EVERLIGHT KT04H-P05-65K-N52-TR

DATASHEET
EHP- B05 Series
EHP-B05 series
Introduction
B05 series is a high power, multi-chip device with very low
thermal resistance as a result of the PCB substrate. The series
is a surface-mount high-power device featuring high brightness
that is suitable for all kinds of lighting applications such as
general illumination, spot, signal, industrial and commercial lighting.
Features
Applications
 Robust package with high lumens
 General Lighting
 ESD protection up to 8KV
 Spot Lighting
 Soldering method: SMT
 Signal and Symbol Luminaries for
 Moisture Sensitivity Level: 3
orientation marker lights (e.g. steps,
 RoHS compliant
exit ways, etc.)
 ANSI binning
 Reliability testing conforms to IESNA
 Industrial Lighting
 Commercial Lighting
LM80 Lumen maintenance test method
1
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DATASHEET
EHP- B05 Series
Table of Contents
Table of Contents… … ...… … … … … … … … … … … .… … … … … … … … … … … … … … .… … … … … ...2
Product Nomenclature & Materials… … … … … … … … … … … … … … … … … … … … .… ...................3
Maximum Rating & JEDEC Moisture Sensitivity… … .… … … .… … … … … … … … … … … … … ..… … 4
PN of the B05 series:Typ.CRI 75 White LEDs… … … … .… … .… … … .… … … … … … .… … … … … 5
PN of the B05 series:Typ.CRI 85 White LEDs… … .… … ...… … … … … ...… … … … … … … … … … .6
Product Binning & Forward Voltage Bins… … … … … … … … … … … … … … … … … … … … ....8
White Bin Structure & Cool-White Bin Structure… … … … .… … … … … … … … … … … … .… … ......9
Cool-White Bin Coordinates… … … … … … … … … … … … ..… … … … … … … … … … … … … … … … ..10
Neutral-White Bin Structure & Neutral-White Bin Coordinates… … … … … … … … ..… … … … ..… ..11
Warm-White Bin Structure & Warm-White Bin Coordinates… … … … … … … … … ...… … … … … 12
Dimensions … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … … ......14
Wavelength Characteristics Curves… … … … … … … … … … … … … … … … … … … … … … … … … ...15
Typical Light Output Characteristics vs Solder Pad Temperature… … … … … … … … … … ............16
Typical Forward Voltage vs Solder Pad Temperature… … … … … … … … … … ............17
Typical Electrical Characteristics… … … … … … … … … … … … … … … … ..… … … … … … … … … … ..17
Typical Relative Luminous Flux vs Forward Current… … … … … … … … … … … … … … … … … ...… 18
Typical CCT Shift Characteristics vs Forward Current… … … … … … … … … … … … … … … … … … 18
Current Derating Curves… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..19
Typical Radiation Pattern… … … … … … … … … … … … … … … … … … … … … … … … .… … … … … .20
Label explanation & Reel dimensions … … … … … … … … … … … … … … … … … … … … ....… … ...21
Carrier Tape Dimensions: Loaded quantity & Moisture Resistant Packaging… … … … … … … … . 22
Reliability Data … … … … … … … ..… … … … … … … … … … … … … … … … … … … … … … .......23
Precautions For Use… … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … ..… ..24
Revision History… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … 27
2
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DATASHEET
EHP- B05 Series
Product Nomenclature
The product name is designated as below:
EHP-B05MLG/GT04H-P05/50K/R11/TR
Designation:
EHP-B05=Family name
MLG = Lambertian
GT =Color Code [1]
0 _ H = Quantity of the chip
[2]
P05 =Power Consumption[3]
50K = Color bin or CCT bin
R11 = min. luminous flux (lm) or radiation power (mW) performance
TR = Tape and Reel
Notes
1. Code of wavelength of the chip:
Symbol
Color
RB
Royal Blue
UB
Ultra Blue
SUG
Green
UY
Amber
USO
Ultra Red-Orange
SUR
Super ultra-Red
GRB
RGB full color
GT
White, CRI Min 70
LM
Warm White, CRI Min 70
KT
White, CRI Min 80
KM
Warm White, CRI Min 80
Dominant wavelength range/Peak wavelength/CCT
445~460nm
460~470nm
520~540nm
580~595nm
610~620nm
620~635nm
SUR+SUG+UB
4745-7050K
2580-4745K
4745-7050K
2580-4745K
2. Quantity of the chip:
Symbol Description
2
2 chips
4
4 chips
6
6 chips
8
8 chips
3. Consume the power:
Symbol Description
P05
5W
P07
7W
P10
10W
Materials
Items
Substrate
Housing
Encapsulating Resin
3
Revision
Description
PCB with Metal Heat Sink
Heat resistant polymer
Silicone resin
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DATASHEET
EHP- B05 Series
Maximum Ratings
Parameter
Symbol
Ratings
Unit
DC Forward Current(1)
IF
800
mA
DC Pulse Current(2)
IPF
1000
mA
ESD Sensitivity
ESD
8000
V
Junction Temperature(3)
Tj
125
°C
Operating Temperature(4)(5)
Top.
-40 ~ +85
°C
Storage Temperature
Tstge.
-40 ~ +100
°C
Junction To Heat-Sink Thermal Resistance
Rth
7
°C /W
Max. Solder Pad Temperature
TSol
260
°C
Max. Allowable Reflow Cycles
n/a
2
cycles
Notes:
1. Maximum forward current is 1000mA (Thermal Pad = 25°C).
2. Duty cycle = 1/[email protected] (Thermal Pad = 25°C)
3. Maximum junction temperature is 125°C for White LEDs.
4. Maximum Operating Temperature (Thermal Pad) is 85°C for White LEDs.
5.Avoid operating LEDs at maximum operating temperature exceeding 1 hour.
JEDEC Moisture Sensitivity
Floor Life
Soak Requirements
Standard
Level
3
4
Revision
Time
(hours)
Conditions
Time
(hours)
Conditions
168H
≦30°C / 60% RH
192 (+5/-0)
30°C / 60% RH
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DATASHEET
EHP- B05 Series
PN of the B05 series: Typ. CRI 75 White LEDs
The table below is a list of part numbers for the EHP-B05 5W series White LED. All parts listed match ANSI
binning standards. Bin offerings of 2700K to 6500K are listed and currently available. CRI is also listed with min
70 to 80. Typical view angle is 140°. These clearly listed binning options allow for proper design and
implementation into lighting applications.
For Example: If you order product using EHP-B05MLG/GT04H-P05/57K/R11/TR, you will get White,
EHP-B05 series LEDs at 700mA are listed below.
Color Radiation
Variant Pattern
Cool
Lambertian
White
CRI
Typ
CCT
Forward
Voltage
(V)
Minimum
Luminous
Flux (lm)
75
57K-1 ~ 57K-2
57K-3 ~ 57K-4
6.0~6.5(O4)
6.5~7.0(O5)
400
EHP-B05MLG represents by **
Color
Order Code of EHP-B05
**/GT04H-P05/65K/R11/TR
Cool
White
6500
**/GT14H-P05/65K/R12/TR
**/GT04H-P05/57K/R11/TR
Cool
White
5700
**/GT14H-P05/57K/R12/TR
**/GT04H-P05/50K/R11/TR
Cool
White
5000
**/GT14H-P05/50K/R12/TR
Neutral
White
4500
**/LM04H-P05/45K/N52/TR
Neutral
White
4000
**/LM04H-P05/40K/N52/TR
5
Revision
Luminous Flux
(lm) [1]
Forward
CCT(K)
Voltage
LifecyclePhase:
CRI
Min
[3]
(V) [2]
400-450
450-500
450-500
65K-1~65K-4
6.0 - 7.0
75
70
57K-1~57K-4
6.0 - 7.0
75
50K-1~50K-4
6.0 - 7.0
75
70
45K-1~45K-4
6.0 - 7.0
75
70
40K-1~40K-4
6.0 - 7.0
75
70
500-550
400-450
450-500
450-500
70
500-550
400-450
450-500
450-500
500-550
375-400
400-450
350-400
400-450
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CRI
Typ
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DATASHEET
EHP- B05 Series
Color
Order Code of EHP-B05
Warm
White
3500
**/LM04H-P05/35K/N51/TR
Warm
White
3000
**/LM04H-P05/30K/N51/TR
Warm
White
2700
**/LM04H-P05/27K/N51/TR
Luminous Flux
(lm) [1]
350-400
400-450
300-350
350-400
300-350
350-400
Forward
CCT(K)
Voltage
CRI
Typ
CRI
Min
[3]
(V) [2]
35K-1~35K-4
6.0 - 7.0
75
70
30K-1~30K-4
6.0 - 7.0
75
70
27K-1~27K-4
6.0 - 7.0
75
70
PN of the B05 series: Typ. CRI 85 White LEDs
EHP-B05MLG represents by **
Color
Order Code of EHP-B05
Cool
White
6500
**/KT04H-P05/65K/N52/TR
Cool
White
5700
**/KT04H-P05/57K/N52/TR
Cool
White
5000
**/KT04H-P05/50K/N52/TR
**/KM04H-P05/45K/N52/TR
Neutral
White
4500
**/KM14H-P05/45K/R11/TR
**/KM04H-P05/40K/N51/TR
Neutral
White
4000
**/KM14H-P05/40K/N52/TR
6
Revision
Luminous
Flux (lm) [1]
375-400
400-450
375-400
400-450
350-400
400-450
Forward
CCT(K)
Voltage
LifecyclePhase:
CRI
Min
[3]
(V) [2]
65K-1~65K-4
6.0 - 7.0
85
80
57K-1~57K-4
6.0 - 7.0
85
80
50K-1~50K-4
6.0 - 7.0
85
80
45K-1~45K-4
6.0 - 7.0
85
80
40K-1~40K-4
6.0 - 7.0
85
80
350-400
400-450
400-450
450-500
325-350
350-400
375-400
400-450
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CRI
Typ
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DATASHEET
EHP- B05 Series
Color
Order Code of EHP-B05
**/KM04H-P05/35K/N51/TR
Warm
White
3500
**/KM14H-P05/35K/N52/TR
**/KM04H-P05/30K/N42/TR
Warm
White
3000
**/KM14H-P05/30K/N51/TR
**/KM04H-P05/27K/N42/TR
Warm
White
2700
**/KM14H-P05/27K/N51/TR
Luminous
Flux (lm) [1]
Forward
CCT(K)
Voltage
CRI
Typ
CRI
Min
[3]
(V) [2]
300-350
350-400
35K-1~35K-4
6.0 - 7.0
85
80
30K-1~30K-4
6.0 - 7.0
85
80
27K-1~27K-4
6.0 – 7.0
85
80
350-400
400-450
275-300
300-350
325-350
350-400
275-300
300-350
325-350
350-400
Note:
1. Luminous Flux measurement tolerance: ±10%.
2. Forward Voltage measurement tolerance: ±0.1V.
3. Color Rendering Index measurement tolerance: ±2.
7
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DATASHEET
EHP- B05 Series
Product Binning
Luminous Intensity spec
Group
N
R
Bin
Minimum
Photometric Flux (lm)
Maximum
Photometric Flux (lm)
31
32
41
42
51
52
11
12
21
22
31
32
33
41
42
43
44
51
52
53
54
200
225
250
275
300
350
400
450
500
550
600
650
700
750
800
850
925
1000
1075
1150
1225
225
250
275
300
350
400
450
500
550
600
650
700
750
800
850
925
1000
1075
1150
1225
1300
Note: Currently available brightness bins for White LEDs are highlighted and bolded.
Forward Voltage Bins
Bin
Minimum Forward
Voltage (V)
Maximum Forward
Voltage (V)
O1
O2
O3
O4
O5
O6
O7
R1
R2
R3
R4
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
10.0
11.0
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
10.0
11.0
12.0
Notes
1.
2.
8
Revision
Wide forward voltage 0.5V bin structure
Wide forward voltage 1.0V bin structure
O1 ~ O7
R1 ~ R4
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DATASHEET
EHP- B05 Series
White Bin Structure
Chromaticity specification defined by ANSI
Notes:
1.
2.
3.
4.
5.
The CCT range of Warm-White varies from 2580K to 3710K
The CCT range of Neutral-White varies from 3710K to 4745K.
The CCT range of Cool-White varies from4745K to 7050K
Color coordinates measurement allowance : ±0.01
Color bins are defined at IF=350mA operation.
Cool-White Bin Structure
9
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DATASHEET
EHP- B05 Series
Cool-White Bin Coordinates
5000K
Bin
CIE X
0.346
0.345
50K-1
0.353
0.355
Reference Range: 4745~5000K
CIE Y
0.369
0.356
0.362
0.376
Bin
CIE Y
0.356
0.343
0.349
0.362
Bin
CIE Y
0.354
0.342
0.349
0.362
Bin
CIE Y
0.342
0.331
0.337
0.349
Bin
CIE Y
0.339
0.329
0.337
0.348
Bin
CIE Y
0.329
0.319
0.326
0.337
CIE X
0.345
0.344
50K-4
0.352
0.353
Reference Range: 4745~5000K
Bin
CIE X
0.338
0.337
50K-2
0.345
0.346
Reference Range: 5000~5310K
CIE Y
0.362
0.349
0.356
0.369
Bin
CIE Y
0.349
0.337
0.343
0.356
Bin
CIE Y
0.346
0.335
0.342
0.354
Bin
CIE Y
0.335
0.324
0.331
0.342
Bin
CIE Y
0.330
0.321
0.329
0.339
Bin
CIE Y
0.321
0.311
0.319
0.329
CIE X
0.337
0.337
50K-3
0.344
0.345
Reference Range: 5000~5310K
5700K
CIE X
0.329
0.329
57K-1
0.337
0.338
Reference Range: 5310~5700K
CIE X
0.329
0.329
57K-4
0.337
0.337
Reference Range: 5310~5700K
CIE X
0.321
0.322
57K-2
0.329
0.329
Reference Range: 5700~6020K
CIE X
0.322
0.322
57K-3
0.329
0.329
Reference Range: 5700~6020K
6500K
CIE X
0.312
0.313
65K-1
0.321
0.321
Reference Range: 6020~6500K
CIE X
0.313
0.315
65K-4
0.322
0.321
Reference Range: 6020~6500K
10
Revision
CIE X
0.303
0.305
65K-2
0.313
0.312
Reference Range: 6500~7050K
CIE X
0.305
0.307
65K-3
0.315
0.313
Reference Range: 6500~7050K
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DATASHEET
EHP- B05 Series
Neutral-White Bin Structure
Neutral-White Bin Coordinates
4000K
Bin
CIE X
0.387
0.383
40K-1
0.395
0.401
Reference Range: 3710~4000K
CIE Y
0.396
0.380
0.388
0.404
Bin
CIE Y
0.380
0.365
0.372
0.388
CIE X
0.383
0.378
40K-4
0.390
0.395
Reference Range: 3710~4000K
Bin
CIE X
0.374
0.370
40K-2
0.383
0.387
Reference Range: 4000~4260K
CIE Y
0.387
0.373
0.380
0.396
Bin
CIE Y
0.373
0.358
0.365
0.380
CIE X
0.370
0.367
40K-3
0.378
0.383
Reference Range: 4000~4260K
4500K
Bin
45K-1
CIE X
CIE Y
0.364
0.381
0.362
0.366
0.370
0.373
0.374
0.387
Bin
45K-2
Reference Range: 4260~4500K
Bin
45K-4
11
Revision
CIE Y
0.355
0.374
0.353
0.360
0.362
0.366
0.364
0.381
Reference Range: 4500~4745K
CIE X
CIE Y
0.362
0.359
0.367
0.358
0.370
0.373
Reference Range: 4260~4500K
CIE X
Bin
CIE X
CIE Y
0.366
0.353
0.360
0.352
0.351
0.347
0.359
0.352
0.362
0.366
45K-3
Reference Range: 4500~4745K
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DATASHEET
EHP- B05 Series
Warm-White Bin Structure
Warm-White Bin Coordinates
2700K
Bin
CIE X
0.469
0.459
27K-1
0.470
0.481
Reference Range: 2580~2700K
CIE Y
0.429
0.410
0.413
0.432
Bin
CIE Y
0.410
0.392
0.394
0.413
Bin
CIE Y
0.421
0.403
0.408
0.426
Bin
CIE Y
0.403
0.385
0.389
0.408
CIE X
0.459
0.448
27K-4
0.459
0.470
Reference Range: 2580~2700K
Bin
CIE X
0.456
0.447
27K-2
0.459
0.469
Reference Range: 2700~2870K
CIE Y
0.426
0.408
0.410
0.429
Bin
CIE Y
0.408
0.389
0.392
0.410
Bin
CIE Y
0.417
0.399
0.403
0.421
Bin
CIE Y
0.399
0.381
0.385
0.403
CIE X
0.447
0.437
27K-3
0.448
0.459
Reference Range: 2700~2870K
3000K
CIE X
0.443
0.435
30K-1
0.447
0.456
Reference Range: 2870~3000K
CIE X
0.435
0.426
30K-4
0.437
0.447
Reference Range: 2870~3000K
12
Revision
CIE X
0.430
0.422
30K-2
0.435
0.443
Reference Range: 3000~3220K
CIE X
0.422
0.415
30K-3
0.426
0.435
Reference Range: 3000~3220K
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DATASHEET
EHP- B05 Series
3500K
Bin
CIE X
0.415
0.408
35K-1
0.422
0.430
Reference Range: 3220~3500K
Bin
CIE Y
0.409
0.392
0.399
0.417
CIE X
CIE Y
0.408
0.392
0.402
0.375
35K-4
0.415
0.381
0.422
0.399
Reference Range: 3220~3500K
Note:
13
Revision
Bin
CIE X
0.400
0.394
35K-2
0.408
0.415
Reference Range: 3500~3710K
CIE Y
0.402
0.385
0.392
0.409
Bin
CIE X
CIE Y
0.394
0.385
0.389
0.369
35K-3
0.402
0.375
0.408
0.392
Reference Range: 3500~3710K
Currently available typical CCT ranges are 3000K, 5700K, and 6500K CCT
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DATASHEET
EHP- B05 Series
Dimensions
Notes.
1.
Dimensions are in millimeters.
2.
Tolerances for fixed dimensions are ± 0.25mm.
14
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DATASHEET
EHP- B05 Series
Wavelength Characteristics
For Cool-White, @ Solder Pad Temperature = 25℃
For Neutral-White, @ Solder Pad Temperature = 25℃
Forward Voltage vs Forward Current,
T soldering=25ºC
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DATASHEET
EHP- B05 Series
For Warm-White, @ Solder Pad Temperature = 25℃
Typical Light Output Characteristic
vs. Solder Pad Temperature
Cool-White, Neutral-White, Warm-White for 700mA Drive Current
Relative Luminous Flux
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0
10
20
30
40
50
60
70
80
90
100

Solder Pad Temperature ( C)
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DATASHEET
EHP- B05 Series
Typical Forward Voltage vs. Solder Pad Temperature
@ 700mA Drive Current
6.7
Forward Voltage(V)
6.6
6.5
6.4
6.3
6.2
6.1
6.0
5.9
20
30
40
50
60
70
80
90
100

Solder Pad Temperature ( C)
Typical Electrical Characteristics
For Cool-White, Neutral-White, Warm-White
@ Solder Pad Temperature = 25℃
7.5
Forward Voltage(V)
7.0
6.5
6.0
5.5
5.0
0
200
400
600
800
1000
1200
1400
Forward Current(mA)
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DATASHEET
EHP- B05 Series
Typical Relative Luminous Flux vs. Forward Current
For Cool-White, Neutral-White, Warm-White
@ Solder Pad Temperature = 25℃
Relative Luminous Intensity
2.0
1.6
1.2
0.8
0.4
0.0
0
200
400
600
800
1000
1200
1400
Forward Current(mA)
Typical CCT Shift Characteristics vs. Forward Current
For Cool-White @ Solder Pad Temperature = 25℃
Corelated Color Temperature(K)
6500
6250
6000
5750
5500
0
200
400
600
800
1000
1200
1400
Forward Current(mA)
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DATASHEET
EHP- B05 Series
Corelated Color Temperature(K)
For Warm-White @ Solder Pad Temperature = 25℃
3200
3100
3000
2900
0
200
400
600
800
1000
1200
1400
Forward Current(mA)
Current Derating Curves
Current Derating Curve for 700mA Drive Current
Cool-White, Neutral-White, Warm-White
Forward Current (mA)
1000
800
600
400
200
0
0
20
40
60
80
100
120
Solder Pad Temperature (C)
19
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DATASHEET
EHP- B05 Series
Typical Radiation Pattern
1.0
Relative Luminous Intensity
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-80
-60
-40
-20
0
20
40
60
80
Degree (2)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
.
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DATASHEET
EHP- B05 Series
Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note.
1.
Dimensions are in millimeters.
2.
Tolerances for fixed dimensions are ±0.1mm.
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DATASHEET
EHP- B05 Series
Carrier Tape Dimensions: Loaded quantity 300 PCS per reel
Note.
1.
Dimensions are in millimeters.
2.
Tolerances for fixed dimensions are ±0.1mm.
Moisture Resistant Packaging
Label
Label
22
Revision
Aluminum moistue-proof bag
Aluminum moisture-proof bag
Desiccant
Desiccant
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DATASHEET
EHP- B05 Series
Reliability Data
(EHP-B05 Series-5W)
Stress Test
Stress Condition
Stress Duration
Reflow
Tsol=260℃, 10sec, 6min
3 times
Thermal Shock
H:+100℃ 20min.
'∫ 20sec.
'L:-10℃
20min.
500 Cycles
Power Temperature Cycle
H:+100℃ 15min.
'∫ 5min.
'L:- 40℃ 15min.
IF= 300 mA , 2min on/off
500 Cycles
High Temperature/Humidity
Storage
Ta=85℃ , RH=85%
1000hours
Ta=85℃ , RH=85% , IF=400mA
1000hours
Ta= -40℃, IF=700mA
1000hours
Ta=25℃, IF=700mA
1000hours
Ta=55℃, IF=700mA
1000hours
Ta=85℃, IF=400mA
1000hours
High Temperature Storage
Ta= 110℃
1000hours
Low Temperature Storage
Ta= -40℃
1000hours
High Temperature/Humidity
Operation
Low Temperature Operation
Life
High Temperature Operation
Life #1
High Temperature Operation
Life #2
High Temperature Operation
Life #3
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<30%
*VF: FORWARD VOLTAGE
23
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DIFFERENCE<20%
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DATASHEET
EHP- B05 Series
Precautions For Use
1. Over-current-Protection
Thought the EHP-B05 series has an ESD protection mechanism, customer must not use the
device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts
may cause significant current changes and may cause failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use
ii. Before the package is opened: The LEDs should be stored at temperatures 30℃or less
and humidity 50% or less.
iii. LEDs may be stored for 6 months. When the storage time has reached more than 6 months,
LEDs should be stored in a sealed container filled with Nitrogen gas.
iv. After the package is opened: The LEDs should be stored at temperatures under 30℃ or less
and humidity 30% or less.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at
60±5℃ for 24 hours.
3. Thermal Management
i. For maintaining high flux output and achieving maximum reliability, EHP-B05 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) with proper thermal
connection to dissipate approximately 5W of thermal energy under 700mA operation.
ii. Special thermal designs are also recommended to take into account outer heat sink design,
such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive
adhesive, etc.
Recommend:
Max TSlug = 70℃
iii. Sufficient thermal management must be implemented, or the die junction temperature may
exceed the limit and LED lifetime will decrease critically.
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DATASHEET
EHP- B05 Series
4.
Proper Handling
To avoid contamination of materials, damage of internal components, and shortening of LED
lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
When handling the product, do not apply
direct pressure to the optical surface.
Do not touch the resin with tweezers to
avoid scratching or other damage the
optical surface.
Pick and Place Nozzle for Surface
Mount Assembly.
During Module Assembly
Avoid directly contacting with nozzle.
25
Revision
Tweezers
Do not stack the modules together, it
could damage the resin or scratch the
lens.
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DATASHEET
EHP- B05 Series
5. Reflow Soldering Process
a. EHP-B05 series are suitable for SMT process
b. Curing of glue in oven according to standard operation flow processes.
300
tp
250
Temperature
TL
200
150
100
ts
Preheat time
50
0
Time
Profile Feature
Ramp-UP Rate
Preheat Temperature
Preheat Time(ts)
Liquid Temperature(TL)
Time above TL
Peak Temperature(TP)
Peak Time(tp)
Ramp-Down Rate
Parameter
2-3 ℃/S
150-200℃
60~120s
217℃
60-90s
260±5℃(Varied with the solder material)
Max 20s
3-5 ℃/S
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
26
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DATASHEET
EHP- B05 Series
Revision History
Current version:2012/03/15
Previous version:2011/12/30
Device No.: DHE-0001726
Rev. Ver. : 3
Page
Subjects(major change in previous version)
9
Revised Cool-White Bin 5700K Coordinates
5
16
17
27
Revision
P05.Revised Typ.CRI 75 White LEDs & Typ.CRI 85 White
LEDs(Added Higher Level Products)
P16.Revised Typ. Light Output Characteristic vs. Solder
Pad Temperature
P17.Add Typical Relative Forward Voltage vs. Solder Pad
Temperature
Date of change
2011/12/30
2012/03/15
Copyright
DHE-0001726
: 3 © 2011, Everlight All Rights Reserved. Release Date: 12.01.2011. Issue No:Release
Date:2012-04-02
LifecyclePhase:
19:22:39.0
www.everlight.com
Expired Period: Forever