SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 D Controlled Baseline D D D D D D Typical VOLP (Output Ground Bounce) − One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Member of the Texas Instruments Widebus+ Family State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. GKE PACKAGE (TOP VIEW) 1 2 3 4 5 <0.8 V at VCC = 3.3 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion Supports Unregulated Battery Operation Down To 2.7 V Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) D D D D D D terminal assignments 6 1 2 3 4 5 6 A A 1Y2 1Y1 1OE 2OE 1A1 1A2 B B 1Y4 1Y3 GND GND 1A3 1A4 C C 2Y2 2Y1 2A2 D 2Y4 2Y3 1VCC GND 2A1 D 1VCC GND 2A3 2A4 E 3Y2 3Y1 GND GND 3A1 3A2 F 3Y4 3Y3 3A4 4Y2 4Y1 1VCC GND 3A3 G 1VCC GND 4A1 4A2 H 4Y3 4Y4 4OE 3OE 4A4 4A3 E F G H J 5Y2 5Y1 5OE 6OE 5A1 5A2 K 5Y4 5Y3 GND GND 5A3 5A4 K L 6Y2 6Y1 6A2 M 6Y4 6Y3 2VCC GND 6A1 L 2VCC GND 6A3 6A4 M N 7Y2 7Y1 GND GND 7A1 7A2 N P 7Y4 7Y3 8Y2 8Y1 2VCC GND 7A4 R 2VCC GND 7A3 P 8A1 8A2 R T 8Y3 8Y4 8OE 7OE 8A4 8A3 J T Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus+ is a trademark of Texas Instruments. Copyright 2004, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"& *%$"# $ " #'&$$!"# '& "+& "&# &,!# #"%&"# #"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*& "&#"/ !)) '!!&"&# POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 description/ordering information The SN74LVTH32244 is a 32-bit buffer and line driver designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. This device can be used as eight 4-bit buffers, four 8-bit buffers, two 16-bit buffers, or one 32-bit buffer. The device provides true outputs and has symmetrical active-low output-enable (OE) inputs. It is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. When VCC is between 0 and 1.5-V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5-V, OE shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. ORDERING INFORMATION TA ORDERABLE PART NUMBER PACKAGE† TOP-SIDE MARKING −40°C to 85°C LFBGA − GKE Tape and reel CLVTH32244IGKEREP L244EP † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each 4-bit buffer/driver) INPUTS 2 OE A OUTPUT Y L H H L L L H X Z POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 5OE 5A1 5A2 5A3 5A4 6OE 6A1 6A2 6A3 6A4 A3 3OE A5 A2 A6 A1 B5 B2 B6 B1 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 A4 4OE C5 C2 C6 C1 D5 D2 D6 D1 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 J3 7OE J5 J2 J6 J1 K5 K2 K6 K1 5Y1 7A1 5Y2 7A2 5Y3 7A3 5Y4 7A4 J4 8OE L5 L2 L6 L1 M5 M2 M6 M1 6Y1 8A1 6Y2 8A2 6Y3 8A3 6Y4 8A4 POST OFFICE BOX 655303 H4 E5 E2 E6 E1 F5 F2 F6 F1 3Y1 3Y2 3Y3 3Y4 H3 G5 G2 G6 G1 H6 H1 H5 H2 4Y1 4Y2 4Y3 4Y4 T4 N5 N2 N6 N1 P5 P2 P6 P1 7Y1 7Y2 7Y3 7Y4 T3 R5 R2 R6 R1 T6 T1 T5 T2 • DALLAS, TEXAS 75265 8Y1 8Y2 8Y3 8Y4 3 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W Storage temperature range, Tstg (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See Figure 1 for additional information on thermal derating. 0.0001 1/Time to Failure − Hours 125°C (16 kHours, 1.84 Years) 115°C (40 kHours, 4.57 Years) 0.00001 105°C (104 kHours, 11.94 Years) 100°C (172 kHours, 19.65 Years) 0.000001 1/TJ − Constant Device Junction Temperature Figure 1. Estimated Wirebond Life Based on Elevated-Temperature Kirkendall-Voiding Failure Mode 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 recommended operating conditions (see Note 5) MIN MAX 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 5.5 V IOH IOL High-level output current −32 mA ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate 200 Operating free-air temperature −40 High-level input voltage 2 V 0.8 Low-level output current Outputs enabled V V 64 mA 10 ns/V µs/V 85 °C NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT −1.2 V VIK VCC = 2.7 V, VCC = 2.7 V to 3.6 V, II = −18 mA IOH = −100 µA VOH VCC = 2.7 V, VCC = 3 V, IOH = −8 mA IOH = −32 mA IOL = 100 µA IOL = 24 mA 0.2 VCC = 2.7 V IOL = 16 mA IOL = 32 mA 0.4 IOL = 64 mA VI = 5.5 V 0.55 VOL VCC = 3 V Control inputs VCC = 0 or 3.6 V, VCC = 3.6 V, Data inputs VCC = 3.6 V II Ioff II(hold) IOZH IOZL VCC = 0, Data inputs VCC−0.2 2.4 V 2 0.5 10 ±1 VI = VCC or GND VI = VCC 1 VI = 0 VI or VO = 0 to 4.5 V VCC = 3 V VI = 0.8 V VI = 2 V VCC = 3.6 V‡, VCC = 3.6 V, VI = 0 to 3.6 V VO = 3 V VCC = 3.6 V, VO = 0.5 V V 0.5 µA A −5 ±100 µA 75 µA −75 ±500 5 µA −5 µA IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care ± 100 µA IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ±100 µA ICC VCC = 3.6 V, IO = 0, VI = VCC or GND Outputs high 0.38 Outputs low 10 Outputs disabled ∆ICC§ VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 mA 0.38 0.2 4 mA pF Co 9 pF † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. § This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y PARAMETER tsk(o) † All typical values are at VCC = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN TYP† MAX 1.2 2.3 3.2 3.7 1.2 2 3.2 3.7 1.2 2.6 4 5 1.2 2.7 4 5 2.2 3.3 4.5 5 2 3.1 4.2 4.4 0.5 • DALLAS, TEXAS 75265 MIN UNIT MAX ns ns ns ns 7 SCBS793A − DECEMBER 2003 − REVISED JUNE 2004 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT 1.5 V Timing Input 0V tw tsu 2.7 V Input 1.5 V th 2.7 V 1.5 V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 2.7 V Input 1.5 V 1.5 V 0V tPHL tPLH VOH Output 1.5 V 1.5 V VOL 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLH tPHL 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CLVTH32244IGKEREP ACTIVE LFBGA GKE 96 1000 TBD SNPB Level-3-220C-168 HR V62/04720-01XA ACTIVE LFBGA GKE 96 1000 TBD SNPB Level-3-220C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVTH32244-EP : • Catalog: SN74LVTH32244 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device CLVTH32244IGKEREP Package Package Pins Type Drawing LFBGA GKE 96 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 5.7 B0 (mm) K0 (mm) P1 (mm) 13.7 2.0 8.0 W Pin1 (mm) Quadrant 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CLVTH32244IGKEREP LFBGA GKE 96 1000 333.2 345.9 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated