TI UC3854BN

UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
ADVANCED HIGH-POWER FACTOR PREREGULATOR
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
Controls Boost PWM to Near-Unity Power
Factor
Limits Line Current Distortion To <3%
World-Wide Operation Without Switches
Accurate Power Limiting
Fixed-Frequency Average Current-Mode
Control
High Bandwidth (5 MHz), Low-Offset Current
Amplifier
Integrated Current- and Voltage-Amplifier
Output Clamps
Multiplier Improvements: Linearity, 500 mV VAC
Offset (Eliminates External Resistor), 0 V to
5 V Multout Common-Mode Range
VREF GOOD Comparator
Faster and Improved Accuracy ENABLE
Comparator
UVLO Options (16 V/10 V or 10.5 V/10 V)
300-µA Start-Up Supply Current
DESCRIPTION
The UC3854A/B products are pin compatible
enhanced versions of the UC3854. Like the UC3854,
these products provide all of the functions necessary
for active power factor corrected preregulators. The
controller achieves near unity power factor by
shaping the ac input line current waveform to
correspond to the ac input line voltage. To do this the
UC3854A/B uses average current mode control.
Average current mode control maintains stable, low
distortion sinusoidal line current without the need for
slope compensation, unlike peak current mode
control.
A 1%, 7.5-V reference, fixed frequency oscillator,
PWM, voltage amplifierwith soft-start, line voltage
feedforward (VRMS squarer), input supply voltage
clamp, and over current comparator round out the lilst
of feataures.
Available in the 16-pin N (PDIP), DW (SOIC Wide),
and J (CDIP) and 20-pin Q (PLCC) package. See
Ordering Information table for availability by
temperature range.
BLOCK DIAGRAM
VAO
MOUT
7
5
CAO PKLMT
3
REF
2
9
VCC
7.5 V REF
(A) 16 V / 10 V
(B) 10.5 V / 10 V
RUN
ENA 10
3V
VRMS
15 VCC
A
VSENSE 11
IAC
6
R
R
S
B
X2
8
7.1 V
IC
POWER
2.65 V / 2.15 V
14 µA
SS 13
16 GTDRV
Q
C
RUN
I MOUT +
A
B
OSC
C
4
ISENSE
14
12
CT
RSET
20 V
1 GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The UC3854A/B products improve upon the UC3854 by offering a wide bandwidth, low offset current amplifier, a
faster responding and improved accuracy enable comparator, a VREF GOOD comparator, UVLO threshold
options (16 V/10 V for offline, 10.5 V/10 V for startup from an auxiliary 12-V regulator), lower startup supply
current, and an enhanced multiply/divide circuit. New features like the amplifier output clamps, improved amplifier
current sinking capability, and low offset VAC pin reduce the external component count while improving
performance. Improved common mode input range of the multiplier output/current amplifier input allow the
designer greater flexibility in choosing amethod for current sensing. Unlike its predecessor, RSET controls only
oscillator charging current and has no effect on clamping the maximum multiplier output current. This current is
now clamped to a maximum of 2 × IAC at all times which simplifies the design process and provides foldback
power limiting during brownout and extreme low line conditions.
ORDERING INFORMATION
TA
UVLO
TURN-ON
(V)
UVLO
TURN-OFF
(V)
–55°C to 125°C
–40°C to 85°C
0°C to 70°C
PART NUMBERS
CDIP-16
(V)
PDIP-16
(N)
SOIC-16
(DW)
PLCC-20
(Q)
–
16
10
–
–
–
10.5
10
UC1854BJ
–
–
–
16
10
UC2854AJ
UC2854AN
UC2854ADW
UC2854AQ
10.5
10
UC2854BJ
UC2854BN
UC2854BDW
UC2854BQ
16
10
–
UC2854AN
UC2854ADW
–
10.5
10
–
UC2854BN
UC2854BDW
–
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Supply voltage
IGTDRV
GTDRV current
Input voltage
Input current
UCX854A, UCX854B
UNIT
22
V
Continuous
0.5
50% duty cycle
1.5
VSENSE, VRMS, ISENSE MOUT
11
PKLMT
5
RSET, IAC, PKLMT, ENA
10
mA
1
W
Power dissipation
TJ
Junction temperature
–55 to 150
Tstg
Storage temperature
–65 to 150
Tsol
Lead temperataure, 1,6 mm (1/16 inch) from case for 10 seconds
(1)
2
A
V
°C
300
Stresses beyond those listed under absolutemaximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periodsmayaffect device reliability. All voltages
arewith respect to GND. Currents are positive into and negative out of, the specified terminal. ENA input is internally clamped to
approximately 10 V.
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VCC
TJ
MIN
MAX
10
20
UC1854X
–55
125
UC2854X
–40
85
UC3854X
0
70
Supply voltage
Operating junction temperature
UNIT
V
°C
THERMAL RESISTANCE
PACKAGED DEVICES
(1)
(2)
RESISTANCES
CDIP-16
(J)
θJC (°C/W)
28 (1)
45
27
34
θJA (°C/W)
80–120
90 (2)
50–130 (2)
43–75 (2)
PDIP-16
(N)
SOP-16
(DW)
PLCC-20
(Q)
θJC data values stated are derived from MIL-STD-1835B which states gthe baseline values shown are worst case (mean +2s) for a 60 ×
60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. For device die sizes greater than
14,400 square mils use the following values, dual-in-line, 11°C/W; flat pack and pin grid array, 10°C/W.are at the end of each trace.
θJA (junction-to-ambient) applies to devices mounted to five square inch FR4 PC board with one ounce copper where noted. When
resitance range is given, lower values are for five square inch aluminum PC board. Test PWB is 0.062 inches thick and typically uses
0,635 mm trace widths for power packages and 1,3 mm trace widths for non-power packages with a 100 × 100 mil probe land are at the
end of each trace.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
3
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
ELECTRICAL CHARACTERISTICS
VCC = 18 V, RT = 8.2 kΩ, CT = 1.5 nF, VPKLMT = 1 V, VVRMS = 1.5 V, IIAC = 100 µA, IISENSE = 0 V, VCAO = 3.5 V, VVAO = 5 V,
VVSENSE = 3 V, –40°C < TA < 85°C for the UC2854A and UC2854B, and 0°C < TA < 70°C for the UC3854A and UC3854B,
and TA = TJ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
250
400
µA
mA
OVERALL
CAO = 0 V,
VCC = VUVLO–0.3 V
Supply current, off
VAO = 0 V,
Supply current, on
VCC turn-on threshold voltage
VCC turn-off threshold voltage
VCC hysteresis
VCC clamp
12
18
UCx854A
15.0
16.0
17.5
UCx854B
8.0
10.5
11.2
UCx854A
9
10
12
UCx854B
7.8
10.3
11.0
UCx854A
5
6
7
UCx854B
0.10
0.22
0.50
18
20
22
2.9
3.0
3.1
V
–500
—25
500
nA
70
100
IVCC = IVCC(on) + 5 mA
V
VOLTAGE AMPLIFIER
Input voltage
VSENSE bias current
Open loop gain
2 V ≤ VOUT ≤ 5 V
VOH
High-level output voltage
ILOAD = –500 µA
VOL
Low-level output voltage
ILOAD = 500 µA
ISC
Output short-circuit current
VOUT = 0 V
Gain bandwidth product (1)
fIN = 100 kHz,
10 mVp-p
VCM = 0 V,
TA = 25°C
VCM = 0 V,
Overtemperature
dB
6
0.3
0.5
1.5
3.5
1
V
mA
MHz
CURRENT AMPLIFIER
Input offset voltage
ISENSE
Input bias current
VCM = 0 V
Open loop gain
2 V ≤ VOUT = 6 V
VOH
High-level output voltage
ILOAD = –500 µA
VOL
Low-level output voltage
ILOAD = 500 µA
ISC
Output short-circuit current
VOUT = 0 V
CMRR
Common mode rejection range
Gain bandwidth product (1)
–4
0
–5.5
0
–500
500
80
110
fIN = 100 kHz,
10 mVp-p
IREF = 0 mA,
TA = 25°C
3
nA
dB
8
0.3
0.5
1.5
3.5
–0.3
mV
5.0
5
V
mA
V
MHz
REFERENCE
Output voltage
ISC
(1)
4
IREF = 0 mA
7.4
7.5
7.6
7.35
7.50
7.65
Load regulation
1 mA ≤ IREF ≤ 10 mA
0
8
20
Line regulation
12 V ≤ VCC ≤ 18 V
0
14
25
Short circuit current
VREF = 0 V
25
35
60
V
mV
mA
Ensured by design. Not production tested.
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
ELECTRICAL CHARACTERISTICS (Continued)
VCC = 18 V, RT = 8.2 kΩ, CT = 1.5 nF, VPKLMT = 1 V, VVRMS = 1.5 V, IIAC = 100 µA, IISENSE = 0 V, VCAO = 3.5 V, VVAO = 5 V,
VVSENSE = 3 V, –40°C < TA < 85°C for the UC2854A and UC2854B, and 0°C < TA < 70°C for the UC3854A and UC3854B,
and TA = TJ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
85
100
115
kHz
OSCILLATOR
Initial accuracy
TA = 25°C
Voltage stability
12 V ≤ VCC ≤ 18 V
Total variation
Line, temperature
1%
80
120
kHz
Ramp amplitude (peak-to-peak)
4.9
5.9
V
Ramp valley voltage
0.8
1.3
V
ENABLE/SOFT-START/CURRENT LIMIT
Enable threshold voltage
2.35
Enaable hysteresis
VFAULT = 2.5 V
Enable input bias current
Propagation delay to disable time
VENA = 0 V
(1)
Soft-start charge current
Enable overdrive = 100 mV
VSS = 2.5 V
Peak limit offset current
2.80
V
500
600
mV
–2
–5
µA
24
µA
15
mV
300
10
Peak limit offset voltage
2.55
14
–15
VPKLMIT = –0.1 V
–200
Peak limit propagation delay time (1)
ns
–100
µA
150
ns
MULTIPLIER
Output current, IA limited
IAC = 100 µA,
RSET = 10 kΩ
VRMS = 1 V,
–220
–200
–170
µA
Output current, zero
IAC = 0 µA,
RSET = 10 kΩ
–2.0
–0.2
2.0
µA
Output current, power limited
VRMS = 1.5 V
Va = 6 V
–230
–200
–170
µA
VRMS = 1.5 V
Va = 2 V
–22
VRMS = 1.5 V
Va = 5 V
–156
VRMS = 5 V
Va = 2 V
–2
VRMS = 5 V
Va = 5 V
VRMS = 1.5 V
Va = 6 V, TA = 25°C
–1.1
–1.0
VCC = 15 V
12.0
12.8
Output current
Gain constant (2)
µA
–14
–0.9
A/A
GATE DRIVER
VOH
High-level output voltage
IOUT = –200 mA,
VOL
Low-level output voltage
IOUT = 200 mA
1.0
2.2
V
IOUT = 10 mA
300
500
mV
0.9
1.5
(1)
Low-level UVLO voltage
IOUT = 50 mA,
Output rise time (1)
CLOAD = 1 nF
Output fall time (1)
Output peak current (1)
V
35
ns
CLOAD = 1 nF
35
ns
CLOAD = 10 nF
1.0
A
Ensured by design. Not production tested.
(K ) =
(2)
VCC = 0 V
V
Gain constant.
I IAC ´ (VVAO - 1.5V )
é(VVRMS )2 ´ I MOUT ù
ë
û
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
5
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
PACKAGE DESCRIPTION
Q PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GTDRV
VCC
CT
SS
RSET
VSENSE
ENA
VREF
3
ISENSE
CAOUT
N/C
MOUT
IAC
5
2 1 20 19
18
4
17
6
16
7
15
8
14
9 10 11 12 13
CT
SS
N/C
RSET
VSENSE
VAO
VRMS
NC
VREF
ENA
GND
PKLMT
CAO
ISENSE
MOUT
IAC
VAO
VRMS
PKLMT
GND
N/C
GTDRV
VCC
J, N and DW PACKAGES
(TOP VIEW)
N/C − No connection
6
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
TERMINAL FUNCTIONS
TERMINAL
NAME
PACKAGES
I/O
DESCRIPTION
J/N/DW
Q/L
CAO
3
4
O
Output of the wide bandwidth current amplifier and one of the inputs to the PWM duty-cycle
comparator. The output signal generated by this amplifier commands the PWM to force the correct
input current. The output can swing from 0.1 V to 7.5 V.
CT
14
18
I
Capacitor from CT to GND sets the PWM oscillator frequency.
ENA
10
13
I
A nominal voltage above 2.65 V on this pin allows the device to begin operating. Once operating,
the device shuts off if this pin goes below 2.15 V nominal.
GND
1
2
–
All bypass and timing capacitors connected to GND should have leads as short and direct as
possible. All voltages are measured with respect GND.
O
Output of the PWM is a 1.5-A peak totem-pole MOSFET gate driver on GTDRV. Use a series gate
resistor of at least 5 Ω to prevent interaction between the gate impedance and the GTDRV output
driver that might cause the GTDRV output to overshoot excessively. Some overshoot of the
GTDRV output is always expected when driving a capacitive load.
GTDRV
16
20
IAC
6
8
I
Current input to the multiplier, proportional to the instantaneous line voltage. This input to the
analog multiplier is a current. The multiplier is tailored for very low distortion from this current input
(IAC) to MOUT, so this is the only multiplier input that should be used for sensing instantaneous
line voltage.
ISENSE
4
5
I
Switch current sensing input. This is the inverting input to the current amplifier. This input and the
non-inverting input MOUT remain functional down to and below GND. Care should be taken to
avoid taking these inputs below –0.5 V, because they are protected with diodes to GND.
MOUT
5
7
I/O
Multiplier output and current sense plus. The output of the analog multiplier and the non-inverting
input of the current amplifier are connected together at MOUT. The cautions about taking ISENSE
below –0.5 V also apply to MOUT. As the multiplier output is a current, this is a high-impedance
input similar to ISENSE, so the current amplifier can be configured as a differential amplifier to reject
GND noise. IMOUT ≤ 2 × IAC
PKLMT
2
3
I
Peak limit. The threshold for PKLMT is 0.0 V. Connect this input to the negative voltage on the
current sense resistor. Use a resistor to REF to offset the negative current sense signal up to GND.
RSET
12
15
I
Oscillator charging current and multiplier limit set. A resistor from RSET to ground programs
oscillator charging current.
17
I
Soft-start. SS remains at GND as long as the device is disabled or VCC is too low. SS pulls up to
over 3 V by an internal 14-µA current source when both VCC becomes valid and the device is
enabled. SS acts as the reference input to the voltage amplifier if SS is below VREF. With a large
capacitor from SS to GND, the reference to the voltage regulating amplifier rises slowly, and
increase the PWM duty cycle slowly. In the event of a disable command or a supply dropout, SS
will quickly discharge to ground and disable the PWM.
SS
13
VAO
7
9
I
Voltage amplifier output
VCC
15
19
I
Positive supply rail
VREF
9
12
O
Used to set the peak limit point and as an internal reference for various device functions. This
voltage must be present for the device to operate.
VRMS
8
10
I
One of the inputs into the multiplier. This pin provides the input RMS voltage to the multiplier
circuitry.
VSENSE
11
14
I
This pin provides the feedback from the output. This input goes into the voltage error amplifier and
the output of the error amplifier is another of the inputs into the multiplier circuit.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
7
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
FUNCTIONAL DESCRIPTION
The UC3854A and UC3854B family of products are designed as pin compatible upgrades to the industry
standard UC3854 active power factor correction circuits. The circuit enhancements allow the user to eliminate in
most cases several external components currently required to successfully apply the UC3854. In addition,
linearity improvements to the multiply, square and divide circuitry optimizes overall system performance. Detailed
descriptions of the circuit enhancements are provided below. For in-depth design applications reference data
refer to the application notes, UC3854 Controlled Power Factor Correction Circuit Design (SLUA144) and
UC3854A and UC3854B Advanced Power Factor Correction Control ICs (SLUA177).
Multiply/Square and Divide
-1 ö
æ
çK = ÷
V ø as the UC3854. The
The UC3854A/B multiplier design maintains the same gain constant è
relationship between the inputs and output current is given as:
I MOUT = I IAC ´
(VVAO - 1.5V )
2
K ´ (VVRMS )
(1)
This is nearly the same as the UC3854, but circuit differences have improved the performance and application.
The first difference is with the IAC input. The UC3854A/B regulated this pin voltage to the nominal 500 mV over
the full operating temperature range, rather than the 6.0 V used on the UC3854. The low offset voltage
eliminates the need for a line zero crossing compensating resistor to VREF from IAC that UC3854 designs
require. The maximum current at high line into IAC should be limited to 250 µA for best performance.
Therefore, if VVAC(max) = 270 V,
RIAC =
270 ´1.414
= 1.53M W
250 m A
(2)
The VRMS pin linear operating range is improved with the UC3854A/B as well. The input range for VRMS extends
from 0 V to 5.5 V. Since the UC3854A squaring circuit employs an analog multiplier, rather than a linear
approximation, accuracy is improved, and discontinuities are eliminated. The external divider network connected
to VRMS should produce 1.5 V at low line (85 VAC). This puts 4.77 V on VRMS at high line (270 VAC) which is
well within its operating range.
The voltage amplifier output forms the third input to the multiplier and is internally clamped to 6.0 V. This
eliminated an external zener clamp often used in UC3854 designs. The offset voltage at this input to the
multiplier has been raised on the UC3854A/B to 1.5 V.
The multiplier output pin, which is also common to the current amplifier non-inverting input, has a –0.3 V to 5.0 V
output range, compared to the –0.3 V to 2.5 V range of the UC3854. This improvement allows the UC3854A/B to
be used in applications where the current sense signal amplitude is very large.
8
Submit Documentation Feedback
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
Voltage Amplifier
The UC3854A/B voltage amplifier design is essentially similar to the UC3854 with two exceptions. The first is
with the internal connection. The lower voltage reduces the amount of charge on the compensation capacitors,
which provides improved recovery form large signal events, such as line dropouts, or power interruption. It also
minimizes the dc current flowing through the feedback. The output of the voltage amplifier is also changed. In
addition to a 6.0-V temperature compensated clamp, the output short circuit current has been lowered to 2 mA
typical, and an active pull down has replaced the passive pull down of the UC3854.
Current Amplifier
The current amplifier for an average current PFC controller needs a low offset voltage in order to minimize ac line
current distortion. With this in mind, the UC3854A/B current amplifier has improved the input offset voltage from
±4 mV to 0 V to ±3 mV. The negative offset of the UC3854A/B assures that the PWM circuit will not drive the
MOSFET is the current command is zero (both current amplifier inputs zero.) Previous designs required an
external offset cancellation network to implement this key feature. The bandwidth of the current amplifier has
been improved as well to 5 MHz typical. While this is not generally an issue at 50 Hz or 60 Hz inputs, it is
essential for 400 Hz input avionics applications.
Miscellaneous
Several other important enhancements have been implemented in the UC3854A/B. AVCC supply voltage clamp at
20 V allows the controller to be current fed if desired. The lower startup supply current (250 µA typical),
substantially reduces the power requirements of an offline startup resistor. The 10.5 V/10 V UVLO option
(UC3854B) enables the controller to be powered off of an auxiliary 12-V supply.
The VREF GOOD comparator assures that the MOSFET driver output remains low if the supply of the 7.5 V
reference are not yet up. This improvement eliminates the need for external Schottky diodes on the PKLMT and
Mult Out pins that some UC3854 designs require. The propagation delay of the disable feature has been
improved to 300 ns typical. This delay was proportional to the size of the VREF capacitor on the UC3854, and is
typically several orders of magnitude slower.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
9
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
TYPICAL CHARACTERISTICS
GATE DRIVE TIMING
vs
LOAD CAPACITANCE
800
GATE DRIVE MAXIMUM DUTY CYCLE
vs
OSCILLATOR CHARGING RESISTANCE
100
700
95
Fall Time
Duty Cycle − %
t− Time − ns
600
500
400
Rise Time
300
90
85
80
200
75
100
0
0
0.01
0.02
0.03
0.04
70
1000
0.05
CLOAD − Load Capacitance − µF
Figure 1.
Figure 2.
MULTIPLIER GAIN CONSTANT
vs
SUPPLY CURRENT
1.20
MULTIPLIER GAIN CONSTANT
vs
SUPPLY CURRENT
1.20
VA Out = 3.5 V
VA Out = 5 V
1.16
1.12
1.12
VRMS = 1.5 V
K− Multiplier Gain Constant− V
K− Multiplier Gain Constant− V
1.16
1.08
VRMS = 5 V
1.04
1.00
0.96
0.92
VRMS = 3 V
0.88
VRMS = 1.5 V
1.08
1.04
1.00
0.96
VRMS = 5 V
0.92
VRMS = 1.5 V
0.88
0.84
0.84
0.80
0.80
0
10
10 k
100 k
RSET − Oscillator Charging Resistance − Ω
50
100
150
IAC − Supply Current − µA
Figure 3.
Submit Documentation Feedback
200
250
0
50
100
150
IAC − Supply Current − µA
Figure 4.
200
250
Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
UC1854A
UC2854A, UC2854B
UC3854A, UC3854B
www.ti.com
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
120
PHASE
120
−90
80
−45
60
−0
40
20
Phase − °
100
0
120
PHASE
100
Gain − dB
Gain − dB
VOLTAGE AMPLIFIER GAIN
vs
FREQUENCY
100
80
80
60
60
40
40
20
20
0
0
Phase − °
140
CURRENT AMPLIFIER GAIN
vs
FREQUENCY
−20
GAIN
fCO = 5.992 MHz
−40
−60
10 k
100 k
1M
−20
100
10 M
1000
10 k
GAIN
100
k
1M
−20
10 M
f − Frequency − Hz
f − Frequency − Hz
Figure 5.
Figure 6.
OSCILLATOR FREQUENCY
vs
LIMIT SET RESISTANCE AND
TIMING CAPACITANCE
1k
fOSC − Oscillator Frequency − kHz
200 pF
100 pF
1 nF
100
500 pF
3 nF
10 nF
10
5 nF
2 nF
0
1
10
100
RSET − Multiplier Limit Set Resistance − kΩ
Figure 7.
Copyright © 2003–2008, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
11
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
5962-9326102M2A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
5962-9326102MEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Call TI
-55 to 125
5962-9326102ME
A
UC1854BJ/883B
UC1854BJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
UC1854BJ
UC1854BJ883B
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9326102ME
A
UC1854BJ/883B
UC1854BL
OBSOLETE
TO/SOT
L
20
TBD
Call TI
Call TI
-55 to 125
UC1854BL883B
OBSOLETE
TO/SOT
L
20
TBD
Call TI
Call TI
-55 to 125
UC2854ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854ADW
UC2854ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854ADW
UC2854ADWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854ADW
UC2854ADWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854ADW
UC2854AN
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2854AN
UC2854ANG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2854AN
UC2854BDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854BDW
UC2854BDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854BDW
UC2854BDWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854BDW
UC2854BDWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2854BDW
UC2854BN
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2854BN
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
UC2854BNG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2854BN
UC2854BQ
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
UC2854BQ
UC2854BQG3
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
UC2854BQ
UC2854J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-40 to 85
UC2854J
UC3854ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854ADW
UC3854ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854ADW
UC3854ADWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854ADW
UC3854ADWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854ADW
UC3854AN
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3854AN
UC3854ANG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3854AN
UC3854BDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854BDW
UC3854BDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854BDW
UC3854BDWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854BDW
UC3854BDWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3854BDW
UC3854BN
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3854BN
UC3854BNG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3854BN
UC3854BQ
OBSOLETE
UTR
20
TBD
Call TI
Call TI
0 to 70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1854B, UC2854B, UC2854M, UC3854A, UC3854B :
• Catalog: UC3854B, UC2854
• Enhanced Product: UC2854B-EP
• Military: UC2854BM, UC1854A, UC1854B
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UC3854ADWTR
Package Package Pins
Type Drawing
SOIC
DW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.7
2.7
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC3854ADWTR
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated