E2E0017-38-93 ¡ Semiconductor MSM6442 ¡ Semiconductor This version: Sep. 1998 MSM6442 Previous version: Mar. 1996 Built-in LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM6442 is a 4-bit microcontroller with a built-in LCD controller/driver, developed to support control systems. The MSM6442 is most suitable for various on-vehicle meters, watches, audio equipment, remote controllers, multifunctional telephones, and instrumentation units. FEATURES • ROM • RAM • I/O port Input-output port : 2048 words ¥ 8 bits : 128 words ¥ 4 bits : 4 ports ¥ 4 bits 1 port ¥ 2 bits Input port : 1 port ¥ 1 bit • LCD driver : 46 segments (static) : 92 segments (1/2 duty) • Stack (RAM) : 16 levels • Four interrupt sources (external, CLK, TBC, T/C) • Internal counter : 12-bit time base counter 8-bit programmable timer/event counter • Crystal and ceramic oscillation • 76 instructions • Minimum instruction execution time : 952 ns @ 4.2 MHz • Operating range Power supply voltage : 4.5 to 5.5 V (@ 4.2 MHz) 3.0 to 6.0 V (@ 1 MHz) Operating temperature : –40 to +85°C • Supply current (Typ.) : 6 mA (@ 5 V, 4.2 MHz) 1 mA (@ 3 V, 1 MHz) • Power down function : Dependent on STOP instruction • Package options: 80-pin plastic QFP (QFP80-P-1420-0.80-K): (Product name : MSM6442-¥¥GS-K) 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM6442-¥¥GS-BK) ¥¥ indicates a code number. 1/12 2048 ¥ 8 bits ¡ Semiconductor ROM INST DEC ACC 128 ¥ 4 bits BLOCK DIAGRAM RAM C SP H P6 P9 8-Bit T/C P5 LCD T. C. BUFFER REG LCD DRV LCDGND VM ALU L SEG46 COM2 XT COM1 SEG1 PC INTEF PC INTRQF PD INT. CONT CLKI T. C. 12-Bit TBC RESET T/C T. C. P4 BZ INT 3 2 1 0 INTOUT OSC0 OSC1 TEST1 TEST2 RESOUT WDT DIVIDER XT TEST3 PB P3 P1 P0 3 2 1 0 3 2 1 0 CIN 3 2 1 0 VDD GND MSM6442 2/12 ¡ Semiconductor MSM6442 65 SEG33 66 SEG34 67 SEG35 68 SEG36 69 SEG37 70 SEG38 71 SEG39 72 SEG40 73 SEG41 74 SEG42 75 SEG43 76 SEG44 77 SEG45 78 SEG46 2 64 SEG32 63 SEG31 3 62 SEG30 4 61 SEG29 5 60 SEG28 6 59 SEG27 7 8 58 SEG26 57 SEG25 1 9 56 SEG24 10 55 SEG23 11 12 54 SEG22 53 SEG21 13 52 SEG20 14 51 SEG19 15 16 50 SEG18 49 SEG17 17 48 SEG16 18 47 SEG15 19 46 SEG14 20 45 SEG13 44 SEG12 21 23 43 SEG11 42 SEG10 24 41 SEG9 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P0.1 25 22 P0.2 P0.3 CIN/P1.0 P1.1 P1.2 P1.3 VDD SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 COM2 VM GND XT XT TEST3 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 OSC1 OSC0 INTOUT RESOUT BZ RESET INT TEST2 TEST1 P0.0 79 LCDGND 80 COM1 PIN CONFIGURATION (TOP VIEW) 80-Pin Plastic QFP 3/12 ¡ Semiconductor MSM6442 PIN DESCRIPTIONS Pin Symbol Type Description 24 to 27 P0.0 to P0.3 28 to 31 P1.0 to P1.3 7 to 10 P3.0 to P3.3 11 to 14 P4.0 to P4.3 I/O 33 to 48 SEG1 to SEG16 O LCD segment output (can be assigned to data output in 4 bits) 49 to 78 SEG17 to SEG46 O LCD segment output 80 COM1 O LCD common output 1 I/O Pseudobidirectional configuration input-output ports (P1.0 is also used as count input CIN) Pseudobidirectional configuration input-output port 1 COM2 O LCD common output 2 21 INT I External interrupt input pin 17 INTOUT O Interrupt request output pin 20 RESET I Reset input pin 18 RESOUT O Reset output pin 19 BZ O 2048 Hz pulse output pin for buzzer 16 OSC0 I 15 OSC1 O 5 XT I 32.768 kHz crystal oscillator connection 4 XT O (reference clock used for LCD control) 23 TEST1 — Testing pin 1 (open) 22 TEST2 — Testing pin 2 (open) (connected to VDD) 6 TEST3 — Testing pin 3 (open) 32 VDD I Power supply (5 V) 79 LCDGND I Negative power supply for LCD 2 VM I/O 3 GND I Crystal or ceramic resonator connection (system clock) (VDD–LCDGND)/2 supply voltage output or supply voltage input Power supply (0 V) 4/12 ¡ Semiconductor MSM6442 ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Symbol Input Voltage VI Output Voltage VO LCD Voltage Storage Temperature Condition VDD Ta = 25°C LCDGND TSTG — Rating Unit –0.3 to +7 V –0.3 to VDD V –0.3 to VDD V VDD – 9 to VDD V –55 to +150 °C Range Unit RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage LCD Voltage Data-Hold Voltage Operating Temperature LCD Clock Oscillation Frequency Fan Out (I/O Port) Symbol Condition fOSC £ 1 MHz 3 to 6 V fOSC £ 4.2 MHz 4.5 to 5.5 V LCDGND *1 VDD – 8 to 0 V VDDH Oscillation off 2 to 6 V Top — –40 to +85 °C fXT *2 32.768 kHz MOS load 15 — TTL load 1 — VDD N *1 A voltage of (VDD–LCDGND) volts is applied to LCD. *2 Oscillation circuit for LCD clock (XT, XT pins) is for crystal oscillation only. 5/12 ¡ Semiconductor MSM6442 ELECTRICAL CHARACTERISTICS DC Characteristics (VDD = 5 V ±10%, LCDGND = 0 V, Ta = –40 to +85°C) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage Applied pin INT *1 Symbol VIH 2.4 — VDD 3.6 — VDD V 0 — 0.8 V OSC1 *1 IO = –15 mA 4.2 — — V *2 IO = –400 mA 2.4 — — V SEG1 to SEG46 VOH OSC1 SEG1 to SEG46 VOL COM1, COM2 IO = –10 mA VDD-0.2 — — V IO = –50 mA VDD-0.2 — — V IO = 1.6 mA — — 0.4 V IO = 15 mA — — 0.4 V IO = 10 mA — — 0.2 V — — 0.2 V IO = 50 mA COM1, COM2 VOM IO = ±0.5 mA OSC0 "H" Input Current XT IIH VI = VDD OSC0 IIL XT VI = 0 V INT, RESET "H" Output Current *1 IOH Power Supply Current (In Stop Mode) VDD/2 — VDD/2 – 0.2 — INT, RESET "L" Input Current V — VIL *1, *2 "M" Output Voltage Min. Typ. Max. Unit — — *3 *1, *4 COM1, COM2 "L" Output Voltage Condition IDDS (32.768 kHz, Without Crystal Oscillator) + 0.2 — V 15 mA — — 7 mA — — 1 mA — — –15 mA — — 7 mA — — –30 mA — mA VO = 2.4 V –0.1 — VO = 0.4 V — — VDD = 2 V,Ta = 25°C No load Display off XT pin is fixed to "L" — 0.2 10 mA — 1 100 mA –1.2 mA No load Display off XT pin is fixed to "L" Power Supply Current (In Stop Mode) Power Supply Current *1 *2 *3 *4 IDDL No load Display off In stop mode fXT = 32.768 kHz — 100 200 mA IDD No load Display off fOSC = 4.2 MHz fXT = 32.768 kHz — 6 12 mA Applied to P0, P1, P3, and P4. Applied to INTOUT, RESOUT, and BZ. Applied to OSC0, XT, and RESET. Applied to OSC0, XT, INT, and RESET. Note: "M" output voltage is an intermediate voltage that is output to the COMMON pins during dynamic display. (VM pin is open.) 6/12 ¡ Semiconductor MSM6442 AC Characteristics (VDD = 5 V ±10%, Ta = –40 to +85°C) Parameter Symbol Condition Min. Typ. Max. Unit Clock (OSC0) Pulse Width tfW — 119 — — ns Cycle Time tCY — 952 — — ns Input Data Setup Time tDS — 120 — — ns Input Data Hold Time tDH *1 120 — — ns INT Input Data Pulse Width tDW1 — 120 — — ns CT Clock Pulse Width tDW2 — — — ns tDR CL = 15 pF — — 300 ns tWRS *2 2 tCY — — ns Data Delay Time Reset Input Pulse Width 2/8 tCY + 120 *1 To release power down by inputting an "L" level into INT pin, the pulse width should be longer than the time for the oscillation stabilization at OSC0. *2 The condition of stable oscillation. To release power down by reset, the pulse width should be longer than the time for oscillation stabilization at OSC0. 7/12 ¡ Semiconductor MSM6442 Timing Diagrams OSC0 tfW tfW tCY OSC0 P0, P1, P3, P4 INPUT DATA tDS tDH OSC0 P0, P1, P3, P4 OUTPUT DATA tDR INT tDW1 P1.0/CIN tDW2 tDW2 RESET tWRS 8/12 ¡ Semiconductor MSM6442 Output Waveforms for LCD Drivers Static mode VDD COM1, COM2 LCDGND VDD SEGn (n = 1 to 46) LCDGND VDD–LCDGND COM1 to SEGn COM2 to SEGn DISPLAY OFF 0 ON DISPLAY OFF OFF = –(VDD–LCDGND) Dynamic mode COM1 VDD VM LCDGND COM2 VDD VM LCDGND VDD SEGn (n = 1 to 46) LCDGND COM1 to SEGn VDD–LCDGND VM–LCDGND 0 = –(VM–LCDGND) = –(VDD–LCDGND) DISPLAY OFF ON OFF COM2 to SEGn DISPLAY OFF OFF ON VDD–LCDGND VM–LCDGND 0 = –(VM–LCDGND) = –(VDD–LCDGND) 9/12 ¡ Semiconductor MSM6442 NOTES ON USE Notes on Using Ports 5 and 6 of MSM6442 The MSM6442 uses Port 5 (P5) and Port 6 (P6) to rewrite the display in the LCD and the dedicated registers in LCD section, and to read the interrupt indication flag. Writing and reading is completed when data has been written using P5 and P6, in this order successively. Therefore, if an interrupt occurs during operation of P5 and P6 and these ports are operated by the interrupt routine, the MSM6442 may not operate normally. Countermeasure Disable a process interruption during operation of P5 and P6. Make the program interrupt disabled when rewriting the display in LCD, rewriting a dedicated register such as the system control register (SCR), or reading/resetting the interrupt indication flag. Note that the program examples provided in the User's Manual use the assumption that each program is in the interrupt disabled state. Therefore, when executing any of the program examples in the interrupt enabled state, execute the MDI and MEI instructions according to the following examples: (1) Writing data into a dedicated register LAI m Set write data m MDI Disable interrupt (*1) OPD 6 LAI n Set control command n OPD 5 MEI Enable interrupt (*2) RPBD 5, 3 End of write processing (2) Reading the interrupt indication flag LAI 0FH MDI Disable interrupt (*1) OPD 6 LAI 0AH Set control command 0AH OPD 5 IPD 6 Read flag MEI Enable interrupt (*2) RPBD 5, 3 End of read processing *1 If an accumulator is not saved during interrupt processing, the MDI instruction must be executed before the LAI instruction is executed. *2 During actual processing, an interrupt is enabled after the execution of the RPBD 5, 3 instruction. 10/12 ¡ Semiconductor MSM6442 PACKAGE DIMENSIONS (Unit : mm) QFP80-P-1420-0.80-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/12 ¡ Semiconductor MSM6442 (Unit : mm) QFP80-P-1420-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Epoxy resin 42 alloy Solder plating 5 mm or more Package weight (g) 1.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12