XILINX XCR3256XL

0
R
DS013 (v1.2) May 3, 2000
XCR3256XL 256 Macrocell CPLD
0
14
Preliminary Product Specification
Features
Description
•
7.5 ns pin-to-pin logic delays
•
System frequencies up to 140 MHz
•
256 macrocells with 6,000 usable gates
•
Available in small footprint packages
The XCR3256XL is a 3.3V, 256 macrocell CPLD targeted at
power sensitive designs that require leading edge programmable logic solutions. A total of 16 logic blocks provide
6,000 usable gates. Pin-to-pin propagation delays are
7.5 ns with a maximum system frequency of 140 MHz.
•
•
-
144-pin TQFP (116 user I/O pins)
-
208-pin PQFP (160 user I/O)
-
280-ball CS BGA (160 user I/O)
TotalCMOS™ Design Technique for
Fast Zero Power
Xilinx offers a TotalCMOS CPLD, both in process technology and design technique. Xilinx employs a cascade of
CMOS gates to implement its sum of products instead of
the traditional sense amp approach. This CMOS gate
implementation allows Xilinx to offer CPLDs that are both
high performance and low power, breaking the paradigm
that to have low power, you must have low performance.
Refer to Figure 1 and Table 1 showing the ICC vs. Frequency of our XCR3256XL TotalCMOS CPLD (data taken
with 16 up/down, loadable 16-bit counters at 3.3V, 25°C).
Optimized for 3.3V systems
-
Ultra low power operation
-
5V tolerant I/O pins with 3.3V core supply
-
Advanced 0.35 micron five metal layer reprogrammable process
-
FZP™ CMOS design technology
Advanced system features
-
In-system programming
-
Input registers
-
Predictable timing model
-
Up to 23 clocks available per logic block
-
Excellent pin retention during design changes
-
Full IEEE Standard 1149.1 boundary-scan (JTAG)
-
Four global clocks
-
Eight product term control terms per logic block
•
Fast ISP programming times
•
Port Enable pin for additional I/O
•
2.7V to 3.6V industrial grade voltage range
•
Programmable slew rate control per output
•
Security bit prevents unauthorized access
•
Refer to XPLA3 family data sheet (DS012) for
architecture description
© 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners.
All specifications are subject to change without notice.
DS013 (v1.2) May 3, 2000
Preliminary Product Specification
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R
XCR3256XL 256 Macrocell CPLD
140
120
Typical ICC (mA)
100
80
60
40
20
0
0
20
40
60
80
100
120
140
160
Frequency (MHz)
Figure 1: XCR3256XL Typical ICC vs. Frequency at VCC = 3.3V, 25°C
Table 1: Typical ICC vs. Frequency at VCC = 3.3V, 25°C
Frequency (MHz)
0
1
10
20
40
60
80
100
120
140
Typical ICC (mA)
0.02
0.91
8.87
17.7
34.8
51.5
68
84.2
100.1
116.6
DC Electrical Characteristics Over Recommended Operating Conditions(1)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
2.4
-
V
-
0.4
V
VOH
Output High voltage for 3.3V outputs
IOH = –8 mA
VOL
Output Low voltage for 3.3V outputs
IOL = 8 mA
IIL
Input leakage current
VIN = GND or VCC
–10
10
mA
IIH
I/O High-Z leakage current
VIN = GND or VCC
–10
10
mA
ICCSB
Standby current
VCC = 3.6V
-
100
mA
ICC
Dynamic current(2,3)
f = 1 MHz
-
2
mA
f = 50 MHz
-
60
mA
CIN
Input pin capacitance(4)
f = 1 MHz
-
8
pF
CCLK
Clock input capacitance(4)
f = 1 MHz
5
12
pF
CI/O
I/O pin capacitance(4)
f = 1 MHz
-
10
pF
Notes:
1. See XPLA3 family data sheet (DS012) for recommended operating conditions.
2. See Table 1, Figure1 for typical values.
3. This parameter measured with a 16-bit, loadable up/down counter loaded into every logic block, with all outputs disabled and
unloaded. Inputs are tied to VCC or ground. This parameter guaranteed by design and characterization, not testing.
4. Typical values not tested.
2
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DS013 (v1.2) May 3, 2000
Preliminary Product Specification
R
XCR3256XL 256 Macrocell CPLD
AC Electrical Characteristics Over Recommended Operating Conditions(1,2)
-7
Symbol
Parameter
-10
-12
Min.
Max.
Min.
Max.
Min.
Max.
Unit
TPD1
Propagation delay time (single p-term)
-
7.0
-
9.0
-
10.8
ns
TPD2
Propagation delay time (OR array)(3)
-
7.5
-
10.0
-
12.0
ns
TCO
Clock to output (global synchronous pin clock)
-
4.5
-
5.8
-
6.9
ns
TSUF
Setup time fast
2.0
-
2.5
-
3.0
-
ns
TSU
Setup time
4.8
-
6.5
-
7.9
-
ns
TH
Hold time
0
-
0
-
0
-
ns
TWLH
Global clock pulse width (High or Low)
3.0
-
4.0
-
5.0
-
ns
TPLH
P-term clock pulse width (High or Low)
4.5
-
6.0
-
7.5
-
ns
TR
Input rise time
-
20
-
20
-
20
ns
TL
Input fall time
-
20
-
20
-
20
ns
fSYSTEM
Maximum system frequency
-
140
-
105
-
88
MHz
TCONFIG
Configuration time(4)
-
40
-
40
-
40
ms
TPOE
P-term OE to output enabled
-
9.0
-
11.0
-
13.0
ns
TPOD
P-term OE to output disabled (5)
-
9.0
-
11.0
-
13.0
ns
TPCO
P-term clock to output
-
8.0
-
10.3
-
12.4
ns
TPAO
P-term set/reset to output valid
-
9.0
-
11.0
-
13.0
ns
Notes:
1. Specifications measured with one output switching.
2. See XPLA3 Family Data Sheet (DS012) for recommended operating conditions.
3. See Figure 4 for derating.
4. Typical current draw during configuration is 10 mA at 3.6V.
5. Output CL = 5 pF.
DS013 (v1.2) May 3, 2000
Preliminary Product Specification
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XCR3256XL 256 Macrocell CPLD
Timing Model
The XPLA3 architecture follows a simple timing model that
allows deterministic timing in design and redesign. The
basic timing model is shown in Figure 2. One key feature of
the XPLA3 CPLD is the ability to have up to 48 product term
inputs into a single macrocell and maintain consistent timing. This is achieved through the use of a fully populated
PLA (Programmable AND Programmable OR Array) which
also has the ability to share product terms and only use the
required amount of product terms per macrocell. There is a
fast path (TLOGI1) into the macrocell which is used if there is
a single product term. The TLOGI2 path is used for multiple
product term timing. For optimization of logic, the XPLA3
CPLD architecture includes a Fold-back NAND path
(TLOGI3). There is a fast input path to each macrocell if used
as an Input Register (TFIN). XPLA3 also includes universal
control terms (TUDA) that can be used for synchronization of
the macrocell registers in different logic blocks. There is
also slew rate control and output enable control on a per
macrocell basis.
TF
TIN
TLOGI1,2
DLT
CE
Q
TOUT
TEN
TSLEW
TFIN
TGCK
TLOGI3
TUDA
S/R
DS017_02_042800
Figure 2: XPLA3 Timing Model
4
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DS013 (v1.2) May 3, 2000
Preliminary Product Specification
R
XCR3256XL 256 Macrocell CPLD
Internal Timing Parameters
-7
Symbol
Parameter
-10
-12
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Buffer Delays
TIN
Input buffer delay
-
2.5
-
3.3
-
4.0
ns
TFIN
Fast input buffer delay
-
2.2
-
2.8
-
3.3
ns
TGCK
Global clock buffer delay
-
1.0
-
1.3
-
1.5
ns
TOUT
Output buffer delay
-
2.5
-
2.8
-
3.3
ns
TEN
Output buffer enable/disable delay
-
4.5
-
5.2
-
6.0
ns
-
1.3
-
1.6
-
2.0
ns
Internal Register and Combinatorial Delays
TLDI
Latch transparent delay
TSUI
Register setup time
0.8
-
1.0
-
1.2
-
ns
THI
Register hold time
4.0
-
5.5
-
6.7
-
ns
TECSU
Register clock enable setup time
2.0
-
2.5
-
3.0
-
ns
TECHO
Register clock enable hold time
3.0
-
4.5
-
5.5
-
ns
TCOI
Register clock to output delay
-
1.0
-
1.3
-
1.6
ns
TAOI
Register async. S/R to output delay
-
2.0
-
2.0
-
2.2
ns
TRAI
Register async. recovery
-
5.0
-
7.0
-
8.0
ns
TLOGI1
Internal logic delay (single p-term)
-
2.0
-
2.5
-
3.0
ns
TLOGI2
Internal logic delay (PLA OR term)
-
2.5
-
3.5
-
4.2
ns
-
2.8
-
3.7
-
4.4
ns
Feedback Delays
TF
ZIA delay
Time Adders
TLOGI3
Fold-back NAND delay
-
6.0
-
8.0
-
9.5
ns
TUDA
Universal delay
-
2.0
-
2.5
-
3.0
ns
TSLEW
Slew rate limited delay
-
4.0
-
5.0
-
6.0
ns
DS013 (v1.2) May 3, 2000
Preliminary Product Specification
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XCR3256XL 256 Macrocell CPLD
Switching Characteristics
VCC
S1
Component
R1
R2
C1
R1
Values
390Ω
390Ω
35 pF
VIN
VOUT
R2
Measurement
TPOE (High)
TPOE (Low)
TP
C1
S1
Open
Closed
Closed
S2
Closed
Open
Closed
Note: For TPOD, C1 = 5 pF
S2
DS013_03_050200
(ns)
Figure 3: AC Load Circuit
7.5
7.4
7.3
7.2
7.1
7.0
6.9
6.8
6.7
6.6
6.5
6.4
6.3
+3.0V
90%
10%
0V
TR
1.5 ns
1
2
4
8
16
Number of Adjacent Outputs Switching
TL
1.5 ns
Measurements:
All circuit delays are measured at the +1.5V level of
inputs and outputs, unless otherwise specified.
DS017_05_042800
DS013_04_042800
Figure 5: Voltage Waveform
Figure 4: Derating Curve for TPD2
6
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DS013 (v1.2) May 3, 2000
Preliminary Product Specification
R
XCR3256XL 256 Macrocell CPLD
Pin Descriptions
Table 2: XCR3256XL Pin Descriptions (Continued)
Table 2: XCR3256XL Pin Descriptions
Function
CS280
PQ208
TQ144
BScan
Order
D0
E14
197
114
506
D1
D14
196
116
502
D2
A14
195
117
498
D3
C13
194
-
494
Function
CS280
PQ208
TQ144
BScan
Order
A0
E18
6
106
736
A1
E19
7
-
732
728*
D4
B13
193
118
490
A2
F15*
8*
104
(TDO)
A3
F17
9
103
724
D11
A13
192
119
480
A4
F18
10
102
720
D12
A12
190
120
476
A11
F19
11
101
710
D13
C12
(TDO)
189
(TDO)
121
-
D14
B12
188
-
468
D15
D12
187
122
464
E0
L17*
28*
89 (TCK)
644*
E1
L18
29
-
640
E2
L19
(TCK)
30 (TCK)
88
-
E3
M16
31
87
632
E4
M18
33
86
628
E11
M17
34
84
618
E12
N16
35
-
614
E13
N19
36
83
610
E14
N18
37
82
606
E15
N17
38
-
602
F0
U10
78
-
460
F1
T10
77
55
456
F2
W11
76
56
452
F3
U11
73
-
448
F4
T11
71
60
444
F11
W12
70
61
434
F12
U12
69
62
430
F13
T12
68
63
426
F14
V13
67
-
422
F15
U13
66
65
418
G0
P16
39
81
598
G1
P18
40
-
594
G2
R19
42
80
590
G3
R16
43
79
586
G4
R18
44
78
582
A12
G16
12
100
706
A13
G17
13
99
702
A14
G19
15
-
698
A15
H16
16
-
694
B0
B19
4
107
552
B1
B18
3
108
548
B2
B17
206
-
544
B3
A18
205
-
540
B4
A17
204
109
536
B11
C16
203
110
526
B12
A16
202
111
522
B13
E15
201
-
518
B14
D15
199
112
514
B15
A15
198
113
510
C0
H17
17
98
690
C1
H18
18
97
686
C2
H19
19
96
682
C3
J16
20
94
678
C4
J17
21
93
674
C11
J18
22
92
664
C12
K16
24
-
660
C13
K17
25
91
656
C14
K18
26
90
652
C15
L16
27
-
648
CLK0/IN0
A10
181
128
-
CLK1/IN1
D11
182
127
-
CLK2/IN2
C11
183
126
-
CLK3/IN3
B11
184
125
-
*Note: BScan Order for CS280 and PQ208 only.
DS013 (v1.2) May 3, 2000
Preliminary Product Specification
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XCR3256XL 256 Macrocell CPLD
Table 2: XCR3256XL Pin Descriptions (Continued)
Table 2: XCR3256XL Pin Descriptions (Continued)
Function
CS280
PQ208
TQ144
BScan
Order
Function
CS280
PQ208
TQ144
BScan
Order
G11
R17
45
77
572
H2
T14
62
68
406
G12
R15
46
-
568
H3
R14
61
69
402
G13
T17
47
75
564
H4
W15
60
-
398
G14
T16
48
74
560
H11
U15
59
70
388
G15
U19
49
-
556
H12
V15
58
-
384
GND
E10
82
52
-
H13
T15
57
71
380
GND
E11
75
57
-
H14
V16
56
-
376
GND
E12
185
124
-
H15
W17
55
72
372
GND
E13
180
129
-
I0
B1
153
2
368
GND
E5
152
3
-
I1
C3
154
1
364
GND
E7
134
17
-
I2
A4
159
-
360
GND
E8
94
33
-
I3
B5
160
-
356
GND
E9
72
59
-
I4
C5
161
143
352
GND
G15
50
64
-
I11
A5
162
-
342
GND
G5
32
85
-
I12
E6
163
142
338
GND
H15
14
105
-
I13
D6
164
141
334
GND
H5
200
135
-
I14
B6
166
140
330
GND
J15
174
-
-
I15
A6
167
139
326
GND
J5
-
-
-
J0
D2*
151*
4 (TDI)
184*
GND
K15
-
-
-
J1
D1
150
-
180
GND
K5
-
-
-
J2
E3
149
5
176
GND
L15
-
-
-
J3
E2
148
6
172
GND
L5
-
-
-
J4
E4
147
7
168
GND
M15
-
-
-
J11
E1
146
8
158
GND
M5
-
-
-
J12
F5
145
-
154
GND
N15
-
-
-
J13
F3
144
9
150
GND
N5
-
-
-
J14
F4
142
10
146
GND
R7
-
-
-
J15
G3
141
11
142
GND
R8
-
-
-
K0
D7
168
-
322
GND
R9
-
-
-
K1
C7
169
-
318
GND
R10
-
-
-
K2
B7
170
138
314
GND
R11
-
-
-
K3
A7
171
-
310
GND
R12
-
-
-
K4
C8
172
137
306
GND
R13
-
-
-
K11
B8
173
136
296
H0
T13
65
66
414
K12
C9
175
134
292
H1
W14
64
67
410
K13
B9 (TDI)
176 (TDI)
133
-
*Note: BScan Order for CS280 and PQ208 only.
8
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Preliminary Product Specification
R
XCR3256XL 256 Macrocell CPLD
Table 2: XCR3256XL Pin Descriptions (Continued)
Table 2: XCR3256XL Pin Descriptions (Continued)
Function
CS280
PQ208
TQ144
BScan
Order
Function
CS280
PQ208
TQ144
BScan
Order
K14
D10
177
132
284
O3
W5
96
41
218
K15
C10
178
131
280
O4
T5
97
40
214
L0
G2
140
-
138
O11
V5
98
-
204
L1
G1
139
-
134
O12
U5
99
39
200
L2
G4
138
12
130
O13
W4
100
38
196
L3
H1
137
14
126
O14
U4
101
-
192
L4
H3
136
15
122
O15
W3
102
37
188
L11
H2
135
16
112
P0
P1
118
-
46
L12
J2
133
-
108
P1
P2
117
-
42
L13
J3
132
18
104
P2
P4
115
29
38
L14
K2
131
19
100
P3
R3
114
30
34
L15
K3
130
-
96
P4
R2
113
31
30
M0
W10
79
-
276
P11
R4
112
32
20
M1
T9
80
54
272
P12
T3
111
-
16
M2
U9
81
53
268
P13
U1
110
34
12
M3
T8
84
-
264
P14
V1
109
35
8
M4
T7
86
49
260
P15
U2
108
36
4
M11
W7
87
48
250
PORT_EN
P3
116
13
-
M12
V7
88
47
246
VCC
V9
83
51
-
M13
U7
89
46
242
VCC
V11
74
58
-
M14
W6
90
-
238
VCC
A11
186
123
-
M15
T6
91
45
234
VCC
B10
179
130
-
N0
K4*
129*
20 (TMS)
92*
VCC
F2
143
24
-
N1
L1
128
-
88
VCC
L4
125
50
-
V2
107
73
-
L2 (TMS)
127
(TMS)
VCC
N2
21
-
VCC
U8
85
76
-
N3
L3
126
22
80
VCC
U14
63
95
-
N4
M1
124
23
76
VCC
T18
41
115
-
N11
M3
123
25
66
VCC
P15
23
144
-
N12
M4
122
-
62
VCC
J19
5
-
-
N13
N1
121
26
58
VCC
D17
191
-
-
N14
N2
120
27
54
VCC
C14
165
-
-
N15
N3
119
28
50
VCC
D13
-
-
-
O0
V6
92
44
230
VCC
C6
-
-
-
O1
U6
93
43
226
O2
R6
95
42
222
DS013 (v1.2) May 3, 2000
Preliminary Product Specification
*Note: BScan Order for CS280 and PQ208 only.
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R
XCR3256XL 256 Macrocell CPLD
Ordering Information
Example: XCR3256XL -7 PQ 208 C
Device Type
Temperature Range
Speed Options
Number of Pins
Package Type
Speed Options
Temperature Range
-12: 12 ns pin-to-pin delay
-10: 10 ns pin-to-pin delay
-7: 7.5 ns pin-to-pin delay
C = Commercial, TA = 0°C to +70°C
I = Industrial, TA = –40°C to +85°C
Packaging Options
TQ144: 144-pin Thin Quad Flat Package
PQ208: 208-pin Plastic Quad Flat Package
CS280: 280-ball Chip Scale Package
Table 3: XCR3256XL JTAG Pinout by package Type
(Pin Number)
Device
XCR3256XL
TCK
Port Enable
TMS
TDI
TDO
144-pin TQ
89
13
20
4
104
208-pin PQ
30
116
127
176
189
280-pin CS
L19
P3
L2
B9
C12
Component Compatibility
Pins
144
208
280
Type
Plastic TQFP
Plastic PQFP
Plastic BGA
Code
TQ144
PQ208
CS280
-7
C
C
C
-10
C, I
C, I
C, I
-12
C, I
C, I
C, I
XCR3256XL
Revision History
The following table shows the revision history for this document
10
Date
Version
Revision
01/21/00
1.0
Initial Xilinx release.
02/10/00
1.1
Updated Pinout table.
05/03/00
1.2
Minor updates and added Boundary Scan to pinout table.
www.xilinx.com
1-800-255-7778
DS013 (v1.2) May 3, 2000
Preliminary Product Specification