FEDR27T401E-02-01 OKI Semiconductor MR27T401E Issue Date: Apr. 17, 2002 512K–Word × 8–Bit P2ROM FEATURES PIN CONFIGURATION (TOP VIEW) ·524,288-word × 8-bit · 2.7 V to 3.6 V power supply · Access time 100 ns MAX · Operating current 25 mA MAX · Standby current 10 µA MAX · Input/Output TTL compatible · Three-state output PACKAGES · MR27T401E-xxxMA 32-pin plastic SOP (SOP32-P-525-1.27-K) · MR27T401E-xxxTA 32-pin plastic TSOP (TSOP I 32-P-814-0.50-1K) DC 1 32 Vcc A16 2 A15 3 31 A18 A17 A12 4 A7 5 A6 6 29 A5 7 A4 8 A3 9 A2 10 A1 11 A0 12 23 30 · Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. · No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. · No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. · Custom Marking is available at no additional charge. A14 A13 27 A8 26 A9 A11 25 24 OE# A10 CE# D7 20 D6 19 D5 18 D4 17 D3 22 21 D0 13 D1 14 D2 15 VSS 16 P2ROM ADVANCED TECHNOLOGY P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; 28 32SOP, A11 A9 A8 A13 A14 A17 A18 Vcc DC A16 A15 A12 A7 A6 A5 A4 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 OE# A10 CE# D7 D6 D5 D4 D3 Vss D2 D1 D0 A0 A1 A2 A3 32TSOP(Type-I) 1/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E BLOCK DIAGRAM CE OE Row Decoder OE# Memory Cell Matrix 512K × 8-Bit Column Decoder Address Buffer A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 CE# Multiplexer Output Buffer D0 D1 D2 D3 D4 D5 D6 D7 PIN DESCRIPTIONS Pin name Functions A0 to A18 Address inputs D0 to D7 Data outputs CE# Chip enable input OE# Output enable input VCC Power supply voltage VSS Ground DC Don’t Care *, * : Logical input level is ignored . However the pin is connected to internal circuit. 2/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E FUNCTION TABLE Mode CE# OE# L L Output disable L H Standby H * Read VCC D0 to D7 Dout 3.0 V Hi-Z Hi-Z ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Operating temperature under bias Condition Ta Storage temperature VI relative to VSS Output voltage VO Power supply voltage VCC Power dissipation per package PD Unit 0 to 70 °C –55 to 125 °C –0.5 to VCC+0.5 V –0.5 to VCC+0.5 V –0.5 to 5 V 1.0 W — Tstg Input voltage Value — RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol VCC power supply voltage VCC Input “H” level VIH Input “L” level VIL Condition Min. Typ. 2.7 2.2 –0.5∗∗ VCC = 2.7 to 3.6 V Max. Unit — 3.6 V — VCC+0.5∗ V — 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE (VCC = 3.0 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Input CIN1 DC CIN2 Output COUT Condition VI = 0 V VO = 0 V Min. Typ. Max. — — 8 — — 200 — — 10 Unit pF 3/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Symbol Condition Min. Typ. Max. Unit Input leakage current Parameter ILI VI = 0 to VCC — — 10 µA Output leakage current ILO VO = 0 to VCC — — 10 µA VCC power supply current ICCSC CE# = VCC — — 10 µA (Standby) ICCST CE# = VIH — — 1 mA VCC power supply current ICCA1 CE# = VIL — — 25 mA ICCA2 OE# = VIH (Read) tc = 100 ns — — 20 mA Input “H” level VIH — tc = 200 ns 2.2 — VCC+0.5∗ V Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH IOH = –1 mA 2.4 — — V Output “L” level VOL IOL = 2 mA — — 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns AC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit tC — 100 — ns Address access time tACC CE# = OE# = VIL — 100 ns CE# access time tCE OE# = VIL — 100 ns OE# access time tOE CE #= VIL — 40 ns Address cycle time Output disable time Output hold time tCHZ OE# = VIL 0 35 ns tOHZ CE# = VIL 0 30 ns tOH CE #= OE# = VIL 0 — ns Measurement conditions Input signal level -------------------------------- 0 V/Vcc V Input timing reference level ------------------ 1/2Vcc Output load--------------------------------------- 50 pF Output timing reference level ---------------- 1/2Vcc Output load Output 50 pF (Including scope and jig) 4/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E TIMING CHART (READ CYCLE) Read tC tC A0 to A18 tOH tACC tCE CE# tOE tCHZ tOH OE# tOHZ tACC D0 to D7 Hi-Z Valid Data Valid Data Hi-Z 5/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E PACKAGE DIMENSIONS (Unit: mm) SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 6/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E (Unit: mm) TSOP(1)32-P-0814-0.50-1K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.27 TYP. 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 7/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E REVISION HISTORY Page Document No. Date FEDR27T401E-02-01 Apr. 17, 2002 Previous Edition Current Edition – – Description Final edition 1 8/9 FEDR27T401E-02-01 OKI Semiconductor MR27T401E NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd. 9/9