TI TPS2837

TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
D
D
D
D
D
D
D
D
D
D
D PACKAGE
(TOP VIEW)
Floating Bootstrap or Ground-Reference
High-Side Driver
Active Deadtime Control
50-ns Max Rise/Fall Times With 3.3-nF Load
2-A Min Peak Output Current
4.5-V to 15-V Supply Voltage Range
TTL-Compatible Inputs
Internal Schottky Bootstrap Diode
Low Supply Current . . . 3 mA Typ
Ideal for High-Current Single- or Multiphase
Applications
–40°C to 125°C Junction-Temperature
Operating Range
IN
PGND
DT
VCC
1
8
2
7
3
6
4
5
BOOT
HIGHDR
BOOTLO
LOWDR
description
The TPS2836 and TPS2837 are MOSFET drivers for synchronous-buck power stages. These devices are ideal
for designing a high-performance power supply using a switching controller that does not include suitable
on-chip MOSFET drivers. The drivers are designed to deliver minimum 2-A peak currents into large capacitive
loads. The high-side driver can be configured as ground-reference or as floating-bootstrap. An adaptive
dead-time control circuit eliminates shoot-through currents through the main power FETs during switching
transitions and provides high efficiency for the buck regulator.
The TPS2836 has a noninverting input, while the TPS2837 has an inverting input. These drivers, available in
8-terminal SOIC packages, operate over a junction temperature range of –40°C to 125°C.
AVAILABLE OPTIONS
PACKAGED DEVICES
TJ
–40°C to 125°C
SOIC
(D)
TPS2836D
TPS2837D
The D package is available taped and reeled. Add R
suffix to device type (e.g., TPS2836DR)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
functional block diagram
4
8
VCC
BOOT
200 kΩ
7
(TPS2836 Only)
HIGHDR
200 kΩ
6
BOOTLO
1
IN
VCC
(TPS2837 Only)
5
LOWDR
200 kΩ
2
3
PGND
DT
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
BOOT
8
I
Bootstrap terminal. A ceramic capacitor is connected between BOOT and BOOTLO to develop the floating
bootstrap voltage for the high-side MOSFET. The capacitor value is typically between 0.1 µF and 1 µF.
BOOTLO
6
O
This terminal connects to the junction of the high-side and low-side MOSFETs.
DT
3
I
Deadtime control terminal. Connect DT to the junction of the high-side and low-side MOSFETs
HIGHDR
7
O
Output drive for the high-side power MOSFET
IN
1
I
Input signal to the MOSFET drivers (noninverting input for the TPS2836; inverting input for the TPS2837).
LOWDR
5
O
Output drive for the low-side power MOSFET
PGND
2
VCC
4
2
Power ground. Connect to the FET power ground.
I
Input supply. Recommended that a 1 µF capacitor be connected from VCC to PGND.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
detailed description
low-side driver
The low-side driver is designed to drive low rDS(on) N-channel MOSFETs. The current rating of the driver is 2 A,
source and sink.
high-side driver
The high-side driver is designed to drive low rDS(on) N-channel MOSFETs. The current rating of the driver is 2 A,
source and sink. The high-side driver can be configured as a ground-reference driver or a floating bootstrap
driver. The internal bootstrap diode, is a Schottky for improved drive efficiency. The maximum voltage that can
be applied between the BOOT terminal and ground is 30 V.
dead-time (DT) control
Dead-time control prevents shoot-through current from flowing through the main power FETs during switching
transitions by controlling the turnon times of the MOSFET drivers. The high-side driver is not allowed to turn
on until the gate drive voltage to the low-side FET is low, and the low-side driver is not allowed to turn on until
the voltage at the junction of the power FETs (Vdrn) is low; the TTL-compatible DT terminal connects to the
junction of the power FETs.
IN
The IN terminal is a TTL-compatible digital terminal that is the input control signal for the drivers. The TPS2836
has a noninverting input; the TPS2837 has an inverting input.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 16 V
Input voltage range: BOOT to PGND (high-side driver ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 30 V
BOOTLO to PGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 16 V
BOOT to BOOTLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 16 V
IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 16 V
DT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 30 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Unless otherwise specified, all voltages are with respect to PGND.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
D
580 mW
5.8 mW/°C
320 mW
232 mW
recommended operating conditions
MIN
NOM
MAX
UNIT
Supply voltage, VCC
4.5
15
V
Input voltage
4.5
28
V
BOOT to PGND
electrical characteristics over recommended operating virtual junction temperature range,
VCC = 6.5 V, CL = 3.3 nF (unless otherwise noted)
supply current
PARAMETER
VCC
VCC
Supply voltage range
VCC
Quiescent current
VCC
Quiescent current
TEST CONDITIONS
TYP
4.5
Quiescent current
VCC =15 V,
VCC =15 V,
V(ENABLE) = LOW
V(ENABLE) = HIGH
VCC =12 V,
fSWX = 200 kHz,
CHIGHDR = 50 pF,
BOOTLO grounded,
CLOWDR = 50 pF,
See Note 2
NOTE 2: Ensured by design, not production tested.
4
MIN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MAX
15
100
300
3
400
UNIT
V
µA
mA
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
electrical characteristics over recommended operating virtual junction temperature range,
VCC = 6.5 V, CL = 3.3 nF (unless otherwise noted) (continued)
output drivers
PARAMETER
TEST CONDITIONS
MIN
TYP
Duty cycle < 2%,
tpw < 100 µs
(see Note 3)
VBOOT – VBOOTLO = 4.5 V, VHIGHDR = 4 V
VBOOT – VBOOTLO = 6.5 V, VHIGHDR = 5 V
VBOOT – VBOOTLO = 12 V, VHIGHDR = 10.5 V
0.7
1.1
1.1
1.5
2
2.4
High side
High-side
source
(see Note 4)
Duty cycle < 2%,
tpw < 100 µs
(see Note 3)
VBOOT – VBOOTLO = 4.5 V, VHIGHDR = 0.5V
VBOOT – VBOOTLO = 6.5 V, VHIGHDR = 1.5 V
VBOOT – VBOOTLO = 12 V, VHIGHDR = 1.5 V
1.2
1.4
1.3
1.6
2.3
2.7
Duty cycle < 2%,
tpw < 100 µs
(see Note 3)
VCC = 4.5 V,
VCC = 6.5 V,
VLOWDR = 4 V
VLOWDR = 5 V
1.3
1.8
Low-side
L
id sink
i k
(see Note 4)
2
2.5
VCC = 12 V,
VCC = 4.5 V,
VLOWDR = 10.5 V
High-side
Hi
h id sink
i k
(see Note 4)
Peak outputcurrent
Low side
Low-side
source
(see Note 4)
Duty cycle < 2%,
tpw < 100 µs
(see Note 3)
High-side sink (see Note 4)
3
3.5
VLOWDR = 0.5V
VLOWDR = 1.5 V
1.4
1.7
2
2.4
VLOWDR = 1.5 V
VBOOT – VBOOTLO = 4.5 V, VHIGHDR = 0.5 V
VBOOT – VBOOTLO = 6.5 V, VHIGHDR = 0.5 V
VBOOT – VBOOTLO = 12 V, VHIGHDR = 0.5 V
2.5
3
VCC = 6.5 V,
VCC = 12 V,
Output
resistance
Low-side sink (see Note 4)
Low-side source (see Note 4)
A
A
A
A
5
Ω
5
75
75
Ω
75
VDRV = 4.5 V,
VDRV = 6.5 V
VLOWDR = 0.5 V
VLOWDR = 0.5 V
7.5
VDRV = 12 V,
VDRV = 4.5 V,
VLOWDR = 0.5 V
6
VDRV = 6.5 V,
VDRV = 12 V,
UNIT
5
VBOOT – VBOOTLO = 4.5 V, VHIGHDR = 4 V
VBOOT – VBOOTLO = 6.5 V, VHIGHDR = 6 V
VBOOT – VBOOTLO = 12 V, VHIGHDR =11.5 V
High-side source (see Note 4)
MAX
9
VLOWDR = 4 V
VLOWDR = 6 V
75
VLOWDR = 11.5 V
75
75
Ω
Ω
NOTES: 3. Ensured by design, not production tested.
4. The pullup/pulldown circuits of the drivers are bipolar and MOSFET transistors in parallel. The peak output current rating is the
combined current from the bipolar and MOSFET transistors. The output resistance is the rDS(on) of the MOSFET transistor when
the voltage on the driver output is less than the saturation voltage of the bipolar transistor.
deadtime
PARAMETER
LOWDR
DT
TEST CONDITIONS
High-level input voltage
Over the VCC range (see Note 3)
Low-level input voltage
High-level input voltage
Over the VCC range
Low-level input voltage
MIN
TYP
MAX
0.7VCC
UNIT
V
1
0.7VCC
V
V
1
V
NOTE 3: Ensured by design, not production tested.
digital control terminals (IN)
PARAMETER
High-level input voltage
Low-level input voltage
TEST CONDITIONS
Over the VCC range
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TYP
MAX
2
UNIT
V
1
V
5
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
switching characteristics over recommended operating virtual junction temperature range,
CL = 3.3 nF (unless otherwise noted)
PARAMETER
TEST CONDITIONS
HIGHDR output (see Note 3)
Rise time
LOWDR output (see Note 3)
HIGHDR output (see Note 3)
LOWDR output (see Note 3)
HIGHDR going
i low
l
((excluding
l di
deadtime) (see Note 3)
Propagation delay time
LOWDR going
i hi
high
h ((excluding
l di
deadtime) (see Note 3)
Propagation delay time
Driver nonoverlap time
NOTE 3:
6
i low
l
(
l di
LOWDR going
(excluding
deadtime) (see Note 3)
DT to LOWDR and LOWDR to
HIGHDR (see Note 3)
TYP
MAX
VBOOTLO = 0 V
VBOOTLO = 0 V
60
VBOOT = 12 V,
VCC = 4.5 V
VBOOTLO = 0 V
50
50
VBOOT = 4.5 V,
VBOOT = 6.5 V,
30
VBOOTLO = 0 V
50
VBOOTLO = 0 V
VBOOTLO = 0 V
40
ns
ns
40
40
30
ns
30
VBOOT = 4.5 V,
VBOOT = 6.5 V,
VBOOTLO = 0 V
VBOOTLO = 0 V
95
VBOOT = 12 V,
VBOOT = 4.5 V,
VBOOTLO = 0 V
65
VBOOTLO = 0 V
VBOOTLO = 0 V
80
VBOOTLO = 0 V
60
80
70
VCC = 4.5 V
VCC = 6.5 V
80
VCC = 12 V
VCC = 4.5 V
60
VCC = 6.5 V
VCC = 12 V
Ensured by design, not production tested.
POST OFFICE BOX 655303
ns
30
VCC = 6.5 V
VCC = 12 V
VBOOT = 6.5 V,
VBOOT = 12 V,
UNIT
40
VCC = 6.5 V
VCC = 12 V
VBOOT = 12 V,
VCC = 4.5 V
Fall time
MIN
VBOOT = 4.5 V,
VBOOT = 6.5 V,
• DALLAS, TEXAS 75265
70
40
170
25
135
15
85
ns
ns
ns
ns
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
TYPICAL CHARACTERISTICS
FALL TIME
vs
SUPPLY VOLTAGE
RISE TIME
vs
SUPPLY VOLTAGE
50
50
CL = 3.3 nF
TJ = 25 °C
45
40
40
t f – Fall Time – ns
t r – Rise Time – ns
CL = 3.3 nF
TJ = 25 °C
45
High Side
35
30
Low Side
25
35
High Side
30
25
20
20
15
15
10
Low Side
10
4
5
6
7
9 10 11 12 13
8
VCC – Supply Voltage – V
14 15
4
6
5
Figure 1
FALL TIME
vs
JUNCTION TEMPERATURE
50
50
VCC = 6.5 V
CL = 3.3 nF
45
VCC = 6.5 V
CL = 3.3 nF
40
40
t f – Fall Time – ns
t r – Rise Time – ns
High Side
35
30
Low Side
25
High Side
35
30
25
Low Side
20
20
15
15
10
–50
14 15
Figure 2
RISE TIME
vs
JUNCTION TEMPERATURE
45
8
7
9 10 11 12 13
VCC – Supply Voltage – V
–25
0
25
50
75
100
125
10
–50
–25
0
25
50
75
100
125
TJ – Junction Temperature – °C
TJ – Junction Temperature – °C
Figure 3
Figure 4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
TYPICAL CHARACTERISTICS
HIGH-TO-LOW PROPAGATION DELAY TIME
vs
SUPPLY VOLTAGE, HIGH TO LOW LEVEL
150
t PHL – High-to-Low Propagation Delay Time – ns
t PLH – Low-to-High Propagation Delay Time – ns
LOW-TO-HIGH PROPAGATION DELAY TIME
vs
SUPPLY VOLTAGE, LOW TO HIGH LEVEL
CL = 3.3 nF
TJ = 25 °C
140
130
120
110
100
90
80
70
60
Low Side
50
40
30
20
4
5
6
7
9 10 11 12 13
8
VCC – Supply Voltage – V
14 15
150
CL = 3.3 nF
TJ = 25 °C
140
130
120
110
100
90
80
70
High Side
60
50
40
Low Side
30
20
4
5
6
8
7
9 10 11 12 13
VCC – Supply Voltage – V
Figure 5
Figure 6
150
130
VCC = 6.5 V
CL = 3.3 nF
120
110
100
High Side
90
80
70
60
Low Side
50
40
30
20
–50
HIGH-TO-LOW PROPAGATION DELAY TIME
vs
JUNCTION TEMPERATURE
t PHL – High-to-Low Propagation Delay Time – ns
t PLH – Low-to-High Propagation Delay Time – ns
LOW-TO-HIGH PROPAGATION DELAY TIME
vs
JUNCTION TEMPERATURE
140
–25
25
75
0
50
100
TJ – Junction Temperature – °C
125
150
140
130
VCC = 6.5 V
CL = 3.3 nF
120
110
100
90
High Side
80
70
60
50
Low Side
40
30
20
–50
–25
0
25
Figure 8
POST OFFICE BOX 655303
50
75
TJ – Junction Temperature – °C
Figure 7
8
14 15
• DALLAS, TEXAS 75265
100
125
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
TYPICAL CHARACTERISTICS
DRIVER-OUTPUT FALL TIME
vs
LOAD CAPACITANCE
DRIVER-OUTPUT RISE TIME
vs
LOAD CAPACITANCE
1000
1000
VCC = 6.5 V
TJ = 27 °C
t f – Fall Time – ns
t r – Rise Time – ns
VCC = 6.5 V
TJ = 27 °C
100
High Side
Low Side
10
1
0.01
1
0.1
10
100
High Side
Low Side
10
1
0.01
100
CL – Load Capacitance – nF
10
Figure 9
Figure 10
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
100
25
6000
TJ = 25 °C
CL = 50 pF
5500
TJ = 25 °C
CL = 50 pF
5000
20
4500
ICC – Supply Current – mA
ICC – Supply Current – µ A
1
0.1
CL – Load Capacitance – nF
500 kHz
4000
300 kHz
3500
200 kHz
3000
100 kHz
50 kHz
25 kHz
2500
2000
1500
1000
2 MHz
15
10
1 MHz
5
500
0
0
4
6
8
10
12
14
16
4
VCC – Supply Voltage – V
6
8
10
12
14
16
VCC – Supply Voltage – V
Figure 11
Figure 12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
TYPICAL CHARACTERISTICS
PEAK SOURCE CURRENT
vs
DRIVE VOLTAGE
PEAK SINK CURRENT
vs
DRIVE VOLTAGE
4
4
TJ = 25 °C
TJ = 25 °C
3.5
3
3
Low Side
Peak Sink Current – A
Peak Source Current – A
3.5
2.5
2
High Side
1.5
Low Side
2.5
2
High Side
1.5
1
1
0.5
0.5
0
0
4
6
8
10
12
14
16
4
6
VCC – Supply Voltage – V
Figure 13
14
16
2.00
TJ = 25 °C
VCC = 6.5 V
V IT – Input Threshold Voltage – V
V IT – Input Threshold Voltage – V
12
INPUT THRESHOLD VOLTAGE
vs
JUNCTION TEMPERATURE
2.00
1.80
1.60
1.40
1.20
6.00
8.00
10.00
12.00
14.00
16.00
1.80
1.60
1.40
1.20
1.00
–50.00 –25.00 0.00
25.00 50.00 75.00 100.00 125.00
TJ – Junction Temperature – °C
VCC – Supply Voltage – V
Figure 15
10
10
Figure 14
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
1.00
4.00
8
VCC – Supply Voltage – V
Figure 16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
APPLICATION INFORMATION
Figure 17 shows the circuit schematic of a 100-kHz synchronous-buck converter implemented with a TL5001A
pulse-width-modulation (PWM) controller and a TPS2837 driver. The converter operates over an input range from
4.5 V to 12 V and has a 3.3 V output. The circuit can supply 3 A continuous load and the transient load is 5 A. The
converter achieves an efficiency of 94% for VIN = 5 V, Iload=1 A, and 93% for VIN = 5 V, Iload = 3 A.
VIN
+
C10
100 µF
C5
100 µF
+
R1
1 kΩ
U1
TPS2837
1
IN
C11
0.47 µF
R5
0Ω
BOOT
2
PGND HIGHDR
3
DT
BOOTLO
4
VCC
LOWDR
8
C15
1.0 µF
7
R6
1 MΩ
Q1
Si4410
6
5
R7
3.3 Ω
R11
4.7 Ω
Q2
Si4410
C14
1 µF
GND
C9
0.22 µF
OUT
3.3 V
C7
100 µF +
C12
100 µF +
C6
1000 pF
C3
0.0022 µF
U2
TL5001A
2
C2
VCC
0.033 µF
R2
1.6 kΩ
COMP 3
6 DTC
FB
4
5 SCP
RT
7
R8
121 kΩ
C13
10 µF
RTN
C8
0.1 µF
1
L1
27 µH
C4
0.022 µF
R3
180 Ω
R4
2.32 kΩ
GND
C1
1 µF
8
R9
90.9 kΩ
R10
1.0 kΩ
Figure 17. 3.3 V 3 A Synchronous-Buck Converter Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
APPLICATION INFORMATION
Great care should be taken when laying out the pc board. The power-processing section is the most critical and
will generate large amounts of EMI if not properly configured. The junction of Q1, Q2, and L1 should be very
tight. The connection from Q1 drain to the positive sides of C5, C10, and C11 and the connection from Q2 source
to the negative sides of C5, C10, and C11 should be as short as possible. The negative terminals of C7 and
C12 should also be connected to Q2 source.
Next, the traces from the MOSFET driver to the power switches should be considered. The BOOTLO signal from
the junction of Q1 and Q2 carries the large gate drive current pulses and should be as heavy as the gate drive
traces. The bypass capacitor (C14) should be tied directly across VCC and PGND.
The next most sensitive node is the FB node on the controller (terminal 4 on the TL5001A). This node is very
sensitive to noise pick-up and should be isolated from the high-current power stage and be as short as possible.
The ground around the controller and low-level circuitry should be tied to the power ground as the output. If these
three areas are properly laid out, the rest of the circuit should not have other EMI problems and the power supply
will be relatively free of noise.
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPS2836, TPS2837
SYNCHRONOUS-BUCK MOSFET DRIVER
WITH DEADTIME CONTROL
SLVS224 – NOVEMBER 1999
MECHANICAL DATA
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0.050 (1,27)
0.020 (0,51)
0.014 (0,35)
14
0.010 (0,25) M
8
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
0.010 (0,25)
1
7
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.069 (1,75) MAX
0.010 (0,25)
0.004 (0,10)
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047 / D 10/96
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
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