AMSCO AS1371-BTDT-12

Datasheet
AS1371
4 0 0 m A , L o w I n p u t Vo l ta g e , L o w Q u i e s c e n t C u r r e n t L D O
1 General Description
2 Key Features
The AS1371 low input voltage, positive voltage regulator
is designed to deliver up to 400mA while consuming
typically only 15µA of quiescent current. The device
operates from input voltages of 1.2V to 3.6V, and is
available in fixed output voltages between 0.6V and
3.3V (programmable in 50mV steps).
!
Ultra-Low Dropout Voltage: 20mV @ 100mA load
!
Operating Input Voltage Range: 1.2V to 3.6V
!
Output Voltages: 0.6V to 3.3V in 50mV steps
!
Max. Output Current: 400mA
!
Output Voltage Accuracy: ±1%
Operation at the full 400mA load current is dependent
upon the maximum power dissipation available from
package and environment.
!
Low Shutdown Current: 10nA
!
Low Quiescent Current: 50µA @ max load
!
Integrated Overtemperature/Overcurrent Protection
!
Under-Voltage Lockout Feature
!
Chip Enable Input
!
Power-OK and Low Battery Detection
!
Sense Input Option
!
Minimal External Components Required
!
Operating Temperature Range: -40°C to +85°C
!
6-pin 2x2 TDFN Package
The low input voltage and ultra-low dropout voltage
(20mV @ 100mA load and 80mV @ 400mA load)
supports single primary cell operation in small
applications, when operated with minimum input-tooutput voltage differentials. In addition, the regulator
provides a power management life extension by
operating from pre-existing 1.8V and 2.5V outputs to
provide low output voltages for new generation portable
processor cores.
The device features stable output voltage with ceramic
capacitors down to a value of 1µF, strict output voltage
regulation tolerances (±1%), and good line- and loadregulation.
3 Applications
The devices are ideal for powering cordless and mobile
phones, MP3 players, CD and DVD players, PDAs,
hand-held computers, digital cameras, and any other
hand-held and/or battery-powered device.
The AS1371 is available in a 6-pin 2x2 TDFN package
and is qualified for -40°C to +85°C operation.
Figure 1. AS1371 - Typical Application Diagram
Input
1.2V to 3.6V
CIN
1µF
ON
OFF
Output
0.6V to 3.3V
OUT
IN
AS1371
EN
GND
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100kΩ
COUT
1µF
POK
SENSE
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AS1371
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
IN 1
6 OUT
POK 2
AS1371
EN 3
Exposed
Pad
5 SENSE
4 GND
Pin Descriptions
Table 1. Pin Descriptions
Pin Name
IN
Pin Number
1
POK
2
EN
3
GND
4
SENSE
5
OUT
6
GND
Exposed Pad
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Description
LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND.
Power-OK Output. Active-low, open-drain output indicates an out-ofregulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic
levels. Leave this pin unconnected if the Power-OK feature is not used.
Active-High Enable Input. A logic low reduces the supply current to < 1µA.
Connect to pin IN for normal operation.
Ground. This pin also functions as a heat sink. Solder it to a large pad or to
the circuit-board ground plane to maximize power dissipation.
Sense Input. Represents the input for the Power-OK behaviour. If
connected to GND the POK output is related to OUT.
LDO Output. Bypass with 1µF to GND.
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad
or to the circuit-board ground plane to maximize power dissipation. Internally
it is connected GND.
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AS1371
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
IN and EN to GND
-0.3
+5.0
V
POK and OUT to GND
-0.3
VIN + 0.3
V
Output Short-Circuit Duration
Indefinite
V
Thermal Resistance θJA
+78.6
ºC/W
Junction Temperature TJ
+150
ºC
Operating Temperature Range
-40
+85
ºC
Storage Temperature Range
-65
+150
ºC
Package Body Temperature
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Notes
+260
Revision 1.04
ºC
Internally limited
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
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AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VIN = VOUT (Nominal) + 0.5V, EN = IN, CIN = COUT = 1µF, TAMB = -40°C to +85ºC (unless otherwise specified). Typical
Values are at TAMB = +25ºC.
Table 3. Electrical Characteristics
Symbol
Parameter
VIN
Input Voltage
VOUT
Output Voltage
Conditions
Output Voltage Accuracy
Max
Units
1.2
3.6
V
Available in 50mV steps, see
Ordering Information on page 13
0.6
3.3
V
TAMB = +25ºC, IOUT = 1mA,
VOUT > 1V
-1
+1
TAMB = -40 to +85ºC, IOUT = 1mA,
VOUT > 1V
Min
Typ
%
-2.7
+2.7
IOUT
Maximum Output Current
ILIM
Current Limit
IQ
Quiescent Current
VIN-VOUT
Dropout Voltage
ΔVLNR
Line Regulation
IOUT = 1mA
ΔVLDR
Load Regulation
IOUT = 1mA to 400mA
0.003
%/mA
Output Voltage Noise
f = 10Hz to 100kHz, IOUT = 10mA
100
µVRMS
Output Voltage AC
Power-Supply Rejection Ratio
f = 10kHz, IOUT = 10mA
50
dB
PSRR
Shutdown
1
15
IOUT = 400mA
50
IOUT = 100mA
20
IOUT = 400mA
80
-15
3,4
IOFF
Enable Supply Current
IEN
IOUT = 0mA
0
mA
20
50
+15
µA
mV
mV
2
Exit Delay from Shutdown
VIL
mA
650
tON
VIH
400
90
150
EN = GND, TAMB = +25ºC
0.01
1
EN = GND, TAMB = +85ºC
0.04
1.0
Enable Input Threshold
0.4
Enable Input Bias Current
EN = IN or GND, TAMB = +25ºC
0.03
EN = IN or GND, TAMB = +85ºC
0.2
100
µs
µA
V
nA
Power-OK Output
5
SENSE = GND, VPOKFALLING
90
94
97
VPOK
Power-OK Voltage Threshold
VSENSE
Power-OK Sense Voltage
Threshold
VOL
POK Output Voltage Low
ISINK = 100µA
0.4
V
IPOK
POK Output Leakage Current
0 ≤ VPOK ≤ 3.6V, TAMB = +25ºC,
VOUT in regulation
1
µA
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SENSE = GND, Hysteresis
VOUT = 1.05V, VSENSE falling
Hysteresis
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% VOUT
1
650
800
950
50
mV
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AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Thermal Protection
TSHDN
Thermal Shutdown
Temperature
150
ºC
ΔTSHDN
Thermal Shutdown Hysteresis
15
ºC
1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) +0.5V (applies only to output
voltages ≥ 1.3V).
2. The rise and fall time of the shutdown signal must not exceed 1ms.
3. The delay time is defined as time required to set VOUT to 95% of its final nominal value.
4. Guaranteed by design.
5. The functionality is proven by production test, limits are guaranteed by design.
Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
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AS1371
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
VOUT = 1.8V, VIN = 2.3V, IOUT = 1mA, TAMB = +25°C (unless otherwise specified).
Figure 4. Line Regulation, VOUT vs. VIN;
1.9
1.9
1.875
1.875
1.85
1.85
Output Voltage (V)
Output Voltage (V)
Figure 3. Output Voltage vs. Temperature
1.825
1.8
1.775
1.75
no load
1.725
1.825
1.8
1.775
1.75
- 40°C
+ 25°C
1.725
Iout = 10mA
1.7
-40
+ 85°C
1.7
-20
0
20
40
60
80
2.2
2.4
2.6
Temperature (°C)
100
1.875
90
1.85
1.825
1.8
1.775
1.75
- 40°C
+ 25°C
3.2
3.4
3.6
no load
Iout = 100mA
80
Iout = 400mA
70
60
50
40
30
20
10
+ 85°C
1.7
0
0
50
2.2
100 150 200 250 300 350 400
2.4
Output Current (mA)
2.6
2.8
3
3.2
3.4
Figure 8. Dropout Voltage vs. Output Current
100
99
90
98
80
Dropout Voltage (mV)
100
97
96
95
94
93
70
60
50
40
30
92
POK rising
20
- 40°C
+ 25°C
91
POK f alling
10
+ 85°C
90
-40
3.6
Input Voltage (V)
Figure 7. POK Voltage Threshold vs. Temperature
Output Voltage (% of Voutnom)
3
Figure 6. Quiescent Current vs. Input Voltage
1.9
Quiescent Current (µA)
Output Voltage (V)
Figure 5. Load Regulation, VOUT vs. IOUT;
1.725
2.8
Input Voltage (V)
0
-20
0
20
40
60
80
0
Temperature (°C)
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50
100 150
200 250 300 350 400
Output Current (mA)
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AS1371
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
500mV/DIV
IOUT
VOUT
500mV/DIV
VIN
VOUT
50mA/Div
Figure 10. Load Transient Response;
IOUT = 0mA to 100mA
500mV/Div
Figure 9. Line Transient Response;
VIN = 2.3V to 2.8V, no load
100ms/Div
100ms/Div
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1V/Div
EN
VOUT
20µs/Div
500mV/DIV
1V/Div
VOUT
500mV/DIV
Figure 12. Turn OFF
EN
Figure 11. Turn ON
20µs/Div
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AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1371 is a low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where
output current load requirements range from no load to 400mA. All devices come with fixed output voltage from 0.6V to
3.3V. (see Ordering Information on page 13).
The AS1371 also features a Power-OK output to indicate when the output is within 10% (max) of final value, and also
an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit
and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying
(e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches
150°C. This is a useful protection when the device is under sustained short circuit conditions.
As illustrated in Figure 13, the devices comprise voltage reference, error amplifier, P-channel MOSFET pass transistor,
Power-OK detect logic, internal voltage divider, current limiter, thermal sensor and shutdown logic.
The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this
reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference
voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the
output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to
the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT.
Figure 13. AS1371 - Block Diagram
AS1371
IN
EN
Thermal
Overload
Protection
Shutdown/
Power-On
Control Logic
Error
Amplifier
OUT
+
Bandgap Voltage
&
Current Reference
Trimmable
Reference
Voltage
SENSE
POK
Power-OK
Compare
Logic
NMOS
GND
Output Voltages
Standard products are factory-set with output voltages from 0.6V to 3.3V. A two-digit suffix of the part number identifies
the nominal output (see Ordering Information on page 13). Non-standard devices are available.
For more information contact: http://www.austriamicrosystems.com/contact-us
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AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
Power-OK and Low-Battery-Detect Functionality
The AS1371’s power-ok or low-battery-detect circuitry is built around an N-channel MOSFET. The circuitry monitors
the voltage on pin SENSE and if the voltage goes out of regulation (e.g. during dropout, current limit or thermal
shutdown) the pin POK goes low. The pin SENSE can be connected to a resistive-divider to monitor a particular
definable voltage and compare it with an internal voltage reference. If the SENSE pin is connected to GND an internal
resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realised with
no additional external components.
The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to
VIN = 1.2V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output,
connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current
consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1).
For the circuit shown in the left of Figure 14 on page 11, the input bias current into SENSE is very low, permitting largevalue resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as
possible. Use a defined resistor for R2 and then calculate R1 as:
V IN
R 1 = R 2 × ⎛⎝ ------------------ – 1⎞⎠
V SENSE
(EQ 1)
Where:
VSENSE .... Is the internal sense reference voltage. For values see Table 3 on page 4.
R2 .... Is the predefined resistor in the resistor divider.
In case of the SENSE pin is connected to GND, an internal resistor-divider network is activated and compares the output voltage with a 94% (typ.) voltage threshold. For this particular Power-OK application, no external resistive components are necessary.
Current Limiting
The AS1371 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and
controls the gate voltage of the P-channel MOSFET, limiting the output current to 400mA. The P-channel MOSFET
output can be shorted to ground for an indefinite period of time without damaging the device.
Thermal-Overload Protection
The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal
shutdown is an effective instrument to prevent die overheating since the power transistor is the principle heat source in
the device.
If the junction temperature exceeds 150ºC with 15ºC hysteresis, the thermal sensor starts the shutdown logic, at which
point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 15ºC, the
thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under
continuous thermal-overload conditions.
Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation.
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AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
Operating Region and Power Dissipation
Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is
calculated by:
P = I OUT × ( V IN – V OUT )
(EQ 2)
T J – T AMB
P MAX = ------------------------θ JB + θ JA
(EQ 3)
Maximum power dissipation is calculated by:
Where:
TJ - TAMB is the temperature difference between the device die junction and the surrounding air.
θJB is the thermal resistance of the package.
θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin
should be connected to the system ground using a large pad or a ground plane.
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AS1371
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Capacitor Selection and Regulator Stability
Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum
electrolytic components. For stable operation with load currents up to 400mA over the entire device temperature
range, use a 1µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (e.g. 10µF) to
reduce noise and improve load transient-response, stability and power-supply rejection.
Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature.
Power Supply Rejection Ratio
The AS1371 is designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically
50dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and
output bypass capacitors, which are shown in Figure 14.
The Section 6 Electrical Characteristics on page 4 show also the device line- and load-transient responses.
Dropout Voltage
For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage
differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life
battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source onresistance multiplied by the load current, and is calculated by:
V DROPOUT = V IN – V OUT = R DS ( ON ) × I OUT
(EQ 4)
Where:
RDS(ON) is the drain-to-source on -resistance.
IOUT is the output current.
Figure 14. Application Diagrams
External Voltage Level Detection
Internal Voltage Level Detection
(Input Monitoring)
(Output Monitoring)
Input
1.2V to 3.6V
CIN
1µF
ON /
OFF
Output
0.6V to 3.3V
Input
1.2V to 3.6V
OUT
IN
AS1371
EN
GND
RPU
100kΩ
CIN
1µF
COUT
1µF
ON /
OFF
POK
SENSE
Output
0.6V to 3.3V
OUT
IN
AS1371
EN
GND
RPU
100kΩ
COUT
1µF
POK
SENSE
R1
R2
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AS1371
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in a 6-pin 2x2 TDFN package.
Figure 15. 6-pin 2x2 TDFN package Diagram
D2
D
Terminal Tip
e
A
INDEX AREA
(D/2 x E/2)
B
L
D/2
PIN#1 ID
aaa C
E
E/2
INDEX AREA
D/2 x E/2
aaa C
bbb
b
C A B
EXPOSED PAD
BOTTOM VIEW
TOP VIEW
A3
ccc C
A
B
A1
SEATING
PLANE
0.08 C
SIDE VIEW
Table 4. 6-pin 2x2 TDFN package Dimensions
Symbol
Min
Typ
A
0.51
0.55
A1
0.00
0.02
A3
0.15 ref
aaa
0.15
bbb
0.10
ccc
0.10
D
1.95
2.00
E
1.95
2.00
Max
0.60
0.05
2.05
2.05
Symbol
D2
E2
L
N
ND
NE
e
b
Min
1.30
0.85
0.15
0.20
Typ
1.45
1.00
0.25
6
3
3
0.50
0.25
Max
1.55
1.10
0.35
0.32
Note:
1.
2.
3.
4.
5.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
All dimensions are in millimeters, angle is in degrees.
N is the total number of terminal.
ND and NE refers to the number of terminals on each side respectively.
Terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the area indicated. The terminal #1 identifier may be
either a mold, embedded metal or mark feature.
6. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip.
7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
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AS1371
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products listed in Table 5.
Table 5. Ordering Information
Ordering Code
Marking
Output
AS1371-BTDT-105
AT
1.05V
AS1371-BTDT-12*
AM
1.2V
AS1371-BTDT-15*
AN
1.5V
AS1371-BTDT-18*
AO
1.8V
AS1371-BTDT-20*
AP
2.0V
AS1371-BTDT-25*
AQ
2.5V
AS1371-BTDT-30*
AR
3.0V
Description
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
Delivery Form
Package
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
Tape and Reel
6-pin 2x2 TDFN
*) on request
Non-standard devices from 0.6V to 3.3V are available in 50mV steps. For more information and inquiries contact
http://www.austriamicrosystems.com/contact
Note: All products are RoHS compliant and Pb-free.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
For further information and requests, please contact us mailto:sales@austriamicrosystems.com
or find your local distributor at http://www.austriamicrosystems.com/distributor
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AS1371
Datasheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner.
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in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement.
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show
deviations from the standard production flow, such as test flow or test location.
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Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
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