FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L 16M–Word × 16–Bit or 32M–Word × 8–Bit Page Mode Issue Date: Mar. 10, 2005 P2ROM FEATURES · 16,777,216-word × 16-bit / 33,554,432-word × 8-bit electrically switchable configuration · Page size of 8-word x 16-Bit or 16-word x 8-Bit · 3.0 V to 3.6 V power supply · Random Access time 100 ns MAX · Page Access time 35 ns MAX · Operating current 60 mA MAX · Standby current 5 mA MAX · Input/Output TTL compatible · Three-state output PACKAGES · MR27V25653L-xxxMB 70-pin plastic SSOP (SSOP70-P-500-0.80-K) P2ROM ADVANCED TECHNOLOGY P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; PIN CONFIGURATION (TOP VIEW) A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A23 NC NC NC NC NC GND NC NC NC NC NC BYTE# A0 D0 D8 D1 D9 Vcc D2 D10 D3 D11 GND 19 52 20 51 21 50 22 49 23 48 24 47 25 46 26 45 27 44 28 43 29 42 30 41 31 40 32 39 33 38 34 37 CE# A12 A13 A14 A15 Vcc A16 A17 A18 A19 A20 A21 NC NC NC NC NC GND NC NC NC NC NC A22 NC OE# D15/A-1 D7 D14 D6 D13 D5 D12 D4 35 36 Vcc 1 70 2 69 3 68 4 67 5 66 6 65 7 64 8 63 9 62 10 61 11 60 12 59 13 58 14 57 15 56 16 55 17 18 54 70SSOP 53 · Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. · No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. · No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. · Custom Marking is available at no additional charge. 1/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM BLOCK DIAGRAM A–1 × 8 / × 16 Switch CE OE Row Decoder OE# BYTE# Memory Cell Matrix 16M × 16-Bit or 32M × 8-Bit Column Decoder Address Buffer A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 CE# Multiplexer Output Buffer D0 D2 D1 D4 D3 D6 D5 D8 D7 D10 D9 D12 D11 D14 D13 D15 In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. PIN DESCRIPTIONS Pin name D15 / A–1 A0 to A23 D0 to D14 CE# OE# BYTE# VCC VSS NC Functions Data output / Address input Address inputs Data outputs Chip enable input Output enable input Word / Byte select input Power supply voltage Ground No connect 2/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM FUNCTION TABLE Mode Read (16-Bit) Read (8-Bit) CE# L L OE# L L Output disable L H Standby H ∗ BYTE# H L H L H L VCC 3.0 V to 3.6 V D0 to D7 DOUT D8 to D14 DOUT Hi–Z D15/A–1 Hi–Z ∗ Hi–Z ∗ L/H ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Condition — Relative to VSS Ta = 25°C — Value 0 to 70 –55 to 125 –0.5 to VCC+0.5 –0.5 to VCC+0.5 –0.5 to 5 1.0 10 Unit °C °C V V V W mA RECOMMENDED OPERATING CONDITIONS Parameter VCC power supply voltage Input “H” level Input “L” level Symbol VCC VIH VIL Condition VCC = 3.0 to 3.6 V Min. 3.0 2.2 –0.5∗∗ Typ. — — — (Ta = 0 to 70°C) Max. Unit 3.6 V VCC+0.5∗ V 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE Parameter Input BYTE# Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. — — — (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Typ. Max. Unit — 10 pF — 200 — 10 3/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C) Min. Typ. Max. Unit — — 5 µA — — 5 µA — — 5 mA — — 5 mA Parameter Input leakage current Output leakage current VCC power supply current (Standby) Symbol ILI ILO ICCSC ICCST Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH VCC power supply current (Read) ICCA1 CE# = VIL, OE# = VIH f=5MHz — — Input “H” level VIH — 2.2 — Input “L” level Output “H” level Output “L” level VIL VOH VOL — IOH = –1 mA IOL = 2 mA –0.5∗∗ 2.4 — — — — 60 VCC+0.5 ∗ 0.6 — 0.4 mA V V V V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics Parameter Address cycle time Address access time Page cycle time Page access time CE# access time OE# access time Symbol tC tACC tPC tPAC tCE tOE tCHZ tOHZ tOH Output disable time Output hold time Condition — CE# = OE# = VIL — — OE# = VIL CE# = VIL OE# = VIL CE# = VIL CE# = OE# = VIL (VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C) Min. Max. Unit 100 — ns — 100 ns 35 — ns — 35 ns — 100 ns — 30 ns 0 20 ns 0 20 ns 0 — ns Measurement conditions Input signal level ---------------------------------------- 0 V/3.0 V Input timing reference level--------------------------- 1/2Vcc Output load ----------------------------------------------- 50 pF Output timing reference level ------------------------ 1/2Vcc Output load Output 50 pF (Including scope and jig) 4/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM TIMING CHART (READ CYCLE) Random Access Mode Read Cycle tC tC Address tOH tACC tCE CE# tCHZ tOE tOH OE# tOHZ tACC Dout Valid Data Valid Data Hi-Z Hi-Z Page Access Mode Read Cycle tC A3 to A23 tPC tPC A-1 to A2 (Byte mode) A0 to A2 (Word mode) tOH tCE CE# tOE tCHZ OE# tACC tPAC tPAC tOHZ Dout Hi-Z Hi-Z 5/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM (Unit: mm) SSOP70-P-500-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.15 TYP. 3/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 6/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM REVISION HISTORY Page Document No. Date Previous Edition Current Edition FEDR27V25653L-02-01 Mar. 10, 2005 – – Description Final edition 1 7/8 FEDR27V25653L-02-01 OKI Semiconductor MR27V25653L/ P2ROM NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2005 Oki Electric Industry Co., Ltd. 8/8