TI V62/04644-01YE

SCBS764 − SEPTEMBER 2003
D Controlled Baseline
D
D
D
D
D
D
D
D
D
D
D Simple Addressing (Shadow) Protocol Is
− One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Member of the Texas Instruments (TI )
Broad Family of Testability Products
Supporting IEEE Std 1149.1-1990 (JTAG)
Test Access Port (TAP) and Boundary-Scan
Architecture
Extends Scan Access From Board Level to
Higher Levels of System Integration
Promotes Reuse of Lower-Level
(Chip/Board) Tests in System Environment
While Powered at 3.3 V, Both the Primary
and Secondary TAPs Are Fully 5-V Tolerant
for Interfacing to 5-V and/or 3.3-V Masters
and Targets
Switch-Based Architecture Allows Direct
Connect of Primary TAP to Secondary TAP
Primary TAP Is Multidrop for Minimal Use of
Backplane Wiring Channels
Shadow Protocols Can Occur in Any of
Test-Logic-Reset, Run-Test/Idle, Pause-DR,
and Pause-IR TAP States to Provide for
Board-to-Board Test and Built-In Self-Test
D
D
D
D
D
D
Received/Acknowledged on Primary TAP
10-Bit Address Space Provides for up to
1021 User-Specified Board Addresses
Bypass (BYP) Pin Forces
Primary-to-Secondary Connection Without
Use of Shadow Protocols
Connect (CON) Pin Provides Indication of
Primary-to-Secondary Connection
High-Drive Outputs (−32-mA IOH, 64-mA IOL)
Support Backplane Interface at Primary and
High Fanout at Secondary
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
PW PACKAGE
(TOP VIEW)
A4
A3
A2
A1
A0
BYP
GND
PTDO
PTCK
PTMS
PTDI
PTRST
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
A5
A6
A7
A8
A9
VCC
CON
STDI
STCK
STMS
STDO
STRST
description/ordering information
The SN74LVT8996 10-bit addressable scan port (ASP) is a member of the Texas Instruments SCOPE testability
integrated-circuit family. This family of devices supports IEEE Std 1149.1-1990 boundary scan to facilitate testing
of complex circuit assemblies. Unlike most SCOPE devices, the ASP is not a boundary-scannable device, rather,
it applies TI’s addressable-shadow-port technology to the IEEE Std 1149.1-1990 (JTAG) test access port (TAP) to
extend scan access beyond the board level.
This device is functionally equivalent to the ’ABT8996 ASPs. Additionally, it is designed specifically for low-voltage
(3.3-V) VCC operation, but with the capability to interface to 5-V masters and/or targets.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SCOPE is a trademark of Texas Instruments.
Copyright  2003, Texas Instruments Incorporated
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SCBS764 − SEPTEMBER 2003
description/ordering information (continued)
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
TSSOP − PW
Tape and reel
SN74LVT8996IPWREP
LT8996EP
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Conceptually, the ASP is a simple switch that can be used to directly connect a set of multidrop primary TAP signals
to a set of secondary TAP signals − for example, to interface backplane TAP signals to a board-level TAP. The ASP
provides all signal buffering that might be required at these two interfaces. When primary and secondary TAPs are
connected, only a moderate propagation delay is introduced − no storage/retiming elements are inserted. This
minimizes the need for reformatting board-level test vectors for in-system use.
Most operations of the ASP are synchronous to the primary test clock (PTCK) input. PTCK is always buffered directly
onto the secondary test clock (STCK) output.
Upon power up of the device, the ASP assumes a condition in which the primary TAP is disconnected from the
secondary TAP (unless the bypass signal is used, as below). This reset condition also can be entered by the
assertion of the primary test reset (PTRST) input or by use of shadow protocol. PTRST is always buffered directly
onto the secondary test reset (STRST) output, ensuring that the ASP and its associated secondary TAP can be reset
simultaneously.
When connected, the primary test data input (PTDI) and primary test mode select (PTMS) input are buffered onto
the secondary test data output (STDO) and secondary test mode select (STMS) output, respectively, while the
secondary test data input (STDI) is buffered onto the primary test data output (PTDO). When disconnected, STDO
is at high impedance, while PTDO is at high impedance, except during acknowledgment of a shadow protocol. Upon
disconnect of the secondary TAP, STMS holds its last low or high level, allowing the secondary TAP to be held in
its last stable state. Upon reset of the ASP, STMS is high, allowing the secondary TAP to be synchronously reset
to the Test-Logic-Reset state.
In system, primary-to-secondary connection is based on shadow protocols that are received and acknowledged on
PTDI and PTDO, respectively. These protocols can occur in any of the stable TAP states other than Shift-DR or
Shift-IR (i.e., Test-Logic-Reset, Run-Test/Idle, Pause-DR or Pause-IR). The essential nature of the protocols is to
receive/transmit an address via a serial bit-pair signaling scheme. When an address is received serially at PTDI that
matches that at the parallel address inputs (A9−A0), the ASP serially retransmits its address at PTDO as an
acknowledgment and then assumes the connected (ON) status, as above. If the received address does not match
that at the address inputs, the ASP immediately assumes the disconnected (OFF) status without acknowledgment.
The ASP also supports three dedicated addresses that can be received globally (that is, to which all ASPs respond)
during shadow protocols. Receipt of the dedicated disconnect address (DSA) causes the ASP to disconnect in the
same fashion as a nonmatching address. Reservation of this address for global use ensures that at least one
address is available to disconnect all receiving ASPs. The DSA is especially useful when the secondary TAPs of
multiple ASPs are to be left in different stable states. Receipt of the reset address (RSA) causes the ASP to assume
the reset condition, as above. Receipt of the test-synchronization address (TSA) causes the ASP to assume a
connect status (MULTICAST) in which PTDO is at high impedance but the connections from PTMS to STMS and
PTDI to STDO are maintained to allow simultaneous operation of the secondary TAPs of multiple ASPs. This is
useful for multicast TAP-state movement, simultaneous test operation (such as in Run-Test/Idle state), and
scanning of common test data into multiple like scan chains. The TSA is valid only when received in the Pause-DR
or Pause-IR TAP states.
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description (continued)
Alternatively, primary-to-secondary connection can be selected by assertion of a low level at the bypass (BYP) input.
This operation is asynchronous to PTCK and is independent of PTRST and/or power-up reset. This bypassing
feature is especially useful in the board-test environment, since it allows the board-level automated test equipment
(ATE) to treat the ASP as a simple transceiver. When the BYP input is high, the ASP is free to respond to shadow
protocols. Otherwise, when BYP is low, shadow protocols are ignored.
Whether the connected status is achieved by use of shadow protocol or by use of BYP, this status is indicated by
a low level at the connect (CON) output. Likewise, when the secondary TAP is disconnected from the primary TAP,
the CON output is high.
FUNCTION TABLE
INPUTS
OUTPUTS
BYP
PTRST
SHADOW-PROTOCOL
RESULT†
STRST
STCK
STDO
PTDO
CON
PRIMARY-TO-SECONDARY
CONNECT STATUS
PTCK
STMS
H‡
L
L
—
L
PTDI
STDI
L
BYP/TRST‡
L
H
—
H
PTCK
PTMS
PTDI
STDI
L
BYP
H
L
—
L
PTCK
H
Z
Z
H
TRST
H
H
RESET
H
PTCK
H
Z
Z
H
RESET
H
H
MATCH
H
PTCK
PTMS
PTDI
STDI
L
ON
H
H
NO MATCH
H
PTCK
Z
Z
H
OFF
H
H
HARD ERROR¶
H
PTCK
STMS0§
STMS0§
Z
Z
H
OFF
Z
Z
H
OFF
PTDI
Z
L
MULTICAST
H
H
DISCONNECT
H
PTCK
H
H
TEST SYNCHRONIZATION
H
PTCK
STMS0§
PTMS
† Shadow protocols are received serially via PTCK and PTDI and acknowledged serially via PTCK and PTDO under certain conditions in which PTMS
is static low or static high (see shadow protocol). The result shown here follows any required acknowledgment.
‡ In normal operation of IEEE Std 1149.1-compliant architectures, it is recommended that TMS be high prior to release of TRST. The BYP/TRST connect
status ensures that this condition is met at STMS regardless of the applied PTMS. Also, it is recommended that STMS be kept high for a minimum
duration of 5 PTCK cycles following assertion of PTRST, either by maintaining PTRST low or by setting PTMS high. This ensures that ICs both with
and without TRST inputs are moved to their Test-Logic-Reset TAP states. It is expected that in normal application, this condition occurs only when
BYP is fixed at the low state. In such case, upon release of PTRST, the ASP immediately resumes the BYP connect status.
§ STMS level before indicated steady-state conditions were established
¶ The shadow protocol is well defined. Some variations in the protocol are tolerated (see protocol errors). Those that are not tolerated produce protocol
result HARD ERROR and cause disconnect as indicated.
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functional block diagram
PTCK
PTRST
PTMS
9
16
VCC
12
13
VCC
STCK
STRST
S
10
1D
VCC
15
STMS
C1
PTDI
STDI
14
11
VCC
17
VCC
BYP
STDO
8
PTDO
6
Shadow-Protocol
Receive
VCC
A9−A0
Connect Control
18
20−24,
1−5
Shadow-Protocol
Transmit
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CON
SCBS764 − SEPTEMBER 2003
Terminal Functions
TERMINAL
NAME
DESCRIPTION
A9−A0
Address inputs. The ASP compares addresses received via shadow protocol against the value at A9−A0 to determine address
match. The bit order is from most significant to least significant. An internal pullup at each A9−A0 terminal forces the terminal to a
high level if it has no external connection.
BYP
Bypass input. A low input at BYP forces the ASP into BYP or BYP/TRST status, depending on PTRST being high or low, respectively.
While BYP is low, shadow protocols are ignored. Otherwise, while BYP is high, the ASP is free to respond to shadow protocols. An
internal pullup forces BYP to a high level if it has no external connection.
CON
Connect indicator (output). The ASP indicates secondary-scan-port activity (resulting from BYP, BYP/TRST, MULTICAST, or ON
status) by forcing CON to be low. Inactivity (resulting from OFF, RESET, or TRST status) is indicated when CON is high.
GND
Ground
PTCK
Primary test clock. PTCK receives the TCK signal required by IEEE Std 1149.1-1990. The ASP always buffers PTCK to STCK.
Shadow protocols are received/acknowledged synchronously to PTCK and connect-status changes invoked by shadow protocol
are made synchronously to PTCK.
PTDI
Primary test data input. PTDI receives the TDI signal required by IEEE Std 1149.1-1990. During appropriate TAP states, the ASP
monitors PTDI for shadow protocols. During shadow protocols, data at PTDI is captured on the rising edge of PTCK. When a valid
shadow protocol is received in this fashion, the ASP compares the received address against the A9−A0 inputs. If the ASP detects
a match, it outputs an acknowledgment and then connects its primary TAP terminals to its secondary TAP terminals. Under BYP,
BYP/TRST, MULTICAST or ON status, the ASP buffers the PTDI signal to STDO. An internal pullup forces PTDI to a high level if
it has no external connection.
PTDO
Primary test data output. PTDO transmits the TDO signal required by IEEE Std 1149.1-1990. During shadow protocols, the ASP
transmits any required acknowledgment via the PTDO. The acknowledgment data output at PTDO changes on the falling edge of
PTCK. Under BYP, BYP/TRST, or ON status, the ASP buffers the PTDO signal from STDI. Under OFF, MULTICAST, RESET, or
TRST status, PTDO is at high impedance.
PTMS
Primary test mode select. PTMS receives the TMS signal required by IEEE Std 1149.1-1990. The ASP monitors the PTMS to
determine the TAP-controller state. During stable TAP states other than Shift-DR or Shift-IR (i.e., Test-Logic-Reset, Run-Test-Idle,
Pause-DR, Pause-IR) the ASP can respond to shadow protocols. Under BYP, MULTICAST, or ON status, the ASP buffers the PTMS
signal to STMS. An internal pullup forces PTMS to a high level if it has no external connection.
PTRST
Primary test reset. PTRST receives the TRST signal allowed by IEEE Std 1149.1-1990. The ASP always buffers PTRST to STRST.
A low input at PTRST forces the ASP to assume TRST or BYP/TRST status, depending on BYP being high or low, respectively. Such
operation also asynchronously resets the internal ASP state to its power-up condition. Otherwise, while PTRST is high, the ASP
is free to respond to shadow protocols. An internal pullup forces PTRST to a high level if it has no external connection.
STCK
Secondary test clock. STCK retransmits the TCK signal required by IEEE Std 1149.1-1990. The ASP always buffers STCK from
PTCK.
STDI
Secondary test data input. STDI receives the TDI signal required by IEEE Std 1149.1-1990. Under BYP, BYP/TRST, or ON status,
the ASP buffers STDI to PTDO. An internal pullup forces STDI to a high level if it has no external connection.
STDO
Secondary test data output. STDO transmits the TDO signal required by IEEE Std 1149.1-1990. Under BYP, BYP/TRST,
MULTICAST, or ON status, the ASP buffers STDO from PTDI. Under OFF, RESET, or TRST status, STDO is at high impedance.
STMS
Secondary test mode select. STMS retransmits the TMS signal required by IEEE Std 1149.1-1990. Under BYP, MULTICAST, or ON
status, the ASP buffers STMS from PTMS. When disconnected (as a result of OFF status), STMS maintains its last valid state until
the ASP assumes BYP/TRST, RESET, or TRST status (upon which it is forced high) or the ASP again assumes BYP, MULTICAST,
or ON status.
STRST
Secondary test reset. STRST retransmits the TRST signal allowed by IEEE Std 1149.1-1990. The ASP always buffers STRST from
PTRST.
VCC
Supply voltage
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application information
In application, the ASP is used at each of several (serially-chained) groups of IEEE Std 1149.1-compliant devices.
The ASP for each such group is assigned an address (via inputs A9−A0) that is unique from that assigned to ASPs
for the remaining groups. Each ASP is wired at its primary TAP to common (multidrop) TAP signals (sourced from
a central IEEE Std 1149.1 bus master) and fans out its secondary TAP signals to the specific group of IEEE Std
1149.1-compliant devices with which it is associated. An example is shown in Figure 1.
IEEE
Std
1149.1
Bus
Master
TDI
TCK
TMS
TDO
TRST
A9−A0
PTDO
PTCK
PTMS
PTDI
PTRST
ASP
BYP
ADDR3
STDI
STCK
STMS
STDO
STRST
ASP
PTDO
PTCK
PTMS
PTDI
PTRST
ADDR2
A9−A0
BYP
PTDO
PTCK
PTMS
PTDI
PTRST
ASP
BYP
ADDR1
A9−A0
IEEE Std 1149.1Compliant
Device Chain
STDI
STCK
STMS
STDO
STRST
IEEE Std 1149.1Compliant
Device Chain
STDI
STCK
STMS
STDO
STRST
IEEE Std 1149.1Compliant
Device Chain
To
Other
Modules
Figure 1. ASP Application
This application allows the ASP to be wired to a 4- or 5-wire multidrop test access bus, such as might be found on
a backplane. Each ASP would then be located on a module, for example a printed-circuit board (PCB), that contains
a serial chain of IEEE Std 1149.1-compliant devices and that would plug into the module-to-module bus (e.g.,
backplane). In the complete system, the ASP shadow protocols would allow the selection of the scan chain on a
single module. The selected scan chain could then be controlled, via the multidrop TAP, as if it were the only scan
chain in the system. Normal IR and DR scans can then be performed to accomplish the module test objectives.
Once scan operations to a given module are complete, another module can be selected in the same fashion, at
which time the ASP-based connection to the first module is dissolved. This procedure can be continued
progressively for each module to be tested. Finally, one of two global addresses can be issued to either leave all
modules unselected (disconnect address, DSA) or to deselect and reset scan chains for all modules (reset address,
RSA).
Additionally, in Pause-DR and Pause-IR TAP states, a third global address (test-synchronization address, TSA) can
be invoked to allow simultaneous TAP-state changes and multicast scan-in operations to selected modules. This
is especially useful in the former case, for allowing selected modules to be moved simultaneously to the
Run-Test-Idle TAP state for module-level or module-to-module built-in self-test (BIST) functions, which operate
synchronously to TCK in that TAP state, and in the latter case, for scanning common test setup/data into multiple
like modules.
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architecture
Conceptually, the ASP can be viewed as a bank of switches that can connect or isolate a module-level TAP to/from
a higher-level (e.g., module-to-module) TAP. This is shown in Figure 2. The state of the switches (open versus
closed) is based on shadow protocols, which are received on PTDI and are synchronous to PTCK.
The simple architecture of the ASP allows the system designer to overcome the limitations of IEEE Std 1149.1 ring
and star configurations. Ring configurations (in which each module’s TDO is chained to the next module’s TDI) are
of limited use in backplane environments, since removal of a module breaks the scan chain and prevents test of
the remainder of the system. Star configurations (in which all module TDOs and TDIs are connected in parallel) are
suited to the backplane environment, but, since each module must receive its own TMS, are costly in terms of
backplane routing channels. By comparison, use of the ASP allows all five IEEE Std 1149.1 signals to be routed
in multidrop fashion.
A9−A0
Control
From Multidrop,
Module-to-Module
Test Access Port
BYP
CON
PTDO
STDI
PTCK
STCK
1
PTMS
STMS
To Module-Level
Test Access Port
0
PTDI
STDO
PTRST
STRST
Figure 2. ASP Conceptual Model
As shown in the functional block diagram, the ASP comprises three major logic blocks. Blocks for shadow-protocol
receive and shadow-protocol transmit are responsible for receipt of select protocol and transmission of
acknowledge protocol, respectively. The connect-control block is responsible for TAP-state monitor and address
matching.
Some additional logic is illustrated outside of these major blocks. This additional logic is responsible for controlling
the activity of the ASP outputs based on the shadow-protocol result and/or protocol bypass [as selected by an active
(low) BYP input].
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shadow protocol
Addressing of an ASP in system is accomplished by shadow protocols, which are received at PTDI synchronously
to PTCK. Shadow protocols can occur only in the following stable TAP states: Test-Logic-Reset, Run-Test/Idle,
Pause-DR, and Pause-IR. Shadow protocols never occur in Shift-DR or Shift-IR states to prevent contention on the
signal bus to which PTDO is wired. Additionally, the ASP PTMS must be held at a constant low or high level
throughout a shadow protocol. If TAP-state changes occur in the midst of a shadow protocol, the shadow protocol
is aborted and the select-protocol state machine returns to its initial state.
The shadow protocol is based on a serial bit-pair signaling scheme in which two bit-pair combinations (data one,
data zero) are used to represent address data and the other two bit-pair combinations (select, idle) are used for
framing − that is, to indicate where address data begins and ends.
These bit pairs are received serially at PTDI (or transmitted serially at PTDO) synchronously to PTCK as follows:
−
−
−
−
The idle bit pair (I) is represented as two consecutive high signals.
The select bit pair (S) is represented as two consecutive low signals.
The data-one bit pair (D) is represented as a low signal followed by a high signal.
The data-zero bit pair (D) is represented as a high signal followed by a low signal.
PTDI
or
PTDO
PTCK
First Bit of Pair Is Transmitted
First Bit of Pair Is Received
Second Bit of Pair Is Transmitted
Second Bit of Pair Is Received
Figure 3. Bit-Pair Timing (Data Zero Shown)
A complete shadow protocol is composed of the receipt of a select protocol followed, if applicable, by the
transmission of an acknowledge protocol (which is issued from PTDO only if the received address matches that at
the A9−A0 inputs). Both of these subprotocols are composed of ten data bit pairs framed at the beginning by idle
and select bit pairs and at the end by select and idle bit pairs. This is represented in an abbreviated fashion as
follows: ISDDDDDDDDDDSI. Figure 4 shows a complete shadow protocol (the symbol T is used to represent a
high-impedance condition on the associated signal line − since the high-impedance state at PTDI is logically high
due to pullup, it maps onto the idle bit pair).
Received at PTDI
Transmitted at PTDO
Primary Tap Is Inactive
Select Protocol Begins
T I S D D D D D D D D D D S I T T T T T T T T T T T T T T T
T T T T T T T T T T T T T T T I S D D D D D D D D D D S I T
LSB
MSB
LSB
Select Protocol Ends
Acknowledge Protocol Begins
Acknowledge Protocol Ends
Primary-to-Secondary Connect,
Scan Operations Can Be Initiated
Figure 4. Complete Shadow Protocol
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MSB
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select protocol
The select protocol is the ASP’s means of receiving (at PTDI) address information from an IEEE Std 1149.1 bus
master. It follows the ISDDDDDDDDDDSI sequence described previously. A 10-bit address value is decoded from
the received data-one and/or data-zero bit pairs. These bit pairs are interpreted in least-significant-bit-first order
(that is, the first data bit pair received is considered to correspond to A0).
acknowledge protocol
Following the receipt of a complete select-protocol sequence, the protocol result provisionally is set to NO MATCH
and the connect status set to OFF. The received address is then compared to that at the ASP address inputs
(A9−A0). If these address values match, the ASP immediately (with no delay) responds with an acknowledge
protocol transmitted from PTDO. This protocol follows the ISDDDDDDDDDDSI sequence described previously. The
transmitted address represents the address of the selected ASP which, by definition, is the same address the ASP
received in the select protocol. The 10-bit address value is encoded into data-one and/or data-zero bit pairs. The
bit pairs are to be interpreted in least-significant-bit-first order (that is, the first data bit pair transmitted is to be
considered to correspond to A0). If the received address does not match that at the A9−A0 inputs, no acknowledge
protocol is transmitted and the shadow protocol is considered complete.
protocol errors
Protocol errors occur when bit pairs are received out of sequence. Some of these sequencing errors can be tolerated
and produce protocol result SOFT ERROR − no specific action occurs as a result. Other errors represent cases
where the addressing information could be incorrectly received and produce protocol result HARD ERROR − these
are characterized by sequences in which at least one bit of address data has been properly transmitted, followed
by a sequencing error; when protocol result HARD ERROR occurs, any connection to an ASP is dissolved.
Table 1 lists the bit-pair sequences that produce protocol results SOFT ERROR and HARD ERROR. A hard error
also results when the primary TAP state changes during select protocol following the proper transmission of at least
one bit of address data. Figures 16 and 17 show shadow-protocol timing in case of protocol result HARD ERROR
while Figure 18 shows shadow-protocol timing in case of protocol result SOFT ERROR.
Table 1. Shadow-Protocol Errors†
SOFT ERROR
HARD ERROR
I(D)I
I(D)(S)I
I(D)(S)(D)I
I(S)I
IS(D)I
IS(D)S(D)I
IS(D)S(S)I
IS(S)(D)I
IS(S)(D)(S)I
† A bit-pair token in parentheses represents
one or more instances.
long address
Receipt of an address longer than ten bits produces protocol result HARD ERROR and the ASP assumes OFF
status. The sole exceptions are when all data ones are received or all data zeros are received. In these special
cases, the global addresses represented by these bit sequences are observed and appropriate action taken. That
is, in the case that only data ones (ten or more) are received, the shadow-protocol result is TEST
SYNCHRONIZATION (if the primary TAP state is Pause-DR or Pause-IR), and in the case that only data zeros (ten
or more) are received, the shadow-protocol result is RESET (see test-synchronization address and reset address).
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short address
In all cases, receipt of an address shorter than ten bits produces protocol result HARD ERROR and the ASP
assumes OFF status.
connect control
The connect-control block monitors the primary TAP state to enable receipt/acknowledge of shadow protocols in
appropriate states (namely, the stable, non-Shift TAP states: Test-Logic-Reset, Run-Test/Idle, Pause-DR, and
Pause-IR). Upon receipt of a valid shadow protocol, this block performs the address matching required to compute
the shadow-protocol result.
TAP-state monitor
The TAP-state monitor is a synchronous finite-state machine that monitors the primary TAP state. The state diagram
is shown in Figure 5 and mirrors that specified by IEEE Std 1149.1-1990. The TAP-state monitor proceeds through
its states based on the level of PTMS at the rising edge of PTCK. Each state is described both in terms of its
significance for ASP devices and for connected IEEE Std 1149.1-compliant devices (called targets). However, the
monitor state (primary TAP) can be different from that of disconnected scan chains (secondary TAP).
Test-Logic-Reset
PTMS = H
PTMS = L
PTMS = H
PTMS = H
PTMS =H
Run-Test /Idle
Select-DR-Scan
Select-IR-Scan
PTMS = L
PTMS = L
PTMS = L
PTMS = H
PTMS = H
Capture-DR
Capture-IR
PTMS = L
PTMS = L
Shift-DR
Shift-IR
PTMS = L
PTMS = L
PTMS = H
PTMS = H
PTMS = H
PTMS = H
Exit1-DR
Exit1-IR
PTMS = L
PTMS = L
Pause-DR
Pause-IR
PTMS = L
PTMS = L
PTMS = H
PTMS = L
PTMS = H
PTMS = L
Exit2-DR
Exit2-IR
PTMS = H
Update-DR
PTMS = H
PTMS = L
Figure 5. TAP-Monitor State Diagram
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PTMS = H
Update-IR
PTMS = H
PTMS = L
SCBS764 − SEPTEMBER 2003
Test-Logic-Reset
The ASP TAP-state monitor powers up in the Test-Logic-Reset state. Alternatively, the ASP can be forced
asynchronously to this state by assertion of its PTRST input. In the stable Test-Logic-Reset state, the ASP is enabled
to receive and respond to shadow protocols. The ASP does not recognize the TSA in this state.
For a target device in the stable Test-Logic-Reset state, the test logic is reset and is disabled so that the normal logic
function of the device is performed. The instruction register is reset to an opcode that selects the optional IDCODE
instruction, if supported, or the BYPASS instruction. Certain data registers also can be reset to their power-up
values.
Run-Test/Idle
In the stable Run-Test/Idle state, the ASP is enabled to receive and respond to shadow protocols. The ASP does
not recognize the TSA in this state.
For a target device, Run-Test/Idle is a stable state in which the test logic can be actively running a test or can be
idle.
Select-DR-Scan, Select-lR-Scan
The ASP is not enabled to receive and respond to shadow protocols in the Select-DR-Scan and
Select-lR-Scan states.
For a target device, no specific function is performed in the Select-DR-Scan and Select-lR-Scan states, and the TAP
controller exits either of these states on the next TCK cycle. These states allow the selection of either data-register
scan or instruction-register scan.
Capture-DR
The ASP is not enabled to receive and respond to shadow protocols in the Capture-DR state.
For a target device in the Capture-DR state, the selected data register can capture a data value as specified by the
current instruction. Such capture operations occur on the rising edge of TCK, upon which the Capture-DR state is
exited.
Shift-DR
The ASP is not enabled to receive and respond to shadow protocols in the Shift-DR state.
For a target device, upon entry to the Shift-DR state, the selected data register is placed in the scan path between
TDI and TDO, and on the first falling edge of TCK, TDO goes from the high-impedance state to an active state. TDO
outputs the logic level present in the least-significant bit of the selected data register. While in the stable Shift-DR
state, data is serially shifted through the selected data register on each TCK cycle.
Exit1-DR, Exit2-DR
The ASP is not enabled to receive and respond to shadow protocols in the Exit1-DR and Exit2-DR states.
For a target device, the Exit1-DR and Exit2-DR states are temporary states that end a data-register scan. It is
possible to return to the Shift-DR state from either Exit1-DR or Exit2-DR without recapturing the data register. On
the first falling edge of TCK after entry to Exit1-DR, TDO goes from the active state to the high-impedance state.
Pause-DR
In the stable Pause-DR state, the ASP is enabled to receive and respond to shadow protocols. Additionally, the TSA
can be recognized in this state.
For target devices, no specific function is performed in the stable Pause-DR state. The Pause-DR state suspends
and resumes data-register scan operations without loss of data.
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Update-DR
The ASP is not enabled to receive and respond to shadow protocols in the Update-DR state.
For a target device, if the current instruction calls for the selected data register to be updated with current data, such
update occurs on the falling edge of TCK, following entry to the Update-DR state.
Capture-IR
The ASP is not enabled to receive and respond to shadow protocols in the Capture-IR state.
For a target device in the Capture-IR state, the instruction register captures its current status value. This capture
operation occurs on the rising edge of TCK, upon which the Capture-IR state is exited.
Shift-IR
The ASP is not enabled to receive and respond to shadow protocols in the Shift-IR state.
For a target device, upon entry to the Shift-IR state, the instruction register is placed in the scan path between TDI
and TDO, and on the first falling edge of TCK, TDO goes from the high-impedance state to an active state. TDO
outputs the logic level present in the least-significant bit of the instruction register. While in the stable Shift-IR state,
instruction data is serially shifted through the instruction register on each TCK cycle.
Exit1-IR, Exit2-IR
The ASP is not enabled to receive and respond to shadow protocols in the Exit1-IR and Exit2-IR states.
For target devices, the Exit1-IR and Exit2-IR states are temporary states that end an instruction-register scan. It is
possible to return to the Shift-IR state from either Exit1-IR or Exit2-IR without recapturing the instruction register.
On the first falling edge of TCK after entry to Exit1-IR, TDO goes from the active state to the high-impedance state.
Pause-IR
In the stable Pause-IR state, the ASP is enabled to receive and respond to shadow protocols. Additionally, the TSA
can be recognized in this state.
For target devices, no specific function is performed in the stable Pause-IR state, in which the TAP controller can
remain indefinitely. The Pause-IR state suspends and resumes instruction-register scan operations without loss of
data.
Update-IR
The ASP is not enabled to receive and respond to shadow protocols in the Update-IR state.
For target devices, the current instruction is updated and takes effect on the falling edge of TCK, following entry to
the Update-IR state.
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address matching
Connect status of the ASP is computed by a match of the address received in the last valid shadow protocol against
that at the address inputs (A9−A0) as well as against the three dedicated addresses that are internal to the ASP
(DSA, RSA, and TSA). The address map is shown in Table 2.
Table 2. Address Map
ADDRESS NAME
Reset Address (RSA)
Matching Address
BINARY
CODE
HEX
CODE
SHADOW-PROTOCOL
RESULT
RESULTANT
PRIMARY-TO-SECONDARY
CONNECT STATUS
0000000000
000
RESET
RESET
A9−A0
A9−A0
MATCH
ON
Disconnect Address (DSA)
1111111110
3FE
DISCONNECT
OFF
Test Synchronization Address (TSA)
1111111111
3FF
TEST SYNCHRONIZATION
MULTICAST
All others
All others
NO MATCH
OFF
All Other Addresses
If the shadow-protocol address matches the address inputs (A9−A0), then the ASP responds by transmitting an
acknowledge protocol. Following the complete transmission of the acknowledge protocol, the ASP assumes ON
status (in which PTDI, PTDO, and PTMS are connected to STDO, STDI, and STMS, respectively). The ON status
allows the scan chain associated with the ASP’s secondary TAP to be controlled from the multidrop primary TAP
as if it were directly wired as such. Figures 6 and 7 show the shadow-protocol timing for MATCH result when the
prior ASP connect status is ON and OFF, respectively.
If the shadow-protocol address does not match the address inputs (A9−A0), then (unless the address is one of the
three dedicated global addresses described below) the ASP responds immediately by assuming the OFF status
(in which PTDO and STDO are high impedance and STMS is held at its last level). This has the effect of deselecting
the scan chain associated with the ASP secondary TAP, but leaves the TAP state of the scan chain unchanged. No
acknowledge protocol is sent. Figures 8 and 9 show the shadow-protocol timing for NO MATCH result when the prior
ASP connect status is ON and OFF, respectively.
disconnect address
The disconnect address (DSA) is one of the three internally dedicated addresses that are recognized globally. When
an ASP receives the DSA, it immediately responds by assuming the OFF status (in which PTDO and STDO are high
impedance and STMS is held at its last level). This has the effect of deselecting the scan chain associated with the
ASP secondary TAP, but leaves the TAP state of the scan chain unchanged. No acknowledge protocol is sent.
Figures 10 and 11 show the shadow-protocol timing for DISCONNECT result when the prior ASP connect status
is ON and OFF, respectively.
The same result occurs when a nonmatching address is received. No specific action to disconnect an ASP is
required, as a given ASP is disconnected by the address that connects another. The dedicated DSA ensures that
at least one address is available for the purpose of disconnecting all receiving ASPs. It is especially useful when
the currently selected scan chain is in a different TAP state than that to be selected. In such a case, the DSA is used
to leave the former scan chain in the proper state, after which the primary TAP state is moved to that needed to select
the latter scan chain.
reset address
The reset address (RSA) is one of the three internally dedicated addresses that are recognized globally. When an
ASP receives the RSA, it immediately responds by assuming the RESET status (in which PTDO and STDO are high
impedance and STMS is forced to the high level). This has the effect of deselecting and resetting (to
Test-Logic-Reset state) the scan chain associated with the ASP secondary TAP. No acknowledge protocol is sent.
Figures 12 and 13 show the shadow-protocol timing for RESET result when the prior ASP connect status is ON and
OFF, respectively.
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test synchronization address
The test synchronization address (TSA) is one of the three internally dedicated addresses that are recognized
globally. When an ASP receives the TSA while its secondary TAP state is Pause-DR or Pause-IR, it immediately
responds by assuming the MULTICAST status (in which PTDI and PTMS are connected to STDO and STMS
respectively, while PTDO is high impedance). No acknowledge protocol is sent. The TSA is valid only when the TAP
state of both primary and secondary is Pause-DR or Pause-IR. If the TSA is received when the TAP state of either
primary or secondary is Test-Logic-Reset or Run-Test-Idle, the shadow-protocol result is considered to be
DISCONNECT. Figures 14 and 15 show the shadow-protocol timing for TEST SYNCHRONIZATION result when
the prior ASP connect status is ON and OFF, respectively.
The TSA allows simultaneous operation of the scan chains of all selected ASPs, either for global TAP-state
movement or for scan input of common serial test data via PTDI. This is especially useful in the former case, to
simultaneously move such scan chains into the Run-Test/Idle state in which module-level or module-to-module
BIST operations can operate synchronous to TCK in that TAP state, and in the later case, to scan common test
setup/data into multiple like modules.
protocol bypass
Protocol bypass is selected by a low BYP input. This protocol-bypass mode forces the ASP into BYP status (primary
TAP signals are connected to secondary TAP signals) regardless of previous shadow-protocol results. The CON
output is made active (low). Receipt of shadow protocols is disabled.
When BYP is taken low, the primary TAP serial data signals (PTDI, PTDO) are immediately (asynchronously to
PTCK) connected to their respective secondary TAP signals (STDO, STDI). The primary TAP mode-select signal
(PTMS) is also connected to its respective secondary TAP signal (STMS) unless PTRST is low, in which case STMS
remains high until PTRST is released. Also, the shadow-protocol-receive block is reset to its power-up state and
is held in this state such that select protocols appearing at the primary TAP are ignored.
When the BYP input is released (taken high), the ASP immediately (asynchronously to PTCK) resumes the connect
status selected by the last valid shadow protocol. The shadow-protocol-receive block is again enabled to respond
to select protocols.
Figures 19 and 20 show protocol-bypass timing when the ASP connect status before BYP active is ON and
OFF, respectively.
asynchronous reset
While the PTRST input is always buffered directly to the STRST output, it also serves as an asynchronous reset
for the ASP. Given that BYP is high, when PTRST goes low, the ASP immediately assumes TRST status, in which
CON is high and PTDO and STDO are at high impedance. Otherwise, if BYP is low, the ASP assumes BYP/TRST
status. In either case, STMS is set high so that connected IEEE Std 1149.1-compliant devices can be synchronously
driven to their Test-Logic-Reset states. While PTRST is low, receipt of shadow protocols is disabled.
Figures 21 and 22 show asynchronous reset timing when the ASP connect status before PTRST active is ON and
OFF, respectively. Figure 23 shows asynchronous reset timing when BYP is low.
connect indicator
The CON output indicates secondary-scan-port activity (STDO, STMS active) regardless of whether such activity
is achieved via protocol bypass or shadow protocol. If the BYP input is low, the CON output is low. Otherwise, if the
BYP input is high, the CON output is low if the result of the last valid shadow protocol is MATCH or TEST
SYNCHRONIZATION. In all other cases, and while acknowledge protocol is in progress, the CON output is high.
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shadow-protocol timing
PTCK
Don’t Care
A9−A0
Don’t Care
BYP
PTDI
Idle
Select
A0P
A9P
Select
Don’t Care†
Idle
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
Idle
Select
A0P
A9P Select
Idle
PTDO = STDI
STCK
STDO
A0P
A9P
STMS
STMS = PTMS
STDO = PTDI
STMS = STMS0
STMS = PTMS
STRST
Select Protocol
Acknowledge Protocol
ON
† The instantaneous value of PTDI during protocol acknowledge is “don’t care” as long as the cumulative effect does not represent another valid
select protocol or produce protocol result HARD ERROR.
Figure 6. Shadow-Protocol Timing, Protocol Result = MATCH, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
Don’t Care
BYP
PTDI
Idle
Select
A0P
A9P
Select
Don’t Care†
Idle
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
Idle
Select
A0P
A9P Select
Idle
PTDO = STDI
STCK
STDO
STDO = PTDI
STMS = STMS0
STMS
STMS = PTMS
STRST
Select Protocol
Acknowledge Protocol
ON
† The instantaneous value of PTDI during protocol acknowledge is “don’t care” as long as the cumulative effect does not represent another valid
select protocol or produce protocol result HARD ERROR.
Figure 7. Shadow-Protocol Timing, Protocol Result = MATCH, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
Don’t Care
BYP
PTDI
Idle
Select
NMAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
NMAP
STMS
STMS = PTMS
STMS = STMS0
STRST
Select Protocol
OFF
Figure 8. Shadow-Protocol Timing, Protocol Result = NO MATCH, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
Don’t Care
BYP
PTDI
Idle
Select
NMAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
STCK
STDO
STMS = STMS0
STMS
STRST
Select Protocol
OFF
Figure 9. Shadow-Protocol Timing, Protocol Result = NO MATCH, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
DSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STMS
DSAP
STMS = PTMS
STMS = STMS0
STRST
Select Protocol
OFF
Figure 10. Shadow-Protocol Timing, Protocol Result = DISCONNECT, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
DSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
STCK
STDO
STMS = STMS0
STMS
STRST
Select Protocol
OFF
Figure 11. Shadow-Protocol Timing, Protocol Result = DISCONNECT, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
RSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
RSAP
STMS
STMS = PTMS
STRST
Select Protocol
RESET
Figure 12. Shadow-Protocol Timing, Protocol Result = RESET, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
RSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
STCK
STDO
STMS
STMS = STMS0
STRST
Select Protocol
RESET
Figure 13. Shadow-Protocol Timing, Protocol Result = RESET, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
TSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STMS
TSAP
STDO = PTDI
STMS = PTMS
STMS = PTMS
STRST
Select Protocol
MULTICAST
Figure 14. Shadow-Protocol Timing,
Protocol Result = TEST SYNCHRONIZATION, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
TSAP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
STCK
STDO
STMS
STDO = PTDI
STMS = STMS0
STMS = PTMS
STRST
Select Protocol
MULTICAST
Figure 15. Shadow-Protocol Timing,
Protocol Result = TEST SYNCHRONIZATION, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
D0P DnP
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STMS
D0P DnP
STMS = PTMS
STMS = STMS0
STRST
Select Protocol
(aborted)
OFF
NOTE A: The position of PTMS shown in this figure is only one of many that would produce protocol result HARD ERROR.
Figure 16. Shadow-Protocol Timing,
Protocol Result = HARD ERROR (PTMS Change During Select Protocol), Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
Don’t Care
BYP
PTDI
Idle
Select
A0P
A9P
Select
Idle
Don’t Care
Don’t Care
PTMS
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
Idle
STCK
STDO
STMS
A0P
A9P
STMS = PTMS
STMS = STMS0
STRST
Select Protocol
Acknowledge Protocol
(aborted)
OFF
NOTE A: The position of PTMS shown in this figure is only one of many that would produce protocol result HARD ERROR.
Figure 17. Shadow-Protocol Timing,
Protocol Result = HARD ERROR (PTMS Change During Acknowledge Protocol),
Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Idle
Select
Select
Select
Idle
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO = STDI
PTDO
STCK
STDO
STMS
STDO = PTDI
STMS = PTMS
STMS = PTMS
STRST
Select Protocol
(aborted)
ON
NOTE A: The sequence of PTDI bits shown in this figure is only one of many that would produce protocol result SOFT ERROR.
Figure 18. Shadow-Protocol Timing,
Protocol Result = SOFT ERROR, Prior Connect Status = ON
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protocol-bypass timing
PTCK
Don’t Care
A9−A0
BYP
PTDI
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STDO = PTDI
STMS
STMS = PTMS
STRST
ON
BYP
ON
Figure 19. Protocol-Bypass Timing, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STDO = PTDI
STMS STMS = STMS0
STMS = PTMS
STMS = STMS0
STRST
OFF
BYP
OFF
Figure 20. Protocol-Bypass Timing, Prior Connect Status = OFF
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asynchronous reset timing
PTCK
Don’t Care
A9−A0
BYP
PTDI
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
PTDO = STDI
STCK
STDO
STDO = PTDI
STMS
STMS = PTMS
STRST
ON
TRST
RESET
Figure 21. Asynchronous Reset Timing, Prior Connect Status = ON
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO
STCK
STDO
STMS STMS = STMS0
STRST
OFF
TRST
RESET
Figure 22. Asynchronous Reset Timing, Prior Connect Status = OFF
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PTCK
Don’t Care
A9−A0
BYP
PTDI
Don’t Care
PTMS
Don’t Care
PTRST
Don’t Care
STDI
CON
PTDO = STDI
PTDO
STCK
STDO = PTDI
STDO
STMS = PTMS
STMS STMS = PTMS
STRST
BYP
BYP/TRST
BYP
Figure 23. Asynchronous Reset Timing, BYP = L
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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings can be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
V
Input voltage
5.5
V
IOH
IOL
High-level output current
−32
mA
Low-level output current
64
mA
∆t/∆v
Input transition rise or fall rate
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−40
High-level input voltage
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
V
µs/V
85
°C
33
SCBS764 − SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless otherwise
noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
MIN
IOH = − 8 mA
IOH = −32 mA
IOL = 100 µA
IOL = 24 mA
0.2
VCC = 2.7 V
IOL = 16 mA
IOL = 32 mA
0.4
IOL = 64 mA
0.55
VI = VCC or GND
VCC = 3.6 V,
VI = VCC
VCC = 3.6 V,
VI = GND
Ioff
IOZH PTDO, STDO
VCC = 0,
VCC = 3.6 V,
VI or VO = 0 to 4.5 V
VO = 3 V
IOZL PTDO, STDO
IOZPU
VCC = 3.6 V,
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
VO = 0.5 V
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V
VCC−0.2
2.4
V
2
0.5
10
±1
1
PTDI, PTMS, PTRST
IIL
A9−A0, BYP, STDI
1
−8
−30
−25
−100
OFF, STCK = H,
STMS = H
ICC
∆ICC‡
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
Co
34
POST OFFICE BOX 655303
µA
A
µA
5
µA
−5
µA
±100
µA
±100
µA
20
mA
7
TRST, STCK = L
10
• DALLAS, TEXAS 75265
A
µA
±100
ON, PTDO = H,
STCK = H,
STDO = H,
STMS = H
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
µA
A
2
ON, PTDO = L,
STCK = L,
STDO = L, STMS = L
VCC = 3.6 V,
VI = VCC or GND,
IO = 0
V
0.5
PTDI, PTMS, PTRST
A9−A0, BYP, STDI
V
VCC = 2.7 V,
VCC = 3 V
VCC = 0 or 3.6 V, VI = 5.5 V
VCC = 3.6 V,
IIH
UNIT
−1.2
II = −18 mA
VCC = 3 V
PTCK
MAX
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V, IOH = −100 µA
VOL
II
TYP†
0.2
mA
3.5
pF
6.5
pF
SCBS764 − SEPTEMBER 2003
timing requirements over recommended ranges of supply voltage and operating free-air temperature
(unless otherwise noted) (see Figure 24)
MIN
fclock
tw
Clock frequency
PTCK
Pulse duration
VCC = 2.7 V
VCC = 3.3 V ± 0.3V
tsu
th
Setup time
Hold time
25
8
PTCK high
20
PTCK low
12
MHz
ns
9
A9−A0 before PTCK↓‡
10.2
PTDI before PTCK↑
10.1
PTMS before BYP↑†
4
PTMS before PTCK↑
A9−A0 after PTCK↓‡
10
PTDI after PTCK↑
PTMS after BYP↑†
UNIT
20
BYP low†
PTRST low
MAX
ns
4
4
4
ns
PTMS after PTCK↑
4
† In normal application of the ASP, such timing requirements with respect to BYP are met implicitly and, therefore, need not be considered.
‡ These requirements apply only in the case in which the address inputs are changed during a shadow protocol. For normal application of the ASP, it
is recommended that the address inputs remain static throughout any shadow protocols. In such cases, the timing of address inputs relative to PTCK
need not be considered.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
35
SCBS764 − SEPTEMBER 2003
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 24)
PARAMETER
FROM
(INPUT)
fmax
tPLH
PTCK
tPHL
tPLH
BYP↓
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH†
tPHL†
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
TO
(OUTPUT)
20
MHz
1
9.4
9.8
1
11.4
2.5
12
2.5
14.7
2.5
11.7
2.5
13.4
1
9.6
1
11.2
1
10
1
11.8
3.5
20.6
3.5
24.8
3.5
23
3.5
27.4
3
14.7
3
17.4
3
15
3
17.7
5.5
19.9
5.5
23.9
5.5
19.1
5.5
22.9
1
8.3
1
9.9
1
8.6
1
10.2
1
8.5
1
9.8
1
8.8
1
10.3
1
8.4
1
10
1
9
1
10.5
CON
3.5
23.9
3.5
29
STMS
2.5
13.2
2.5
15.7
1
6.8
1
8.2
1
7.6
1
9
STCK
PTCK↓
CON
PTCK↓
(shadow-protocol acknowledge)
PTDO
PTCK↓
(connect)
STMS
PTDI
STDO
PTMS
STMS
PTRST
STRST
PTDO
UNIT
MAX
8.2
PTCK
STDI
MIN
1
STMS
tPLH
tPHL
MAX
VCC = 2.7 V
1
CON
BYP↓
PTRST↓
MIN
25
BYP↑
tPLH
VCC = 3.3 V
± 0.3 V
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
† The transitions at STMS are possible only when a shadow-protocol select is issued while STMS is held (in the OFF status) at a level that differs from
that at PTMS. Such operation is not recommended since state synchronization of the primary TAP to secondary TAP cannot be ensured.
36
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS764 − SEPTEMBER 2003
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued) (see Figure 24)
PARAMETER
tPZH†
tPZL
tPZH‡
tPZL
tPZH†
tPZH‡
tPZL
tPHZ†
tPLZ
tPHZ‡
tPLZ
tPHZ†
tPLZ
tPHZ‡
tPLZ§
tPHZ†
tPLZ
tPHZ‡
FROM
(INPUT)
TO
(OUTPUT)
BYP↓
PTDO
BYP↓
STDO
PTCK↓
PTDO
PTCK↓
STDO
BYP↑
PTDO
BYP↑
STDO
PTCK↓
PTDO
PTCK↓
STDO
PTRST↓
PTDO
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MIN
MAX
MIN
MAX
1.5
9
1.5
10.6
1.5
10.1
1.5
11.9
1.5
8.1
1.5
9.3
1.5
9.2
1.5
10.7
4
14.5
4
16.8
4
15.8
4
18.4
4
16.4
4
19.1
1.5
8.3
1.5
9.3
1.5
7.7
1.5
8.3
1.5
7.3
1.5
8.5
1.5
7.4
1.5
7.1
3
14
3
16.6
3
13.9
3
15.5
3.5
16.9
3.5
18.3
3.5
13
3.5
15.1
3.5
18.3
3.5
21.6
3.5
19.3
3.5
19.6
4.5
18.2
4.5
21.4
STDO
PTRST↓
tPLZ
4.5
20.6
4.5
23.4
† In most applications, the node to which PTDO is connected has a pullup resistor. In such cases, this parameter is not significant.
‡ In most applications, the node to which STDO is connected has a pullup resistor. In such cases, this parameter is not significant.
§ This parameter applies only in case of protocol result HARD ERROR.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
37
SCBS764 − SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
1.5 V
Timing Input
0V
tw
tsu
2.7 V
1.5 V
Input
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
Output
tPLZ
3V
1.5 V
tPZH
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
tPHL
tPLH
2.7 V
Output
Control
Output
Waveform 2
S1 at Open
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 24. Load Circuit and Voltage Waveforms
38
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVT8996IPWREP
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04644-01YE
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVT8996-EP :
• Catalog: SN74LVT8996
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVT8996IPWREP
Package Package Pins
Type Drawing
TSSOP
PW
24
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.95
8.3
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVT8996IPWREP
TSSOP
PW
24
2000
346.0
346.0
33.0
Pack Materials-Page 2
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