NEC UPC358G2

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC358
LOW POWER DUAL OPERATIONAL AMPLIFIERS
DESCRIPTION
FEATURES
The µPC358 is a dual operational amplifier which is
• Internally frequency compensation
designed to operate from a single power supply over a
• Wide output voltage swing V– to V+ –1.5 V
wide range of voltages. Operation from split power
• Common mode input voltage range includes V–
supplies is also possible and the power supply current
• Wide supply voltage range
drain is very low. Further advantage, the input common-
3 V to 30 V (Single)
mode voltage range includes ground in the linear mode.
±1.5 V to ±15 V (Split)
• Output short circuit protection
EQUIVALENT CIRCUIT (1/2 Circuit)
6 µA
PIN CONFIGURATION (Marking Side)
OUT1
Q5
Q2
II
Q4
CC
Q11
Q10
V+
7
OUT2
– +
II1
Q7
2
2
+ –
OUT
IN
8
1
RSC
Q8
1
Q6
Q3
Q1
µ PC358C, 358G2
V+
100 µ A
6 µA
Q13
IN1
3
6
II2
V–
4
5
IN2
Q12
50 µ A
Q9
µ PC358HA
V–
6
7
8
9
+
II1
5
V
4
II2
3
OUT2
2
IN1
V–
IN2
V
+
1
2
+ –
OUT1
1
– +
ORDERING INFORMATION
Part Number
Package
µPC358C
8-pin plastic DIP (300 mil)
µPC358G2
8-pin plastic SOP (225 mil)
µPC358HA
9-pin slim SIP
The information in this document is subject to change without notice.
Document No. G11765EJ4V0DS00 (4th edition)
(Previous No. IC-1284)
Date Published May 1997 N
Printed in Japan
The mark
shows major revised points.
©
1997
µPC358
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Voltage between
V+
and
Symbol
V–
V+
Note 1
–0.3 to +32
V
±32
V
VI
V––0.3 to V–+32
V
Note 3
VO
V––0.3
V
C Package
Note 4
PT
G2 Package
HA Package
Input Voltage
Note 2
Output Voltage
Power Dissipation
Unit
VID
Differential Input Voltage
Output Short Circuit Duration
–
Ratings
V–
to
V++0.3
350
mW
Note 5
440
mW
Note 4
350
mW
Note 6
Indefinite
s
Operating Ambient Temperature
TA
–20 to +80
°C
Storage Temperature
Tstg
–55 to +125
°C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction independent of the magnitude
of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation
will establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage which should be allowed to supply to the output terminal from external
without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.
4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C.
5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and
Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Split)
Supply Voltage
(V–
= GND)
Symbol
MIN.
V±
V+
TYP.
MAX.
Unit
±1.5
±15
V
+3
+30
V
ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = +5 V, V– = GND)
Parameter
Symbol
MIN.
MAX.
Unit
VIO
±2
±7
mV
Input Offset Current
IIO
±5
±50
nA
IB
45
250
nA
Note 7
Large Signal Voltage Gain
Supply Current
RS = 0 Ω
TYP.
Input Offset Voltage
Input Bias Current
AV
RL ≥ 2 kΩ
ICC
RL = ∞, IO = 0 A, Both Amplifiers
25
100
0.7
Common Mode Rejection Ratio
CMR
65
70
Supply Voltage Rejection Ratio
SVR
65
100
Output Voltage Swing
Common Mode Input Voltage Range
Output Current (SOURCE)
Output Current (SINK)
Channel Separation
Note 7.
2
Conditions
VO
RL = 2 kΩ (Connect to GND)
VICM
IO SOURCE
IO SINK
VIN+
= +1 V,
VIN–
V/mA
1.2
mA
dB
dB
0
V+
–1.5
V
0
V+
–1.5
V
=0V
20
40
mA
VIN– = +1 V, VIN+ = 0 V
10
20
mA
VIN– = +1 V, VIN+ = 0 V,
VO = 200 mV
12
50
µA
120
dB
f = 1 kHz to 20 kHz
Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input
stage.
µPC358
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.)
SUPPLY CURRENT
POWER DISSIPATION
4
500
µ PC358G2
ICC - Supply Current - mA
PT - Total Power Dissipation - mW
600
400
300
µPC358C, 358HA
200
100
V+
A ICC
3
–
+
2
1
TA = 0 to 70 °C
TA = –20 °C
0
0
20
40
60
80
100
TA - Operating Ambient Temperature - °C
10
20
30
40
V+ - Supply Voltage - V (V– = GND)
INPUT OFFSET VOLTAGE
INPUT OFFSET VOLTAGE
3
5
+
V =5V
2
TA = 25 ˚C
1
0
0
VIO - Input Offset Voltage - mV
VIO - Input Offset Voltage - mV
4
3
2
1
0
–1
–2
–3
–4
–50
0
50
100
TA - Operating Ambient Temperature - ˚C
10
20
30
40
–
V - Supply Voltage - V (V = GND)
+
INPUT BIAS CURRENT
INPUT BIAS CURRENT
100
75
50
T A = 25 °C
25
0
10
20
30
40
V+ - Supply Voltage - V (V– = GND)
IB - Input Bias Current - nA
IB - Input Bias Current - nA
100
80
V+ = +15 V
V– = GND
60
40
20
0
–50
0
50
100
TA - Operating Ambient Temperature - ˚C
3
µPC358
OPEN LOOP FREQUENCY RESPONSE
140
10 MΩ
–
+
60
Aυ - Open Loop Voltage Gain - dB
IO SHORT - Output Short Circuit Current - mA
OUTPUT SHORT CIRCUIT CURRENT
70
IO SHORT
50
40
30
–20
0
20
60
40
TA - Ambient Temperature - ˚C
120
+
60
V+ = 30 V
40
V+ = 10 to 15 V
20
1
VO - Output Voltage Swing -Vp-p
AV - Open Loop Voltage Gain - dB
20
RL = 20 kΩ
120
RL = 2 kΩ
80
40
15
VIN
+7 V
+
VO
2 kΩ
5
3 5 10 k 30 50 100 k 300 500 1 M
f - Frequency - Hz
VOLTAGE FOLLOWER
PULSE RESPONSE
COMMON MODE REJECTION RATIO
120
VIN VO Input Voltage - V Output Voltage - V
4
100
80
60
40
20
0
100
+15 V
–
10
0
1k
10
20
30
40
V - Supply Voltage - V (V– = GND)
100 kΩ
1 kΩ
+
CMR - Common Mode Rejection Ratio - dB
10 100 1 k 10 k 100 k 1 M 10 M
f - Frequency - Hz
LARGE SIGNAL
FREQUENCY RESPONSE
160
0
VO
–
V+/2
80
OPEN LOOP VOLTAGE GAIN
4
V+
VIN
100
0
80
0.1 µF
1k
10 k
100 k
f - Frequency - Hz
1M
RL ≥ 2 kΩ
+
V = 15 V
3
2
1
0
3
2
1
0
20
40
t - Time - µs
60
80
µPC358
SLEW RATE
SR–
0.3
SR - Slew Rate - V/µ s
SR+
0.2
0.1
V± = ±15 V
VO = ±10 V
0
0
50
100
–50
TA - Operating Ambient Temperature - ˚C
OUTPUT SINK CURRENT LIMIT
100
VO - Output Voltage - V
50
30
20
10
5
3
2
1
0.5
0.3
0.2
V+
V+/2
0.1
0.05
0.03
0.02
0.01
0.01
–
+
0.03 0.05
0.1
0.3 0.5
1
2
3
5
V+ = +15 V
IO SINK
VO
10
20 30
50
100
10
20 30
50
100
IO SINK - Output Sink Current - mA
OUTPUT SOURCE CURRENT LIMIT
5
V+ = +15 V
∆VO - Output Voltage to V+ - V
V+
4
V+/2
3
∆VO
+
–
IO SOURCE
2
1
0
0.01
0.03 0.05
0.1
0.3 0.5
1
2
3
5
IO SOURSE - Output Source Current - mA
5
µPC358
PACKAGE DRAWINGS
8 PIN PLASTIC DIP (300 mil)
8
5
1
4
A
K
I
L
P
J
C
H
G
B
M
R
F
D
N
M
NOTES
1) Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.
2) ltem "K" to center of leads when formed parallel.
ITEM
MILLIMETERS
INCHES
A
B
10.16 MAX.
1.27 MAX.
0.400 MAX.
0.050 MAX.
C
2.54 (T.P.)
0.100 (T.P.)
D
0.50±0.10
0.020 +0.004
–0.005
F
1.4 MIN.
0.055 MIN.
G
H
3.2±0.3
0.51 MIN.
0.126±0.012
0.020 MIN.
I
J
4.31 MAX.
5.08 MAX.
0.170 MAX.
0.200 MAX.
K
7.62 (T.P.)
0.300 (T.P.)
L
6.4
0.252
M
0.25 +0.10
–0.05
0.010 +0.004
–0.003
N
0.25
0.01
P
0.9 MIN.
0.035 MIN.
R
0~15°
0~15°
P8C-100-300B,C-1
6
µPC358
8 PIN PLASTIC SOP (225 mil)
8
5
P
detail of lead end
4
1
A
H
J
E
K
F
G
I
B
L
N
C
D
M
M
NOTE
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
INCHES
A
5.37 MAX.
0.212 MAX.
B
0.78 MAX.
0.031 MAX.
C
1.27 (T.P.)
0.050 (T.P.)
D
0.40 +0.10
–0.05
0.016 +0.004
–0.003
E
0.1±0.1
0.004±0.004
F
1.8 MAX.
0.071 MAX.
G
1.49
0.059
H
6.5±0.3
0.256±0.012
I
4.4
0.173
J
1.1
0.043
K
0.15 +0.10
–0.05
0.006 +0.004
–0.002
L
0.6±0.2
0.024 +0.008
–0.009
M
0.12
0.005
N
0.10
0.004
P
3° +7°
–3°
3° +7°
–3°
S8GM-50-225B-4
7
µPC358
9 PIN PLASTIC SLIM SIP
A
N
M
1
9
Y
C
F
Q
K
V
H
G
M
J
U
Z
NOTE
Each lead centerline is located within 0.25 mm (0.01 inch) of
its true position (T.P.) at maximum material condition.
8
ITEM
MILLIMETERS
INCHES
A
22.86 MAX.
0.900 MAX.
C
1.1 MIN.
0.043 MIN.
F
0.5±0.1
0.02 +0.004
–0.005
G
0.25
0.010
H
2.54
0.100
J
1.27 MAX.
0.050 MAX.
K
0.51 MIN.
0.020 MIN.
M
5.08 MAX.
0.200 MAX.
N
2.8±0.2
0.11+0.009
–0.008
Q
5.75 MAX.
0.227 MAX.
U
1.5 MAX.
0.059 MAX.
V
0.25 +0.10
–0.05
0.01+0.004
–0.003
Y
3.2±0.5
0.126±0.02
Z
1.1 MIN.
0.043 MIN.
P9HA-254B-1
µPC358
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Type of Surface Mount Device
µPC358G2: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
Vapor phase soldering
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Infrared ray reflow
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Types of Through-hole Device
µPC358C: 8-pin plastic DIP (300 mil)
µPC358HA: 9-pin slim SIP
Process
Wave soldering
(only to leads)
Partial heating method
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
9
µPC358
REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
C11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
C10535E
IC PACKAGE MANUAL
C10943X
GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES
MEI-1202
SEMICONDUCTORS SELECTION GUIDE
X10679E
NEC SEMICONDUCTOR DEVICE RELIABILITY/
IEI-1212
QUALITY CONTROL SYSTEM - STANDARD LINEAR IC
10
µPC358
[MEMO]
11
µPC358
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
2