TI DS90LV012A

DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
DS90LV012A /DS90LT012A 3V LVDS Single CMOS Differential Line Receiver
Check for Samples: DS90LT012A, DS90LV012A
FEATURES
DESCRIPTION
•
•
•
•
•
The DS90LV012A and DS90LT012A are single
CMOS differential line receivers designed for
applications requiring ultra low power dissipation, low
noise, and high data rates. The devices are designed
to support data rates in excess of 400 Mbps (200
MHz) utilizing Low Voltage Differential Swing (LVDS)
technology
1
2
•
•
•
•
•
•
•
•
•
•
•
•
Compatible with ANSI TIA/EIA-644-A Standard
>400 Mbps (200 MHz) switching rates
100 ps differential skew (typical)
3.5 ns maximum propagation delay
Integrated line termination resistor (102Ω
typical)
Single 3.3V power supply design (2.7V to 3.6V
range)
Power down high impedance on LVDS inputs
Accepts small swing (350 mV typical)
differential signal levels
LVDS receiver inputs accept
LVDS/BLVDS/LVPECL inputs
Supports open, short and terminated input failsafe
Pinout simplifies PCB layout
Low Power Dissipation (10mW [email protected] 3.3V
static)
SOT-23 5-lead package
Leadless WSON-8 package (3x3 mm body size)
Electrically similar to the DS90LV018A
Fabricated with advanced CMOS process
technology
Industrial temperature operating range (−40°C
to +85°C)
The DS90LV012A and DS90LT012A accept low
voltage (350 mV typical) differential input signals and
translates them to 3V CMOS output levels. The
receivers also support open, shorted, and terminated
(100Ω) input fail-safe. The receiver output will be
HIGH for all fail-safe conditions. The DS90LV012A
has a pinout designed for easy PCB layout. The
DS90LT012A includes an input line termination
resistor for point-to-point applications.
The DS90LV012A and DS90LT012A, and companion
LVDS line driver provide a new alternative to high
power PECL/ECL devices for high speed interface
applications.
Connection Diagram
Figure 1. Top View
See Package Number DBV (R-PDSO-G5)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
DS90LT012A, DS90LV012A
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
www.ti.com
Figure 2. Top View
See Package Number NGK0008A
Functional Diagram
Figure 3. DS90LV012A
Figure 4. DS90LT012A
Truth Table
INPUTS
OUTPUT
[IN+] − [IN−]
TTL OUT
VID ≥ 0V
H
VID ≤ −0.1V
L
Full Fail-safe OPEN/SHORT or Terminated
H
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
Absolute Maximum Ratings
(1)
−0.3V to +4V
Supply Voltage (VDD)
−0.3V to +3.9V
Input Voltage (IN+, IN−)
−0.3V to (VDD + 0.3V)
Output Voltage (TTL OUT)
−100mA
Output Short Circuit Current
Maximum Package Power Dissipation @ +25°C
NGK Package
2.26 W
Derate NGK Package
18.1 mW/°C above +25°C
Thermal resistance (θJA)
55.3°C/W
DBV Package
902mW
Derate DBV Package
7.22 mW/°C above +25°C
Thermal resistance (θJA)
138.5°C/W
−65°C to +150°C
Storage Temperature Range
Lead Temperature Range Soldering (4 sec.)
+260°C
Maximum Junction Temperature
+150°C
ESD Ratings
(1)
(2)
(2)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
ESD Ratings:
(a) DS90LV012A:
(a) HBM (1.5 kΩ, 100 pF) ≥ 2kV
(b) EIAJ (0Ω, 200 pF) ≥ 900V
(c) CDM ≥ 2000V
(d) IEC direct (330Ω, 150 pF) ≥ 5kV
(b) DS90LT012A:
(a) HBM (1.5 kΩ, 100 pF) ≥ 2kV
(b) EIAJ (0Ω, 200 pF) ≥ 700V
(c) CDM ≥ 2000V
(d) IEC direct (330Ω, 150 pF) ≥ 7kV
Recommended Operating Conditions
Supply Voltage (VDD)
Operating Free Air Temperature (TA)
Min
Typ
Max
Units
+2.7
+3.3
+3.6
V
−40
25
+85
°C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.
(1)
(2)
(1) (2)
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified (such as VID).
All typicals are given for: VDD = +3.3V and TA = +25°C.
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
Submit Documentation Feedback
3
DS90LT012A, DS90LV012A
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
www.ti.com
Electrical Characteristics (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2)
Symbol
Parameter
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
VCM
Common-Mode Voltage
IIN
Input Current (DS90LV012A)
Conditions
VCM dependant on VDD
(3)
Pin
IN+, IN−
−100
Change in Magnitude of IIN
0
mV
−30
mV
V
0.05
VDD - 0.3V
V
VIN = +2.8V
−10
±1
+10
μA
−10
±1
+10
μA
+20
μA
VDD = 3.6V or 0V
VIN = +3.6V
VDD = 0V
VIN = +2.8V
VDD = 3.6V or 0V
−20
VDD = 0V
Differential Input Current
VIN+ = +0.4V, VIN− = +0V
(DS90LT012A)
VIN+ = +2.4V, VIN− = +2.0V
Integrated Termination Resistor
(DS90LT012A)
CIN
Input Capacitance
IN+ = IN− = GND
VOH
Output High Voltage
IOH = −0.4 mA, VID = +200 mV
3
4
μA
4
μA
4
μA
3.9
4.4
mA
102
Ω
3
pF
2.4
3.1
V
IOH = −0.4 mA, Inputs terminated
2.4
3.1
V
IOH = −0.4 mA, Inputs shorted
2.4
3.1
VOL
Output Low Voltage
IOL = 2 mA, VID = −200 mV
IOS
Output Short Circuit Current
VOUT = 0V
(4)
VCL
Input Clamp Voltage
ICL = −18 mA
IDD
No Load Supply Current
Inputs Open
4
−30
VDD = 3.0V to 3.6V, VID = 100mV
RT
(4)
Units
2.35
VIN = +3.6V
(3)
Max
0.05
VIN = 0V
IIND
Typ
VDD = 2.7V, VID = 100mV
VIN = 0V
ΔIIN
Min
TTL OUT
VDD
V
0.3
0.5
V
−15
−50
−100
mA
−1.5
−0.7
5.4
V
9
mA
VDD is always higher than IN+ and IN− voltage. IN+ and IN− are allowed to have voltage range −0.05V to +2.35V when VDD = 2.7V and
|VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V. VID is not allowed to be greater than 100 mV when VCM = 0.05V to 2.35V when VDD =
2.7V or when VCM = |VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V.
Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted
at a time, do not exceed maximum junction temperature specification.
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol
Parameter
(1) (2)
Conditions
Min
Typ
Max
Units
tPHLD
Differential Propagation Delay High to Low
CL = 15 pF
1.0
1.8
3.5
ns
tPLHD
Differential Propagation Delay Low to High
VID = 200 mV
1.0
1.7
3.5
ns
tSKD1
Differential Pulse Skew |tPHLD − tPLHD|
0
100
400
ps
tSKD3
Differential Part to Part Skew
(4)
0
0.3
1.0
ns
tSKD4
Differential Part to Part Skew
(5)
0
0.4
1.5
ns
tTLH
Rise Time
350
800
ps
tTHL
Fall Time
175
800
ps
fMAX
(1)
(2)
(3)
(4)
(5)
(6)
Maximum Operating Frequency
(3)
(Figure 5 and Figure 6)
(6)
200
250
MHz
CL includes probe and jig capacitance.
Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3 ns for IN±.
tSKD1 is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of
the same channel.
tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
at the same VDD and within 5°C of each other within the operating temperature range.
tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over the recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35 peak to peak). Output criteria:
60%/40% duty cycle, VOL (max 0.4V), VOH (min 2.4V), load = 15 pF (stray plus probes). The parameter is ensured by design. The limit
is based on the statistical analysis of the device over the PVT range by the transition times (tTLH and tTHL).
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
Submit Documentation Feedback
5
DS90LT012A, DS90LV012A
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 5. Receiver Propagation Delay and Transition Time Test Circuit
Figure 6. Receiver Propagation Delay and Transition Time Waveforms
TYPICAL APPLICATIONS
Balanced System
Figure 7. Point-to-Point Application (DS90LV012A)
Balanced System
Figure 8. Point-to-Point Application (DS90LT012A)
6
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
APPLICATION INFORMATION
General application guidelines and hints for LVDS drivers and receivers may be found in the following application
notes: LVDS Owner's Manual (SNLA187), AN-808 (SNLA028), AN-977 (SNLA166), AN-971 (SNLA165), AN-916
(SNLA219), AN-805 (SNOA233), AN-903 (SNLA034).
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 7. This configuration provides a clean signaling environment for the fast edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of the media is in the
range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to
the receiver input pins as possible. The termination resistor converts the driver output (current mode) into a
voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration,
but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination loading must be taken into account.
The DS90LV012A and DS90LT012A differential line receivers are capable of detecting signals as low as 100
mV, over a ±1V common-mode range centered around +1.2V. This is related to the driver offset voltage which is
typically +1.2V. The driven signal is centered around this voltage and may shift ±1V around this center point. The
±1V shifting may be the result of a ground potential difference between the driver's ground reference and the
receiver's ground reference, the common-mode effects of coupled noise, or a combination of the two. The AC
parameters of both receiver input pins are optimized for a recommended operating input voltage range of 0V to
+2.4V (measured from each pin to ground). The device will operate for receiver input voltages up to VDD, but
exceeding VDD will turn on the ESD protection circuitry which will clamp the bus voltages.
POWER DECOUPLING RECOMMENDATIONS
Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended)
0.1μF and 0.001μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the
device supply pin. Additional scattered capacitors over the printed circuit board will improve decoupling. Multiple
vias should be used to connect the decoupling capacitors to the power planes. A 10μF (35V) or greater solid
tantalum capacitor should be connected at the power entry point on the printed circuit board between the supply
and ground.
PC BOARD CONSIDERATIONS
Use at least 4 PCB board layers (top to bottom): LVDS signals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL signals may couple onto the LVDS lines. It is best to
put TTL and LVDS signals on different layers which are isolated by a power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
For PC board considerations for the WSON package, please refer to application note AN-1187 “Leadless
Leadframe Package” (SNOA401). It is important to note that to optimize signal integrity (minimize jitter and noise
coupling), the WSON thermal land pad, which is a metal (normally copper) rectangular region located under the
package, should be attached to ground and match the dimensions of the exposed pad on the PCB (1:1 ratio).
DIFFERENTIAL TRACES
Use controlled impedance traces which match the differential impedance of your transmission medium (ie. cable)
and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave
the IC (stubs should be < 10mm long). This will help eliminate reflections and ensure noise is coupled as
common-mode. In fact, we have seen that differential signals which are 1mm apart radiate far less noise than
traces 3mm apart since magnetic field cancellation is much better with the closer traces. In addition, noise
induced on the differential lines is much more likely to appear as common-mode which is rejected by the
receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals which destroys the magnetic field cancellation benefits of differential signals and EMI
will result! (Note that the velocity of propagation, v = c/E r where c (the speed of light) = 0.2997mm/ps or 0.0118
in/ps). Do not rely solely on the autoroute function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number of vias and other
discontinuities on the line.
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
Submit Documentation Feedback
7
DS90LT012A, DS90LV012A
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
www.ti.com
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode
rejection of the receivers. On the printed circuit board, this distance should remain constant to avoid
discontinuities in differential impedance. Minor violations at connection points are allowable.
TERMINATION
DS90LV012A:
Use a termination resistor which best matches the differential impedance or your transmission line. The resistor
should be between 90Ω and 130Ω. Remember that the current mode outputs need the termination resistor to
generate the differential voltage. LVDS will not work without resistor termination. Typically, connecting a single
resistor across the pair at the receiver end will suffice.
Surface mount 1% - 2% resistors are the best. PCB stubs, component lead, and the distance from the
termination to the receiver inputs should be minimized. The distance between the termination resistor and the
receiver should be < 10mm (12mm MAX).
DS90LT012A:
The DS90LT012A integrates the terminating resistor for point-to-point applications. The resistor value will be
between 90Ω and 133Ω.
THRESHOLD
The LVDS Standard (ANSI/TIA/EIA-644-A) specifies a maximum threshold of ±100mV for the LVDS receiver.
The DS90LV012A and DS90LT012A support an enhanced threshold region of −100mV to 0V. This is useful for
fail-safe biasing. The threshold region is shown in the Voltage Transfer Curve (VTC) in Figure 9. The typical
DS90LV012A or DS90LT012A LVDS receiver switches at about −30mV. Note that with VID = 0V, the output will
be in a HIGH state. With an external fail-safe bias of +25mV applied, the typical differential noise margin is now
the difference from the switch point to the bias point. In the example below, this would be 55mV of Differential
Noise Margin (+25mV − (−30mV)). With the enhanced threshold region of −100mV to 0V, this small external failsafe biasing of +25mV (with respect to 0V) gives a DNM of a comfortable 55mV. With the standard threshold
region of ±100mV, the external fail-safe biasing would need to be +25mV with respect to +100mV or +125mV,
giving a DNM of 155mV which is stronger fail-safe biasing than is necessary for the DS90LV012A or
DS90LT012A. If more DNM is required, then a stronger fail-safe bias point can be set by changing resistor
values.
Figure 9. VTC of the DS90LV012A and DS90LT012A LVDS Receivers
8
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
FAIL-SAFE FEATURE
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS
logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from
appearing as a valid signal.
The receiver's internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe
protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs.
1. Open Input Pins. The DS90LV012A and DS90LT012A are single receiver devices. It is not required to tie
the receiver inputs to ground or any supply voltage. Internal failsafe circuitry will ensure a HIGH, stable
output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a power-off condition,
the receiver output will again be in a HIGH state, even with the end of cable 100Ω termination resistor across
the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable
picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch.
To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be
used. Twisted pair cable will offer better balance than flat ribbon cable.
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V
differential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not
supported across the common-mode range of the device (GND to 2.4V). It is only supported with inputs
shorted and no external common-mode voltage applied.
External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the
presence of higher noise levels. The pull up and pull down resistors should be in the 5kΩ to 15kΩ range to
minimize loading and waveform distortion to the driver. The common-mode bias point should be set to
approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry.
The DS90LV012A and DS90LT012A are compliant to the original ANSI EIA/TIA-644 specification and is also
compliant to the new ANSI EIA/TIA-644-A specification with the exception the newly added ΔIIN specification.
Due to the internal fail-safe circuitry, ΔIIN cannot meet the 6µA maximum specified. This exception will not be
relevant unless more than 10 receivers are used.
Additional information on fail-safe biasing of LVDS devices may be found in AN-1194 (SNLA051).
PROBING LVDS TRANSMISSION LINES
Always use high impedance (> 100kΩ), low capacitance (< 2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing will give deceiving results.
CABLES AND CONNECTORS, GENERAL COMMENTS
When choosing cable and connectors for LVDS it is important to remember:
Use controlled impedance media. The cables and connectors you use should have a matched differential
impedance of about 100Ω. They should not introduce major impedance discontinuities.
Balanced cables (e.g. twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax) for
noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and
also tend to pick up electromagnetic radiation a common-mode (not differential mode) noise which is rejected by
the receiver.
For cable distances < 0.5M, most cables can be made to work effectively. For distances 0.5M ≤ d ≤ 10M, CAT 3
(category 3) twisted pair cable works well, is readily available and relatively inexpensive.
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
Submit Documentation Feedback
9
DS90LT012A, DS90LV012A
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
www.ti.com
Pin Functions
Pin Descriptions
Package Pin Number
10
Pin Name
Description
SOT-23
WSON
4
1
IN−
Inverting receiver input pin
3
3
IN+
Non-inverting receiver input pin
5
8
TTL OUT
Receiver output pin
1
6
VDD
Power supply pin, +3.3V ± 0.3V
2
2, 7
GND
Ground pin
4, 5
NC
No connect
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
DS90LT012A, DS90LV012A
www.ti.com
SNLS141D – AUGUST 2002 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LT012A DS90LV012A
Submit Documentation Feedback
11
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90LT012ATMF
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
N03
DS90LT012ATMF/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N03
DS90LV012ATMF
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
N02
DS90LV012ATMF/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N02
DS90LV012ATMFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N02
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
SOT-23
DBV
5
1000
178.0
8.4
DS90LT012ATMF/NOPB SOT-23
DS90LT012ATMF
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
DS90LV012ATMF/NOPB SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
DS90LV012ATMFX/NOPB SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
DS90LV012ATMF
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90LT012ATMF
SOT-23
DBV
5
1000
210.0
185.0
35.0
DS90LT012ATMF/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
DS90LV012ATMF
SOT-23
DBV
5
1000
210.0
185.0
35.0
DS90LV012ATMF/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
DS90LV012ATMFX/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated