LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TAPE AND REEL Pb Lead-Free Parts LDGM9033/TR1 DATA SHEET DOC. NO : QW0905- LDGM9033/TR1 REV : A DATE : 04 - Aug - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LDGM9033/TR1 Package Dimensions Cathode 4.6±0.5 2.5 0.4±0.1 0.5±0.1 2.0 ψ1.9 1.4 2.8 0.16 0.7 0.4 Note : 1.All dimension are in millimeter tolerance is ± 0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.16 0.3 9.3 4.85 12±0.3 5.5 Polarity 1.75 2.0 4.0 Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm. 1.5 3.32 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM9033/TR1 Page 2/7 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0± 1.5 Part No. Description Quantity/Reel LDGM9033/TR1 12.0mm tape,7"reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO.LDGM9033/TR1 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 150 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LDGM9033/TR1 InGaN/GaN Green Luminous Viewing Peak Dominant Spectral Forward intensity angle wave wave halfwidth voltage @20 mA(V) @20mA(mcd) length length θ 1/2 2 △λ nm (deg) λPnm λDnm Typ. Max. Min. Lens Water Clear 518 525 36 3.5 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typ. 4.0 1100 1800 20 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM9033/TR1 Page 4/7 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 450 500 550 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature(℃) Ambient Temperature(℃) Relative Intensity@20mA 100 600 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO.LDGM9033/TR1 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃ ) 240 Rising +5 ℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 3-2 PB-Free Reflow Solder 1~5° C/sec Preheat 180~200° C 1~5° C/sec 260° C MaX. 10sec.Max Above 220° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO.LDGM9033/TR1 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO.LDGM9033/TR1 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11