TI SN74LV163ADBRE4

SCLS405F − APRIL 1998 − REVISED APRIL 2005
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
RCO
QA
QB
QC
QD
ENT
LOAD
CLK
A
B
C
D
ENP
16
CLK
CLR
NC
VCC
RCO
1
SN54LV163A . . . FK PACKAGE
(TOP VIEW)
15 RCO
14 QA
2
3
A
B
NC
C
D
13 QB
12 QC
4
5
11 QD
10 ENT
6
7
8
9
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
ENP
GND
NC
16
VCC
1
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV163A . . . RGY PACKAGE
(TOP VIEW)
SN54LV163A . . . J OR W PACKAGE
SN74LV163A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
CLR
CLK
A
B
C
D
ENP
GND
D
LOAD
D
D
D
CLR
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
Internal Look Ahead for Fast Counting
Carry Output for n-Bit Cascading
GND
D
D Synchronous Counting
D Synchronously Programmable
D Ioff Supports Partial-Power-Down Mode
QA
QB
NC
QC
QD
LOAD
ENT
D 2-V to 5.5-V VCC Operation
D Max tpd of 9.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
NC − No internal connection
description/ordering information
ORDERING INFORMATION
QFN − RGY
SN74LV163ARGYR
Tube of 40
SN74LV163AD
Reel of 2500
SN74LV163ADR
SOP − NS
Reel of 2000
SN74LV163ANSR
74LV163A
SSOP − DB
Reel of 2000
SN74LV163ADBR
LV163A
Tube of 90
SN74LV163APW
Reel of 2000
SN74LV163APWR
Reel of 250
SN74LV163APWT
TVSOP − DGV
Reel of 2000
SN74LV163ADGVR
LV163A
CDIP − J
Tube of 25
SNJ54LV163AJ
SNJ54LV163AJ
CFP − W
Tube of 150
SNJ54LV163AW
SNJ54LV163AW
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV163A
LV163A
LV163A
LCCC − FK
Tube of 55
SNJ54LV163AFK
SNJ54LV163AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"#$% !%&% '
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*&)&#$$)POST OFFICE BOX 655303
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1
SCLS405F − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
The ’LV163A devices are 4-bit synchronous binary counters designed for 2-V to 5.5-V VCC operation.
These synchronous, presettable counters feature an internal carry look ahead for application in high-speed
counting designs. The ’LV163A devices are 4-bit binary counters. Synchronous operation is provided by having
all flip-flops clocked simultaneously so that the outputs change coincident with each other when instructed by
the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting
spikes normally associated with synchronous (ripple-clock) counters. A buffered clock (CLK) input triggers the
four flip-flops on the rising (positive-going) edge of the clock waveform.
These counters are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. As
presetting is synchronous, setting up a low level at the load input disables the counter and causes the outputs
to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs.
The clear function for the ’LV163A devices is synchronous. A low level at the clear (CLR) input sets all four of
the flip-flop outputs low after the next low-to-high transition of CLK, regardless of the levels of the enable inputs.
This synchronous clear allows the count length to be modified easily by decoding the Q outputs for the maximum
count desired. The active-low output of the gate used for decoding is connected to CLR to synchronously clear
the counter to 0000 (LLLL).
The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without
additional gating. ENP, ENT, and a ripple-carry output (RCO) are instrumental in accomplishing this function.
Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a
high-level pulse while the count is maximum (9 or 15 with QA high). This high-level overflow ripple-carry pulse
can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the
level of CLK.
These counters feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that
modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of
the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the
stable setup and hold times.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
INPUTS
2
OUTPUTS
CLR
LOAD
ENP
ENT
CLK
L
X
X
X
X
FUNCTION
QA
QB
QC
QD
L
L
L
L
Reset to “0”
B
C
D
Preset data
H
L
X
X
H
H
X
L
No change
No count
H
H
L
X
No change
No count
H
H
H
H
Count up
Count
H
X
X
X
No change
No count
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SCLS405F − APRIL 1998 − REVISED APRIL 2005
logic diagram (positive logic)
LOAD
ENT
ENP
9
10
15
LD†
7
RCO
CK†
CLK
CLR
2
1
CK
LD
R
A
B
C
D
M1
G2
1, 2T/1C3
G4
3D
4R
3
M1
G2
1, 2T/1C3
G4
3D
4R
4
M1
G2
1, 2T/1C3
G4
3D
4R
5
M1
G2
1, 2T/1C3
G4
3D
4R
6
14
13
12
11
QA
QB
QC
QD
† For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown
on the logic diagram of the D/T flip-flops.
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
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3
SCLS405F − APRIL 1998 − REVISED APRIL 2005
logic diagram, each D/T flip-flop (positive logic)
CK
LD
TE
LD†
TG
TG
LD†
Q
TG
TG
CK†
D
TG
CK†
R
† The origins of LD and CK are shown in the overall logic diagram of the device.
4
POST OFFICE BOX 655303
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CK†
TG
CK†
SCLS405F − APRIL 1998 − REVISED APRIL 2005
typical clear, preset, count, and inhibit sequence
The following sequence is illustrated below:
1. Clear outputs to zero (synchronous)
2. Preset to binary 12
3. Count to 13, 14, 15, 0, 1, and 2
4. Inhibit
CLR
LOAD
A
Data
Inputs
B
C
D
CLK
ENP
ENT
QA
Data
Outputs
QB
QC
QD
RCO
12
13
14
15
0
1
Count
2
Inhibit
Sync Preset
Clear
Async
Clear
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5
SCLS405F − APRIL 1998 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in high or low state, VO (see Notes 1 and 2) . . . . . . . . . . −0.5 V to VCC + 0.5 V
Voltage range applied to any output in the power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
6
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SCLS405F − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV163A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
Output voltage
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
0
0
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
V
VCC
−50
µA
0
V
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
200
200
100
100
20
20
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
VCC × 0.3
5.5
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
MAX
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV163A
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV163A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
IOL = 6 mA
IOL = 12 mA
Ioff
Ci
VI or VO = 0 to 5.5 V
VI = VCC or GND
IO = 0
TYP
SN74LV163A
MAX
MIN
VCC−0.1
2
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
2.3 V
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VI = VCC or GND,
MIN
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
II
ICC
VCC
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
1.8
1.8
pF
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$1% *&$ ( $2$,*#$%- &)&!$)! && &% $)
*$!(!&% &)$ $1% 1&,- $.& %)"#$% )$$)2$ $ )1 !&%1$ ) !%%"$ $$ *)"! /" %!$-
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SCLS405F − APRIL 1998 − REVISED APRIL 2005
timing
requirements
over
recommended
operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
free-air
TA = 25°C
MIN
MAX
tw
Pulse duration, CLK high or low
th
Setup time before CLK↑
6
Data (A, B, C, and D)
7.5
8.5
8.5
ENP, ENT
9.5
11
11
LOAD low
10
11.5
11.5
1.5
1.5
1.5
Pulse duration, CLK high or low
Hold time, all synchronous inputs after CLK↑
SN54LV163A
MIN
MAX
MAX
UNIT
ns
ns
ns
temperature
range,
SN74LV163A
MIN
5
5
5
4
4
4
Data (A, B, C, and D)
5.5
6.5
6.5
ENP, ENT
7.5
9
9
LOAD low
8
9.5
9.5
1
1
1
CLR
th
MIN
7
free-air
range,
SN74LV163A
6
TA = 25°C
MIN
MAX
Setup time before CLK↑
MAX
7
Hold time, all synchronous inputs after CLK↑
tsu
MIN
6
timing
requirements
over
recommended
operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
tw
SN54LV163A
7
CLR
tsu
temperature
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration, CLK high or low
tsu
Setup time before CLK↑
th
Hold time, all synchronous inputs after CLK↑
MIN
MAX
SN74LV163A
MIN
5
5
5
CLR
3.5
3.5
3.5
Data (A, B, C, and D)
4.5
4.5
4.5
ENP, ENT
5
6
6
LOAD low
5
6
6
1
1
1
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$1% *&$ ( $2$,*#$%- &)&!$)! && &% $)
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8
SN54LV163A
POST OFFICE BOX 655303
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MAX
UNIT
ns
ns
ns
SCLS405F − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
TYP
MAX
tpd
ENT
50*
115*
40*
40
CL = 50 pF
30
90
25
25
tpd
RCO
(preset mode)
ENT
MAX
MIN
MAX
UNIT
MHz
8.5*
16.2*
1*
19.5*
1
19.5
9.1*
17*
1*
20.5*
1
20.5
12.1*
20.6*
1*
24.5*
1
24.5
8.7*
15.7*
1*
19*
1
19
11
19.2
1
22.5
1
22.5
11.9
20
1
23.5
1
23.5
14.6
23.6
1
27.5
1
27.5
11.7
18.7
1
22
1
22
CL = 15 pF
ns
RCO
RCO
(count mode)
MIN
range,
SN74LV163A
CL = 15 pF
Q
CLK
SN54LV163A
MIN
RCO
(count mode)
RCO
(preset mode)
temperature
LOAD
CAPACITANCE
Q
CLK
free-air
CL = 50 pF
ns
RCO
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
CLK
tpd
TA = 25°C
TYP
MAX
tpd
CL = 15 pF
80*
160*
70*
70
CL = 50 pF
55
125
50
50
MIN
MAX
MIN
MAX
UNIT
MHz
12.8*
1*
15*
1
15
RCO
(count mode)
6.8*
13.6*
1*
16*
1
16
8.8*
17.2*
1*
20*
1
20
6.5*
12.3*
1*
14.5*
1
14.5
8
16.3
1
18.5
1
18.5
8.8
17.1
1
19.5
1
19.5
10.7
20.7
1
23.5
1
23.5
8.2
15.8
1
18
1
18
CL = 15 pF
ns
RCO
RCO
(count mode)
range,
SN74LV163A
MIN
6.2*
RCO
(preset mode)
ENT
SN54LV163A
LOAD
CAPACITANCE
Q
CLK
temperature
Q
RCO
(preset mode)
ENT
free-air
CL = 50 pF
ns
RCO
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
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SCLS405F − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
TYP
MAX
tpd
135*
210*
115*
115
CL = 50 pF
95
160
85
85
tpd
MIN
MAX
1*
9.5*
1
9.5
5.2*
8.1*
1*
9.5*
1
9.5
6.4*
10.3*
1*
12*
1
12
RCO
4.9*
8.1*
1*
9.5*
1
9.5
Q
6.1
10.1
1
11.5
1
11.5
6.6
10.1
1
11.5
1
11.5
7.8
12.3
1
14
1
14
6.3
10.1
1
11.5
1
11.5
RCO
(preset mode)
UNIT
MHz
8.1*
RCO
(count mode)
ENT
MAX
range,
SN74LV163A
CL = 15 pF
MIN
4.7*
RCO
(preset mode)
CLK
SN54LV163A
MIN
RCO
(count mode)
ENT
temperature
LOAD
CAPACITANCE
Q
CLK
free-air
CL = 15 pF
ns
CL = 50 pF
ns
RCO
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV163A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.3
0.8
V
Quiet output, minimum dynamic VOL
−0.2
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
26
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
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$1% *&$ ( $2$,*#$%- &)&!$)! && &% $)
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f = 10 MHz
23.8
pF
SCLS405F − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
From Output
Under Test
Test
Point
RL = 1 kΩ
S1
VCC
Open
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
50% VCC
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
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11
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV163AD
ACTIVE
SOIC
D
16
SN74LV163ADBR
ACTIVE
SSOP
DB
SN74LV163ADBRE4
ACTIVE
SSOP
SN74LV163ADE4
ACTIVE
SN74LV163ADGVR
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV163ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV163ARGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
40
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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