TI SN74GTL3004DCKR

SN74GTL3004
www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008
SELECTABLE GTL VOLTAGE REFERENCE
FEATURES
1
•
•
•
•
•
•
VDD Range: 3.0 V to 3.6 V
VTT Range: 1 V to 1.3 V
Provides Selectable GTL VREF
– 0.615 × VTT
– 0.63 × VTT
– 0.65 × VTT
– 0.67 × VTT
±1% Resistor Ratio Tolerance
Ambient Temperature Range: –40°C to 85°C
ESD Protection Exceeds the Following Levels
Tests (Tested Per JESD-22):
– 2500-V Human-Body Model
(A114-B, Class II)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
VDD
1
6
VTT
GND
2
5
GTL_REF
S0
3
4
S1
DESCRIPTION/ORDERING INFORMATION
The SN74GTL3004 provides for a selectable GTL Voltage Reference (GTL VREF). The value of the GTL VREF can
be adjusted using S0 and S1 select pins.
The S0 and S1 pins contain glitch-suppression circuitry for excellent noise immunity. When left floating, the S0
and S1 control input pins have 100-kΩ pullups that set the GTL VREF default value to the 0.67 × VTT ratio
(S0 = 1 and S1 =1).
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
SOT (SC70) – DCK
(1) (2)
Tape and reel
ORDERABLE PART NUMBER
SN74GTL3004DCKR
TOP-SIDE MARKING
2TK
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
SN74GTL3004
SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
LOGIC DIAGRAM
VTT
R1
N1
R2
N2
R3
GTL_REF
N3
R4
N4
VCC
R5
100 kΩ
100 kΩ
S0
Control
Logic
S1
FUNCTION TABLE
2
S1
S0
RATIO SET
0
0
0.615 × VTT
0
1
0.63 × VTT
1
0
0.65 × VTT
1
1
0.67 × VTT
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
SN74GTL3004
www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008
ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VDD
Power supply voltage range
–0.3
4.6
V
VTT
Termination voltage range (2)
–0.3
4.6
V
–0.3
VDD + 0.3
V
–0.3
VDD + 0.3
VIN
Control input voltage range
(2)
VGTL_REF Resistor output voltage range (2)
UNIT
V
IIK
Input clamp current
VIN < 0
–18
mA
IOK
Output clamp current
VO < 0
–18
mA
Continuous current through VDD or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
(1)
(2)
(3)
DCK package
–65
100
mA
259
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
PARAMETER
MIN
TYP
MAX
UNIT
VDD
Power supply voltage
3
3.3
3.6
V
VTT
Termination voltage
1
1.1
1.3
V
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI
Control input voltage
IOUT
IGTL_REF, GTL_REF output current
PW
Control input pulse width
110
TA
Operating free-air temperature
–40
(1)
VDD × 0.65
V
VDD × 0.35
0
0
V
VDD
V
10
µA
ns
°C
85
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow of Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Control
VDD = 3.6 V, IIN = –18 mA
IIN
Control
VDD = 3.6 V, VIN = GND
IDD
TYP
MAX
VDD = 3.6 V, VIN = GND, IO = 0 mA
R
End-to-end resistance
GTL VREF accuracy (1)
(1)
MIN
VDD = 3.6 V, VTT = 1.1 V, IO = 0 mA
4.25
7.12
UNIT
–1.8
V
43
µA
85
µA
10.6
kΩ
IO = 0 µA, See Figure 1
–1
1
IO = 10 µA, See Figure 1
–7
7
%
GTL VREF accuracy is used to compare measured GTL_VREF voltage versus expected GTL_VREF voltage as determined by control
inputs S0 and S1. The resistor ratio tolerance is incorporated into this parameter.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range,, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V
(unless otherwise noted)
PARAMETER
PSR
TEST CONDITIONS
Power supply rejection
MIN
TYP
MAX
–58
Pulse rejection
dB
40
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
UNIT
ns
3
SN74GTL3004
SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VTT
R1
N1
GTL_VREF accuracy is used to compare measured GTL_VREF
voltage versus expected GTL_VREF voltage as determined by
control inputs S0 and S1.
R2
N2
VREF
R3
S1
S0
Calculated VREF
0
0
0.615 X VTT
0
1
0.63 X VTT
1
0
0.65 X VTT
1
1
0.67 X VTT
N3
R4
N4
R5
% Accuracy = (((VREF measured/VREF calculated) – 1)/100)
S0
Logic
S1
Figure 1. GTL_REF Accuracy
4
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
PACKAGE OPTION ADDENDUM
www.ti.com
19-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74GTL3004DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74GTL3004DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74GTL3004DCKR
Package Package Pins
Type Drawing
SC70
DCK
6
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
3000
180.0
9.2
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
2.24
2.34
1.22
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74GTL3004DCKR
SC70
DCK
6
3000
205.0
200.0
33.0
Pack Materials-Page 2
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