3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MTSM2350-G-A 3.2 x 2.8mm SMD TYPE ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 0T60*$ 3.2 x 2.8mm SMD TYPE Package Dimensions 1.9 2.8 0.8 3.6 2.2 3.2 2.4 0.9 K 0.6 0.14 A 0.8 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted. Description LED Chip Part No. MTSM2350-G-A Material Emitting Color InGaN/Sapphire True Green Lens Color Water Clear VER.: 01 Date: 2006/11/23 Page: 1/6 0T60*$ 3.2 x 2.8mm SMD TYPE Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 120 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature Tsld. Electric Static Discharge Threshold (HBM) ESD Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Reflow Soldering: 260℃ for 10 sec. Hand Soldering: 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 270 620 Forward Voltage Vf If=20mA 3.2 Peak Wavelength λP If=20mA ----- nm Dominant Wavelength λD If=20mA 525 nm Reverse Current Ir Vr=5V Viewing Angle 2θ1/2 If=20mA 120 deg ∆λ If=20mA 35 nm Spectrum Line Halfwidth Max. Unit mcd 4.0 50 V µA Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2006/11/23 Page: 2/6 0T60*$ 3.2 x 2.8mm SMD TYPE Typical Electrical/Optical Characteristic Curves 50 1000 40 800 Relative Luminous Intensity Forward Current IF(mA) (25℃ Ambient Temperature Unless Otherwise Noted) 30 20 10 600 400 200 0 1.6 2.0 2.4 3.0 3.4 4.0 0.0 30.0 Forward Current (mA) Applied Voltage (V) Forward Current VS. Applied Voltage 20.0 10.0 Forward Current VS. Luminous Intensity 0° 50 20° 10° Forward Current IF(mA) 30° 40 40° 30 1.0 20 50° 0.9 10 0 60° 0.8 20 40 60 80 100 Ambient Temperature Ta (。C) Ambient Temperature VS. Forward Current 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Radiation Diagram VER.: 01 Date: 2006/11/23 Page: 3/6 0T60*$ 3.2 x 2.8mm SMD TYPE PRECAUTION IN USE Storage Recommended storage environment o Temperature: 5 C ~ 30oC (41oF ~ 86oF) Humidity: 60% RH Max. Use within 7 days after opening of sealed vapor/ESD barrier bags. If the mois ture absorbent mater ial (s ilica ge l) has faded a way or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. Fold the opened bag firmly and keep in dry environment. Soldering Reflow Soldering Lead Solder Lead – free Solder 120~150℃ 180~200 ℃ Pre-heat Pre-heat time 120sec. Max. 120sec. Max. 240℃ Max. 260℃ Max. Peak temperature Soldering time 10sec. Max. 10sec. Max. Condition refer to refer to T emperatureTemperatureprofile 1 profile 2 *After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. ＜1 : Lead Solder＞ 240°C Max. 10sec. Max. 2.5~5°C/sec. Pre-heating 120~150°C 60sec. Max. 120sec. Max. Hand Soldering Temperature Soldering time 350℃ Max. 3sec. Max. (one time only) ＜2 : Lead-free Solder＞ 260°C Max. 10sec. Max. 1~5°C/sec. Pre-heating 180~200°C 120sec. Max. 60sec. Max. 1~5°C/sec. 2.5~5°C/sec. [ Recommended soldering pad design ] Use the following conditions shown in the figure. 1.4 1.8 1.4 2.2 (UNIT:mm) VER.: 01 Date: 2006/11/23 Page: 4/6 0T60*$ 3.2 x 2.8mm SMD TYPE Handling of Silicone Resin LEDs Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all all types should not be used to pierce the sealing compound Figure 1 In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. Figure 2 When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin muxt be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. VER.: 01 Date: 2006/11/23 Page: 5/6 0T60*$ 3.2 x 2.8mm SMD TYPE Dimensions for Tape 2.0 1.5 1.75 5.5 12.0 4.0 0.2 0.4 0.8 0.6 57 60.0±0.5 4 0.6 .2 178.0± 1 Dimensions for Reel 13.2 0.5 16.2 0.5 Notes: 1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted. 2.Specifications are subject to change without notice. VER.: 01 Date: 2006/11/23 Page: 6/6