TI SN54LV165A_101

SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
D 2-V to 5.5-V VCC Operation
D Max tpd of 10.5 ns at 5 V
D Support Mixed-Mode Voltage Operation on
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
All Ports
Ioff Supports Partial-Power-Down Mode
Operation
SN54LV165A . . . J OR W PACKAGE
SN74LV165A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
14
4
13
5
12
6
11
7
10
8
9
CLK
E
F
G
H
QH
1
16
CLK
SH/LD
NC
VCC
CLK INH
3
VCC
CLK INH
D
C
B
A
SER
QH
SN54LV165A . . . FK PACKAGE
(TOP VIEW)
15 CLK INH
14 D
2
3
E
F
NC
G
H
13 C
12 B
4
5
11
A
10 SER
6
7
8
9
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
D
C
NC
B
A
GND
NC
QH
SER
15
VCC
16
2
QH
1
SH/LD
SH/LD
CLK
E
F
G
H
QH
GND
SN74LV165A . . . RGY PACKAGE
(TOP VIEW)
GND
D
D Latch-Up Performance Exceeds 250 mA Per
NC − No internal connection
description/ordering information
The ’LV165A devices are parallel-load, 8-bit shift registers designed for 2-V to 5.5-V VCC operation.
When the devices are clocked, data is shifted toward the serial output QH. Parallel-in access to each stage is
provided by eight individual direct data inputs that are enabled by a low level at the shift/load (SH/ LD) input.
The ’LV165A devices feature a clock-inhibit function and a complemented serial output, QH.
ORDERING INFORMATION
QFN − RGY
SN74LV165ARGYR
Tube of 40
SN74LV165AD
Reel of 2500
SN74LV165ADR
SOP − NS
Reel of 2000
SN74LV165ANSR
74LV165A
SSOP − DB
Reel of 2000
SN74LV165ADBR
LV165A
Tube of 90
SN74LV165APW
Reel of 2000
SN74LV165APWR
Reel of 250
SN74LV165APWT
TVSOP − DGV
Reel of 2000
SN74LV165ADGVR
LV165A
CDIP − J
Tube of 25
SNJ54LV165AJ
SNJ54LV165AJ
CFP − W
Tube of 150
SNJ54LV165AW
SNJ54LV165AW
LCCC − FK
Tube of 55
SNJ54LV165AFK
SNJ54LV165AFK
TSSOP − PW
−55°C to 125°C
†
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV165A
LV165A
LV165A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
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1
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
description/ordering information (continued)
Clocking is accomplished by a low-to-high transition of the clock (CLK) input while SH/LD is held high and clock
inhibit (CLK INH) is held low. The functions of CLK and CLK INH are interchangeable. Since a low CLK and a
low-to-high transition of CLK INH accomplishes clocking, CLK INH should be changed to the high level only
while CLK is high. Parallel loading is inhibited when SH/LD is held high. The parallel inputs to the register are
enabled while SH/ LD is held low, independently of the levels of CLK, CLK INH, or SER.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
INPUTS
OPERATION
SH/ LD
CLK
CLK INH
L
X
X
H
H
X
Q0
H
X
H
Q0
H
L
↑
Shift
H
↑
L
Shift
Parallel load
logic diagram (positive logic)
A
SH/LD
CLK INH
CLK
SER
1
B
11
C
12
D
13
E
14
F
3
H
5
6
15
2
10
S
C1
1D
R
S
C1
1D
R
S
C1
1D
R
S
C1
1D
R
S
C1
1D
R
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
2
G
4
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• DALLAS, TEXAS 75265
S
C1
1D
R
S
C1
1D
R
S
C1
1D
R
9
7
QH
QH
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
typical shift, load, and inhibit sequences
CLK
CLK INH
SER
L
SH/LD
Data
Inputs
A
H
B
L
C
H
D
L
E
H
F
L
G
H
H
H
QH
H
H
L
H
L
H
L
H
QH
L
L
H
L
H
L
H
L
Inhibit
Serial Shift
Load
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3
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
4
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SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
recommended operating conditions (see Note 5)
VCC
SN54LV165A
SN74LV165A
MIN
MAX
MIN
MAX
2
5.5
2
5.5
Supply voltage
VCC = 2 V
VIH
High level input voltage
High-level
1.5
UNIT
V
1.5
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC × 0.7
VCC = 2 V
V
0.5
0.5
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC × 0.3
VIL
Low level input voltage
Low-level
VI
Input voltage
0
5.5
0
5.5
V
VO
Output voltage
0
VCC
0
VCC
V
−50
−50
µA
−2
−2
VCC × 0.3
VCC = 4.5 V to 5.5 V
VCC = 2 V
IOH
VCC = 2.3 V to 2.7 V
High level output current
High-level
VCC = 3 V to 3.6 V
−6
−6
−12
50
50
VCC = 2.3 V to 2.7 V
2
2
VCC = 3 V to 3.6 V
6
6
VCC = 4.5 V to 5.5 V
12
12
VCC = 2.3 V to 2.7 V
200
200
VCC = 3 V to 3.6 V
100
100
20
20
VCC = 2 V
IOL
∆t/∆v
Low level output current
Low-level
Input transition rise or fall rate
VCC = 4.5 V to 5.5 V
TA
VCC × 0.3
−12
VCC = 4.5 V to 5.5 V
Operating free-air temperature
−55
125
V
−40
mA
µA
mA
ns/V
°C
85
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV165A
PARAMETER
VOH
TEST CONDITIONS
MIN
TYP
SN74LV165A
MAX
MIN
IOH = −50 µA
2 V to 5.5 V
IOH = −2 mA
2.3 V
2
2
IOH = −6 mA
3V
2.48
2.48
4.5 V
3.8
IOH = −12 mA
VOL
VCC
VCC−0.1
TYP
MAX
VCC−0.1
V
3.8
IOL = 50 µA
2 V to 5.5 V
0.1
0.1
IOL = 2 mA
2.3 V
0.4
0.4
IOL = 6 mA
3V
0.44
0.44
4.5 V
IOL = 12 mA
II
VI = 5.5 V or GND
ICC
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
IO = 0
UNIT
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
POST OFFICE BOX 655303
1.7
• DALLAS, TEXAS 75265
1.7
pF
5
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
CLK high or low
tw
Pulse duration
SH/LD low
SH/LD high before CLK↑
SER before CLK↑
tsu
Setup time
CLK INH before CLK↑
Data before SH/LD↑
SER data after CLK↑
th
Hold time
MAX
SN54LV165A
MIN
MAX
SN74LV165A
MIN
8.5
9
9
11
13
13
7
8.5
8.5
8.5
9.5
9.5
7
7
7
11.5
12
12
−1
0
0
Parallel data after SH/LD↑
0
0.5
0.5
SH/LD high after CLK↑
0
0
0
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
CLK high or low
tw
tsu
Pulse duration
Setup time
MAX
MIN
6
7
7
9
9
SH/LD high before CLK↑
5
6
6
SER before CLK↑
5
6
6
CLK INH before CLK↑
5
5
5
7.5
8.5
8.5
0
0
0
0.5
0.5
0.5
0
0
0
SER data after CLK↑
Hold time
MIN
SN74LV165A
7.5
SH/LD low
Data before SH/LD↑
th
MAX
SN54LV165A
Parallel data after SH/LD↑
SH/LD high after CLK↑
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
tw
tsu
Pulse duration
Setup time
MAX
SN74LV165A
MIN
4
4
SH/LD low
5
6
6
SH/LD high before CLK↑
4
4
4
SER before CLK↑
4
4
4
3.5
3.5
3.5
CLK INH before CLK↑
Parallel data after SH/LD↑
SH/LD high after CLK↑
6
MIN
4
SER data after CLK↑
Hold time
SN54LV165A
CLK high or low
Data before SH/LD↑
th
MAX
POST OFFICE BOX 655303
5
5
5
0.5
0.5
0.5
1
1
1
0.5
0.5
0.5
• DALLAS, TEXAS 75265
MAX
UNIT
ns
ns
ns
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
SH/LD
QH or QH
CL = 15 pF
50*
80*
45*
45
CL = 50 pF
40
65
35
35
CL = 15 pF
QH or QH
MAX
MIN
MAX
MIN
MAX
19.8*
1*
22*
1
22
13.1*
21.5*
1*
23.5*
1
23.5
12.9*
21.7*
1*
24*
1
24
15.3
23.3
1
26
1
26
16.1
25.1
1
28
1
28
15.9
25.3
1
28
1
28
H
UNIT
MHz
12.2*
CL = 50 pF
range,
SN74LV165A
TYP
CLK
SH/LD
SN54LV165A
MIN
H
tpd
temperature
LOAD
CAPACITANCE
CLK
tpd
free-air
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
tpd
free-air
TA = 25°C
temperature
SN54LV165A
SN74LV165A
LOAD
CAPACITANCE
MIN
TYP
CL = 15 pF
65*
115*
55*
55
CL = 50 pF
60
90
50
50
MAX
MIN
MAX
MIN
MAX
CLK
8.6*
15.4*
1*
18*
1
18
9.1*
15.8*
1*
18.5*
1
18.5
H
8.9*
14.1*
1*
16.5*
1
16.5
CLK
10.9
14.9
1
16.9
1
16.9
SH/LD
11.3
19.3
1
22
1
22
11.1
17.6
1
20
1
20
CL = 15 pF
QH or QH
CL = 50 pF
H
UNIT
MHz
SH/LD
QH or QH
range,
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
SH/LD
QH or QH
CL = 15 pF
110*
165*
90*
90
CL = 50 pF
95
125
85
85
CL = 15 pF
QH or QH
CL = 50 pF
H
MAX
MIN
MAX
range,
SN74LV165A
TYP
CLK
SH/LD
SN54LV165A
MIN
H
tpd
temperature
LOAD
CAPACITANCE
CLK
tpd
free-air
MIN
MAX
UNIT
MHz
6*
9.9*
1*
11.5*
1
6*
9.9*
1*
11.5*
1
11.5
11.5
6*
9*
1*
10.5*
1
10.5
7.7
11.9
1
13.5
1
13.5
7.7
11.9
1
13.5
1
13.5
7.6
11
1
12.5
1
12.5
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
pF
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
VCC
TYP
3.3 V
36.1
5V
37.5
UNIT
pF
7
SN54LV165A, SN74LV165A
PARALLEL-LOAD 8-BIT SHIFT REGISTERS
SCLS402L − APRIL 1998 − REVISED MAY 2010
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
S1
Open
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
tPHL
50% VCC
tPHL
50% VCC
VOL
VOH
50% VCC
VOL
tPLZ
≈VCC
50% VCC
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
50% VCC
tPZL
VOH
In-Phase
Output
Out-of-Phase
Output
0V
VCC
Output
Control
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
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PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74LV165AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADBRE4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ADGVR
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ADGVRE4
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ADGVRG4
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ADRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ADRG3
PREVIEW
SOIC
D
16
2500
TBD
Call TI
Samples Not Available
SN74LV165ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ANSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ANSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
27-May-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74LV165APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165APWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74LV165APWRG3
PREVIEW
TSSOP
PW
16
2000
TBD
Call TI
Samples Not Available
SN74LV165APWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74LV165APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74LV165ARGYR
ACTIVE
VQFN
RGY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
SN74LV165ARGYRG4
ACTIVE
VQFN
RGY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
27-May-2010
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LV165A :
• Enhanced Product: SN74LV165A-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
SN74LV165ADBR
SSOP
DB
16
2000
330.0
16.4
8.2
SN74LV165ADGVR
TVSOP
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74LV165ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LV165ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV165APWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV165APWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV165ARGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV165ADBR
SSOP
DB
16
2000
346.0
346.0
33.0
SN74LV165ADGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
SN74LV165ADR
SOIC
D
16
2500
333.2
345.9
28.6
SN74LV165ANSR
SO
NS
16
2000
346.0
346.0
33.0
SN74LV165APWR
TSSOP
PW
16
2000
346.0
346.0
29.0
SN74LV165APWT
TSSOP
PW
16
250
346.0
346.0
29.0
SN74LV165ARGYR
VQFN
RGY
16
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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