TI SNJ54AC244W

SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
D 2-V to 6-V VCC Operation
D Inputs Accept Voltages to 6 V
D Max tpd of 7.5 ns at 5 V
SN54AC244 . . . J OR W PACKAGE
SN74AC244 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
These octal buffers and line drivers are designed
specifically to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
The ’AC244 devices are organized as two 4-bit
buffers/drivers with separate output-enable (OE)
inputs. When OE is low, the device passes
noninverted data from the A inputs to the Y
outputs. When OE is high, the outputs are in the
high-impedance state.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
To ensure the high-impedance state during power
up or power down, OE should be tied to VCC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1A2
2Y3
1A3
2Y2
1A4
2OE
2Y4
1A1
1OE
VCC
SN54AC244 . . . FK PACKAGE
(TOP VIEW)
ORDERING INFORMATION
PDIP − N
SN74AC244N
Tube
SN74AC244DW
Tape and reel
SN74AC244DWR
SOP − NS
Tape and reel
SN74AC244NSR
AC244
SSOP − DB
Tape and reel
SN74AC244DBR
AC244
Tube
SN74AC244PW
Tape and reel
SN74AC244PWR
CDIP − J
Tube
SNJ54AC244J
SNJ54AC244J
CFP − W
Tube
SNJ54AC244W
SNJ54AC244W
LCCC − FK
Tube
SNJ54AC244FK
SNJ54AC244FK
TSSOP − PW
−55°C
125°C
55 C to 125
C
†
TOP-SIDE
MARKING
Tube
SOIC − DW
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AC244N
AC244
AC244
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54AC244
VCC
Supply voltage
VCC = 3 V
VIH
High-level
High
level input voltage
MIN
MAX
2
6
Low-level
Low
level input voltage
VI
Input voltage
VO
Output voltage
IOL
High-level
High
level output current
Low-level
Low
level output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
MAX
2
6
2.1
VCC = 4.5 V
3.15
3.15
VCC = 5.5 V
3.85
3.85
UNIT
V
V
0.9
0.9
VCC = 4.5 V
1.35
1.35
VCC = 5.5 V
1.65
1.65
V
0
VCC
0
VCC
V
0
VCC
0
VCC
V
VCC = 3 V
IOH
MIN
2.1
VCC = 3 V
VIL
SN74AC244
−12
−12
VCC = 4.5 V
−24
−24
VCC = 5.5 V
−24
−24
VCC = 3 V
12
12
VCC = 4.5 V
24
24
VCC = 5.5 V
24
24
8
8
ns/V
85
°C
−55
125
−40
mA
mA
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50
50 μA
IOH = −12 mA
VOH
IOH = −24
24 mA
A
†
MAX
SN74AC244
MIN
3V
2.9
2.9
2.9
4.5 V
4.4
4.4
4.4
5.5 V
5.4
5.4
5.4
3V
2.56
2.4
2.46
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
MAX
V
3V
0.1
0.1
0.1
IOL = 50 μA
4.5 V
0.1
0.1
0.1
5.5 V
0.1
0.1
0.1
3V
0.36
0.5
0.44
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
5.5 V
IOL = 75 mA†
5.5 V
VI = VCC or GND
VO = VCC or GND,
VI(OE) = VIL or VIH
ICC
VI = VCC or GND,
Ci
VI = VCC or GND
IO = 0
V
1.65
1.65
± 0.1
±1
±1
± 0.1
±1
±1
5.5 V
± 0.25
±5
± 2.5
μA
5.5 V
4
80
40
μA
55V
5.5
VI = VCC or GND
IOZ
3.85
4.5 V
mA†
UNIT
3.85
5V
2.5
A
μA
pF
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
4
MIN
5.5 V
IOL = 50
Control inputs
SN54AC244
MAX
5.5 V
IOL = 24 mA
II
TYP
IOH = −75 mA†
IOL = 12 mA
Data inputs
MIN
mA†
IOH = −50
VOL
TA = 25°C
VCC
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
POST OFFICE BOX 655303
free-air
TA = 25°C
temperature
SN54AC244
SN74AC244
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2
6.5
9
1
12.5
1.5
10
2
6.5
9
1
12
2
10
2
6
10.5
1
11.5
1.5
11
2.5
7.5
10
1
13
2
11
3
7
10
1
12.5
1.5
10.5
2.5
7.5
10.5
1
13
2.5
11.5
• DALLAS, TEXAS 75265
range,
UNIT
ns
ns
ns
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
free-air
TA = 25°C
temperature
SN54AC244
range,
SN74AC244
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1.5
5
7
1
9.5
1
7.5
1.5
5
7
1
9
1
7.5
1.5
5
7
1
9
1.5
8
1.5
5.5
8
1
10.5
1.5
8.5
2.5
6.5
9
1
10.5
1
9.5
2
6.5
9
1
11
2
9.5
UNIT
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
CL = 50 pF,
TYP
f = 1 MHz
45
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
Output
Control
(low-level
enabling)
LOAD CIRCUIT
Input
VCC
50% VCC
50% VCC
0V
tPLH
tPHL
50% VCC
S1
Open
2 × VCC
Open
VCC
50% VCC
50% VCC
VOL
50% VCC
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
≈VCC
50% VCC
tPZH
VOH
Output
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
VOL
tPHZ
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
VOL + 0.3 V
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-87552012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287552012A
SNJ54AC
244FK
5962-8755201RA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8755201RA
SNJ54AC244J
5962-8755201SA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
-55 to 125
5962-8755201SA
SNJ54AC244W
5962-8755201VRA
ACTIVE
CDIP
J
20
20
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8755201VR
A
SNV54AC244J
5962-8755201VSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
-55 to 125
5962-8755201VS
A
SNV54AC244W
SN74AC244DBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
-40 to 85
SN74AC244DBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DBRE4
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DBRG4
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DWRE4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244DWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74AC244N
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Sep-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74AC244NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74AC244N
SN74AC244NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244NSRE4
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244NSRG4
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
Call TI
-40 to 85
SN74AC244PWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PWRE4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SN74AC244PWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC244
SNJ54AC244FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287552012A
SNJ54AC
244FK
SNJ54AC244J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8755201RA
SNJ54AC244J
SNJ54AC244W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
-55 to 125
5962-8755201SA
SNJ54AC244W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC244, SN54AC244-SP, SN74AC244 :
• Catalog: SN74AC244, SN54AC244
• Enhanced Product: SN74AC244-EP, SN74AC244-EP
• Military: SN54AC244
• Space: SN54AC244-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AC244DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74AC244DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74AC244NSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74AC244PWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AC244DBR
SN74AC244DWR
SSOP
DB
20
2000
367.0
367.0
38.0
SOIC
DW
20
2000
367.0
367.0
45.0
SN74AC244NSR
SO
NS
20
2000
367.0
367.0
45.0
SN74AC244PWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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