TPA0211 2-W MONO AUDIO POWER AMPLIFIER SLOS275B – JANUARY 2000 – REVISED MARCH 2000 D D D D D D D D D Ideal for Wireless Communicators, Notebook PCs, PDAs, and Other Small Portable Audio Devices 2 W Into 4-Ω From 5-V Supply 0.6 W Into 4-Ω From 3-V Supply Wide Power Supply Compatibility 3 V to 5 V Low Supply Current – 4 mA Typical at 5 V – 4 mA Typical at 3 V Shutdown Control . . . 1 µA Typical Shutdown Pin is TTL Compatible –40°C to 85°C Operating Temperature Range Space-Saving, Thermally-Enhanced MSOP Packaging DGN PACKAGE (TOP VIEW) IN SHUTDOWN VDD BYPASS 1 8 2 7 3 6 4 5 VO– GND SE/BTL VO+ description The TPA0211 is a 2-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 4-Ω impedance. The device is ideal for use in small wireless communicators, notebook PCs, PDAs, anyplace a mono speaker and stereo head phones are required. From a 5-V supply, the TPA0211 can delivery 2-W of power into a 4-Ω speaker. The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor (AV = – RF/ RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL mode. Thus, the overall gain of the amplifier is 62.5 kΩ/ RI in SE mode and 125 kΩ/ RI in BTL mode. The input terminals are high-impedance CMOS inputs, and can be used as summing nodes. The TPA0211 is available in the 8-pin thermally-enhanced MSOP package (DGN) and operates over an ambient temperature range of –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TPA0211 2-W MONO AUDIO POWER AMPLIFIER SLOS275B – JANUARY 2000 – REVISED MARCH 2000 CB 4 BYPASS VDD 3 VDD GND 7 VDD BYPASS 50 kΩ 1.25*R Audio Input CI 100 kΩ RI 1 IN R – CC – VO+ + 5 + BYPASS 100 kΩ BYPASS 1 kΩ 50 kΩ Stereo/Mono Control SE/BTL 6 VO– 8 50 kΩ 1.25*R – R – + + BYPASS BYPASS From System Control 2 SHUTDOWN Shutdown and Depop Circuitry AVAILABLE OPTIONS TA PACKAGED DEVICES MSOP† (DGN) MSOP SYMBOLIZATION – 40°C to 85°C TPA0211DGN AEG † The DGN package are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA0211DGNR). 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPA0211 2-W MONO AUDIO POWER AMPLIFIER SLOS275B – JANUARY 2000 – REVISED MARCH 2000 Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF to 1-µF capacitor. BYPASS 4 GND 7 IN 1 I IN is the audio input terminal. SE/BTL 6 I When SE/BTL is held low, the TPA0211 is in BTL mode. When SE/BTL is held high, the TPA0211 is in SE mode. SHUTDOWN 2 I SHUTDOWN places the entire device in shutdown mode when held low. TTL compatible input. VDD VO+ 3 5 O VDD is the supply voltage terminal. VO+ is the positive output for BTL and SE modes. VO– 8 O VO– is the negative output in BTL mode and a high-impedance output in SE mode. GND is the ground connection. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§ Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (see Dissipation Rating Table) Operating free-air temperature range, TA (see Table 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C § Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C 2.14 W¶ DERATING FACTOR TA = 70°C 1.37 W TA = 85°C 1.11 W DGN 17.1 mW/°C ¶ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document. recommended operating conditions ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ Supply voltage, VDD High-level input voltage, VIH ST/MN VDD = 3 V VDD = 5 V SHUTDOWN Low-level input voltage, VIL ST/MN MIN MAX 2.5 5.5 UNIT V 2.7 V 4.5 2 VDD = 3 V VDD = 5 V 1.65 2.75 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ Á ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ SHUTDOWN 0.8 Operating free-air temperature, TA – 40 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 85 °C 3 TPA0211 2-W MONO AUDIO POWER AMPLIFIER SLOS275B – JANUARY 2000 – REVISED MARCH 2000 electrical characteristics at specified free-air temperature, VDD = 3 V, TA = 25°C (unless otherwise noted) ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ Á ÁÁ Á ÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ PARAMETER TEST CONDITIONS |VOO| Output offset voltage (measured differentially) IDD IDD(SD) Supply current Supply current, shutdown mode MIN TYP MAX UNIT 30 mV 4 6 mA 1 10 µA TYP MAX operating characteristics, VDD = 3 V, TA = 25°C, RL = 4 Ω PARAMETER PO Output power, power see Note 1 THD + N Total harmonic distortion plus noise BOM Maximum output power bandwidth TEST CONDITIONS THD = 1%, BTL mode THD = 0.1%, SE mode, PO = 500 mW, Gain = 2, f = 20 Hz to 20 kHz MIN 660 RL = 32 Ω UNIT mW 33 0.3% THD = 2% 20 kHz NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. electrical characteristics at specified free-air temperature, VDD = 5 V, TA = 25°C (unless otherwise noted) ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁ ÁÁ Á ÁÁÁ ÁÁ Á ÁÁÁ ÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ PARAMETER TEST CONDITIONS MIN TYP MAX UNIT |VOO| Output offset voltage (measured differentially) 30 mV IDD IDD(SD) Supply current 4 6 mA Supply current, shutdown mode 1 10 µA operating characteristics, VDD = 5 V, TA = 25°C, RL = 4 Ω PARAMETER TEST CONDITIONS THD = 1%, BTL mode PO Output power, power see Note 1 THD = 0.1%, SE mode, THD + N Total harmonic distortion plus noise PO = 1.5 W, f = 20 Hz to 20 kHz BOM Maximum output power bandwidth Gain = 2.5, THD = 2% MIN RL = 32 Ω NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP MAX UNIT 2 W 92 mW 0.2% 20 kHz TPA0211 2-W MONO AUDIO POWER AMPLIFIER SLOS275B – JANUARY 2000 – REVISED MARCH 2000 MECHANICAL DATA DGN (S-PDSO-G8) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,25 M 5 Thermal Pad (See Note D) 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073271/A 01/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions include mold flash or protrusions. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimension of the thermal pad is 1.40 mm (height as illustrated) × 1.80 (width as illustrated) mm (maximum). The pad is centered on the bottom of the package. E. Falls within JEDEC MO-187 PowerPAD is a trademark of Texas Instruments Incorporated. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated