ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Applications • • • • • 2G/3G/4G Wireless Infrastructure Base station Transceivers / Repeaters GSM / CDMA / WCDMA / LTE HPA Feedback Paths ISM (industrial, scientific and medical) 8-pin MSOP-8 package Product Features • • • • • • • • • Functional Block Diagram High dynamic range mixer with integrated LO driver +36 dBm Input IP3 9 dB Conversion Loss RF: 700 – 1000 MHz LO: 540 – 1300 MHz IF: 70 – 300 MHz +5V Supply @ 50 mA 0 dBm Drive Level RoHS-compliant MSOP-8 (14mm2) General Description LO 1 8 RF GND 2 7 GND GND 3 6 GND Vcc 4 5 IF Pin Configuration The ML483 high linearity converter combines a passive GaAs FET mixer with an integrated LO driver in an ultrasmall lead-free/green/RoHS-compliant MSOP-8 package. The double-balanced integrated IC is able to operate across a 0.7-1.0 GHz frequency range to achieve +36 dBm Input IP3 while drawing a very low 50mA current. The ML483 can be used as an upconverter or downconverter in a lowside or high-side LO configuration. Pin # Symbol 1 4 5 8 2, 3, 6, 7 Backside Paddle LO Vcc IF RF GND GND A LO buffer amplifier is integrated on the chip to allow for operation directly from a synthesizer requiring only 0 dBm of drive level. The dual-stage LO driver provides a stable input power level into the mixer to allow for consistent performance over a wide range of LO power levels. The converter requires no external baluns and supports a wide range of IF frequencies. Typical applications include frequency up/down conversion, modulation and demodulation for receivers and transmitters used in 2.5G and 3G mobile infrastructure. Due to the wide frequency range of operation, the converter can also be used for ISM and fixed wireless applications. Ordering Information The ML483 is footprint and pin compatible with TriQuint’s 1.6-3.2 GHz ML485 mixer for high band applications. Part No. Description ML483-G ML483-PCB 0.7-1.0 GHz Mixer Fully Assembled Evaluation PCB Standard T/R size = 1000 pieces on a 7” reel. Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. - 1 of 8 - Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Specifications Absolute Maximum Ratings Recommended Operating Conditions Parameter Rating Parameter Min Typ Storage Temperature Thermal Resistance (jnc. to case) θjc Vcc LO Power RF Input Power, CW, 50Ω,T = 25ºC -65 to 150 oC 81 oC/W +7 V +10 dBm +27 dBm Vcc Icc Case Temperature Max TJ (for 106 hours MTTF) RF Input Power 4.75 5 50 -40 Max Units 5.25 85 150 +10 V mA o C o C dBm Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: 25 °C, 0 dBm LO drive, IF = 140 MHz , Vcc = +5V in a downconverting configuration with a high-side LO Parameter RF Frequency Range LO Frequency Range IF Frequency Range SSB Conversion Loss [2] Input IP3 [1] [2] LO leakage at RF port LO leakage at IF port RF – IF Isolation Return Loss: RF Port Return Loss: IF Port Return Loss: LO Port Input P1dB LO Drive Level Operating Supply Voltage Operating Current Units Min MHz MHz MHz dB dBm dBm dBm dB dB dB dB dBm dBm V mA -4 Typ Max 700-800 770-1040 70-240 9.2 +37 -17 -11 12.5 13 11 11 +24 0 +5 50 Min +30 +4 -4 Typ 800-1000 870-1240 70-240 8.6 +36 -18 -15 16 16 12 14 +23.5 0 +5 50 Max 10.5 +4 Notes: 1. IIP3 is measured with ∆f = 1 MHz with RFin = 0 dBm / tone. 2. Min/Max conditions tested with LO=1041 MHz, RF=901 MHz, IF=140 MHz Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. - 2 of 8 - Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Device Characterization Data Spur Table All spur tables are N × fRF – M × fLO mixer spurious products for 0 dBm input power, unless otherwise noted. RF Freq = 900 MHz LO Freq = 1041 MHz All values relative to the IF power level. M N 0 1 2 3 4 5 0 1 2 3 4 5 -- 8 dBc 13 dBc 15 dBc 10 dBc 9 dBc 8 dBc 0 dBc 43 dBc 19 dBc 34 dBc 22 dBc 54 dBc 59 dBc 44 dBc 65 dBc 53 dBc 64 dBc 85 dBc 91 dBc 87 dBc 79 dBc 91 dBc 84 dBc 99 dBc 100 dBc 100 dBc 99 dBc 100 dBc 98 dBc 101 dBc 100 dBc 97 dBc 99 dBc 99 dBc 100 dBc Application Circuit Notes: 1. See PC Board Layout, page 6 for more information. Bill of Material Reference Desg. U1 C1 C2 Value Description 0.01 uF Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. High IP3 Mixer with LO Amp Chip, 0603, 50V, 5%, NPO Do Not Place - 3 of 8 - Manufacturer Part Number TriQuint various ML483-G Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Typical Performance 0.7-1.0 GHz Performance using the circuitry on the ML483-PCB evaluation board. Conversion Loss vs RF Freq. vs If Freq. Input IP3 vs RF Freq. vs IF Freq. Input P1dB vs RF Freq. +25oC, LO=0dBm, high-side LO +25oC, LO=0dBm, high-side LO +25oC, IF=140MHz, LO=0dBm, high-side LO 42 12 10 8 38 36 750 800 850 900 RF Frequency (MHz) 950 1000 750 800 850 900 RF Frequency (MHz) 950 Conversion Loss vs RF Freq. vs Temp. Conversion Loss vs RF Freq. vs Temp. LO=0dBm, IF=70MHz, high-side LO LO=0dBm, IF=140MHz, high-side LO 700 10 8 6 4 750 800 850 900 RF Frequency (MHz) 950 12 10 8 6 750 800 850 900 RF Frequency (MHz) 950 Conversion Loss vs RF Freq. vs LO Power +25oC, IF=70MHz, high-side LO +25oC, IF=140MHz, high-side LO 10 8 6 4 750 800 850 900 RF Frequency (MHz) 950 Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. 1000 8 6 750 800 850 900 RF Frequency (MHz) 950 1000 +25oC, IF=240MHz, high-side LO 16 +4 dBm 0 dBm -4 dBm 14 12 10 8 6 4 700 10 Conversion Loss vs RF Freq. vs LO Power Conversion Loss (dB) Conversion Loss (dB) 12 12 700 16 +4 dBm 0 dBm -4 dBm +85°C +25°C -40°C 14 1000 Conversion Loss vs RF Freq. vs LO Power 14 950 4 700 16 900 LO=0dBm, IF=240MHz, high-side LO +85°C +25°C -40°C 14 1000 800 850 RF Frequency (MHz) 16 4 700 750 Conversion Loss vs RF Freq. vs Temp. Conversion Loss (dB) 12 Conversion Loss (dB) +85°C +25°C -40°C 22 1000 16 14 24 18 700 16 26 20 32 700 Conversion Loss (dB) 240 MHz 140 MHz 70 MHz 40 34 6 4 Conversion Loss (dB) 28 Input P1dB (dBm) 240 MHz 140 MHz 70 MHz 14 Input IP3 (dBm) Conversion Loss (dB) 16 +4 dBm 0 dBm -4 dBm 14 12 10 8 6 4 700 750 800 850 900 RF Frequency (MHz) - 4 of 8 - 950 1000 700 750 800 850 900 RF Frequency (MHz) 950 1000 Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Typical Performance 0.7-1.0 GHz Performance using the circuitry on the ML483-PCB evaluation board. Input IP3 vs RF Freq. vs Temp. LO=0dBm, IF=70MHz, high-side LO LO=0dBm, IF=140MHz, high-side LO 42 38 36 34 +85°C +25°C -40°C 40 38 36 800 850 900 RF Frequency (MHz) 950 1000 Input IP3 vs RF Freq. vs LO Power 750 800 850 900 RF Frequency (MHz) 1000 700 38 36 34 32 800 850 900 RF Frequency (MHz) 950 1000 38 36 750 800 850 900 RF Frequency (MHz) +25oC, LO = 0 dBm 950 700 5 0 800 850 900 RF Frequency (MHz) 950 RF = 700 MHz RF = 800 MHz RF = 900 MHz RF = 1000 MHz 20 15 10 5 1000 100 130 160 190 IF Frequency (MHz) 220 L-I Isolation vs LO Freq. vs Temp. Referenced with LO=0dBm Referenced with LO=0dBm 30 L-I Isolation (dB) 20 15 10 850 950 1050 LO Frequency (MHz) 1150 Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. 1250 15 10 5 850 950 1050 LO Frequency (MHz) 1150 1250 Referenced with LO=0dBm 30 +85°C +25°C -40°C 25 750 R-I Isolation vs LO Freq. vs Temp. 20 15 +85°C +25°C -40°C 25 20 15 10 5 750 20 250 10 5 1000 0 70 L-R Isolation vs LO Freq. vs Temp. +85°C +25°C -40°C 25 950 +25oC, LO = 0 dBm R-I Isolation (dB) 30 750 800 850 900 RF Frequency (MHz) 25 0 700 750 LO Return Loss vs LO Freq. LO Return Loss (dB) IF Return Loss (dB) 10 36 1000 25 15 38 32 700 IF Return Loss vs IF Freq. 70 MHz 140 MHz 240 MHz +4 dBm 0 dBm -4 dBm 40 34 +25oC, LO = 0 dBm 20 1000 +25oC, IF=240MHz, high-side LO +4 dBm 0 dBm -4 dBm 40 RF Return Loss vs RF Freq. 25 950 Input IP3 vs RF Freq. vs LO Power 32 750 800 850 900 RF Frequency (MHz) 42 34 700 750 +25oC, IF=140MHz, high-side LO Input IP3 (dBm) Input IP3 (dBm) 950 42 +4 dBm 0 dBm -4 dBm 40 36 Input IP3 vs RF Freq. vs LO Power +25oC, IF=70MHz, high-side LO 42 38 32 700 Input IP3 (dBm) 750 +85°C +25°C -40°C 40 34 32 700 RF Return Loss (dB) LO=0dBm, IF=240MHz, high-side LO 42 34 32 L-R Isolation (dB) Input IP3 vs RF Freq. vs Temp. Input IP3 (dBm) +85°C +25°C -40°C 40 Input IP3 (dBm) Input IP3 (dBm) 42 Input IP3 vs RF Freq. vs Temp. 5 750 850 950 1050 LO Frequency (MHz) - 5 of 8 - 1150 1250 750 850 950 1050 LO Frequency (MHz) 1150 1250 Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Pin Description LO 1 8 RF GND 2 7 GND GND 3 6 GND Vcc 4 5 IF Pin Symbol 1 LO 2 3 4 GND GND Vcc 5 IF 6 7 GND GND RF 8 Backside Paddle Description Local Oscillator (LO) Input. Internally matched to 50 Ω. Internally DC blocked. External blocking not required. Ground Ground Positive Supply Voltage. Requires capacitive decoupling at pin. Intermediate Frequency (IF) Output. Internally matched to 50 Ω. No Internal DC blocking. External blocking cap required if DC present. Ground Ground RF Input. Internally matched to 50 Ω. No Internal DC blocking. External blocking cap required if DC present. Ground Applications Information PC Board Layout Top RF layer is .014” FR4, єr = 4.3, 4 total layers (0.062” thick) for mechanical rigidity. Metal layers are 1-oz copper. Microstrip line details: width = .026”, spacing = .026”. The ML483 application board is easy to use requiring only 1 external decoupling cap. This cap should be placed as close as possible to Vcc pin 4. All three ports use 50 Ω microstrip. There are 5 grounding vias that are not shown. The backside paddle requires these 5 vias for good RF grounding. The mechanical configuration diagram on the next page illustrates proper placement of these vias. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical www.TriQuint.com information, Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. Refer to - 6 of 8 - Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Mechanical Information Package Information and Dimensions This package is lead-free/green/RoHS-compliant. The plating material on the leads is matte tin. It is compatible with both lead-free (maximum 260 oC reflow temperature) and lead (maximum 245 oC reflow temperature) soldering processes. M43 YXX The component will be laser marked with a “M43” product label with an alphanumeric lot code on the top surface of the package. Notes: 1. 2. 3. All dimensions are in millimeters (inches). Package length does not include mold flash, protrusions or gate burr. Package width does not include interlead flash or protrusions. Mounting Configuration All dimensions are in millimeters (inches). Angles are in degrees. Notes: 1. Vias shown use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). Other via sizes are possible. 2. To ensure reliable operation, device ground paddle-to-ground pad solder joint is critical. 3. RF trace width for 50 Ω depends upon the PC board material and construction. Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. - 7 of 8 - Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network® ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Product Compliance Information ESD Information Solderability Compatible with the latest version of J-STD-020, Lead free solder, 260° ESD Rating: Value: Test: Standard: Class 1A Passes/ 250 V to < 500 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class 3 Passes ≥ 500 V to < 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101 This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: • Lead Free • Halogen Free (Chlorine, Bromine) MSL Rating Level 2 at +260 °C convection reflow. The part is rated Moisture Sensitivity Level 2 at 260°C per JEDEC standard IPC/JEDEC J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev C 03/23/10 © 2010 TriQuint Semiconductor, Inc. - 8 of 8 - Disclaimer: Subject to change without noticee Connecting the Digital World to the Global Network®