. 21.0±0.8 (0.83) dia. 13.0±0.5 (0.51) 2.0±0.5 (0.08) dia. 80.0±1.0 (3.50) dia. 330.0±2.0 (13.00) Label 12.4+0.2 0 (0.49) 18.4 max. (0.73) Tape 4.0 (0.16) Figure 1 dia. 1.5 (0.06) m E 1.75 (0.07) 5.5 (0.22) K n C 12.0 (0.47) A Part number h l m n EE-SX1107 3.2 (0.13) 3.6 (0.14) 0.9 (0.04) 3.2 (0.13) EE-SX1108 4.2 (0.17) 5.2 (0.20) 0.25 (0.01) 4.2 (0.17) EE-SX1131 4.2 (0.17) 5.2 (0.20) 0.25 (0.01) 4.2 (0.17) Part number EE-SX1109 h 5.2 (0.20) l 6.2 (0.24) m 0.25 (0.01) 0.3 (0.01) l 8.0 (0.32) h 4.0 (0.16) Figure 2 dia. 1.5 (0.06) m C K E A 5.5 (0.22) n 12.0 (0.47) 0.3 (0.01) l 12.0 (0.47) h Tape configuration more than 40 mm (1.58) Empty more than 400 mm (15.76) Parts mounted Leading part Empty more than 40 mm (1.58) Quantity per reel Part number 8 1.75 (0.07) Pieces per reel EE-SX1107 2500 EE-SX1108/EE-SX1131 2000 EE-SX1109 1000 n 4.2 (0.17) EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Precautions ■ SOLDERING INFORMATION Reflow soldering • Reflow soldering must be done within 48 hours after opening the aluminum envelope. The component must be stored under 30°C at 80% RH. • The following soldering paste is recommended: Melting temperature: 178~192°C Composition: Sn 63%, Pb 37% • Recommended thickness of metal mask is between 0.2 mm and 0.25 mm for screen printing. • The following chart illustrates the maximum temperature limits for soldering: 10 sec. max. 250 Temperature (°C) 230°C max. 200 4°C/sec. max. 140~160°C 150 40 sec. max. 4°C/sec. max. 60~120 sec. 100 Time Manual soldering • "Sn 60" (60% tin and 40% lead) or solder with silver content is recommended. • Use a soldering iron of less than 25W. The temperature of the iron tip must be kept above 300°C (572°F). • Solder each land for a maximum of 3 seconds. OMRON ELECTRONICS LLC OMRON CANADA, INC. One East Commerce Drive Schaumburg, IL 60173 885 Milner Avenue Scarborough, Ontario M1B 5V8 1-800-55-OMRON 416-286-6465 Cat. No. E02DAD2 3/01 Specifications subject to change without notice. Printed in the U.S.A. 9