CM1421 4-Channel LCD EMI Filter Array plus 4-Channel ESD Protection Array Features Product Description • The CM1421 is a multichannel array consisting of four low-pass filters with integrated ESD protection and four ESD-only protection channels designed to reduce EMI/ RFI emissions on LCD data lines in mobile handsets. The CM1421 has component values of 15pF-100Ω15pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI607 Four channels of combined EMI/RFI filtering plus ESD protection Four additional channels of ESD-only protection Better than 30dB attenuation (typical) at 1 GHz ±15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Optiguard™ coated for improved reliability Lead-free version available Applications • • • • • LCD data lines in mobile handsets EMI filtering and ESD protection for both data and I/O ports Mobile Handsets Handheld PCs / PDAs Notebook Computers This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1421 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CM1421 incorporates Optiguard™ coating which results in improved reliability. The CM1421 is available in space-saving, low-profile chip-scale packages with optional lead-free finishing. Electrical Schematic 100Ω FILTER+ESDn* FILTER+ESDn* 15pF ESDn* 15pF 15pF GND (Pins B1-B3) 1 of 4 EMI/RFI + ESD Channels. 1 of 4 ESD-only Channels * See Package/Pinout Diagram for expanded pin information © 2004 California Micro Devices Corp. All rights reserved. 04/27/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CM1421 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER+ESD_2 ESD_3 A C1 C2 C3 N213 GND A1 A1 B2 GND ESD_1 Orientation Marking C B1 C6 A3 B3 FILTER+ESD_4 A4 FILTER+ESD_3 FILTER+ESD_1 ESD_4 GND FILTER+ESD_2 A2 C5 FILTER+ESD_3 FILTER+ESD_1 B FILTER+ESD_4 C4 A5 A6 ESD_2 CM1421-03 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD_1 ESD Channel 1 A2 FILTER+ESD_1 Filter + ESD Channel 1 A3 FILTER+ESD_2 Filter + ESD Channel 2 A4 FILTER+ESD_3 Filter + ESD Channel 3 A5 FILTER+ESD_4 Filter + ESD Channel 4 A6 ESD_2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD_3 ESD Channel 3 C2 FILTER+ESD_1 Filter + ESD Channel 1 C3 FILTER+ESD_2 Filter + ESD Channel 2 C4 FILTER+ESD_3 Filter + ESD Channel 3 C5 FILTER+ESD_4 C6 ESD_4 Filter + ESD Channel 4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish Ordering Part Ordering Part Pins Package Number1 Part Marking Number1 Part Marking2 15 CSP CM1421-03CS N213 CM1421-03CP N213 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/27/04 CM1421 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL PARAMETER MIN TYP MAX UNITS 80 100 120 Ω At 2.5V DC 12 15 18 pF Diode Standoff Voltage IDIODE=10µA 5.5 ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω , C=15pF R Resistance C Capacitance VDIODE VESD VCL fC CONDITIONS V 100 5.6 -1.5 6.8 -0.8 nA 9.0 -0.4 V V ±30 kV ±15 kV +12 -7 V V 120 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2004 California Micro Devices Corp. All rights reserved. 04/27/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CM1421 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1) © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/27/04 CM1421 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2) © 2004 California Micro Devices Corp. All rights reserved. 04/27/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CM1421 Performance Information (cont’d) Figure 5. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/27/04 CM1421 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2004 California Micro Devices Corp. All rights reserved. 04/27/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 CM1421 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1421 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW C1 15 Dim Millimeters B A 1 Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 # per tape and reel Min A2 Bumps C C2 Custom CSP B2 B1 B4 B3 PACKAGE DIMENSIONS Package OptiGuardTM Coating A1 Nom 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Max SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1421 Chip Scale Package 0.0155 0.0175 0.0195 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1421 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 9. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/27/04