MCNIX MX28F2000PQC-12C4

MX28F2000P
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
• 262,144 bytes by 8-bit organization
• Fast access time: 70/90/120 ns
• Low power consumption
– 50mA maximum active current
– 100uA maximum standby current
• Programming and erasing voltage 12V ± 5%
• Command register architecture
– Byte Programming (15us typical)
– Auto chip erase 5 seconds typical
(including preprogramming time)
– Block Erase
• Optimized high density blocked architecture
– Four 4-KB blocks (Top)
– Fourteen 16-KB blocks
– Four 4-KB blocks (Bottom)
• Auto Erase (chip & block) and Auto Program
– DATA polling
– Toggle bit
• 10,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1 to VCC+1V
• Advanced CMOS Flash memory technology
• Compatible with JEDEC-standard byte-wide 32-pin
EPROM pinouts
• Package type:
– 32-pin plastic DIP
– 32-pin PLCC
– 32-pin TSOP (Type 1)
GENERAL DESCRIPTION
The MX28F2000P is a 2-mega bit Flash memory organized as 256K bytes of 8 bits each. MXIC's Flash
memories offer the most cost-effective and reliable
read/write non-volatile random access memory. The
MX28F2000P is packaged in 32-pin PDIP, PLCC
and TSOP. It is designed to be reprogrammed and
erased in-system or in-standard EPROM programmers.
MXIC Flash technology reliably stores memory contents even after 10,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling.
The
MX28F2000P uses a 12.0V ± 5% VPP supply to
perform the Auto Program/Erase algorithms.
The standard MX28F2000P offers access times as
fast as 70 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate
bus contention, the MX28F2000P has separate chip
enable (CE) and output enable (OE ) controls.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and
programming. The MX28F2000P uses a command
register to manage this functionality, while
maintaining a standard 32-pin pinout. The
command register allows for 100% TTL level control
inputs and fixed power supply levels during erase
and programming, while maintaining maximum
EPROM compatibility.
P/N: PM0380
1
REV. 1.5, OCT 29, 1998
MX28F2000P
MX28F2000P Block Address and Block Structure
A17~A0
3FFFFH
3F000H
3EFFFH
3E000H
3DFFFH
3D000H
3CFFFH
3C000H
3BFFFH
38000H
37FFFH
34000H
33FFFH
30000H
2FFFFH
2C
2B
28
27
24
23
0
F
0
F
0
F
0
F
0
F
0
F
0H
FH
0H
FH
0H
FH
20000H
1FFFFH
1C000H
1BFFFH
1
1
1
1
8
7
4
3
0
F
0
F
0
F
0
F
0H
FH
0H
FH
10000H
0FFFFH
0C000H
0BFFFH
08000H
07FFFH
04000H
03FFFH
03000H
02FFFH
02000H
01FFFH
01000H
00FFFH
00000H
P/N: PM0380
4-K byte
4-K byte
4-K byte
4-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
16-K byte
4-K byte
4-K byte
4-K byte
4-K byte
2
REV. 1.5, OCT 29, 1998
MX28F2000P
PIN CONFIGURATIONS
32 PDIP
TSOP (TYPE 1)
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
VCC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
MX28F2000P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A11
A9
A8
A13
A14
A17
WE
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
MX28F2000P
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A11
A9
A8
A13
A14
A17
WE
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
A7
32
A17
1
WE
A16
4
VCC
5
A15
A12
32 PLCC
VPP
(NORMAL TYPE)
30
29
A14
A6
A13
A5
A8
A4
A3
A9
MX28F2000P
9
25
A11
A2
OE
A1
A10
A0
CE
21
20
Q5
Q4
Q3
VSS
Q2
17
Q7
Q6
13
14
Q1
Q0
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
MX28F2000P
(REVERSE TYPE)
PIN DESCRIPTION:
P/N: PM0380
3
SYMBOL
PIN NAME
A0~A17
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
WE
Write enable Pin
VPP
Program Supply Voltage
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV. 1.5, OCT 29, 1998
MX28F2000P
BLOCK DIAGRAM
CE
OE
CONTROL
INPUT
WE
LOGIC
LATCH
A0-A17
BUFFER
Y-DECODER
AND
HIGH VOLTAGE
X-DECODER
ADDRESS
PROGRAM/ERASE
MODE
LOGIC
STATE
REGISTER
MX28F2000P
FLASH
ARRAY
Y-PASS GATE
SENSE
AMPLIFIER
PGM
DATA
HV
ARRAY
SOURCE
HV
COMMAND
DATA
DECODER
COMMAND
DATA LATCH
PROGRAM
DATA LATCH
Q0-Q7
P/N: PM0380
I/O BUFFER
4
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC PROGRAMMING
AUTOMATIC ERASE ALGORITHM
The MX28F2000P is byte programmable using the
Automatic Programming algorithm. The Automatic
Programming algorithm does not require the system to
time out or verify the data programmed. The typical
room temperature chip programming time of the
MX28F2000P is less than 5 seconds.
MXIC's Automatic Erase algorithm requires the user to
only write an erase set-up command and erase command. The device will automatically pre-program and
verify the entire array. Then the device automatically
times the erase pulse width, provides the erase verify,
and counts the number of sequences. A status bit
similar to DATA polling and a status bit toggling
between consecutive read cycles, provide feedback to
the user as to the status of the erase operation.
AUTOMATIC CHIP ERASE
Commands are written to the command register using
standard microprocessor write timings. Register contents serve as inputs to an internal state-machine
which controls the erase and programming circuitry.
During write cycles, the command register internally
latches address and data needed for the programming
and erase operations. For system design simplification, the MX28F2000P is designed to support either
WE or CE controlled writes. During a system write
cycle, addresses are latched on the falling edge of WE
or CE whichever occurs last. Data is latched on the
rising edge of WE or CE whichever occur first. To
simplify the following discussion, the WE pin is used as
the write cycle control pin throughout the rest of this
text. All setup and hold times are with respect to the
WE signal.
The device may be erased using the Automatic Erase
algorithm. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase.
The timing and verification of electrical erase are
controlled internal to the device.
AUTOMATIC BLOCK ERASE
The MX28F2000P is block(s) erasable using MXIC's
Auto Block Erase algorithm. Block erase modes allow
blocks of the array to be erased in one erase cycle.
The Automatic Block Erase algorithm automatically
programs the specified block(s) prior to electrical
erase. The timing and verification of electrical erase
are controlled internal to the device.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX28F2000P electrically erases all bits simultaneously using Fowler-Nordheim tunneling. The bytes are programmed one byte at
a time using the EPROM programming mechanism of hot
electron injection.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm requires
the user to only write a program set-up command and
a program command (program data and address). The
device automatically times the programming pulse
width, provides the program verify, and counts the
number of sequences. A status bit similar to DATA
polling and a status bit toggling between consecutive
read cycles, provide feedback to the user as to the
status of the programming operation.
P/N: PM0380
5
REV. 1.5, OCT 29, 1998
MX28F2000P
TABLE 1. COMMAND DEFINITIONS
COMMAND
BUS
CYCLES
FIRST BUS CYCLE
SECOND BUS CYCLE
OPERATION
ADDRESS
DATA
OPERATION
ADDRESS
DATA
Read Memory
1
Write
X
00H
Read Identified codes
2
Write
X
90H
Read
IA
ID
Setup auto erase/
auto erase (chip)
2
Write
X
30H
Write
X
30H
Setup auto erase/
auto erase (block)
2
Write
X
20H
Write
EA
D0H
Setup auto program/
program
2
Write
X
40H
Write
PA
PD
Setup Erase/
Erase (chip)
2
Write
X
20H
Write
X
20H
Setup Erase/
Erase (block)
2
Write
X
60H
Write
EA
60H
Erase verify
2
Write
EVA
A0H
Read
X
EVD
Reset
2
Write
X
FFH
Write
X
FFH
Note:
IA
= Identifier address
EA = Block of memory location to be erased
PA = Address of memory location to be programmed
ID
= Data read from location IA during device identification
PD = Data to be programmed at location PA
EVA = Address of memory location to be read during
erase verify.
EVD = Data read from location EVA during erase
verify.
Auto modes have the build-in enchanced features.
Please use the auto erase mode whenever it is.
P/N: PM0380
6
REV. 1.5, OCT 29, 1998
MX28F2000P
COMMAND DEFINITIONS
When low voltage is applied to the VPP pin, the contents of the command register default to 00H, enabling
read-only operation.
Placing high voltage on the VPP pin enables read/write
operations. Device operations are selected by writing
specific data patterns into the command register. Table 1 defines these MX28F2000P register commands.
Table 2 defines the bus operations of MX28F2000P.
TABLE 2. MX28F2000P BUS OPERATIONS
OPERATION
READ-ONLY
READ/WRITE
VPP(1)
A0
A9
CE
OE
WE
DQ0-DQ7
Read
VPPL
A0
A9
VIL
VIL
VIH
Data Out
Output Disable
VPPL
X
X
VIL
VIH
VIH
Tri-State
Standby
VPPL
X
X
VIH
X
X
Tri-State
Read Silicon ID (Mfr)(2)
VPPL
VIL
VID(3)
VIL
VIL
VIH
Data = C2H
Read Silicon ID (Device)(2)
VPPL
VIH
VID(3)
VIL
VIL
VIH
Data = 2AH
Read
VPPH
A0
A9
VIL
VIL
VIH
Data Out(4)
Standby(5)
VPPH
X
X
VIH
X
X
Tri-State
Write
VPPH
A0
A9
VIL
VIH
VIL
Data In(6)
NOTES:
1. VPPL may be grounded, a no-connect with a resistor tied
to ground, or < VCC + 2.0V. VPPH is the programming
voltage specified for the device. When VPP = VPPL,
memory contents can be read but not written or erased.
2. Manufacturer and device codes may also be accessed
via a command register write sequence. Refer to Table
1. All other addresses don't care.
P/N: PM0380
3. VID is the Silicon-ID-Read high voltage.(11.5V to 13v)
4. Read operations with VPP = VPPH may access array
data or Silicon ID codes.
5. With VPP at high voltage, the standby current equals ICC
+ IPP (standby).
6. Refer to Table 1 for valid Data-In during a write operation.
7. X can be VIL or VIH.
7
REV. 1.5, OCT 29, 1998
MX28F2000P
contain an all-zero pattern, a self-timed chip erase and
verify begin. The erase and verify operations are
complete when the data on DQ7 is "1" at which time the
device returns to the Read mode. The system is not
required to provide any control or timing during these
operations.
READ COMMAND
While VPP is high, for erasure and programming,
memory contents can also be accessed via the read
command. The read operation is initiated by writing
00H into the command register. Microprocessor read
cycles retrieve array data. The device remains enabled for reads until the command register contents
are altered.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when
adequate erase margin has been achieved for the
memory array(no erase verify command is required).
The margin voltages are internally generated in the
same manner as when the standard erase verify
command is used.
The default contents of the register upon VPP powerup is 00H. This default value ensures that no spurious
alteration of memory contents occurs during the VPP
power transition. Where the VPP supply is hard-wired
to the MX28F2000P, the device powers up and
remains enabled for reads until the command register
contents are changed.
The Automatic set-up erase command is a commandonly operation that stages the device for automatic
electrical erasure of all bytes in the array. Automatic
set-up erase is performed by writing 30H to the
command register.
SILICON-ID-READ COMMAND
To command automatic chip erase, the command 30H
must be written again to the command register. The
automatic chip erase begins on the rising edge of the
WE and terminates when the data on DQ7 is "1" and
the data on DQ6 stops toggling for two consecutive
read cycles, at which time the device returns to the
Read mode.
Flash-memories are intended for use in applications
where the local CPU alters memory contents. As such,
manufacturer- and device-codes must be accessible
while the device resides in the target system. PROM
programmers typically access signature codes by raising A9 to a high voltage. However, multiplexing high
voltage onto address lines is not a desired systemdesign practice.
The MX28F2000P contains a Silicon-ID-Read operation to supplement traditional PROM-programming
methodology. The operation is initiated by writing 90H
into the command register. Following the command
write, a read cycle from address 0000H retrieves the
manufacturer code of C2H. A read cycle from address
0001H returns the device code of 2AH.
SET-UP AUTOMATIC BLOCK ERASE/ERASE
COMMANDS
The automatic block erase does not require the device
to be entirely pre-programmed prior to executing the
Automatic set-up block erase command and
Automatic block erase command. Upon executing the
Automatic block erase command, the device automatically will program and verify the block(s) memory for an
all-zero data pattern. The system is not required to
provide any controls or timing during these operations.
SET-UP AUTOMATIC CHIP ERASE/ERASE
COMMANDS
When the block(s) is automatically verified to contain
an all-zero pattern, a self-timed block erase and verify
begin. The erase and verify operations are complete
when the data on DQ7 is "1" and the data on DQ6 stops
toggling for two consecutive read cycles, at which time
the device returns to the Read mode. The system is
not required to provide any control or timing during
these operations.
The automatic chip erase does not require the device
to be entirely pre-programmed prior to excuting the
Automatic set-up erase command and Automatic chip
erase command. Upon executing the Automatic chip
erase command, the device automatically will program
and verify the entire memory for an all-zero data
pattern. When the device is automatically verified to
P/N: PM0380
8
REV. 1.5, OCT 29, 1998
MX28F2000P
When using the Automatic Block Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verify command is required). The margin
voltages are internally generated in the same manner
as when the standard erase verify command is used.
RESET COMMAND
A reset command is provided as a means to safely
abort the erase- or program-command sequences.
Following either set-up command (erase or program)
with two consecutive writes of FFH will safely abort the
operation. Memory contents will not be altered. Should
program-fail or erase-fail happen, two consecutive
writes of FFH will reset the device to abort the
operation. A valid command must then be written to
place the device in the desired state.
The Automatic set-up block erase command is a command only operation that stages the device for automatic electrical erasure of selected blocks in the array.
Automatic set-up block erase is performed by writing
20H to the command register.
To enter automatic block erase, the user must write
the command D0H to the command register. Block
addresses are loaded into internal register on the 2nd
falling edge of WE. Each successive block load cycles,
started by the falling edge of WE, must begin within
30us from the rising edge of the preceding WE.
Otherwise, the loading period ends and internal auto
block erase cycle starts. When the data on DQ7 is "1"
and the data on DQ6 stops toggling for two
consecutive read cycles, at which time auto erase
ends and the device returns to the Read mode.
WRITE OPERATON STATUS
TOGGLE BIT-DQ6
The MX28F2000P features a "Toggle Bit" as a method
to indicate to the host sytem that the Auto Program/
Erase algorithms are either in progress or completed.
While the Automatic Program or Erase algorithm is in
progress, successive attempts to read data from the
device will result in DQ6 toggling between one and
zero. Once the Automatic Program or Erase algorithm
is completed, DQ6 will stop toggling and valid data will
be read. The toggle bit is valid after the rising edge of
the second WE pulse of the two write pulse sequences.
Refer to page 2 for detailed block address.
SET-UP AUTOMATIC PROGRAM/PROGRAM
COMMANDS
The Automatic Set-up Program is a command-only
operation that stages the device for automatic programming. Automatic Set-up Program is performed by
writing 40H to the command register.
DATA POLLING-DQ7
The MX28F2000P also features Data Polling as a
method to indicate to the host system that the
Automatic Program or Erase algorithms are either in
progress or completed.
Once the Automatic Set-up Program operation is performed, the next WE pulse causes a transition to an
active programming operation. Addresses are
internally latched on the falling edge of the WE pulse.
Data is internally latched on the rising edge of the WE
pulse. The rising edge of WE also begins the
programming operation. The system is not required to
provide further controls or timings. The device will
automatically provide an adequate internally
generated program pulse and verify margin. The
automatic programming operation is completed when
the data read on DQ6 stops toggling for two
consecutive read cycles and the data on DQ7 and
DQ6 are equivalent to data written to these two bits, at
which time the device returns to the Read mode (no
program verify command is required).
P/N: PM0380
While the Automatic Programming algorithm is in operation, an attempt to read the device will produce the
complement data of the data last written to DQ7. Upon
completion of the Automatic Program algorithm an
attempt to read the device will produce the true data
last written to DQ7. The Data Polling feature is valid
after the rising edge of the second WE pulse of the two
write pulse sequences.
9
REV. 1.5, OCT 29, 1998
MX28F2000P
While the Automatic Erase algorithm is in operation,
DQ7 will read "0" until the erase operation is completed. Upon completion of the erase operation, the
data on DQ7 will read "1". The Data Polling feature is
valid after the rising edge of the second WE pulse of
two write pulse sequences.
The Data Polling feature is active during Automatic
Program/Erase algorithms.
POWER-UP SEQUENCE
The MX28F2000P powers up in the Read only mode.
In addition, the memory contents may only be altered
after successful completion of a two-step command
sequence. Power up sequence is not required.
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The
magnitude of these transient current peaks is
dependent on the output capacitance loading of the
device. At a minimum, a 0.1uF ceramic capacitor (high
frequency, low inherent inductance) should be used
on each device between VCC and GND, and between
VPP and GND to minimize transient effects. In
addition, to overcome the voltage drop caused by the
inductive effects of the printed circuit board traces on
FLASH memory arrays, a 4.7uF bulk electrolytic
capacitor should be used between VCC and GND for
each eight devices. The location of the capacitor
should be close to where the power supply is connected to the array.
P/N: PM0380
10
REV. 1.5, OCT 29, 1998
MX28F2000P
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and functional operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may
affect reliability.
NOTICE:
Specifications contained within the following tables are subject to change.
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
0oC to 70oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to 7.0V
VCC to Ground Potential
-0.5V to 7.0V
A9 & VPP
-0.5V to 13.5V
CAPACITANCE TA = 25oC, f = 1.0 MHz
SYMBOL
PARAMETER
CIN
COUT
MIN.
TYP
MAX.
UNIT
CONDITIONS
Input Capacitance
14
pF
VIN = 0V
Output Capacitance
16
pF
VOUT = 0V
READ OPERATION
DC CHARACTERISTICS TA = 0oC TO 70oC, VCC = 5V ± 10%, VPP = GND to VCC
SYMBOL
ILI
PARAMETER
Input Leakage Current
ILO
Output Leakage Current
IPP1
VPP Current
ISB1
Standby VCC current
MIN.
TYP
1
ISB2
ICC1
1
Operating VCC current
ICC2
MAX.
10
UNIT
uA
CONDITIONS
VIN = GND to VCC
10
uA
VOUT = GND to VCC
100
uA
VPP = 5.5V
1
mA
CE = VIH
100
uA
CE = VCC + 0.3V
30
mA
IOUT = 0mA, f=1MHz
50
mA
IOUT = 0mA, f=11MHz
VIL
Input Low Voltage
-0.3(NOTE 1)
0.8
V
VIH
Input High Voltage
2.4
VCC + 0.3
V
VOL
Output Low Voltage
0.45
V
IOL = 2.1mA
VOH
Output High Voltage
V
IOH = -400uA
2.4
NOTES:
1. VIL min. = -1.0V for pulse width < 50 ns.
VIL min. = -2.0V for pulse width < 20 ns.
2. VIH max. = VCC + 1.5V for pulse width < 20 ns
If VIH is over the specified maximum value, read operation
cannot be guaranteed.
P/N: PM0380
11
REV. 1.5, OCT 29, 1998
MX28F2000P
AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP = GND to VCC
28F2000P-70
SYMBOL
PARAMETER
tACC
MIN.
28F2000P-90 28F2000P-12
MAX. MIN.
MAX. MIN.
MAX.
UNIT CONDITIONS
Address to Output Delay
70
90
120
ns
CE=OE=VIL
tCE
CE to Output Delay
70
90
120
ns
OE=VIL
tOE
OE to Output Delay
40
40
50
ns
CE=VIL
tDF
OE High to Output Float (Note1)
0
30
ns
CE=VIL
tOH
Address to Output hold
0
ns
CE=OE=VIL
20
0
20
0
0
0
TEST CONDITIONS:
NOTE:
• Input pulse levels: 0.45V/2.4V
1. tDF is defined as the time at which the output achieves the
• Input rise and fall times: < 10ns
open circuit condition and data is no longer driven.
• Output load: 1 TTL gate + 100pF (Including scope and jig)
• Reference levels for measuring timing: 0.8V, 2.0V
READ TIMING WAVEFORMS
ADDRESS
WE
CE
ACTIVE MODE
STANDBY MODE
STANDBY MODE
tCE
OE
tDF
tOE
tACC
DATA OUT
P/N: PM0380
tOH
DATA OUT VALID
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REV. 1.5, OCT 29, 1998
MX28F2000P
COMMAND PROGRAMMING/DATA PROGRAMMING/ERASE OPERATION
DC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP = 12.0V ± 5%
SYMBOL
PARAMETER
ILI
MIN.
TYP
MAX.
UNIT
CONDITIONS
Input Leakage Current
10
uA
VIN=GND to VCC
ILO
Output Leakage Current
10
uA
VOUT=GND to VCC
ISB1
Standby VCC current
1
mA
CE=VIH
100
uA
CE=VCC ± 0.3V
30
mA
IOUT=0mA, f=1MHz
ICC2
50
mA
IOUT=0mA, F=11MHz
ICC3 (Program)
50
mA
In Programming
ICC4 (Erase)
50
mA
In Erase
ICC5 (Program Verify)
50
mA
In Program Verify
ICC6 (Erase Verify)
50
mA
In Erase Verify
100
uA
VPP=12.6V
IPP2 (Program)
50
mA
In Programming
IPP3 (Erase)
50
mA
In Erase
IPP4 (Program Verify)
50
mA
In Program Verify
IPP5 (Erase Verify)
50
mA
In Erase Verify
-0.3 (Note 5)
0.8
V
2.4
VCC+0.3V V
ISB2
ICC1 (Read)
IPP1 (Read)
VIL
1
Operating VCC Current
VPP Current
Input Voltage
VIH
(Note 6)
VOL
Output Voltage
VOH
0.45
2.4
V
IOL=2.1mA
V
IOH=-400uA
NOTES:
1. VCC must be applied before VPP and removed after VPP.
5. VIL min. = -0.6V for pulse width < 20ns.
2. VPP must not exceed 14V including overshoot.
6. If VIH is over the specified maximum value, programming
3. An influence may be had upon device reliability if the device
operation cannot be guranteed.
is installed or removed while VPP=12V.
7. All currents are in RMS unless otherwise noted.(Sampled, not
4. Do not alter VPP either VIL to 12V or 12V to VIL when
100% tested.)
CE=VIL.
P/N: PM0380
13
REV. 1.5, OCT 29, 1998
MX28F2000P
AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP =12V ± 5%
28F2000P-70
28F2000P-90
28F2000P-12
SYMBOL PARAMETER
MIN.
MIN.
MIN.
tVPS
VPP setup time
100
100
100
ns
tOES
OE setup time
100
100
100
ns
tCWC
Command programming cycle
70
90
120
ns
tCEP
WE programming pulse width
45
45
50
ns
tCEPH1
WE programming pluse width High
20
20
20
ns
tCEPH2
WE programming pluse width High
100
100
100
ns
tAS
Address setup time
0
0
0
ns
tAH
Address hold time
45
45
50
ns
tAH1
Address hold time for DATA POLLING
0
0
0
ns
tDS
Data setup time
45
45
50
ns
tDH
Data hold time
10
10
10
ns
tCESP
CE setup time before DATA polling/toggle bit
100
100
100
ns
tCES
CE setup time
0
0
0
ns
tCESC
CE setup time before command write
100
100
100
ns
tCESV
CE setup time before verify
6
6
6
us
tVPH
VPP hold time
100
100
100
ns
tDF
Output disable time (Note 3)
tDPA
DATA polling/toggle bit access time
70
tAETC
Total erase time in auto chip erase
5(TYP.)
5(TYP.)
5(TYP.)
s
tAETB
Total erase time in auto block erase
5(TYP.)
5(TYP.)
5(TYP.)
s
tAVT
Total programming time in auto verify
15
300
15
300
15
300
us
tBALC
Block address load cycle
0.3
30
0.3
30
0.3
30
us
tBAL
Block address load time
100
100
100
us
tCH
CE Hold Time
0
0
0
ns
tCS
CE setup to WE going low
0
0
0
ns
MAX.
20
MAX.
MAX.
UNIT CONTIONS
20
30
ns
90
120
ns
NOTES:
1. CE and OE must be fixed high during VPP transition from 5V
to 12V or from 12V to 5V.
2. Refer to read operation when VPP=VCC about read operation while VPP 12V.
3. tDF defined as the time at which the output achieves the open
circuit condition and data is no longer driven.
P/N: PM0380
14
REV. 1.5, OCT 29, 1998
MX28F2000P
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance
SWITCHING TEST WAVEFORMS
2.4 V
2.0V
2.0V
TEST POINTS
0.8V
0.8V
0.45 V
OUTPUT
INPUT
AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0".
Input pulse rise and fall times are <20ns.
P/N: PM0380
15
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC PROGRAMMING TIMING WAVEFORM
One byte data is programmed. Verify in fast algorithm
and additional programming by external control are not
required because these operations are excuted automatically by internal control circuit. Programming
completion can be verified by DATA polling and toggle bit
checking after automatic verify starts. Device outputs
DATA during programming and DATA after programming
on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle bit, DATA
polling, timing waveform) are in high impedance.
Setup auto program/
Auto program & DATA polling
program command
Vcc 5V
12V
Vpp
0V
tVPH
tVPS
Address
valid
A0 ~ A17
tAS
WE
tAH1
tAVT
tCWC
CE
tOES
tCEP
tCEPH1 tCEP
tCESC
tCESP tCES
OE
tDS
tDH
tDS
tDH
Q7
Command in
Data in
Q0~Q5
Command in
Data in
tDF
tDPA
DATA
DATA polling
DATA
DATA
Command #40H
P/N: PM0380
16
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Apply VppH
Write Set up auto program Command (40H)
Write Auto program Command(A/D)
Toggle Bit Checking
DQ6 not Toggled
NO
YES
NO
Verify Byte Ok
YES
NO
Reset
Last Byte
YES
Auto Program Completed
P/N: PM0380
17
Auto Program Failed
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verify is not
required because data is erased automatically by internal
control circuit. Erasure completion can be verified by
DATA polling and toggle bit checking after automatic
erase starts. Device outputs 0 during erasure and 1 after
erasure on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle
bit, DATA polling, timing waveform) are in high impedance.
Setup auto chip erase/
erase command
Auto chip erase & DATA polling
Vcc 5V
12V
tVPH
Vpp
0V
tVPS
A0 ~ A17
WE
tAETC
tCWC
CE
tOES
tCEP
tCEPH1 tCEP
tCESP tCES
tCESC
OE
tDS
tDH
tDH
Q7
Command in
Command in
Q0~Q5
Command in
Command in
Command #30H
P/N: PM0380
tDS
tDPA
tDF
DATA polling
Command #30H
18
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Apply VppH
Write Set up auto chip Erase Command (30H)
Write Auto chip Erase Command(30H)
Toggle Bit Checking
DQ6 not Toggled
No
YES
DATA Polling
DQ7 = 1
No
Reset
YES
Auto Chip Erase Completed
P/N: PM0380
Auto Chip Erase Failed
19
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC BLOCK ERASE TIMING WAVEFORM
Block data indicated by A12 to A17 are erased. External
erase verify is not required because data are erased
automatically by internal control circuit. Erasure completion can be verified by DATA polling and toggle bit
checking after automatic erase starts. Device outputs 0
during erasure and 1 after erasure on Q7. Q0 to Q5 (Q6
is for toggle bit; see toggle bit, DATA polling, timing
waveform) are in high impedance.
Auto block erase & DATA polling
Setup auto block erase/erase command
Vcc 5V
12V
Vpp
0V
tVPH
tVPS
A0 ~ A11
Block
address 0
A12 ~ A17
Block
address 1
Block
address #
tAH1
tCH
CE
tCS
tAS
tCWC
WE
tOES
tAH
tBALC
tBAL
tAETB
tCESC
tCEPH1
tCEP
tCEP tCEPH2
OE
tDS
tDH
tDS
tDH
Q7
Command in
Command in
Q0~Q5
Command in
Command in
tDPA
tDF
DATA polling
Command #20H Command #D0H
*Refer to page 2 for detailed block address.
P/N: PM0380
20
REV. 1.5, OCT 29, 1998
MX28F2000P
AUTOMATIC BLOCK ERASE ALGORITHM FLOWCHART
START
Apply VppH
Write Set up auto block Erase Command (20H)
Write Auto block Erase Command(D0H)
to Load Block Address
Load Block Address
Last Block
to Erase
NO
YES
Wait 200 us
NO
Toggle Bit Checking
DQ6 not Toggled
YES
NO
DATA Polling
DQ7 = 1
Reset
YES
Auto Block Erase Completed
Auto Block Erase Failed
P/N: PM0380
21
REV. 1.5, OCT 29, 1998
MX28F2000P
COMPATIBLE CHIP ERASE TIMING WAVEFORM
All data in chip are erased. Control verification and
additional erasure externally according tocompatible chip
erase flowchart.
Setup chip erase/
Chip erase
erase command
Erase Verify
Vcc 5V
12V
Vpp
0V
tVPH
tVPS
Verify
Address
A0 ~ A17
tAS tAH
WE
tCESV
tET
tCWC
CE
tOES
tCEP
tCEP tCEPH1 tCEP
tCESC
tCES
OE
tDS
tDH
tDS
tDH
tDS
tVA
tDF
Q7
Command in
Command in
Command in
Data valid
Q0~Q6
Command in
Command in
Command in
Data valid
Command #20H Command #20H
P/N: PM0380
tDH
Command #A0H
22
REV. 1.5, OCT 29, 1998
MX28F2000P
COMPATIBLE BLOCK ERASE
page2) without any voltage stress to the device nor
deterioration in reliability of data.
This device can be applied to the compatible block erase
algorithm shown in the following flowchart. This algorithm
allows to obtain faster erase time by the block (refer to
COMPATIBLE BLOCK ERASE FLOWCHART
START
For selected block(s),
All bits PGM"0"
N=0
BLOCK ERASE FLOW
N = N+1
FAIL
NO
N = 1024?
ERSVFY FLOW
YES
ALL BITS VERIFIED
BLOCK ERASE FAIL
APPLY
VPP = VCC
END
BLOCK ERASE
COMPLETE
BLOCK ERASE FLOW
START
Apply
VPP = VPPH
WRITE SETUP BLOCK ERASE COMMAND
( 60H )
WRITE BLOCK ERASE COMMAND
( LOAD FIRST SECTOR ADDRESS , 60H )
LOAD OTHER SECTORS' ADDRESS
IF NECESSARY
( LOAD OTHER SECTOR ADDRESS )
WAIT
10 ms
END
P/N: PM0380
23
REV. 1.5, OCT 29, 1998
MX28F2000P
ERASE VERIFY FLOW
START
APPLY
VPP = VPPH
ADDRESS =
FIRST ADDRESS OF ERASED BLOCKS
OR LAST VERIFY FAILED ADDRESS
WRITE ERASE VERIFY COMMAND
( A0H )
WAIT 6 us
ERSVFY
FFH ?
INCREMENT ADDRESS
NO
YES
NO
LAST ADDRESS ?
YES
ERASE VERIFY
COMPLETE
P/N: PM0380
24
GO TO ERASE FLOW
AGAIN OR ABORT
REV. 1.5, OCT 29, 1998
MX28F2000P
COMPATIBLE BLOCK ERASE TIMING WAVEFORM
Indicated block data are erased. Control verification and
additional erasure externally according to compatible
block erase flowchart.
Block erase
Setup block erase/erase command
Erase Verify
Vcc 5V
12V
Vpp
0V
tVPH
tVPS
Verify
address
A0 ~ A13
Block
address 0
A14 ~ A17
Block
address 1
Verify
address
Block
address #
tAS tAH
tAS tAH
WE
tCWC
tBALC
tBAL
tCESV
tET
CE
tOES tCEP
tCEPH1
tCEP tCEPH2
tCESC
tCEP
tCES
OE
tDS tDH
tDS
tDH
Q7
Command in
Command in
Command in
Data valid
Q0~Q6
Command in
Command in
Command in
Data valid
tDS
Command #60H Command #60H
P/N: PM0380
tDH
tVA
tDF
Command #A0H
25
REV. 1.5, OCT 29, 1998
MX28F2000P
VPP HIGH READ TIMING WAVEFORM
Vcc 5V
12V
Vpp
0V
tVPS
tVPH
A0 - A17
Address valid
tCWC
WE
tACC
tCESC
CE
tOES
tOES
tCEPH1
tCEP
tCE
OE
tDF
tDH
tDS
Q0-Q7
tOE
tOH
Data out valid
Command in
00H
VPP LOW ID CODE READ TIMING WAVEFORM
VID
VIH
A9
VIL
A0
A1 - A8
A10-A17
tACC
WE
tACC
VIH
CE
tCE
OE
tDF
tOE
Q0 - Q7
tOH
tOH
Manufacturer code
Device code
C2H
P/N: PM0380
2AH
26
REV. 1.5, OCT 29, 1998
MX28F2000P
VPP HIGH ID CODE READ TIMING WAVEFORM
Vcc 5V
12V
Vpp
0V
tVPS
tVPH
A0
Address Valid 0 or 1
A1 - A16
tCWC
WE
tACC
tCESC
CE
tOES
tOES
tCEP
tCEPH2
tCE
OE
tDF
tDH
tDS
Q0-Q7
tOE
tOH
Command in
Data out valid
90H
C2H or 2AH
RESET TIMING WAVEFORM
Vcc 5V
12V
Vpp
0V
tVPS
A0 - A17
tCWC
WE
CE
tOES
tCEP
tCEPH1
tCEP
OE
tDS
tDH
Command in
tDS
tDH
Command in
Q0-Q7
FFH
P/N: PM0380
FFH
27
REV. 1.5, OCT 29, 1998
MX28F2000P
TOGGLE BIT, DATA POLLING TIMING WAVEFORM
Toggle bit appears in Q6, when program/erase is
opperating. DATA polling appears in Q7 during programming or erase.
HIGH
WE
Vpp 12V
CE
OE
Q6
DURING P/E
HIGH-Z
Q7
DURING P
HIGH-Z
Q7
DURING E
HIGH-Z
TOGGLE BIT
DATA
DATA POLLING
Q0~Q5
P/N: PM0380
DATA
DATA
DATA
DATA
PROGRAM/ERASE COMPLETE
DATA POLLING
HIGH-Z
DATA
28
REV. 1.5, OCT 29, 1998
MX28F2000P
ORDERING INFORMATION PLASTIC PACKAGE
PART NO.
ACCESS TIME
OPERATING
STANDBY
PACKAGE
ERASE/PROGRAM
CURRENT
CURRENT
CYCLE
(ns)
MAX.(mA)
MAX.(uA)
MIN.(time)
MX28F2000PPC-70C4
70
50
100
32 Pin DIP
10,000
MX28F2000PPC-90C4
90
50
100
32 Pin DIP
10,000
MX28F2000PPC-12C4
120
50
100
32 Pin DIP
10,000
MX28F2000PQC-70C4
70
50
100
32 Pin PLCC
10,000
MX28F2000PQC-90C4
90
50
100
32 Pin PLCC
10,000
MX28F2000PQC-12C4
120
50
100
32 Pin PLCC
10,000
MX28F2000PTC-70C4
70
50
100
32 Pin TSOP
10,000
(Normal Type)
MX28F2000PTC-90C4
90
50
100
32 Pin TSOP
10,000
(Normal Type)
MX28F2000PTC-12C4
120
50
100
32 Pin TSOP
10,000
(Normal Type)
MX28F2000PRC-70C4
70
50
100
32 Pin TSOP
10,000
(Reverse Type)
MX28F2000PRC-90C4
90
50
100
32 Pin TSOP
10,000
(Reverse Type)
MX28F2000PRC-12C4
120
50
100
32 Pin TSOP
10,000
(Reverse Type)
P/N: PM0380
29
REV. 1.5, OCT 29, 1998
MX28F2000P
PACKAGE INFORMATION
32-PIN PLASTIC DIP
ITEM
MILLIMETERS
INCHES
A
42.13 max.
1.660 max.
B
1.90 [REF]
.075 [REF]
C
2.54 [TP]
.100 [TP]
D
.46 [Typ.]
.050 [Typ.]
E
38.07
1.500
F
1.27 [Typ.]
.050 [Typ.]
G
3.30 ± .25
.130 ± .010
H
.51 [REF]
.020 [REF]
I
3.94 ± .25
1.55 ± .010
J
5.33 max.
.210 max.
K
15.22 ± .25
.600 ± .101
L
13.97 ± .25
.550 ± .010
M
.25 [Typ.]
.010 [Typ.]
32
17
1
16
A
K
L
F
D
NOTE: Each lead certerline is located within
.25mm[.01 inch] of its true position [TP] at a
maximum at maximum material condition.
C
I
J
H
G
M
B
0~15¡
E
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
A
ITEM
MILLIMETERS
INCHES
A
12.44 ± .13
.490 ± .005
B
11.50 ± .13
.453 ± .005
C
14.04 ± .13
.553 ± .005
D
14.98 ± .13
.590 ± .005
E
1.93
.076
F
3.30 ± .25
.130 ± .010
G
2.03 ± .13
.080 ± .005
H
.51 ± .13
.020 ± .005
I
1.27 [Typ.]
.050 [Typ.]
J
.71 [REF]
.028 [REF]
K
.46 [REF]
.018 [REF]
L
10.40/12.94
.410/.510
(W)
(W) (L)
(L)
M
.89R
.035R
N
.25[Typ.]
.010[Typ.]
B
1
4
32
30
5
29
9
25
13
C
D
21
14
20
17
E
F
G
NOTE: Each lead certerline is located within
.25mm[.01 inch] of its true position [TP] at a
maximum at maximum material condition.
N
H
M
I
J
K
L
P/N: PM0380
30
REV. 1.5, OCT 29, 1998
MX28F2000P
32-PIN PLASTIC TSOP
ITEM
MILLIMETERS
INCHES
A
20.0 ± .20
.078 ± .006
A
B
18.40 ± .10
.724 ± .004
B
C
8.20 max.
.323 max.
D
0.15 [Typ.]
.006 [Typ.]
E
.80 [Typ.]
.031 [Typ.]
F
.20 ± .10
.008 ± .004
G
.30 ± .10
.012 ± .004
H
.50 [Typ.]
.020 [Typ.]
I
.45 max.
.018 max.
J
0 ~ .20
0 ~ .008
K
1.00 ± .10
.039 ± .004
L
1.27 max.
.050 max.
M
.50
.020
N
0 ~5°
.500
C
O
N
M
K
L
D
E
F
G
H
I
J
NOTE: Each lead certerline is located within
.25mm[.01 inch] of its true position [TP] at a
maximum at maximum material condition.
P/N: PM0380
31
REV. 1.5, OCT 29, 1998
MX28F2000P
Note. Revision History
Revision #
1.3
1.4
1.5
P/N: PM0380
Description
Command description of dummy mode a added, TSOP pin configuration
diagram rotated 180°, the flow chart of block erase corrected, fast acces time
150ns removed.
The speed performanes is featured up to 70ns as the new update of fast
access time
To corret typing error
32
Page
Date
P1,14,29
Sep/18/98
P12,14,16, OCT/29/98
27,29
REV. 1.5, OCT 29, 1998
MX28F2000P
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888
FAX:+886-3-578-8887
EUROPE OFFICE:
TEL:+32-2-456-8020
FAX:+32-2-456-8021
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TEL:+81-44-246-9100
FAX:+81-44-246-9105
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TEL:+65-747-2309
FAX:+65-748-4090
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TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
33