APL5537 Dual Channel 300mA Low Dropout Linear Regulator Features General Description • Dual Regulator Outputs • Low Dropout Voltage: Typical 240mV at 300mA The APL5537 is a dual channel low dropout linear regulator, which operates from 2.5V to 5.5V input voltage • Wide Input Voltage Range: 2.5V to 5.5V • Low Quiescent Current: Typical 58µA • High PSRR: 70dB at 1kHz • Low Shutdown Current: <1µA • Shutdown Function • Output Current-Limit Protection • Short-Circuit Current-Limit Protection current-limit protection to ensure specified output current. The APL5537 is available in the TSOT-23-6A and TDFN • Over-Temperature Protection 1.6x1.6-6 packages. • Lead Free and Green Devices Available and delivers up to 300mA output current at each channel. Typical dropout voltage is only 240mV at 300mA. The APL5537 with low quiescent current, high PSRR, and low noise is ideal for battery powered system appliances. Other features include logic-controlled shutdown mode, over-temperature protection, short-circuit current-limit, and Pin Configurations (RoHS Compliant) Applications VOUT2 1 • Mobile Phone • GPS Navigation • Blue Tooth Headset 6 VOUT1 GND 2 5 VIN EN2 3 4 EN1 TSOT-23-6A (Top View) VIN 1 EN1 2 EN2 3 EP 6 VOUT1 5 VOUT2 4 GND TDFN1.6x1.6-6 (Top View) Ordering and Marking Information Voltage Code See Voltage Code Table Package Code CT : TSOT-23-6A QB : TDFN1.6x1.6-6 Operating Ambient Temperature Range I : -40 to 85oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL5537 Assembly Material Handling Code Temperature Range Package Code Voltage Code APL5537-VVCT: 7VVX APL5537-VVQB: 7VV X VV - Voltage Code X - Date Code VV - Voltage Code X - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 1 www.anpec.com.tw APL5537 Voltage Code Table Output Voltage Output Voltage Voltage Code VOUT1 (V) VOUT2 (V) 1.30 2.80 1.85 1.50 Voltage Code VOUT1 (V) VOUT2 (V) 7M 1.20 2.80 1.85 bb 1.85 1.50 b9 1.50 99 1.50 2.80 9M 1.80 1.20 C5 1.80 2.60 CK 2.50 1.80 JC 1.80 3.30 CR 2.50 3.00 JO 2.50 2.80 JM 2.80 2.85 Ud 2.50 3.30 JR 2.85 2.85 dd 2.85 1.85 db 2.80 1.80 MC 2.85 1.80 dC 2.80 3.30 MR 2.80 2.80 MM 2.80 3.00 MO 3.00 1.80 OC 3.30 2.85 Rd 3.00 3.00 OO 3.30 3.30 RR 3.30 3.00 RO 3.15 2.80 eM 3.30 3.10 RP 5M Available Voltage Version Code 5 7 9 A C b D E F J K Voltage 1.20 1.30 1.50 1.60 1.80 1.85 1.90 2.00 2.10 2.50 2.60 Code c L M d N O P e Q R Voltage 2.65 2.70 2.80 2.85 2.90 3.00 3.10 3.15 3.20 3.30 Absolute Maximum Ratings Symbol VIN VEN1, VEN2 TJ TSTG TSDR (Note 1) Rating Unit VIN Input Voltage (VIN to GND) Parameter -0.3 ~ 7 V EN1, EN2 to GND Voltage -0.3 ~ 7 Maximum Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds V 150 o -65 ~ 150 o 260 o C C C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit Junction-to-Ambient Resistance in Free Air (Note 2) θJA TSOT-23-6A 220 TDFN1.6x1.6-6 165 o C/W Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 2 www.anpec.com.tw APL5537 Recommended Operating Conditions Symbol VIN VEN1, VEN2 (Note 3) Parameter VIN Input Voltage (VIN to GND) Range Unit 2.5 ~ 5.5 V EN1, EN2 to GND Voltage 0 ~ 5.5 V IOUT VOUT Output Current 0 ~ 300 mA TA Ambient Temperature -40 ~ 85 o -40 ~ 125 o TJ Junction Temperature C C Note 3: Refer to the typical application circuit Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=VOUT+1V, VEN1= VEN2=5V and TA= -40 to 85 oC. Typical values are at TA=25oC. Symbol Parameter APL5537 Test Conditions Unit Min. Typ. Max. 1.9 2.2 2.45 UNDER-VOLTAGE LOCKOUT (UVLO) AND SUPPLY CURRENT VIN UVLO Threshold Voltage VIN rising, TA= -40 to 85 oC VIN UVLO Hysteresis IQ V - 0.1 - V No load, VEN1= VEN2=5V - 58 90 µA No load, VEN1= VEN2=0V - - 1 µA -1 - +1 % IOUT=1mA to 300mA, TA= -40 C to 85 C -3 - +3 % Line Regulation IOUT=1mA, VIN=VOUT+0.3V to 5.5V, or VIN=2.5V to 5.5V - - 0.2 %/V Load Regulation IOUT=1mA to 300mA - - 0.6 % Dropout Voltage (Note 4) IOUT=300mA - 240 330 mV f=100Hz - 70 - f=1kHz - 70 - f=10kHz - 60 - f=100kHz - 35 - VIN Supply Current OUTPUT VOLTAGE (REGULATOR1 AND REGULATOR2) Output Voltage Accuracy VDROP PSRR Power Supply Rejection Ratio IOUT=1mA, TA= 25 oC o IOUT=50mA, COUT=2.2µF o dB Output Noise IOUT=1mA, BW=10 to 100kHz, COUT=10µF - 100 - µVRMS VOUT Discharge Resistance VEN1= VEN2=0V - 0.7 - kΩ ENABLE/DISABLE (EN1 AND EN2) VIH EN Input Logic HIGH VIN=2.5V to 5.5V 1.5 - - V VIL EN Input Logic LOW VIN=2.5V to 5.5V - - 0.4 V EN Input Current VEN1= VEN2=5V - 0.2 - µA 330 450 750 mA - mA PROTECTIONS (REGULATOR1 AND REGULATOR2) ILIMIT Current Limit Threshold ISHORT Short-Circuit Output Current - 50 Over-Temperature Threshold - 160 - °C Over-Temperature Hysteresis - 40 - °C Soft-Start Time - 60 - µs Note 4: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 1V. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 3 www.anpec.com.tw APL5537 Typical Operating Characteristics Output Voltage vs. Temperature Output Voltage vs. Temperature 1.90 3.10 APL5537-OC VOUT2 3.05 Output Voltage (V) Output Voltage (V) APL5537-OC VOUT1 3.00 2.95 2.90 -40 -25 1.85 1.80 1.75 1.70 0 25 50 Temperature 75 100 -40 -25 125 25 50 75 100 125 ( oC) Temperature Quiescent Current vs. Temperature Dropout Voltage vs. Output Current 350 65 APL5537-OC VIN=VEN=4.2V TJ=125oC 300 Dropout Voltage (mV) Quiescent Current (µA) 0 (oC) 60 55 50 250 TJ=25oC 200 150 TJ=-40oC 100 50 45 -40 -25 0 25 50 75 100 0 125 0 50 Temperature (oC) 150 200 250 300 Noise PSRR vs. Frequency 200 0 IOUT1=50mA IOUT=50mA VIN=VEN=4.2V (Battery) 150 -20 100 Noise (µV) PSRR (dB) 100 Output Current (mA) -40 -60 50 0 -50 -100 -80 -150 -100 100 1k 10k 100k -200 1M Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 0 20m 40m 60m 80m 100m Time (sec) Frequency (Hz) 4 www.anpec.com.tw APL5537 Operating Waveforms Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified. Power on Power off VIN VIN 1 1 VOUT1 VOUT1 2 2 VOUT2 VOUT2 3 3 CIN=COUT=1µF, IOUT1=IOUT2=10mA CH1: VIN, 2V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 4ms/Div CIN=COUT=1µF, IOUT1=IOUT2=10mA CH1: VIN, 2V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 4ms/Div Enable Response Disable Response VEN VEN 1 1 VOUT1 VOUT1 2 3 2 VOUT2 VOUT2 3 CIN=COUT=1µF, IOUT1=IOUT2=50mA CH1: VEN, 5V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 40µs/Div CIN=COUT=1µF, IOUT1=IOUT2=10mA CH1: VEN, 5V/Div, DC CH2: VOUT1, 1V/Div, DC CH3: VOUT2, 1V/Div, DC TIME: 40µs/Div Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 5 www.anpec.com.tw APL5537 Operating Waveforms (Cont.) Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified. Line Transient Response Line Transient Response VIN VIN 1 2 3 1 VOUT1 VOUT1 2 VOUT2 VOUT2 3 VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs) CIN=COUT=1µF, IOUT1=IOUT2=50mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100µs/Div VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs) CIN=COUT=1µF, IOUT1=IOUT2=10mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100µs/Div Line Transient Response Load Transient Response I OUT VIN 1 1 2 3 VOUT1 VOUT1 2 VOUT2 VOUT2 3 IOUT=10mA to 50mA to 10mA (rise / fall time = 1µs) CIN=COUT=1µF, VIN=VEN=4.2V CH1: IOUT, 50mA/Div, DC CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:40µs/Div VIN=3.8V to 4.8V to 3.8V (rise / fall time = 4µs) CIN=COUT=1µF, IOUT1=IOUT2=100mA CH1: VIN, 500mV/Div, DC, Offset=3.8V CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:100µs/Div Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 6 www.anpec.com.tw APL5537 Operating Waveforms (Cont.) Refer to the typical application circuit. The test condition is VIN=VEN=4.2V, TA= 25oC. Unless otherwise specified. Load Transient Response Load Transient Response I OUT IOUT 1 1 VOUT1 VOUT1 2 2 VOUT2 VOUT2 3 3 IOUT=10mA to 200mA to 10mA (rise / fall time = 1µs) CIN=COUT=1µF, VIN=VEN=4.2V CH1: IOUT, 100mA/Div, DC CH2: VOUT1, 50mV/Div, DC, Offset=3.0V CH3: VOUT2, 50mV/Div, DC, Offset=1.8V TIME:40µs/Div IOUT=10mA to 100mA to 10mA (rise / fall time = 1µs) CIN=COUT=1µF, VIN=VEN=4.2V CH1: IOUT, 50mA/Div, DC CH2: VOUT1, 20mV/Div, DC, Offset=3.0V CH3: VOUT2, 20mV/Div, DC, Offset=1.8V TIME:40µs/Div Pin Description PIN FUNCTION NO. NAME TSOT-23-6A TDFN1.6x1.6-6 Input Supply Pin. VIN can range from 2.5V to 5.5V and should be bypassed with at least a 1µF capacitor. 5 1 VIN 4 2 EN1 3 3 EN2 Enable Input. Pulling the VEN1/2 above 1.5V enables the respective regulator output; pulling VEN1/2 below 0.4V disables the respective regulator output. 2 4 GND Ground. 1 5 VOUT2 6 6 VOUT1 - - EP Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 Regulator Outputs. Sources up to 300mA. Bypass with at least a 1µF capacitor to the GND respectively. Exposed Pad. Connect it to a large ground plane for heatsinking. 7 www.anpec.com.tw APL5537 Block Diagram VIN Current Limit1 UVLO and Shutdown Control1 EN1 VREF1 OverTemperature Protection VOUT1 Short Circuit Current Limit1 GND Current Limit2 UVLO and Shutdown Control2 EN2 VREF2 OverTemperature Protection VOUT2 Short Circuit Current Limit2 Typical Application Circuit VIN 2.5V to 5.5V VIN VOUT1 VOUT1 COUT1 CIN 1µF 1.2V to 3.3V/300mA 1µF APL5537 ON EN1 VOUT2 VOUT2 COUT2 OFF EN2 1.2V to 3.3V/300mA 1µF GND Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 8 www.anpec.com.tw APL5537 Function Description VIN Under-Voltage Lockout (UVLO) Over-Temperature Protection The APL5537 has a built-in under-voltage lockout circuit to keep the outputs shuting off until internal circuitry is An over-temperature protection circuitry limits the junction temperature of APL5537. When the junction temperature exceeds +160 oC, the over-temperature protection operating properly. The UVLO circuit has a hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. circuitry disables the LDO outputs, allowing the device to cool down. The LDO outputs are enabled again after the Soft-Start (For Each Channel) junction temperature cools down by 40oC, resulting in a pulsed output during continuous thermal overload The APL5537 provides an internal soft-start circuitry to control rise rate of the output voltage and limit the current conditions. Over-temperature protection is designed to protect the IC in the event of over temperature conditions. surge during start-up. The output voltage starts the softstart at approximate 60µs after the VIN is over the UVLO For reliable operation, the junction temperature cannot exceed TJ=+125oC threshold. The typical soft-start interval is about 60µs. Current-Limit Protection (For Each Channel) The APL5537 provides a current-limit protection function. During current limit, the device limits output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Current-Limit Protection (For Each Channel) When the output voltage drops below 0.8V, which is caused by the over load or short circuit, the device limits the output current down to a safe level. The short circuit current limit is used to reduce the power dissipation during short circuit conditions. If the junction temperature is over the over-temperature threshold, the device will enter the thermal shutdown. Enable/Disable (For Each Channel) Pulling the VEN1/2 above 1.5V enables the respective LDO output, and pulling VEN1/2 below 0.4V disables the respective LDO output. When both the LDO outputs are disabled, the supply current is reduced to less than 1µA. EN1/2 pins are internally pulled low by resistors. If shutdown function is not used, connect EN1/2 to VIN for normal operation. The enable inputs are compatible with both TTL and CMOS logic levels. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 9 www.anpec.com.tw APL5537 Application Information Input Capacitor where (TJ-TA) is the temperature difference between the The APL5537 requires proper input capacitors to supply surge current during stepping load transients to prevent junction and ambient air. θJA is the thermal resistance between Junction and ambient air. Assuming the TA=25oC the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to and maximum TJ=160oC (typical thermal limit threshold), the maximum power dissipation is calculated as: the VIN limit the slew rate of the surge current, place the Input capacitors near VIN as close as possible. Input ca- PD(max)=(160-25)/165 = 0.82(W) For normal operation, do not exceed the maximum junc- pacitors should be larger than 1µF and a minimum ceramic capacitor of 1µF is necessary. tion temperature rating of TJ = 125 oC. The calculated power dissipation should be less than: Output Capacitor PD =(125-25)/165 = 0.61(W) The GND provides an electrical connection to the ground The APL5537 needs a proper output capacitor to maintain circuit stability and improve transient response over and channels heat away. Connect the GND to the ground by using a large pad or a ground plane. temperature and current. In order to insure the circuit stability, the proper output capacitor value should be larger Layout Consideration Figure 2 illustrates the layout. Below is a checklist for your layout: than 1µF. With X5R and X7R dielectrics, 1µF is sufficient at all operating temperatures. Large output capacitor 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the value can reduce noise and improve load-transient response and PSRR, Figure 1. shows the curves of allow- load as close as possible. 3. To place APL5537 and output capacitors near the load able ESR range as the function of load current for various output capacitor values. is good for performance. 4. Large current paths, the bold lines in figure 2, must Region of Stable COUT ESR vs. Output Current Region of Stable COUT ESR (Ω) 10 have wide tracks. APL5537-OC VIN=VEN=4.2V CIN=COUT=1µF/X7R VIN VOUT1 VIN 1 Unstable Range 0.1 VOUT1 CIN COUT1 APL5537 Stable Range ON EN1 VOUT2 VOUT2 COUT2 0.01 Stable by Simulation Verify OFF EN2 GND 0.001 0 50 100 150 200 250 300 Output Current (mA) Figure2. Large Current Paths Figure1. Stable COUT ESR Range Operation Region and Power Dissipation The APL5537 maximum power dissipation depends on the thermal resistance and temperature difference between the die junction and ambient air. The TDFN1.6x 1.6-6 package power dissipation PD across the device is: PD = (TJ - TA) / θJA Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 10 www.anpec.com.tw APL5537 Package Information TSOT-23-6A D e E E1 SEE VIEW A b c 0.25 A GAUGE PLANE SEATING PLANE L A1 A2 e1 VIEW A S Y M B O L TSOT-23-6A INCHES MILLIMETERS MIN. MAX. MIN. MAX. A 0.70 A1 0.01 1.00 0.028 0.039 0.10 0.000 0.004 A2 0.70 0.90 0.028 0.035 b 0.30 0.50 0.012 0.020 c 0.08 0.20 0.003 0.008 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 1.80 0.055 0.071 E1 1.40 e e1 L 0 0.037 BSC 0.95 BSC 0.075 BSC 1.90 BSC 0.30 0.60 0° 8° 0.012 0.024 0° 8° Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 11 www.anpec.com.tw APL5537 Package Information (Cont.) TDFN1.6x1.6-6 D E A b Pin 1 A1 D2 E2 A3 L K Pin 1 Corner e S Y M B O L MIN. MAX. MIN. MAX. A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 TDFN1.6x1.6-6 MILLIMETERS A3 INCHES 0.20 REF 0.008 REF b 0.20 0.30 0.008 0.012 D 1.55 1.65 0.061 0.065 D2 0.95 1.05 0.037 0.041 E 1.55 1.65 0.061 0.065 E2 0.55 0.65 0.022 0.026 e 0.50 BSC 0.020 BSC K 0.20 - 0.008 - L 0.19 0.29 0.007 0.011 Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 12 www.anpec.com.tw APL5537 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application TSOT-23-6A Application TDFN1.6x1.6-6 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 4.0±0.10 4.0±0.10 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 1.90±0.20 1.90±0.20 1.30±0.20 4.0±0.10 4.0±0.10 (mm) Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 13 www.anpec.com.tw APL5537 Devices Per Unit Package Type TSOT-23-6A TDFN1.6x1.6-6 Unit Tape & Reel Tape & Reel Quantity 3000 3000 Taping Direction Information TSOT-23-6A USER DIRECTION OF FEED AAAX AAAX AAAX AAAX AAAX AAAX AAAX TDFN1.6x1.6-6 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 14 www.anpec.com.tw APL5537 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 15 www.anpec.com.tw APL5537 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ 125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.5 - Oct., 2009 16 www.anpec.com.tw